JP2726316B2 - Inspection equipment for semiconductor parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] As shown in FIG. 1, the present invention relates to a method of transporting a long strip-shaped lead frame A in the longitudinal direction at least while a lead frame A is being transferred. A semiconductor component B having a pair of left and right external terminals B1 and B2 is placed at a constant pitch P along the longitudinal direction of the lead frame A, and both external terminals B
In order to inspect the performance of each semiconductor component B in a state where the semiconductor component B is connected to the lead frame A in a case where the semiconductor component B is manufactured while being connected integrally to the lead frame A via the first and second B2. It concerns the device.

[Prior Art] In the above-mentioned inspection, conventionally, a lead frame A was
As shown in FIG. 8, when the number of semiconductor components B is N, that is, the interval between a plurality of semiconductor components B in the longitudinal direction, that is, the number of semiconductor components B is intermittently transferred by a length of N × P = L. When the intermittent transfer is temporarily stopped, the handler C moving downward toward the lead frame A is connected to each of the other external terminals B2 of the N (for example, N = 5) semiconductor components B. Contact the probe C1 protruding from
By supplying power to each semiconductor component B via the probe C1, the performance of each semiconductor component B is inspected, and this inspection is completed, and the handler C moves the probe C1 away from the other external terminal B2. , The transfer of the lead frame A by the length of N × P = L is repeated.

[Problems to be solved by the invention]

However, this conventional inspection method is an intermittent inspection in which the semiconductor components B are inspected N by N. The time T required for the inspection of the N semiconductor components B is equal to N × P
= Time T1 required to transfer by length L, time T2 required to lower the handler C with the probe C1 toward the lead frame A, time T3 required to supply power to the semiconductor component B and determine the necessity thereof, And the time T4 required to raise the handler C with the probe C1 from the lead frame A, and the inspection of the N semiconductor components B
T1 and T2 and T4 need wasted time, so
The number of semiconductor components that can be inspected per unit time becomes smaller, in other words, the inspection speed is slow.

In addition, in the conventional inspection method, the lead frame must be intermittently transported in the longitudinal direction by a length of N × P = L. You have to move up and down in time with the transfer,
Since the structure of the device becomes extremely complicated, the size of the device increases, and the production cost of the device increases,
In combination with the slow inspection speed, the cost required for the inspection is considerably increased.

The present invention provides an apparatus capable of inspecting each semiconductor component integrally connected to the lead frame in a state in which the lead frame is continuously transferred at a constant speed, whereby the conventional technique is provided. The purpose is to eliminate the problem.

[Means for solving the problem]

In order to achieve this object, the present invention provides a method for moving a lead frame provided with semiconductor components at a constant pitch along the longitudinal direction along the longitudinal direction of the lead frame in a path for continuously transferring the lead frame at an appropriate speed in the longitudinal direction. A pair of pulleys are provided at appropriate intervals, and an endless belt made of an insulator wound between the two pulleys is brought into contact with one surface of the lead frame, and at a portion between the two pulleys, A measuring wheel that rotates at a peripheral speed equal to the transfer speed of the lead frame is provided, and the outer peripheral surface of the measuring wheel is curved so that the lead frame and the endless belt are curved with respect to the other surface of the lead frame. Press contact, and further cut from the lead frame of at least a pair of left and right external terminals of the semiconductor component on the outer peripheral surface of the measurement wheel. A probe adapted to contact with external terminals and, and in a number the provided configuration equal intervals between the pitch of the semiconductor component in the circumferential direction on the outer peripheral surface of the measuring wheel.

[Action]

With this configuration, the lead frame continuously transferred at an appropriate speed in the longitudinal direction contacts the outer peripheral surface of the measuring wheel rotating at a peripheral speed equal to the transfer speed of the lead frame over an appropriate contact angle. Each probe provided on the outer peripheral surface of the measurement wheel at an interval equal to the pitch of each semiconductor component is transferred to the lead frame and the measurement wheel is moved. Along with the rotation, of the at least one pair of left and right external terminals in each semiconductor component of the lead frame, the external terminals cut sequentially from the lead frame are sequentially contacted.

Moreover, the contact of each probe with the external terminal is
Since the lead frame is maintained during the contact angle wound around the outer peripheral surface of the measurement wheel, during this contact angle, each semiconductor component in the lead frame is connected to the probe through the probe in the measurement wheel. By supplying power, the performance of each semiconductor component can be inspected.

〔The invention's effect〕

As described above, according to the present invention, in a state where the lead frame is continuously transferred at an appropriate speed in the longitudinal direction thereof,
Since the performance of all the semiconductor components connected at a constant pitch along the longitudinal direction of the lead frame can be inspected, the following effects are obtained.

That is, when inspecting semiconductor components, it is not necessary to temporarily stop the transfer of the lead frame and move the handler with the probe up and down during this stop, as in the conventional case. The number of semiconductor components that can be inspected can be increased, in other words, the inspection can be performed at a high speed.

Moreover, it is only necessary to continuously transfer the lead frame at an appropriate speed, and a mechanism for intermittently transferring the lead frame at appropriate lengths and a mechanism for vertically moving the probe-equipped handler are required as in the prior art. Therefore, the structure of the device can be extremely simplified, and the size of the device can be reduced and the manufacturing cost of the device can be reduced. Therefore, the manufacturing cost of the device can be reduced and the speed of the inspection can be increased. In conjunction with this, the cost required for inspection can be significantly reduced, incomparable to the conventional case.

〔Example〕

Hereinafter, an embodiment of the present invention will be described with reference to the drawings (FIGS. 2 to 6). In this drawing, reference symbol A indicates a lead frame configured as shown in FIG. An arrow 3 is formed by a pair of upper and lower first feed rollers 1a and 1b and a pair of upper and lower second feed rollers 2a and 2b.
As shown by, it is continuously transferred at an appropriate speed in the longitudinal direction.

Between the first feed roller pair 1a, 1b and the second feed roller pair 2a, 2b, and at a portion on the lower surface side of the lead frame A, an appropriate space is provided in the longitudinal direction of the lead frame A. A pair of pulleys 4 and 5 are provided rotatably, and an endless belt 6 made of an insulator such as rubber or soft synthetic resin is wound between the two pulleys 4 and 5, and an upper end of the endless belt 6 is provided. While the upper surface contacts the lower surface of the lead frame A, the tension pulley 7 disposed between the pulleys 4 and 5 contacts the inner surface below the endless belt 6,
The tension pulley 7 is configured to be urged downward by a spring or a pneumatic cylinder (not shown) to apply an appropriate tension to the endless belt 6.

Reference numeral 8 denotes the first roller pair 1a, 1b and the second roller pair 2a,
2b and a measuring wheel disposed at a position on the upper surface side of the lead frame A.
Is made of an insulator such as a hard synthetic resin, and is rotatably supported on a base 11 via a bearing body 10 for a hollow shaft 9 fixed to the center thereof.

The outer peripheral surface 8a of the measuring wheel 8 is pressed against the upper surface of the lead frame A so as to curve the lead frame A and the endless belt 6 downward, and the measuring wheel 8 is not shown. The rotation is driven by a motor or the like such that the peripheral speed of the outer peripheral surface 8a of the measurement wheel 8 is equal to the transfer speed of the lead frame A.

A longitudinal groove 12 extending in the axial direction of the measuring wheel 8 is formed on the outer peripheral surface 8a of the measuring wheel 8.
Are formed at intervals equal to the pitch P of each semiconductor component B in the lead frame A along the circumferential direction of the lead frame A, and in the vertical grooves 12, the lead frame A Of the pair of left and right external terminals B1 and B2 of each of the semiconductor components B, the probe 13 made of a leaf spring is provided so as to contact one of the external terminals B2 cut from the lead frame A. Of the measuring wheel 8 from the outer peripheral surface 8a of an appropriate dimension (for example, 0.1 to 1 m
m).

With such a configuration, the lead frame A continuously transported at an appropriate speed in the longitudinal direction becomes the measuring wheel 8 rotating at a peripheral speed equal to the transport speed of the lead frame A.
As shown in FIGS. 2 and 4, with respect to the outer peripheral surface 8a of
Since it is wound so as to be in contact with an appropriate contact angle (θ) and is pressed by the endless belt 6, a circumference equal to the pitch P of each semiconductor component B is formed on the outer peripheral surface 8a of the measuring wheel 8. Each probe 13 provided at intervals
Of the pair of left and right external terminals B1 and B2 of each of the semiconductor components B of the lead frame A with the transfer of the lead frame A and the rotation of the measuring wheel 8 with respect to one of the external terminals B2 cut from the lead frame A. , As shown in FIG.

Moreover, the contact of each probe 13 with one external terminal B2 is maintained over the contact angle (θ) around which the lead frame A is wound around the outer peripheral surface 8a of the measuring wheel 8. By supplying power to each semiconductor component B in the lead frame A via the probe 13 in the measuring wheel 8 during the contact angle (θ), the performance of each semiconductor component B can be inspected. In this case, according to the present embodiment, 60 semiconductor components B can be inspected per rotation of the measuring wheel 8.

A specific configuration for supplying power to the probe 13 that contacts one external terminal B2 of the semiconductor component B during the contact angle (θ) is configured as described below. Is preferred.

That is, the sixty probes 13 on the outer peripheral surface 8a of the measuring wheel 8 are divided into ten sets as six sets, and
As shown, the first probe 131 in each set
To the first annular wiring 14, the second probe 132 to the second annular wiring 15, and the third probe 133 to the third annular wiring 15.
The fourth probe 134 is connected to the fourth wire 17
In the meantime, the fifth probe 135 is connected to the annular fifth wiring 18 and the sixth probe 136 is connected to the annular sixth wiring 19, respectively, while the other of the hollow shaft 9 supporting the measuring wheel 8 is connected. Six conductive rings 21, 22, 23, 24, 25, and 26 are provided on the side surface of the insulator disk 20 fixed to the end, and the first conductive ring 21 and the first wiring 14 are provided among these conductive rings. Between
Between the second conductive ring 22 and the second wiring 15; between the third conductive ring 23 and the third wiring 16; between the fourth conductive ring 24 and the fourth wiring 17; And the fifth wiring
18 and between the sixth conductive ring 26 and the sixth wire 19, wires 27, 28, 29, 30, 31, 3 inserted into the hollow shaft 9.
2 and each of the conductive rings 21, 22, 23, 24, 25, 26
Each of them has a bracket made of an insulator standing upright from the base 11.
The six current collectors 34, 35, 36, 37, 38, 39 attached to 33 are slidably contacted with each other, and these current collectors 34, 35, 36, 37, 38, 39
Is connected to the controller 40.

Further, a timing disk 41 provided in a notch groove 42 whose number is half the number of the probes 13 is fixed to the outer periphery of the hollow shaft 9 supporting the measuring wheel 8, and a light beam is opposed to the outer periphery of the timing disk 41. The sensor 43 is installed and this optical sensor
43, as shown by the reference symbol D in FIG.
Pulse signals obtained at intervals of 42 are transmitted to the controller 40.
To be entered.

Then, based on the pulse signal D from the optical sensor 43, the controller 40 sends a sixth pulse to the first wiring 14 and the second wiring 15 by the first pulse D1.
As shown by reference numeral E in the figure, the current collectors 34 and 35 and the conductive ring 2
Power is supplied to the third and fourth wirings 16 and 17 by the next second pulse D2, as shown by reference numeral F in FIG. Conductive rings 23, 24
And the third pulse D3 supplies the current collectors 38, 39 and the conductive ring 25 to the fifth wiring 18 and the sixth wiring 19, as shown by a symbol G in FIG. , 26
Power is supplied via the.

Thereby, each probe in the measuring wheel 8
13, the first probe 131 and the second probe 132 are connected to the external terminal B2 during the contact angle (θ).
Can be supplied to both the probes 131 and 132 when the probe 13 contacts the third probe 133 and the fourth probe 134 of the probes 13 at the contact angle (θ). When contacting the external terminal B2, power can be supplied to both probes 133 and 134, and furthermore,
When the fifth probe 135 and the sixth probe 136 of the probes 13 contact the external terminal B2 during the contact angle (θ), the probes 135 and 136
Can be fed.

In the above embodiment, one external terminal B was provided on each side.
Although the case where the present invention is applied to the inspection of the semiconductor component B provided with 1, B2 is shown, the present invention is not limited to this, and as shown in FIG.
Needless to say, it can be applied to the inspection of other semiconductor components such as a semiconductor component Ba (for example, a transistor) having one external terminal B1a on one side and two external terminals B2a and B3a on the other side. Nor.

Further, on the outer peripheral surface 8a of the measuring wheel 8, a plurality of pins 8b are provided at the same interval as the interval between the probes 13 or at intervals of an integral multiple of the interval between the probes 13, and each of the pins 8b is
When the probe 13 is configured so as to sequentially mesh with the feed holes A1 formed at regular intervals in the longitudinal direction of the lead frame A, the distance between each probe 13 on the outer peripheral surface of the measuring wheel 8 and each semiconductor component B on the lead frame A is increased. Can be eliminated, so that each probe 13 is connected to each semiconductor component B
The endless belt 6 can be made to rotate as the lead frame A is fed, or the transfer speed of the lead frame A can be reduced. It may be configured to rotate at the same speed.

[Brief description of the drawings]

1 is a perspective view of a lead frame, FIG. 2 is a front view of an apparatus according to an embodiment of the present invention, FIG. 3 is an enlarged sectional view taken along the line III-III of FIG. 2, and FIG. FIG. 5 is a perspective view showing a state of connection, FIG. 6 is a view showing a timing chart, FIG. 7 is a perspective view of another lead frame, FIG.
FIG. 1 is a perspective view showing a conventional method. A: Lead frame, B: Semiconductor parts, B1, B2 ...
External terminals, 1a, 1b, 2a, 2b: feed roller, 4, 5, pulley, 6: endless belt, 7: tension pulley, 8:
… Measurement wheel, 8a …… Outer surface of the measurement wheel, 9 ……
Hollow shaft, 10 ... Bearing body, 11 ... Machine stand, 12 ... Vertical groove, 13 ...
… Probe, 14,15,16,17,18,19 …… circular wiring, 20 ……
Disk, 21,22,23,24,25,26 …… conductive ring, 34,35,36,3
7, 38, 39… current collector, 40… controller, 41… timing disk, 43… optical sensor.

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-53-8066 (JP, A) JP-A-51-66781 (JP, A) JP-A-57-64947 (JP, A) 82980 (JP, A) JP-A-60-116181 (JP, A) JP-A-2-139855 (JP, A)

Claims (1)

(57) [Claims] 1. A path for continuously transferring a lead frame provided with semiconductor components at a constant pitch in the longitudinal direction at an appropriate speed in the longitudinal direction at an appropriate interval along the longitudinal direction of the lead frame. A pair of pulleys are provided, and an endless belt made of an insulator wound between the two pulleys is brought into contact with one surface of the lead frame, and transferred to a portion between the two pulleys. A measurement wheel that rotates at a peripheral speed equal to the speed is disposed, and the outer peripheral surface of the measurement wheel is pressed against the other surface of the lead frame so as to curve the lead frame and the endless belt, and further, On the outer peripheral surface of the measuring wheel, an external terminal cut from the lead frame among at least a pair of external terminals on the left and right of the semiconductor component. A probe into contact, semiconductor components of the inspection apparatus is characterized in that a number present provided at equal intervals between the pitch of the semiconductor component in the circumferential direction on the outer peripheral surface of the measuring wheel.