CN103035589B - Sheet molded core chip size package - Google Patents

Sheet molded core chip size package Download PDF

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Publication number
CN103035589B
CN103035589B CN201210378005.9A CN201210378005A CN103035589B CN 103035589 B CN103035589 B CN 103035589B CN 201210378005 A CN201210378005 A CN 201210378005A CN 103035589 B CN103035589 B CN 103035589B
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CN
China
Prior art keywords
packaging material
nude film
conductive post
equipment
direct
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CN201210378005.9A
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Chinese (zh)
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CN103035589A (en
Inventor
弗兰克·J·尤斯基
保罗·班茨
奥托·贝格尔
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Qorvo US Inc
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Triquint Semiconductor Inc
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Publication date
Priority claimed from US13/252,083 external-priority patent/US8487435B2/en
Application filed by Triquint Semiconductor Inc filed Critical Triquint Semiconductor Inc
Publication of CN103035589A publication Critical patent/CN103035589A/en
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Publication of CN103035589B publication Critical patent/CN103035589B/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods

Abstract

The invention discloses a kind of sheet molded core chip size package.Embodiment includes but not limited to include the equipment of microelectronic device and system, and this microelectronic device includes: nude film, has first surface and the second surface relative with first surface;Conductive post, is formed on the first surface of nude film;And packaging material, pack nude film, including side surface at least some of covering first surface, second surface and conductive post.Also describe the method for manufacturing this microelectronic device.

Description

Sheet molded core chip size package
To Cross-Reference to Related Applications
The application submits to and the U.S. of entitled " linerless bottom package " JIUYUE in 2008 on the 9th The part continuity application that state's patent application the 12/207th, 206, entire contents and disclosure are by quoting It is herein incorporated.
Technical field
Embodiments of the invention relate generally to microelectronic device, and more particularly, to including not having With module and the device of nude film of carrier substrates encapsulation.
Background technology
Under the current state of integrated circuit technique, IC apparatus is generally by for nude film or chip Form.One or more nude films will be installed in carrier substrates sometimes to form encapsulation.Although carrier Substrate is suitably adapted for multiple application, but which increases size of population and the cost of encapsulation.
Summary of the invention
It relates to a kind of microelectronic device including sheet molded core chip size package and manufacture process thereof. Disclosed microelectronic device includes: nude film, has first surface and relative with first surface second Surface;Conductive post, is formed on the first surface of nude film;And packaging material.This packaging material bag Dress nude film so that packaging material cover the side surface of first surface, second surface and conductive post extremely A few part.Here, packaging material are formed by the first of packaging material and second of packaging material. The first of packaging material is attached to the second surface of nude film.Second of packaging material is laminated to nude film First surface on so that the side surface of nude film and conductive post be packaged in packaging at least partially In material.The first of packaging material and the second of packaging material first at packaging material and bag Second place contacted with each other of package material is fused.
Accompanying drawing explanation
Embodiments of the invention will be easy to understand according to following detailed description of the accompanying drawings.For Being conducive to this description, identical reference represents identical structural detail.Embodiments of the invention The diagram of accompanying drawing illustrates not as restriction as example.
Fig. 1 show each embodiment according to the present invention, include the micro-of sheet molded core chip size package The cross-sectional side view of electronic installation, this microelectronic device has nude film, the conduction being formed on nude film Post and packaging nude film and the packaging material of conductive post.
Fig. 2 show each embodiment according to the present invention, include the another of sheet molded core chip size package The cross-sectional side view of one microelectronic device, this microelectronic device has nude film, is formed on nude film Conductive post and packaging nude film and the packaging material of conductive post, wherein, the surface of packaging material is in conduction Below the height of the end of post.
Fig. 3 show each embodiment according to the present invention, include the another of sheet molded core chip size package The cross-sectional side view of one microelectronic device, this microelectronic device has nude film, is formed on nude film Conductive post and packaging nude film and the packaging material of conductive post, wherein, packaging material include that conductive post is attached Near depression.
Fig. 4 show each embodiment according to the present invention, include the another of sheet molded core chip size package The cross-sectional side view of one microelectronic device, this microelectronic device has nude film, other parts, formation Conductive post on nude film and packaging nude film, other parts and the packaging material of conductive post.
Fig. 5 A to 5H show each embodiment according to the present invention, for manufacture include sheet mould Each stage of the method for the microelectronic device of coremaking chip size package, this microelectronic device have nude film, The conductive post that is formed on nude film and packaging nude film and the packaging material of conductive post.
Fig. 6 show each embodiment according to the present invention, be associated with the most such as Fig. 1 to 4 The block diagram of the system of the one or more microelectronic device in shown device.
Detailed description of the invention
In the following detailed description, with reference to the accompanying drawing of the part constituting this detailed description, in the accompanying drawings, Identical reference represents identical part all the time, and in the accompanying drawings, by the present invention can be put into practice Explanation embodiment illustrate.Should be understood that available other embodiments, and without departing substantially from this Structure or logical changes can be carried out in the case of the scope of invention.Therefore, described in detail below not with Restrictive, sense is carried out, and according to an embodiment of the invention scope by claims and Equivalent limits.
Various operations and then can be described in the way of can help to understand embodiments of the invention For multiple discrete operations;But, the order of description is not necessarily to be construed as implying that these operations are to rely on In order.It addition, some embodiments can include operation more more or less of than describable operation.
Description can use phrase " in one embodiment ", " in an embodiment ", " in certain embodiments ", Or " in various embodiments ", these phrases each may refer to identical or different embodiment In one or more.Additionally, the term used about embodiments of the invention " includes ", " tool Have " etc. be synonym.
Term can be used herein " be coupled to " together with its derivative words." couple " can represent following in One or more." couple " and two or more element direct physical or electrical contacts can be represented.So And, " coupling " also can represent that two or more interelement ground connection contact with each other, but assists the most each other Make or interactively with each other, and other element one or more coupling can be represented or be connected to it is said that each other Between the element of coupling.
Can be used herein term " be formed at ... on " together with its derivative words." being formed at " its Its layer " on " layer context in " be formed at ... on " can represent that layer is formed at other layer (example As, can be inserted into other layer one or more between layers) on, but not necessarily direct with this layer Physically or electrically contact.But, in certain embodiments, and " be formed at ... on " can represent layer and its At least some of direct physical contact of the top surface of its layer.Such as " top " and the term of " bottom " Use be for assisting understanding, and they should not be construed as the restriction to disclosure.
As used herein term " active surface " may refer to have active region the nude film in district Surface, this is known for a person skilled in the art.The active surface of nude film can include various electricity Any one or more in circuit unit, such as transistor, memory cell, passive component etc..
For the purpose of the present invention, phrase " A/B " represents A or B.Phrase " A and/or B " table Show " (A), (B) or | (A and B) ".Phrase " at least one in A, B and C " expression " (A), (B), (C), (A and B), (A and C), (B and C) or (A, B and C) ".Phrase " (A) B " expression " (B) or (AB) ", i.e. A is optional element.
Each embodiment of the present invention relates to microelectronic device, and this microelectronic device includes: nude film, tool There are first surface and the second surface relative with first surface;Conductive post, is formed at the first table of nude film On face;And such as molding material and/or the packaging material of wafer-coated with resins, this packaging material bag Fill this nude film, including at least the one of the side surface on the first and second surfaces and conductive post covering nude film Part.In various embodiments, the first end of conductive post may be formed on the first surface of nude film, and And solder bump can be with the second end direct-coupling of conductive post.Therefore, in various embodiments, microelectronics Device can be wafer-level package or module.
Fig. 1 shows the cross-sectional side view of example microelectronic device 100.As shown, Microelectronic device 100 (also referred to as " device 100 ") includes at least one nude film 102, and this is at least one years old Individual nude film 102 includes first surface 104 and the second surface 106 relative with first surface 104.Many Individual conductive post 108 may be formed on first surface 104, and such as moulds the packaging material of material 110 side surfaces 112 that can cover first surface 104, second surface 106 and conductive post 108 At least partially, to pack nude film 102 and conductive post 108, thus formed or initially form chip-scale Encapsulation or module.
First surface 104 can be active surface.Although active surface is illustrated by shown embodiment For spreading the whole width of nude film 102, but in alternative embodiment, active surface 104 can spread Whole width less than nude film 102.
First end 116 of conductive post 108 can with first surface 104 direct-coupling of nude film 102, and And at least the second end 118 of conductive post 108 can be outside packaging material 110.As shown, Solder bump 114 can be with the second end 118 direct-coupling of conductive post 108.Solder bump 114 can be via biography Guide pillar 108 provides the electrical connection with nude film 102.In various embodiments, device 100 can pass through back Stream solder bump 114 couples with the system level board of the most such as printed circuit board (PCB).
In certain embodiments, conductive post 108 includes copper.Other conduction material can be suitable similarly 's.
Packaging material 110 can be molding material.Molding material is sometimes referred to as " molding in the art Compound ", and this purpose, any electric insulation packing timber well known in the art can be suitable for Material.Such as, molding material can be epoxy material.But, in various other embodiments, molding Material can be the one in plastics, pottery, glass etc..
As shown in Figures 1 to 3, packaging material 110 may be included on the second surface 106 of nude film 102 , the first 122 of packaging material 110 and the side table in first surface 104 and conductive post 108 Face 112 at least some of on, second 124 of packaging material 110.First 122 He Pack nude film 102 and conductive post 108 together for second 124, to form or to initially form chip-scale envelope Dress or module.It should be noted that the one or more operations to device 100 be no matter during constructing or After this, all can cause first 122 and second 124 become engaging so that sheet 122,124 Do not repartition or substantially the same.Such as, heat, vacuum or pressure can have sheet 122,124 The effect fused together.
As shown in Figures 2 and 3, the part of the side surface 112 of conductive post 108 can be at packaging material 210 (sheets 222,224), 310 | outside (sheet 322,324), so that solder bump 214 and side Those part direct-couplings on surface 112.For the device 200 shown in Fig. 2, packaging material 210 The surface of second 224 below the height of the second end 118 of conductive post 108 so that side table The part in face 112 is outside packaging material 210, thus allows solder bump 214 as shown Those part direct-couplings with side surface 112.In other embodiments, as shown in Fig. 3 Shown by device 300, second end of removable (such as passing through laser ablation) conductive post 108 The packaging material 310 in district 320 near 118, to form depression so that the side of conductive post 108 The part on surface 112 is outside packaging material 310, thus allows solder bump as shown 314 with those part direct-couplings of side surface 112.
Fig. 4 shows another example of the microelectronic device 400 according to each embodiment.As shown As, device 400 includes at least one nude film 102 and at least one other parts 426.One Or multiple conductive post 108 may be formed at the of the first surface 104 of nude film 102 and other parts 426 On one surface 428, and packaging material 422,424 can cover first surface 104,428, and second The side surface 112 of surface 106,430 and conductive post 108 at least some of, to pack nude film 102, other parts 426 and conductive post 108, thus formed or initially form wafer-level package or mould Block.Solder bump 114 can as shown with the second end 118 direct-coupling of conductive post 108.
Other parts 426 can be passive device, the most such as resistor, inducer, diode, Low pass filter, surface acoustic wave (SAW) or bulk acoustic wave (BAW) device or capacitor.? In some embodiments, other parts 426 can be another nude film.
In Fig. 5 A to 5H, respectively by regarding in the cross-sectional side of the device in each stage of method Illustrate for forming the most such as Fig. 1 to the device 100,200,300 or 400 shown in 4 The exemplary method of microelectronic device.It should be noted that each operation that discussed and/or diagram is typically entered And can be described as multiple discrete operation, to help to understand embodiments of the invention.The order described should not It is construed as to imply that these operations are to rely on order, unless explicitly stated otherwise.It addition, some embodiments Operation more more or less of than describable operation can be included.
As shown in Figure 5A, it is provided with and includes the nude film 102 of first surface 104.First surface 104 It can be active surface.
In figure 5b, conductive post 108 is formed on first surface 104.As discussed herein, Conductive post 108 can include copper or other suitable material.
In certain embodiments, optional protective layer (the most not shown) may be formed at conductive post 108 Top surface on.Protective layer can be at other stage quilt of method (as discussed more fully below) Remove, and therefore protective layer can be selected to be readily removable or remove with minimum cost Material.Usually, protective layer can be used for protecting conductive post from exposing (such as to conduction Oxidation or the damage of the top surface of post 108 minimize).Although usually any materials is suitably adapted for shape Become protective layer, but in certain embodiments, stannum can be suitable selection.Other material can be similar to Ground is suitable.
In figure 5 c, the one or more firsts that can be placed in packaging material in nude film 102 On 122, so that first 122 covers the second surface 106 of nude film 102.The most suitable load Body 532 can be used for beneficially disposing the first 122 of packaging material and nude film 102.
Before nude film 102 is placed on first 122, can be to the first 122 of packaging material Heating, so that packaging material become sticky, this can be conducive to nude film 102 is adhered to first 122。
In various embodiments, in addition to for molding material, first 122 is alternately interim Adhesive film, to temporarily hold nude film 102 in position during one or more operations subsequently. In these embodiments, packaging material can be formed in such as the following operation subsequently that will be discussed more fully below On the second surface 106 of nude film 102.Temporary adhesive attachment film can be when being heated on specified temp Time from nude film 102 depart from heat depart from temporary bands.
In certain embodiments, in addition to nude film 102, at least one other parts also can be set, As referring herein to described in Fig. 4.
Second 124 of packaging material may be formed on nude film 102, as shown in Figure 5 D, so that Being packaged at least partially in packaging material of side surface 112 of nude film 102 and conductive post 108.
Second 124 of packaging material can be formed at by any suitable method nude film 102 it On, these methods include but not limited to lamination.As shown in Figure 5 D, press section 534 can be by packing timber Second 124 pressing layer of material are pressed onto on nude film 102.Pressing lamination can be under vacuum and/or heating Performing, this can provide tight or the most void-free lamination in certain embodiments.
In other embodiments, second 124 can as shown in fig. 5e as rolled by cylinder 536 Dynamic lamination.Rolling lamination to perform under vacuum and/or heating, this can provide in certain embodiments Void-free or the most void-free lamination.
After being laminated to second 124 on nude film, curing operation can be performed to solidify packing timber Material.
As illustrated in figure 5f, second 124 of packaging material can be formed such that conductive post 108 Second end 118 is no longer exposed.In order to expose the second end 118 of conductive post 108, removable second A part for sheet 124 is to expose the second end 118.In certain embodiments, such as, such as Fig. 2 or figure Shown in 3, also can expose the part of the side surface 112 of conductive post 108.Laser ablation can be passed through or grind Mill or other suitable method perform the removal of the part of second 124.For removal second During the operation with the second end 118 of exposure conductive post 108 of the part of sheet 124, it may be desirable to remove The second a small amount of end 118 of conductive post 108 is to provide clean smooth surface, it is done so that be not Required.
In certain embodiments, when being initially formed, the thickness of second 124 of packaging material can be controlled Degree, so that not covering the second end 118 of conductive post 108.Such as, second 124 is formed as The surface making second 124 is neat with the second end 118 phase, as depicted in fig. 5g, or is formed as The surface making second 124 is less than the height of the second end 118, as shown in Figure 2.
It is the embodiment of temporary adhesive attachment film for first 122, assembly can be heated to temporary adhesive attachment film Disengaging temperature on, to depart from nude film 102 from first 122.The second surface 106 of nude film 102 Then can be covered by packaging material.In various embodiments, the second surface 106 of nude film 102 can make By suitable method (such as, such as one of those methods shown in Fig. 5 D or Fig. 5 E) by moulding Material covers.In various embodiments, the second surface 106 of nude film 102 can pass through silk screen printing Or other suitable operation is covered by wafer coated with resins.
Solder bump 114 may be directly coupled to the second end 118 of conductive post 108, as illustrated in fig. 5h. For the part of side surface 112 of conductive post 108 embodiment outside packaging material, solder bump 114 side surfaces 112 that may be also coupled directly to conductive post 108, as shown in Figure 2 or Figure 3.
Then, unification operation can be performed, device to be separated into single device, exist the most respectively One of device 100,200 or 300 shown in Fig. 1, Fig. 2 or Fig. 3.
The embodiment of device described herein and include the equipment of such device may be incorporated into various its In its equipment and system.Fig. 6 shows the block diagram of example system 600.System 600 can include micro- Electronic installation 602 and antenna 636.Device 602 especially comprises the steps that nude film, have first surface and The second surface relative with first surface;Conductive post, is formed on the first surface of nude film;And bag Package material, packs nude film, including covering the first surface of nude film and second surface and the side of conductive post Surface at least some of.Device 602 can dress shown in Fig. 1 to 4 the most respectively Put the device of one of 100,200,300 or 400.
In various embodiments, device 602 can be configured to transmission and the reception of beneficially signal, and And antenna 636 can be operatively coupled to but be not necessarily be directly coupled to device 602 with pass Send and receive signal.
Owing to relative to including the various prior-art devices of carrier substrates, device 602 can have less Size, therefore system can be advantageously incorporated in electronic installation, and these electronic installations include mobile electricity Words and other portable electron device.Device 602 can be modularity in certain embodiments in configuration So that it include more than one nude film, one or more passive component and possible one or Other parts being associated multiple.Although system is incorporated in any number of electronic installation, but Some suitable portable electron devices can include laptop computer, personal digital assistant, game device, Music player, video player etc..
Although illustrate and describe specific embodiment herein for describing preferred embodiment, but ability Field technique personnel should be understood that in the case of without departing substantially from the scope of the present invention, is calculated for realizing phase With the broad category of alternative of purpose and/or equivalent integers or realize alternative shown and describe Embodiment.The person skilled in the art will easily understand, can be extensively to plant according to embodiments of the invention The mode of class realizes.This application is intended to cover arbitrarily amendment or the modification of embodiment discussed here. Therefore, expressly it is intended that, only come by claim and equivalent thereof according to embodiments of the invention Limit.

Claims (18)

1. include an equipment for sheet molded core chip size package, including:
Nude film, has first surface and the second surface relative with described first surface;
Conductive post, is formed on the described first surface of described nude film;And
Packaging material, pack described nude film, including cover described first surface, described second surface with And the side surface of described conductive post is at least some of,
Wherein, described packaging material are by formed below:
It is attached to the first of packaging material described in the described second surface of described nude film;And
It is laminated to second of described packaging material on the described first surface of described nude film, so that The described of side surface obtaining described nude film and described conductive post is packaged in described packing timber at least partially In material, wherein, the described first of described packaging material and described packaging material described second The place quilt that the described first of described packaging material and second of described packaging material contact with each other Fusion.
Equipment the most according to claim 1, wherein, the first end of described conductive post is with described The described first surface direct-coupling of nude film, and wherein, the second end of described conductive post is at described bag Outside package material.
Equipment the most according to claim 2, also includes described second end with described conductive post Direct-coupled solder bump.
Equipment the most according to claim 2, wherein, the described side surface of described conductive post The other parts adjacent with described second end are outside described packaging material.
Equipment the most according to claim 4, wherein, solder bump is described with described conductive post The other parts direct-coupling of the described side surface of the second end and described conductive post.
Equipment the most according to claim 1, also includes passive component, and wherein, described Described passive component also packed by packaging material.
Equipment the most according to claim 1, wherein, described packaging material include the first packaging Material and second packaging material different from described first packaging material, wherein, described packaging material Described first is formed by described first packaging material, and described packaging material described second by Described second packaging material are formed.
Equipment the most according to claim 7, wherein, described first packaging material are coated wafers Cover resin, and described second packaging material are molding materials.
9. for the method manufacturing the equipment including sheet molded core chip size package, including:
Arranging nude film, described nude film has the second surface that first surface is relative with described first surface And the conductive post on the described first surface of described nude film;And
At the side surface of described first surface, described second surface and described conductive post at least one Packaging material are formed on Fen, to pack described nude film and described conductive post,
Wherein, form described packaging material to include:
The first of described packaging material is attached to the described second surface of described nude film;And
On second of the described packaging material described first surface being laminated to described nude film, so that The described of side surface obtaining described nude film and described conductive post is packaged in described packing timber at least partially In material.
Method the most according to claim 9, wherein, the described nude film that arranges includes described biography First end of guide pillar and the described first surface direct-coupling of described nude film, and wherein, described method Also include the second end direct-coupling of solder bump Yu described conductive post.
11. methods according to claim 10, also include: at solder bump described in direct-coupling Before, a part for the described encapsulating material near described second end of described conductive post is carried out laser Excision, to remove described second end of described conductive post.
12. methods according to claim 10, also include: at solder bump described in direct-coupling Before, remove a part for described packaging material, to expose described second end of described conductive post.
13. methods according to claim 10, also include described solder bump and described conduction The other parts direct-coupling adjacent with described second end of the described side surface of post.
14. methods according to claim 9, wherein, form described packaging material and include:
The described second surface of described nude film is attached to adhesion material;
On described second described first surface being laminated to described nude film of described packaging material, So that the described of the described side surface of described nude film and described conductive post is packaged in institute at least partially State in packaging material;
After lamination, the described second surface of described nude film is separated with described adhesion material;And The described first of described packaging material is attached to the described second surface of described nude film.
15. methods according to claim 14, wherein, described the first of described packaging material Sheet is coated resin formation by wafer, and wherein, described packaging material described second by molding material Material is formed.
16. methods according to claim 9, also include arranging passive component, and wherein, The formation of described packaging material is included on described passive component and forms the described of described packaging material Second.
17. 1 kinds of systems including there is the microelectronic device of sheet molded core chip size package, described system Including:
Described microelectronic device, is configured to transmission and the reception of beneficially signal, and described microelectronics fills Put and include:
Nude film, has first surface and the second surface relative with described first surface;
Conductive post, is formed on the described first surface of described nude film;And
Packaging material, pack described nude film, including cover described first surface, described second The side surface of surface and described conductive post at least some of;And
Antenna, is operatively coupled to described microelectronic device, to transmit and to receive described signal;
Wherein, described packaging material are by formed below:
It is attached to the first of packaging material described in the described second surface of described nude film;And
It is laminated to second of described packaging material on the described first surface of described nude film, so that The described of side surface obtaining described nude film and described conductive post is packaged in described packing timber at least partially In material, wherein, the described first of described packaging material and described packaging material described second The place quilt that the described first of described packaging material and second of described packaging material contact with each other Fusion.
18. systems according to claim 17, wherein, described system is mobile phone, knee joint Upper computer, personal digital assistant, game device, music player and video player, thunder Reach device or satellite communication apparatus.
CN201210378005.9A 2011-10-03 2012-10-08 Sheet molded core chip size package Active CN103035589B (en)

Applications Claiming Priority (2)

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US13/252,083 US8487435B2 (en) 2008-09-09 2011-10-03 Sheet-molded chip-scale package
US13/252,083 2011-10-03

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Publication number Priority date Publication date Assignee Title
US9362191B2 (en) * 2013-08-29 2016-06-07 Infineon Technologies Austria Ag Encapsulated semiconductor device
US10797019B2 (en) * 2016-08-31 2020-10-06 Advanced Semiconductor Engineering, Inc. Semiconductor package and method for manufacturing the same
CN111584478B (en) * 2020-05-22 2022-02-18 甬矽电子(宁波)股份有限公司 Laminated chip packaging structure and laminated chip packaging method

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CN101101900A (en) * 2006-06-27 2008-01-09 奇梦达股份公司 Die configurations and methods of manufacture
TW200820375A (en) * 2006-10-31 2008-05-01 Qimonda Ag Solder pillar bumping and a method of making the same

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
CN101101900A (en) * 2006-06-27 2008-01-09 奇梦达股份公司 Die configurations and methods of manufacture
TW200820375A (en) * 2006-10-31 2008-05-01 Qimonda Ag Solder pillar bumping and a method of making the same

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Effective date of registration: 20161228

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Patentee after: Qorvo USA Inc.

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Patentee before: Triquint Semiconductor Inc