JP2734189B2 - Optical sensor element and method of manufacturing the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical sensor element in which an optical sensor element is covered with a transparent resin, and which is used for a CCD or a camera IC.

[Conventional technology]

When packaging an optical sensor element used for a CCD or a camera IC for shielding the element element from outside air, light must reach the element element. Such packaging technologies include the following.

(1) The optical sensor body is housed in a ceramic container, and a transparent glass plate as an upper lid is bonded to the ceramic container.

(2) The optical sensor body is housed in a thermoplastic resin molding container such as polyphenylene sulfide (PPS), and a transparent glass plate as an upper lid is adhered to the molding container.

(3) Using a transparent resin, transfer molding or the like is used to integrally mold the optical sensor body so as to surround it.

Of these, the method (1) has high reliability but high cost, and the method (2) is in a practical stage due to poor adhesion between the resin such as PPS and the lead frame supporting the optical sensor element. Not reached. The method (3) is inferior to the method (1) in reliability such as heat resistance and moisture resistance, but is low in cost and high in productivity, and is becoming the mainstream of optical sensor package technology. Specifically, as shown in FIG. 2, the optical sensor chip 1 is fixed to the mount 11 of the lead frame, and the external lead 12
Then, transfer molding is performed using a transparent epoxy resin compound 14 in the same manner as in the sealing of the IC. Then, the optical module 2 of a transparent resin molded body having a lens for guiding light to a predetermined position of the sensor chip 1 and a reflective surface is aligned and adhered to the surface of the molded resin 14 with the adhesive 15.

In addition to these methods, there is a method in which the optical sensor element is housed in a container made of acrylic resin or the like, and a space between the container and the sensor element is filled with a transparent gel resin or an ultraviolet curable resin.

[Problems to be solved by the invention]

Among the above-mentioned methods, the transfer molding method using a mainstream transparent resin has the following problems.

(1) An epoxy resin used as a transparent resin has a poor mold releasability from a mold. Therefore, it is necessary to apply a silicone-based or fluorine-based external mold release agent to the mold. For this reason, traces of the applied release agent remain as irregularities on the surface of the molded product, causing optical defects.

(2) In the transfer molding, since the hot-melted resin is injected into the mold at a high pressure, problems such as deformation of the connection conductor and application of a large pressure to the optical sensor element occur.

(3) When the molding resin shrinks after curing, a large thermal stress is generated in the optical sensor body, so that the reliability is not sufficient.

(4) The molding cycle time is long and the productivity is not sufficient.

The method of housing the optical sensor element in a transparent container and filling the transparent resin solves these problems, but like other methods, in order to guide light to the sensor element,
For example, as shown in FIG. 2, there is still another problem that an optical module must be separately prepared and precisely aligned and combined.

An object of the present invention is to solve the above-described problems, to have no irregularities on the outer surface that hinder the incidence of light on the sensor element, to apply no stress to the sensor element, and not to deform the connection conductor, Another object of the present invention is to provide an optical sensor element that does not require a separate optical system for guiding light, and a method for manufacturing the same.

[Means for solving the problem]

In order to achieve the above object, according to the optical sensor element of the present invention, an optical sensor element, an optical module forming an optical system for guiding light to the optical sensor element, and a light incident surface of the optical sensor element A conductive path connected to an end terminal of the light incident surface of the optical sensor element, with a part interposed between the optical sensor element and the light emitting surface of the optical module; A molding resin that fills the light-exiting surface with the light-exiting surface and the light-exiting surface without interposing any other member between the light-incident surface and the light-exiting surface in a region other than the end terminal and the conductive path; In the element, the optical module has a protruding portion around a light emitting surface facing the optical sensor element body, and a molding resin is filled in a recess surrounded by the protruding portion. Further, according to the method for manufacturing an optical sensor element of the present invention, a plurality of conductive paths are fixed to the light emitting surface of the optical module forming the optical system, and the ends of the conductive paths and the light incident surface of the optical sensor element body. The upper input / output terminal is conductively connected, and then the light input surface and the area other than the input / output terminal and the conductive path between the light input surface of the optical sensor element and the light output surface of the optical module are connected. The molding resin is filled without interposing other members between the light emitting surface and the optical sensor element and the optical module are integrally connected by the molding resin. Here, it is preferable to use an optical module having a protruding portion around the light emitting surface facing the optical sensor element body and to fill the molding resin into a concave portion surrounded by the protruding portion.

[Action]

Since light enters the optical sensor body through the optical module and the resin filled in the gap between the optical module and the sensor body, there is no problem of surface irregularities. When the light emitting surface of the optical module facing the optical sensor element is the bottom surface of the concave portion, molding can be performed only by injecting resin into the concave portion, and transfer molding is not required. In the optical sensor element body, only the resin that fills the gap between the light incident surface and the light emitting surface of the optical module is present.

〔Example〕

One embodiment of the present invention will be described with reference to FIG. 1 in which the same parts as those in FIG. In FIG.
An optical module 2 having a lens function and a reflecting function, which is a transparent resin molded body made of, for example, an acrylic resin, has a light emitting surface 21 surrounded by a projection 3. Then, two strip-shaped conductive paths 4 are formed on the protruding portion side. The conductive path 4 is formed, for example, by vapor deposition and patterning of Al, or by fixing a strip-shaped copper foil. The optical sensor chip 1 faces the light exit surface 21 of the optical module 2.
The input / output terminals provided at both ends of the optical sensor chip 1 and the ends of the conductive paths 4 are electrically connected by a conductive adhesive 5. A transparent resin 6 is filled in a concave portion surrounded by the protruding portion 3 and covers the side opposite to the light incident surface of the optical sensor chip 1 and enters between the sensor chip 1 and the light emitting surface 21 of the optical module 2. In. Thereby, the optical sensor chip 1 is sealed and integrated with the optical module 2. The transparent resin 6 can be easily molded by injecting it into the concave portion, and a photocurable resin is used from the viewpoint of productivity.

The optical module 2 is a distance measuring device of a triangular distance measuring method used for a conventional camera or the like. As shown in FIG. 81 and prisms 82 and 83
And the like. When bonding the input / output terminals of the chip 1 and the conductive paths 4 on the surface of the optical module in order to form the optical module 2 and the optical sensor chip 1 integrally, the positional relationship between the optical module 2 and the sensor chip 1 Needs to be precisely adjusted. To do this,
It is better to use a light-curing adhesive as the adhesive 5. However, the conductive path 4 and the input / output terminals of the sensor chip 1 may not be electrically connected to each other by a conductive adhesive, but may be conductively connected only by contact by the pressing force and the fixing force of the transparent resin 6. it can.

〔The invention's effect〕

As described above, according to the second aspect of the present invention, the optical sensor element is opposed to the optical module and integrally joined by molding resin, so that light is directly incident from the optical module. The problem is gone. According to the first or third aspect of the present invention, by forming a concave portion surrounding the sensor element body in the optical module, resin molding can be performed without the need for transfer molding, and stress is not applied to the sensor element body. Since no connecting wires are used, there is no problem of deformation of the connecting wires. And since it is integral with the optical module, there is no need to separately install an optical system, and the number of adjustment points during use is reduced, and a practical optical sensor element can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of an optical sensor element according to an embodiment of the present invention,
FIG. 2 is a sectional view of a conventional optical sensor element, and FIG. 3 is a sectional view showing an optical system when using the conventional optical sensor element. 1: optical sensor chip, 2: optical module, 3: optical module protrusion, 4: conductive path, 5: conductive adhesive, 6: transparent resin.

Claims (3)

(57) [Claims] An optical sensor element, an optical module forming an optical system for guiding light to the optical sensor element, and a part between a light incident surface of the optical sensor element and a light emitting surface of the optical module. A conductive path interposed and connected to an end terminal of the light incident surface of the optical sensor element body; and a region excluding the end terminal and the conductive path between the light incident surface of the optical sensor element element and the light emitting surface of the optical module. And a molding resin that is filled and integrally joined without interposing any other member between the light incident surface and the light exit surface, wherein the optical module comprises: An optical sensor element having a protruding portion around the opposing light emitting surface, wherein a molding resin is filled in a recess surrounded by the protruding portion. 2. A plurality of conductive paths are fixed to a light emitting surface of an optical module forming an optical system, and an end of the conductive path and an input / output terminal on a light incident surface of the optical sensor element are conductively connected. After that, another member is provided between the light incident surface and the light emitting surface in a region excluding the input / output terminals and the conductive path between the light incident surface of the optical sensor body and the light emitting surface of the optical module. A method for manufacturing an optical sensor element, comprising: filling a molding resin without interposing a resin; and coupling the optical sensor body and the optical module integrally with the molding resin. 3. The method for manufacturing an optical sensor element according to claim 2, wherein an optical module having a projecting portion around a light exit surface facing the optical sensor element body is used, and the molding resin is surrounded by the projecting portion. A method for manufacturing an optical sensor element, characterized by filling a recess.