JP2754683B2 - Printed circuit board connection device and connection method - Google Patents
Printed circuit board connection device and connection methodInfo
- Publication number
- JP2754683B2 JP2754683B2 JP1067023A JP6702389A JP2754683B2 JP 2754683 B2 JP2754683 B2 JP 2754683B2 JP 1067023 A JP1067023 A JP 1067023A JP 6702389 A JP6702389 A JP 6702389A JP 2754683 B2 JP2754683 B2 JP 2754683B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connection
- lands
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Description
【発明の詳細な説明】 産業上の利用分野 本発明はラジオやオーディオテープレコーダやビデオ
テープレコーダやカメラ等の電子機器におけるプリント
基板の接続装置および接続方法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for connecting printed circuit boards in electronic devices such as radios, audio tape recorders, video tape recorders and cameras.
従来の技術 以下、従来のプリント基板の接続方法を図面を参照に
しながら説明する。第３図は従来のプリント基板の接続
方法を工程を追って説明したものである。１はプリント
基板、1aはその基材、1b〜1fはその基材1a上に印刷され
た銅箔の回路（以下ランド部と略省する。）、２は屈曲
自在なプリント基板（以下FPCと略する。）、2aはその
基材、2b〜2dはその基材2a上に印刷された銅箔の回路
（以下FPCのランド部と略省する。）、3aは熱圧接工法
時に生じた過剰半田、3b〜3fはクリーム半田、４はクリ
ーム半田を印刷するときに使用する版、５はプリント基
板１上に実装するチップ状の電気部品、６は熱圧接工法
のための熱板、７はその受け台である。2. Description of the Related Art Hereinafter, a conventional method of connecting printed circuit boards will be described with reference to the drawings. FIG. 3 illustrates a conventional method of connecting a printed circuit board in a step-by-step manner. 1 is a printed circuit board, 1a is its base material, 1b to 1f are copper foil circuits printed on the base material 1a (hereinafter abbreviated as lands). 2 is a flexible printed circuit board (hereinafter referred to as FPC). 2a is the base material, 2b to 2d are the copper foil circuits printed on the base material 2a (hereinafter abbreviated as FPC lands), and 3a is the excess generated during the hot pressing method. Solder, 3b to 3f are cream solder, 4 is a plate used for printing cream solder, 5 is a chip-shaped electric component mounted on the printed circuit board 1, 6 is a hot plate for hot pressing, 7 is It is the cradle.
まず、第３図ａに示すように版４を用いてクリーム半
田3b〜3fをプリント基板１のランド部1b〜1fに印刷す
る。これにチップ状の電気部品５（実際には多数個あ
る。）を第３図ｂに示すようにランド部1e〜1f上に実装
してリフロー炉に通すとクリーム半田3b〜3fが溶け、第
３図ｃに示すようにチップ状の電気部品５は半田付け出
来る。然る後に第３図ｄのようにプリント基板１とFPC2
をそれぞれのランド部が重なるように合わせ、この下を
受け台７で保持し、熱板６で加熱してすでにリフロー炉
で普通の半田となっているクリーム半田3b〜3fを再度溶
かし回路の接続を計る。First, the cream solders 3b to 3f are printed on the lands 1b to 1f of the printed circuit board 1 using the plate 4 as shown in FIG. As shown in FIG. 3b, when the chip-shaped electric components 5 (actually, many) are mounted on the lands 1e to 1f and passed through a reflow furnace, the cream solders 3b to 3f are melted. As shown in FIG. 3c, the chip-shaped electric component 5 can be soldered. Then, as shown in Fig. 3d, the printed circuit board 1 and the FPC2
Are adjusted so that the respective lands overlap each other, and the lower portion is held by the cradle 7 and heated by the hot plate 6 to re-melt the cream solders 3b to 3f which are already ordinary solders in the reflow furnace, and connect the circuits. Measure.
発明が解決しようとする課題 しかしながら、かかる従来工法のプリント基板の接続
では、クリーム半田3b〜3fの量を第４図のように抵抗や
トランジスタ等であるチップ状の電気部品５の半田付け
に最適となるよう設定するため、熱圧接工法で以て接続
するためには半田の量が過剰となる。このため、第３図
ｅのように各接続ランド1b〜1d,2b〜2d間に過剰半田3a
が溜まりショートサーキット不良が多々発生する場合が
あった。逆にFPC2の接続に最適なように設定すれば、第
４図に示すようにチップ状の電気部品５の半田付けのた
めのクリーム半田3e,3fの量が少なく、チップ状の電気
部品５の半田づけが薄くなり不良が発生する恐れがあ
る。また両者の条件を満たすためクリーム半田3b〜3fの
印刷の版４を二種類作り、クリーム半田印刷量を別管理
とすればコストの上昇を招くというおそれがあった。However, in the connection of the printed circuit board according to the conventional method, the amount of the cream solders 3b to 3f is optimal for soldering the chip-shaped electric component 5 such as a resistor or a transistor as shown in FIG. Therefore, the amount of solder becomes excessive for the connection by the hot pressing method. Therefore, as shown in FIG. 3E, the excess solder 3a is placed between the connection lands 1b to 1d and 2b to 2d.
And the short circuit failure often occurred. Conversely, if the setting is made so as to be optimal for the connection of the FPC 2, the amount of cream solders 3e and 3f for soldering the chip-shaped electric component 5 is small as shown in FIG. There is a possibility that soldering becomes thin and defects occur. In addition, in order to satisfy both conditions, two types of printing plates 4 of the cream solders 3b to 3f are prepared, and if the cream solder printing amount is separately managed, there is a fear that the cost may be increased.
課題を解決するための手段 本発明のプリント基板の接続装置は、並列に形成され
クリーム半田を付着させた複数の第１の接続ランド相互
間にそれぞれ１乃至複数個穿った孔を有する第１のプリ
ント基板と、前記第１のプリント基板の第１の接続ラン
ドに相対向する複数の第２の接続ランドを有すると共
に、前記第１のプリント基板の孔を避けかつ第２の接続
ランド相互間に１乃至複数個穿った孔を有する屈曲自在
な第２のプリント基板とを備え、前記記第１のプリント
基板のクリーム半田を付着させた第１の接続ランドと前
記屈曲自在な第２のプリント基板の第２の接続ランドと
の間を熱圧接工法により半田接続する際に、過剰半田を
前記第１もしくは第２のプリント基板に穿った孔より排
出するように構成したことを特徴とするものである。Means for Solving the Problems A printed circuit board connection device of the present invention has a first connection land having one or more holes between a plurality of first connection lands formed in parallel and having cream solder attached thereto. A printed circuit board, having a plurality of second connection lands opposed to the first connection lands of the first printed circuit board, avoiding holes in the first printed circuit board, and between the second connection lands; A first connection land to which cream solder of the first printed circuit board is attached, and a second flexible printed circuit board having a flexible second printed circuit board having one or a plurality of drilled holes; When solder connection is made between the first and second connection lands by hot pressing, the excess solder is discharged from a hole formed in the first or second printed circuit board. is there .
また、本発明のプリント基板の接続方法は、第１のプ
リント基板と屈曲自在な第２のプリント基板とを熱圧接
工法を用いて接続するに際し、第１のプリント基板の所
定の接続ランドにクリーム半田を印刷し、電子部品を搭
載してリフロー炉を通し前記電子部品を半田付け固定し
た後、クリーム半田を有する第１の接続ランド上に第２
のプリント基板の第２の接続ランドを対向させ、加熱圧
着させることにより前記第１の接続ランド上のクリーム
半田を溶かして当該第１と第２の接続ランド間を半田接
続すると共に、過剰半田を前記第１もしくは第２のプリ
ント基板に穿った孔より排出することを特徴とするもの
である。Further, the method for connecting a printed board according to the present invention, when connecting the first printed board and the bendable second printed board using a hot pressing method, applies cream to a predetermined connection land of the first printed board. After printing the solder, mounting the electronic component, and soldering and fixing the electronic component through a reflow furnace, a second connection land is provided on the first connection land having cream solder.
The second connection lands of the printed circuit board are opposed to each other, and the solder paste is melted by heating and pressing to melt the cream solder on the first connection lands, and solder connection between the first and second connection lands is performed. The discharge is performed through a hole formed in the first or second printed circuit board.
作用 本発明によれば、第１のプリント基板と屈曲自在な第
２のプリント基板とを熱圧接工法を用いて接続する場
合、過剰半田を前記第１のプリント基板に穿った孔部も
しくは前記屈曲自在な第２のプリント基板に穿った孔部
より排出することにより、接続ランド間のショートサー
キット不良を防止することができる。According to the present invention, when the first printed board and the bendable second printed board are connected using the hot pressing method, a hole formed in the first printed board by excess solder or the bent portion is formed. The short circuit failure between the connection lands can be prevented by discharging the air from the hole formed in the flexible second printed circuit board.
実施例 以下、本発明のプリント基板の接続方法を図面を参照
にしながら説明する。第２図は本発明のプリント基板の
接続方法を工程を追って説明したものである。１はプリ
ント基板、1aはその基材、1b〜1fはその基材1a上に印刷
された銅箔の回路（以下ランド部と略省する。）、1g〜
1jはランド1b〜1d間に穿った孔、２は屈曲自在なプリン
ト基板（以下FPCと略する。）、2aはその基材、2b〜2d
はその基材2a上に印刷された銅箔の回路（以下FPCのラ
ンド部と略省する。）、2e〜2hはランド2b〜2d間に穿っ
た孔で、プリント基板１に重ね合わせたとき孔1g〜1jと
互い違いになるよう配置している。3aは過剰半田、3b〜
3fはクリーム半田、４はクリーム半田を印刷するときに
使用する版、５はプリント基板１上に実装するチップ状
の電気部品、６は熱圧接工法のための熱板、７はその受
け台である。Embodiment Hereinafter, a method of connecting a printed board according to the present invention will be described with reference to the drawings. FIG. 2 illustrates a method of connecting a printed circuit board according to the present invention step by step. 1 is a printed circuit board, 1a is its base material, 1b to 1f are copper foil circuits printed on the base material 1a (hereinafter abbreviated as land portions), 1g to
1j is a hole formed between the lands 1b to 1d, 2 is a flexible printed circuit board (hereinafter abbreviated as FPC), 2a is its base material, 2b to 2d
Is a circuit of a copper foil printed on the base material 2a (hereinafter abbreviated as an FPC land portion), and 2e to 2h are holes formed between the lands 2b to 2d when the printed circuit board 1 is overlaid. The holes 1g to 1j are arranged alternately. 3a is excess solder, 3b ~
3f is cream solder, 4 is a plate used for printing cream solder, 5 is a chip-shaped electric component mounted on the printed circuit board 1, 6 is a hot plate for hot-press welding, and 7 is a cradle thereof. is there.
まず、第２図ａに示すように版４を用いてクリーム半
田3b〜3fをプリント基板１のランド部1b〜1fに印刷す
る。そして第２図ｂに示すようにチップ状の電気部品５
（実際には多数個ある）をランド部1e,1f上に実装して
リフロー炉に通すとクリーム半田3b〜3fが溶け、第２図
ｃに示すようにチップ状の電気部品５は半田付け出来
る。然る後に第２図ｄのようにプリント基板１とFPC2を
それぞれのランド部が重なるように合わせ、この下を受
け台７で保持し、熱板６で加熱してクリーム半田３を再
度溶かし回路の接続を計る。このとき、生じた過剰半田
3aは第２図ｅの断面図に示すように孔1g〜1jもしくは2e
〜2hからはみ出す。そして第２図ｆのように熱板６がFP
C2から離れると冷えて固まり、その表面張力で球状にな
って孔1g〜1jもしくは2e〜2hから落下する。この本発明
のプリント基板の接続装置の全体の構成を第１図に示
す。First, cream solders 3b to 3f are printed on the lands 1b to 1f of the printed circuit board 1 using the plate 4 as shown in FIG. Then, as shown in FIG.
When (there are actually many) mounted on the lands 1e and 1f and passed through a reflow oven, the cream solders 3b to 3f are melted, and the chip-shaped electric component 5 can be soldered as shown in FIG. 2c. . Thereafter, as shown in FIG. 2d, the printed circuit board 1 and the FPC 2 are aligned so that their lands overlap, and the lower portion is held by a pedestal 7 and heated by a hot plate 6 to melt the cream solder 3 again. Measure the connection. At this time, excess solder generated
3a is a hole 1g-1j or 2e as shown in the sectional view of FIG.
Protrudes from ~ 2h. Then, as shown in FIG.
When it separates from C2, it cools and hardens, becomes spherical due to its surface tension, and falls from holes 1g-1j or 2e-2h. FIG. 1 shows the overall configuration of the printed circuit board connection device of the present invention.
発明の効果 以上のように本発明のプリント基板の接続方法および
接続装置を用いれば、第１のプリント基板と屈曲自在な
第２のプリント基板とを熱圧接工法を用いて接続する場
合、過剰半田を前記第１のプリント基板に穿った孔部も
しくは前記屈曲自在な第２のプリント基板に穿った孔部
より排出することにより、接続ランド間のショートサー
キット不良を防止することができる。Effect of the Invention As described above, when the method and the apparatus for connecting a printed circuit board according to the present invention are used, when the first printed circuit board and the flexible second printed circuit board are connected using the hot pressing method, excessive soldering is required. Is discharged from the hole formed in the first printed circuit board or the hole formed in the bendable second printed circuit board, thereby preventing short circuit failure between the connection lands.
第１図は本発明のプリント基板の接続装置を示し、ａは
平面図、ｂはＸ−Ｘ線断面図、ｃはＹ−Ｙ線断面図、第
２図は本発明のプリント基板の接続方法を示す工程説明
図、第３図は従来のプリント基板の接続方法の工程説明
図、第４図はクリーム半田の量の違いによる部品の接続
状態を示す平面図および断面図。 １……プリント基板、２……屈曲自在なプリント基板、
３……クリーム半田、４……クリーム半田の印刷版、５
……チップ状の電気部品、６……熱圧接工法のための熱
板、７……受け台。1 shows a printed circuit board connection device of the present invention, wherein a is a plan view, b is a cross-sectional view taken along line XX, c is a cross-sectional view taken along line YY, and FIG. 2 is a method for connecting a printed circuit board according to the present invention. FIG. 3 is a process explanatory view of a conventional method of connecting a printed circuit board, and FIG. 4 is a plan view and a cross-sectional view showing a connection state of components due to a difference in the amount of cream solder. 1 ... printed circuit board, 2 ... flexible printed circuit board,
3 ... cream solder, 4 ... cream solder printing plate, 5
... Chip-shaped electrical components, 6... Hot plates for hot pressing, 7.
Claims (2)
複数の第１の接続ランド相互間にそれぞれ１乃至複数個
穿った孔を有する第１のプリント基板と、前記第１のプ
リント基板の第１の接続ランドに相対向する複数の第２
の接続ランドを有すると共に、前記第１のプリント基板
の孔を避けかつ第２の接続ランド相互間に１乃至複数個
穿った孔を有する屈曲自在な第２のプリント基板とを備
え、前記記第１のプリント基板のクリーム半田を付着さ
せた第１の接続ランドと前記屈曲自在な第２のプリント
基板の第２の接続ランドとの間を熱圧接工法により半田
接続する際に、過剰半田を前記第１もしくは第２のプリ
ント基板に穿った孔より排出するように構成したことを
特徴とするプリント基板接続装置。1. A first printed circuit board having one or more holes formed between a plurality of first connection lands formed in parallel and having cream solder adhered thereto, and a first printed circuit board of the first printed circuit board. A plurality of second lands facing one connection land
And a bendable second printed circuit board having one or a plurality of holes formed between the second connection lands while avoiding holes in the first printed circuit board. When the solder connection is made between the first connection land of the first printed board to which the cream solder is attached and the second connection land of the bendable second printed board by a hot pressing method, excess solder is removed. A printed circuit board connecting device configured to discharge through a hole formed in a first or second printed circuit board.
リント基板とを熱圧接工法を用いて接続するに際し、前
記第１のプリント基板の所定の接続ランドにクリーム半
田を印刷し、電子部品を搭載してリフロー炉を通し前記
電子部品を半田付け固定した後、クリーム半田を有する
前記第１の接続ランド上に前記第２のプリント基板の第
２の接続ランドを対向させ、加熱圧着させることにより
前記第１の接続ランド上のクリーム半田を溶かして当該
第１と第２の接続ランド間を接続すると共に、過剰半田
を前記第１もしくは第２のプリント基板に穿った孔より
排出することを特徴とするプリント基板の接続方法。2. A method for connecting a first printed circuit board and a flexible second printed circuit board to each other by using a hot pressing method, wherein cream solder is printed on predetermined connection lands of the first printed circuit board. After mounting the components and soldering and fixing the electronic components through a reflow furnace, the second connection lands of the second printed circuit board are opposed to the first connection lands having cream solder, and are heated and pressed. Melting the cream solder on the first connection land to connect the first and second connection lands, and discharging excess solder from a hole formed in the first or second printed circuit board. A method of connecting printed circuit boards, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1067023A JP2754683B2 (en) | 1989-03-17 | 1989-03-17 | Printed circuit board connection device and connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1067023A JP2754683B2 (en) | 1989-03-17 | 1989-03-17 | Printed circuit board connection device and connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02246186A JPH02246186A (en) | 1990-10-01 |
| JP2754683B2 true JP2754683B2 (en) | 1998-05-20 |
Family
ID=13332883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1067023A Expired - Fee Related JP2754683B2 (en) | 1989-03-17 | 1989-03-17 | Printed circuit board connection device and connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2754683B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60201692A (en) * | 1984-03-27 | 1985-10-12 | 日本精機株式会社 | Wiring circuit device |
-
1989
- 1989-03-17 JP JP1067023A patent/JP2754683B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02246186A (en) | 1990-10-01 |
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