JP2734663B2 - Exterior method of capacitor - Google Patents
Exterior method of capacitorInfo
- Publication number
- JP2734663B2 JP2734663B2 JP1200551A JP20055189A JP2734663B2 JP 2734663 B2 JP2734663 B2 JP 2734663B2 JP 1200551 A JP1200551 A JP 1200551A JP 20055189 A JP20055189 A JP 20055189A JP 2734663 B2 JP2734663 B2 JP 2734663B2
- Authority
- JP
- Japan
- Prior art keywords
- film capacitor
- curable resin
- ultraviolet
- film
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明はコンデンサ、特に積層形コンデンサの外装方
法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging a capacitor, particularly a multilayer capacitor.
従来の技術 近年、電子機器や電気機器の小形化、薄型化および高
密度化に伴って、電子部品のチップ化および面実装化が
進められている。2. Description of the Related Art In recent years, as electronic devices and electric devices have become smaller, thinner, and denser, electronic components have been formed into chips and surface mounted.
チップ型のコンデンサとしては、これまでセラミック
コンデンサや固体電解コンデンサが広く使用されてい
る。Ceramic capacitors and solid electrolytic capacitors have been widely used as chip-type capacitors.
一方、フィルムコンデンサにおいても、ポリフェニレ
ンサルファイドフィルムを誘電体に用いた、耐熱性のよ
いチップ状の積層形フィルムコンデンサが開発され、は
んだ付け時の温度にも十分に耐え得るようになった。そ
して、セラミックコンデンサや電解コンデンサに比べて
電気特性と信頼性とが優れていることもあって、チップ
状フィルムコンデンサも急速に普及して来ている。On the other hand, in the case of a film capacitor, a chip-shaped laminated film capacitor having good heat resistance using a polyphenylene sulfide film as a dielectric has been developed, and has become able to withstand the temperature during soldering sufficiently. Further, chip-type film capacitors are rapidly spreading because of their excellent electrical characteristics and reliability as compared with ceramic capacitors and electrolytic capacitors.
第３図は従来のトランスファー成形によるチップフィ
ルムコンデンサの外装方法を説明するための工程斜視図
である。FIG. 3 is a process perspective view for explaining a conventional method of packaging a chip film capacitor by transfer molding.
この方法では、図に示すように、コムリード41にチッ
プフィルムコンデンサ素子42の外部電極43,44を溶接し
て多連状にした後、モールド上金型45と下金型46の素子
収納部47（図では上金型45側の素子収納部は示されてい
ない）にチップフィルムコンデンサ素子42をそれぞれ配
置し、両金型45,46を合わせる。次に、ホッパー48に入
れてある粉体エポキシ樹脂49をポッド50に移し、それを
溶融させた後、プランジャー51で60〜90kg/cm2の圧力を
加えてエポキシ樹脂49を素子収納部47に充填し硬化させ
る。このようにして外装されたチップフィルムコンデン
サ52が得られる。In this method, as shown in the figure, after the external electrodes 43 and 44 of the chip film capacitor element 42 are welded to the comb lead 41 to form a multiple series, the element housing portions of the upper mold 45 and the lower mold 46 are molded. The chip film capacitor elements 42 are respectively arranged in 47 (the element housing portion on the upper mold 45 side is not shown in the figure), and the two molds 45 and 46 are combined. Next, the powdered epoxy resin 49 put in the hopper 48 is transferred to the pod 50, and after melting it, a pressure of 60 to 90 kg / cm 2 is applied by the plunger 51 to put the epoxy resin 49 into the element housing 47. Fill and cure. The chip film capacitor 52 thus packaged is obtained.
樹脂は、ポッド50および両金型45,46を150〜180℃程
度に加温することで、溶融，硬化させる。The resin is melted and hardened by heating the pod 50 and the molds 45 and 46 to about 150 to 180 ° C.
第４図は上述のようにして作製されたチップフィルム
コンデンサ52の一部破断斜視図である。FIG. 4 is a partially cutaway perspective view of the chip film capacitor 52 manufactured as described above.
チップフィルムコンデンサ素子42はコムリード41によ
る電極53（他方の電極43に接続されている電極は図示さ
れていない）を有し、エポキシ樹脂による外装体54で覆
われている。The chip film capacitor element 42 has an electrode 53 formed by a comb lead 41 (an electrode connected to the other electrode 43 is not shown), and is covered with an exterior body 54 made of epoxy resin.
このトランスファー成形で得られる製品の特徴は、外
形寸法の精度がよく、そのばらつきの小さいことであ
る。これは金型の素子収納部寸法で製品の外形寸法が決
定されることによる。The feature of the product obtained by this transfer molding is that the external dimensions are accurate and the variation is small. This is because the outer dimensions of the product are determined by the dimensions of the element housing portion of the mold.
発明が解決しようとする課題 しかしながら、この従来の方法によれば、第４図に示
す外装体54の厚みt2が0.3〜0.5mmと厚く、しかもその六
面すべてが外装体54により覆われていることから、製品
寸法に占める外装体54の厚みの割合が大きくなり、小形
化を妨げる要因となっている。SUMMARY OF THE INVENTION However, according to this conventional method, increasing the thickness t 2 of the outer body 54 shown in FIG. 4 is a 0.3 to 0.5 mm, moreover six surfaces, all of which are covered by the outer package 54 Therefore, the ratio of the thickness of the exterior body 54 to the product dimensions increases, which is a factor that hinders downsizing.
また、製造コスト的にも、その製造設備が高価であ
り、電力料金をはじめとするランニングコストも割高に
なっている。Further, in terms of manufacturing cost, the manufacturing equipment is expensive, and running costs including electric power charges are also expensive.
このように、トランスファー成形により外装体を形成
するという方法では、チップフィルムコンデンサの小形
化が非常に困難で、セラミックコンデンサなどの他のコ
ンデンサに比べて形状が大きくなり、また、その製造コ
ストが高いので、他のコンデンサよりも単価が高くなら
ざるを得ないのが実情である。As described above, in the method of forming the exterior body by transfer molding, it is very difficult to reduce the size of the chip film capacitor, the shape becomes larger than other capacitors such as a ceramic capacitor, and the manufacturing cost is high. Therefore, the unit price must be higher than other capacitors.
本発明は、チップフィルムコンデンサを従来品より小
形化し、かつ安価に製造することができる方法を提供し
ようとするものである。An object of the present invention is to provide a method capable of manufacturing a chip film capacitor smaller than conventional products and at a lower cost.
課題を解決するための手段 本発明のコンデンサの外装方法は、積層形フィルムコ
ンデンサ素子の切断面に紫外線硬化樹脂を塗布し、支持
体をその紫外線硬化樹脂に接触させて配置し、紫外線硬
化樹脂を硬化させ、この硬化した紫外線硬化樹脂膜を、
支持体と紫外線硬化樹脂膜の界面で剥離させて、切断面
に紫外線硬化樹脂外装体を有する積層形フィルムコンデ
ンサ素子を形成する方法である。Means for Solving the Problems The method for packaging a capacitor of the present invention comprises applying a UV curable resin to a cut surface of a laminated film capacitor element, placing a support in contact with the UV curable resin, and disposing the UV curable resin. Cured, and the cured ultraviolet curable resin film,
This is a method in which a laminated film capacitor element having a UV curable resin outer package on the cut surface is formed by peeling off at the interface between the support and the UV curable resin film.
作用 本発明の外装方法においては、積層フィルムコンデン
サ素子の切断面上の外装体が転写されることによって形
成される。したがって、その外装体の厚みは0.001〜0.1
5mmと非常に薄く形成することが可能となり、製品外形
寸法がほぼ素子寸法と同じくなる。In the packaging method of the present invention, the packaging body is formed by transferring the packaging body on the cut surface of the multilayer film capacitor element. Therefore, the thickness of the outer body is 0.001-0.1
It can be formed as thin as 5 mm, and the external dimensions of the product are almost the same as the element dimensions.
実施例 以下、本発明の方法の実施例について、図面を参照し
ながら説明する。Examples Hereinafter, examples of the method of the present invention will be described with reference to the drawings.
第１図は、チップフィルムコンデンサ素子の切断面に
紫外線硬化樹脂を用いて外装する工程の一例を示す斜視
図である。FIG. 1 is a perspective view showing an example of a step of packaging a cut surface of a chip film capacitor element using an ultraviolet curing resin.
積層フィルムコンデンサ素子の切断面４の上に、ゴム
ローラー８などを用いて紫外線硬化樹脂９を所定の厚さ
に塗布して、紫外線硬化樹脂６を形成する。それから、
支持体として連続した紫外線透過性のフィルムシート１
の上に紫外線硬化樹脂膜６とが接触する様にフィルムシ
ート１と切断面４を平行に取りつけ、フィルムシート１
の素子３取り付け面側とは反対側から紫外線ランプ５に
より紫外線を照射して、紫外線硬化樹脂膜６と空気中の
O2との反応を抑え、紫外線硬化樹脂膜６の硬化を促進さ
せて、すばやく紫外線硬化樹脂膜を硬化させる。そし
て、フィルムシート１と紫外線硬化樹脂膜６との界面で
剥離させて、フィルムコンデンサ素子３をフィルムシー
ト１から取り外す。これによりフィルムコンデンサ素子
３の一方の切断面４に紫外線硬化樹脂からなる外装体７
が形成される。そして他方の切断面２についても同様に
して外装体を付与する。On the cut surface 4 of the multilayer film capacitor element, an ultraviolet curable resin 9 is applied to a predetermined thickness using a rubber roller 8 or the like to form an ultraviolet curable resin 6. then,
Continuous UV-permeable film sheet 1 as support
The film sheet 1 and the cut surface 4 are attached in parallel so that the ultraviolet curable resin film 6 comes into contact with the
UV light is irradiated from the side opposite to the surface on which the element 3 is mounted by the UV lamp 5 so that the UV curable resin film 6 and the air
The reaction with O 2 is suppressed, the curing of the ultraviolet-curable resin film 6 is accelerated, and the ultraviolet-curable resin film is quickly cured. Then, the film capacitor element 3 is detached from the film sheet 1 by peeling off at the interface between the film sheet 1 and the ultraviolet curable resin film 6. As a result, the exterior body 7 made of an ultraviolet curable resin
Is formed. Then, the exterior body is similarly applied to the other cut surface 2.
なお、フィルムシート１として紫外線を１％以上透過
するものであればよく、その形状も長尺であってもよ
い。The film sheet 1 only needs to transmit 1% or more of ultraviolet rays, and may have a long shape.
さらに、フィルムシートに代えて紫外線透過性の薄い
板状体を使用してもよい。Further, instead of the film sheet, a thin ultraviolet-transparent thin plate may be used.
さらに、支持体１は、切断面2,4よりも表面エネルギ
ーが高いものを使用する。Further, the support 1 has a higher surface energy than the cut surfaces 2 and 4.
第２図に上述の実施例によるチップフィルムコンデン
サの構造を示す。FIG. 2 shows the structure of the chip film capacitor according to the above embodiment.
このフィルムコンデンサ11はフィルムコンデンサ素子
３の切断面2,4にそれぞれ薄い外装体7,12が付与されて
いる。なお、13,14はフィルムコンデンサ11の外部電極
である。This film capacitor 11 is provided with thin exterior bodies 7 and 12 on the cut surfaces 2 and 4 of the film capacitor element 3, respectively. In addition, 13 and 14 are external electrodes of the film capacitor 11.
上記外装体7,12の厚みt1は0.001mm〜0.15mmとするこ
とができ、その形状は従来のトランスファー成形で得ら
れる製品に比べると、容積比で20％〜60％と大幅に小形
化される。これは、将来、フィルムコンデンサ素子がよ
り一層小形化される場合には、本発明の方法は非常に有
効である。The thickness t 1 of the outer body 7, 12 may be a 0.001Mm～0.15Mm, when the shape is compared to the product obtained by the conventional transfer molding, 20% to 60% by volume and greatly downsized Is done. This means that the method of the present invention is very effective if the film capacitor element is to be further miniaturized in the future.
そして、実施のための設備は、トランスファー成形装
置に比べて非常に簡単で、かつ小形でよく、さらに外装
体形成に要する材料も少なくて済むため、ランニングコ
ストが低減され、安価なチップフィルムコンデンサを得
ることができる。And the equipment for implementation is very simple and small in size compared to the transfer molding apparatus, and furthermore, the material required for forming the outer package can be reduced, so that the running cost is reduced and an inexpensive chip film capacitor can be manufactured. Obtainable.
発明の効果 本発明の方法によれば、フィルムコンデンサを大幅に
小形化ができ、しかもそれを実施するための設備がトラ
ンスファー法による場合に比べて非常に簡単でよく、し
かも生産ランニングコストが安価で、量生産も向上させ
ることができる。According to the method of the present invention, the film capacitor can be significantly reduced in size, and the equipment for carrying out the method can be much simpler than in the case of the transfer method, and the production running cost is low. , Mass production can also be improved.
第１図は本発明のフィルムコンデンサの外装方法の一実
施例における要部工程を示す斜視図、第２図は同実施例
で得られるフィルムコンデンサの一部破断斜視図、第３
図は従来のフィルムコンデンサの外装方法を示す工程斜
視図、第４図は同従来法で得られたフィルムコンデンサ
の一部破断斜視図である。 １……フィルムシート、2,4……切断面、３……フィル
ムコンデンサ素子、５……紫外線ランプ、６……紫外線
硬化樹脂膜、７……外装体、８……ゴムローラー、９…
…紫外線硬化樹脂。FIG. 1 is a perspective view showing an essential step in one embodiment of a method for packaging a film capacitor of the present invention, FIG. 2 is a partially cutaway perspective view of a film capacitor obtained in the embodiment, FIG.
FIG. 4 is a perspective view showing a process of a conventional method for packaging a film capacitor, and FIG. 4 is a partially broken perspective view of a film capacitor obtained by the conventional method. DESCRIPTION OF SYMBOLS 1 ... Film sheet, 2,4 ... Cut surface, 3 ... Film capacitor element, 5 ... Ultraviolet lamp, 6 ... Ultraviolet curable resin film, 7 ... Outer body, 8 ... Rubber roller, 9 ...
... UV curable resin.
Claims (1)
外装部材である紫外線硬化樹脂を塗布する工程と、支持
体を前記紫外線硬化樹脂の塗布膜上に接触させて配置す
る工程と、前記紫外線硬化樹脂を紫外線照射により硬化
させた後、前記紫外線硬化樹脂を前記支持体との界面で
剥離させ、前記切断面に紫外線硬化樹脂外装体を有する
積層形フィルムコンデンサ素子を形成する工程とを有す
るコンデンサの外装方法。A step of applying an ultraviolet curable resin as an exterior member to a cut surface of the laminated film capacitor element; a step of placing a support in contact with the applied film of the ultraviolet curable resin; Curing the resin by irradiation with ultraviolet light, peeling the ultraviolet-curable resin at the interface with the support, and forming a laminated film capacitor element having an ultraviolet-curable resin outer package on the cut surface. Exterior method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1200551A JP2734663B2 (en) | 1989-08-01 | 1989-08-01 | Exterior method of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1200551A JP2734663B2 (en) | 1989-08-01 | 1989-08-01 | Exterior method of capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0364012A JPH0364012A (en) | 1991-03-19 |
| JP2734663B2 true JP2734663B2 (en) | 1998-04-02 |
Family
ID=16426194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1200551A Expired - Lifetime JP2734663B2 (en) | 1989-08-01 | 1989-08-01 | Exterior method of capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2734663B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2683087A1 (en) * | 1991-10-29 | 1993-04-30 | Europ Composants Electron | Method of producing a capacitor with non-encapsulated layers |
| AT2273U1 (en) * | 1997-07-18 | 1998-08-25 | Swarovski & Co | CAVE JEWELERY |
-
1989
- 1989-08-01 JP JP1200551A patent/JP2734663B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0364012A (en) | 1991-03-19 |
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