JP2752835B2 - Automatic wire feeder for wire bonder - Google Patents

Automatic wire feeder for wire bonder

Info

Publication number
JP2752835B2
JP2752835B2 JP4061632A JP6163292A JP2752835B2 JP 2752835 B2 JP2752835 B2 JP 2752835B2 JP 4061632 A JP4061632 A JP 4061632A JP 6163292 A JP6163292 A JP 6163292A JP 2752835 B2 JP2752835 B2 JP 2752835B2
Authority
JP
Japan
Prior art keywords
wire
bonding head
bonder
automatic
feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4061632A
Other languages
Japanese (ja)
Other versions
JPH06204279A (en
Inventor
信一 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP4061632A priority Critical patent/JP2752835B2/en
Publication of JPH06204279A publication Critical patent/JPH06204279A/en
Application granted granted Critical
Publication of JP2752835B2 publication Critical patent/JP2752835B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は半導体装置の組立に使用
するワイヤボンダのワイヤ自動供給装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic wire feeder for a wire bonder used for assembling a semiconductor device.

【０００２】[0002]

【従来の技術】従来のワイヤボンダのワイヤ自動供給装
置は、図２の正面図に示すように、ワイヤスプール３を
ボンダー本体に固定されたモーター６の軸に取り付け、
モーター６を回転させる事によりワイヤ２を自動的にボ
ンディングヘッド１へくり出していた。すなわち、ボン
ディングヘッド１は、キャピラリー１ａを取り付けたホ
ーン１ｂを備え、ワイヤ２はワイヤスプール３からワイ
ヤ振れ防止リング１ｄ及びクランパ１ｃを経てキャピラ
リ１ａに供給されていた。2. Description of the Related Art As shown in a front view of FIG. 2, a conventional automatic wire bonder for a wire bonder attaches a wire spool 3 to a shaft of a motor 6 fixed to a bonder body.
By rotating the motor 6, the wire 2 is automatically drawn out to the bonding head 1. That is, the bonding head 1 was provided with a horn 1b to which a capillary 1a was attached, and the wire 2 was supplied from the wire spool 3 to the capillary 1a via the wire deflection preventing ring 1d and the clamper 1c.

【０００３】[0003]

【発明が解決しようとする課題】この従来のワイヤ自動
供給装置では、ワイヤをくり出すモータが固定されてい
るためにボンディングヘッドがＸ軸方向と平行に左右へ
大きく移動してボンディングを行う際、ワイヤのくり出
し方向が図２のように正面から見てボンディングヘッド
と直線関係にならないためワイヤに余分なストレスがか
かり、ボンディングワイヤの曲り等が発生するという問
題点があった。In this conventional automatic wire feeder, when the bonding head is largely moved to the left and right in parallel with the X-axis direction to perform bonding since the motor for feeding the wire is fixed. As shown in FIG. 2, the direction in which the wire is drawn out does not have a linear relationship with the bonding head when viewed from the front, so that extra stress is applied to the wire, causing a problem such as bending of the bonding wire.

【０００４】[0004]

【課題を解決するための手段】本発明のワイヤ自動供給
装置は、ワイヤスプールを回転させるモーターを取りつ
けたナットと、このナットにねじ込み、ナットを移動さ
せるためのねじと、このねじを回転させナットを移動さ
せるモーターとを備え、ボンディングヘッドの移動位置
情報に基づいてナットを移動させるモーターを制御する
構成を有する。According to the present invention, there is provided an automatic wire feeding apparatus comprising: a nut having a motor for rotating a wire spool; a screw for screwing into the nut to move the nut; and a nut for rotating the screw. And a motor for moving the nut based on the moving position information of the bonding head.

【０００５】[0005]

【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例のワイヤ自動供給装置を示
す図で、同図（ａ）は正面図，同図（ｂ）は側面図であ
る。ワイヤスプール３は回転用モータ４の軸に取りつけ
られ、そのモーター４はナット７に取り付けられ、移動
用モーター６を回転させることによりねじ５が回転し、
ナット７と共にワイヤスプール３はボンディングヘッド
のＸ軸方向と平行に左右に移動する。ボンディングヘッ
ド１がボンディング動作のために左右に移動する位置情
報をモーター６にフィードバックしてねじ５を回転さ
せ、ワイヤスプール３を動かす事により常にワイヤ２の
くり出し方向とボンディングヘッドが図１（ａ）のよう
に正面から見て直線関係になる様にする事ができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a view showing an automatic wire feeder according to an embodiment of the present invention, wherein FIG. 1 (a) is a front view and FIG. 1 (b) is a side view. The wire spool 3 is attached to a shaft of a rotation motor 4, the motor 4 is attached to a nut 7, and the screw 5 is rotated by rotating the movement motor 6,
The wire spool 3 moves right and left along with the nut 7 in parallel with the X-axis direction of the bonding head. Position information of the bonding head 1 moving to the left and right for the bonding operation is fed back to the motor 6 to rotate the screw 5 and move the wire spool 3 so that the direction in which the wire 2 is drawn out and the bonding head always move as shown in FIG. It can be made to have a linear relationship when viewed from the front as shown in FIG.

【０００６】[0006]

【発明の効果】以上説明したように本発明は、ワイヤス
プールをボンディングヘッドの動きに合せて移動させる
事により、ワイヤとボンディングヘッドの直線関係を常
に保つ事ができるようになり、ワイヤに不要なストレス
をかける事がなくなるのでワイヤの曲りを防止できると
いう効果を有する。As described above, according to the present invention, the linear relationship between the wire and the bonding head can be always maintained by moving the wire spool in accordance with the movement of the bonding head. Since there is no need to apply stress, there is an effect that bending of the wire can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例を示す図で、同図（ａ）は正
面図，同図（ｂ）は側面図である。FIG. 1 is a view showing an embodiment of the present invention, wherein FIG. 1 (a) is a front view and FIG. 1 (b) is a side view.

【図２】従来のワイヤ自動供給装置の正面図である。FIG. 2 is a front view of a conventional automatic wire feeder.

【符号の説明】[Explanation of symbols]

１ ボンディングヘッド １ａ キャピラリ １ｂ ホーン １ｃ クランパ １ｄ ワイヤ振れ防止リング ２ ワイヤ ３ ワイヤスプール ４ 回転モーター ５ ねじ ６ 移動用モーター ７ ナット DESCRIPTION OF SYMBOLS 1 Bonding head 1a Capillary 1b Horn 1c Clamper 1d Wire runout prevention ring 2 Wire 3 Wire spool 4 Rotary motor 5 Screw 6 Moving motor 7 Nut

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 ワイヤスプールを回転させワイヤをボン
ディングヘッドに供給する駆動部を有するワイヤボンダ
のワイヤ自動供給装置において、ボンディングヘッドの
移動位置情報に基づきワイヤスプールをその駆動部と共
にボンディングヘッドのＸ軸方向と平行に動かす駆動部
を有する事を特徴とするワイヤボンダのワイヤ自動供給
装置。An automatic wire feeder for a wire bonder having a drive unit for rotating a wire spool and supplying a wire to a bonding head, wherein the wire spool is moved together with the drive unit in the X-axis direction of the bonding head based on movement position information of the bonding head. An automatic wire feeder for a wire bonder, comprising a driving unit that moves in parallel with the wire.
JP4061632A 1992-03-18 1992-03-18 Automatic wire feeder for wire bonder Expired - Lifetime JP2752835B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4061632A JP2752835B2 (en) 1992-03-18 1992-03-18 Automatic wire feeder for wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4061632A JP2752835B2 (en) 1992-03-18 1992-03-18 Automatic wire feeder for wire bonder

Publications (2)

Publication Number Publication Date
JPH06204279A JPH06204279A (en) 1994-07-22
JP2752835B2 true JP2752835B2 (en) 1998-05-18

Family

ID=13176769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4061632A Expired - Lifetime JP2752835B2 (en) 1992-03-18 1992-03-18 Automatic wire feeder for wire bonder

Country Status (1)

Country Link
JP (1) JP2752835B2 (en)

Also Published As

Publication number Publication date
JPH06204279A (en) 1994-07-22

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19980127