JP2705412B2 - LC filter - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LC filter which is a composite part having a combination of a condenser and a coil.

[0002]

2. Description of the Related Art FIGS. 101, 102 and 103 show a conventional noise filter disclosed in, for example, Japanese Patent Application Laid-Open No. 1-316013. FIG. 101 is a development view of the film sheet, FIG. 102 is a perspective view showing a state in which the film sheets are stacked and wound, and FIG. 103 is an equivalent circuit. FIG. 101,
102 and 103, 20a and 21a are first terminals, 41a and 41b are second and third terminals, 22a and 23.
a indicates a fourth terminal. 43, 1a, 47a, 47b,
2a is a conductive foil, and 4, 45a and 45b are film sheets. In FIG. 102, 19 is a coil, and 17 is a hole for inserting a core. In FIG. 103, 9, 10 and 11 are capacitors, and 7 and 8 are inductances. In FIG. 101, a conductive foil 1a is overlaid on a film sheet 4, and one terminal 20a and the other terminal 21a are fixed on the conductive foil 1a by a conductive foil 43, respectively, to form a first electrode.
The conductive foils 47a, 4a are placed on the film sheets 45a, 45b.
7b, one terminal 41a is placed on the conductive foil 4 on the 47a.
3 to form a second electrode, and one terminal 41b is fixed on the conductive foil 47b by the conductive foil 43 to form a third electrode.
Are formed. Conductive foil 2a on film sheet 4
And one terminal 22a and the other terminal 23a are fixed on the conductive foil 2a by the conductive foil 43 to form a fourth electrode. Next, a second electrode and a third electrode are overlaid on both ends of the fourth electrode, and a first electrode is overlaid thereon. And FIG.
2, a first electrode, a second electrode, a third electrode,
The film sheet and the conductive foil connected to the fourth electrode are overlapped and wound around the hole 17 for inserting the core.

The present noise filter can have the function of combining a coil and a capacitor by the above-described configuration in which a film sheet and a conductive foil are simultaneously wound without combining a single coil and a capacitor component. That is, in the equivalent circuit of FIG. 103, the inductance 7 can be formed by winding the conductive foil 1a, and similarly, the inductance 8 is formed by the conductive foil 2a. Conductive foils 47a, 47b, conductive foil 1a and film sheet 4
The capacitor 9 is formed by the
a, 47b, conductive foil 2a and film sheets 45a, 4a
The capacitor 10 is formed by 5b. The capacitor 11 is formed by the conductive foil 1a, the film sheet 4, and the conductive foil 2a.

[0004]

A conventional filter is:
With the above configuration, a distributed capacitance is generated between the layers of the wound conductive foil, causing a deterioration in high-frequency characteristics of the inductance and a deterioration in filter characteristics. In addition, since a filter is manufactured by stacking and winding a plurality of conductive foils and film sheets, it has been difficult to manufacture the filter. Further, it is difficult to automate the manufacturing process with a step of taking out the terminal. In addition, since the setting of each constant of the inductance and the capacitor showing the filter characteristics is mainly performed by selecting the winding length of the conductive foil and the film sheet, there is a problem that the adjustment is difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to obtain an LC filter having improved high-frequency characteristics, and to obtain an LC filter whose manufacturing method is relatively simple. It is an object of the present invention to obtain an LC filter which can automate the production and can easily set the filter characteristics.

[0006]

The LC filter according to the present invention is composed of first, second and third dielectric films, first and second conductor sheets, and first and second conductor sheets. A third conductive sheet having a wide width, wherein the dielectric film and the conductive sheet are alternately overlapped in this order to insulate the first, second, and third conductive sheets; The first and second conductive sheets are wound so as to enclose the first and second conductive sheets, with the sheets facing outward.
An input terminal and an output terminal formed by extending respective ends of the conductive sheet in the same direction as the winding axis;
And a terminal formed by extending an end of the conductive sheet.

Further, the first, second, and third ring-shaped conductive plates having a cut portion extending from the central opening to the outer periphery are connected to the first, second, and third conductive plates.
The second and third dielectric films are alternately overlapped in this order to insulate the first, second and third conductive plates, and at one end of the cut portion of the first conductive plate to the first dielectric film. Body film, the second conductive plate, the second dielectric film, the third conductive plate, and the third dielectric film in this order, and the other end of the cut portion of the first conductive plate is the first dielectric plate. The first, second, and third conductive plates and the first, second, and third conductive plates are drawn in the order of a body film, a second conductive plate, a second dielectric film, a third conductive plate, and a third dielectric film. The second and third dielectric films are rotated to displace the respective cut portions, and the other ends of the cut portions of the first conductive plate are connected to the third dielectric film. A first laminate formed by twisting them so as to be adjacent to each other, and formed in the same manner as the first laminate described above. One end of the cut portion of the first, second and third conductive plates of the first laminate and the first, second and third conductive plates of the second laminate The first laminated body and the second laminated body are overlapped so that their respective openings are aligned so that the other ends of the cut portions of the first laminated body and the second laminated body are aligned with each other. The first, second, and third conductive plates are electrically connected to each other, and include a first coil and a second coil in which at least two turns are formed.

The first, second, third and fourth ring-shaped dielectric films having an opening provided with an angle positioning means at the center thereof sandwich the opening on a specific diameter with respect to the angle positioning means. A first hole and a second hole arranged in the first dielectric film, the first hole is closer to the opening,
The second hole is located near the outer periphery, and the first hole is formed in the second dielectric film.
And the second hole are closer to the opening, the first hole is closer to the outer periphery and the second hole is closer to the opening in the third dielectric film, and the first and second holes are closer to the opening in the fourth dielectric film. The first, second, third, and fourth dielectric films provided with the holes near the outer periphery are arranged in order by aligning the respective openings and adjusting the respective angles by the angle positioning means in order. A first, a second, a third, and a fourth conductive plate sequentially provided on the upper surface of each of the second, third, and fourth dielectric films; An opening is formed at a corresponding position, a cut portion is formed at the position of the first hole extending from the opening to the outer periphery and a terminal is formed at the position of the first hole, and a cut portion is formed at the position of the second hole. An opening at a position corresponding to the opening of the second dielectric film, and a second hole extending from the opening to the outer periphery; A cutting portion for forming a respective terminal on the outer peripheral side, cut portion is formed at a position of the first hole, the third
In the conductive plate of (1), an opening is provided at a position corresponding to the opening of the third dielectric film, a first hole is formed from the opening to the outer periphery, and a cut portion is formed on the opening side to form a terminal. In the fourth conductive plate, an opening is formed at a position corresponding to the opening of the fourth dielectric film, and a terminal is formed at the position of the second hole from the opening to the outer periphery and at the opening side. A cutting portion, the first, second, third, and fourth conductive plates each having a cutout portion formed at a position of the first hole; a terminal at a position of the first hole of the first conductive plate; And the terminal at the position of the first hole of the third conductive plate is passed through the first hole of the first dielectric film, the cutout of the second conductive plate, and the first hole of the second dielectric film. A first coil formed at least two turns by being electrically connected, a terminal at a position of a second hole of the second conductive plate, and a second coil. The terminal at the position of the second hole of the conductive plate is electrically connected through the second hole of the second dielectric film, the cutout of the third conductive plate, and the second hole of the third dielectric film. And a second coil having at least two turns.

Further, the first, second, third and fourth ring-shaped dielectric films having an opening provided with the angle positioning means at the center thereof are aligned with each other, and the respective angles are adjusted by the angle positioning means. The first, second, third and fourth conductive plates are sequentially provided on the respective upper surfaces, and the first, second, third and fourth dielectric films are arranged in a position relative to the angle positioning means. A thick conductive plate terminal on the lower surface connected to the conductive plate provided on the upper surface with a hole arranged on the specific diameter and sandwiching the opening,
In the first dielectric film, the thick conductive plate terminal is close to the opening,
The hole is closer to the outer periphery, the thick conductive plate terminal and the hole are closer to the opening in the second dielectric film, and the thick conductive plate terminal is closer to the opening and the hole is closer to the opening in the third dielectric film. In the film, thick conductive plate terminals and holes are provided near the outer periphery, and the first, second, third, and fourth conductive plates have openings at positions corresponding to the openings of the dielectric film and extend from the openings to the outer periphery. A cut portion for forming a terminal at the position of the thick conductive plate terminal and an outer peripheral side thereof, and a cut portion at a position of the hole are formed, and the first, second, third, and fourth dielectric films and the first dielectric film are formed. , The second, third, and fourth conductive plates are overlapped, and the thick conductive plate terminal of the first dielectric film is connected to the third conductive plate.
A first coil formed at least two turns by being electrically connected to a terminal on the opening side of the conductive plate through a cutout portion of the second conductive plate and a hole in the second dielectric film; The thick conductive plate terminal of the dielectric film is electrically connected to the terminal on the opening side of the fourth conductive plate through the cutout portion of the third conductive plate and the hole of the third dielectric film to form at least two turns. And a second coil.

Further, a plurality of the above-mentioned LC filters are provided, and the respective LC filters are connected in series to form a multistage.

[0011]

In addition to the first and second conductor sheets, the first and second conductor sheets are provided.
By manufacturing an LC filter using a third conductive sheet covering these, which is wider than the conductive sheet, the third conductive sheet can shield between the first and second conductive layers. As a result, the distributed capacity of the coil between the layers can be reduced. The resonance frequency f of the coil and the capacitor is given by the equation f = 1
/ 2π√LC, and the resonance frequency f of the coil can be increased by decreasing the distributed capacitance C.

[0012] Further, an LC filter in which a ring-shaped conductive plate and a dielectric film are laminated can be formed by winding a ring-shaped conductive plate and a dielectric film without winding a plurality of conductive sheets or dielectric films which are difficult to manufacture. By overlapping alternately,
The same LC filter as in the case of winding can be manufactured. Furthermore, in the connection method in which the cut portions of the conductive plate and the dielectric film of the repeating unit layer in the configuration are shifted while being shifted, and the corresponding cut end of the next unit layer is connected, the conductive plate is connected in the plane. , Without connecting terminal outside, LC
The filter can be downsized.

[0013] Further, the conductive plate has an opening provided at the center and a cut portion extending from the opening to the outer periphery. The conductive plate having terminals at the cut portion and a dielectric film form inductance and capacitance to form a multilayer conductive plate. It can be realized by overlapping, and the work of taking out the electrode as in the conventional case is not required. Further, since it is only necessary to make contact or to connect with a conductive adhesive or the like in accordance with the angle positioning means provided on the dielectric film, the production can be automated and the production cost can be reduced.

In addition, the LC filter is composed of a double-sided substrate, and the terminal thickness on the lower surface is made thicker than the terminal thickness on the upper surface by the thickness of the dielectric layer or the like, so that the connection can be further facilitated and the production can be automated. Therefore, the manufacturing cost can be reduced.

Further, the degree of freedom in designing the LC filter can be increased by stacking the respective LC filters in multiple stages.

[0016]

[Embodiment 1] 1, 2, 3, and 4 are a development view, a layer configuration view,
It is a perspective view showing an equivalent circuit and appearance. In FIG.
1a, 2a, and 3a are first, second, and third conductive foils, respectively.
4 is a dielectric film. Reference numeral 19 denotes a coil formed by winding these. 20a, 21a, 22a, 23
Reference numerals a and 25a denote terminals.

The coil 19 is formed as follows. Terminal 25
a dielectric film 4 on the conductive foil 3a provided with
The conductive foil 2a provided with the terminals 22a and 23a, the dielectric film 4, the conductive foil 1a provided with the terminals 20a and 21a, and the dielectric film 4 are sequentially stacked thereon, and these are wound to obtain the coil 19.

FIG. 2 is a layer configuration diagram of the coil 19 in which the conductive foils 1a, 2a, 3a and the dielectric film 4 are wound.
In FIG. 2, reference numeral 9 denotes a distributed capacitance generated between the wound conductor layers. In FIG. 3, 10, 11, and 12 are condensers,
7 and 8 indicate inductances. FIG. 4 shows the appearance of the LC filter, and 18 is a core such as ferrite.

The inductances 7 and 8 shown in FIG. 3 can be formed from the conductive foils 1a and 2a thus wound, and the capacitance 1 can be obtained from the conductive foil 1a, the dielectric film 4 and the conductive foil 2a.
2 can be formed. Further, the capacitance 10 can be formed by the conductive foils 1a, 3a and the dielectric film 4 therebetween, and the capacitance 11 can be similarly formed by the conductive foils 2a, 3a and the dielectric film 4 therebetween.

In the LC filter thus formed, a distributed capacitor 9 is formed between the layers of the wound coil as shown in FIG. This distributed capacitance is formed in parallel with the inductances 7 and 8 as shown in FIG. In the present embodiment, the conductive foils 3a are provided together with the conductive foils 1a and 2a, and by winding these at the same time, the interlayer of the coil 19 can be shielded by the conductive foil 3a and the interlayer distributed capacitance 9 can be reduced. FIG. 5 is a characteristic diagram showing the impedance of the terminals 20a and 21a of FIG. The vertical axis, the impedance Z, the horizontal axis indicates frequency f, f ₁ is the resonance frequency when not provided with the conductive foil 3a, f ₂ denotes a resonance frequency according to the present invention. The resonance frequency of the coil and the capacitor can be expressed by the formula f = 1 / 2π√LC, and the distribution capacitance C
Is reduced, the resonance frequency can be increased from f ₁ to f ₂ as shown in FIG. 5, and the frequency characteristics of the LC filter can be improved. By making the conductive foil 3a wider than the conductive foils 1a and 2a, the effect of reducing the distributed capacitance can be increased.

Embodiment 2 FIG. By using the terminal 25a of the conductive foil 3a of the first embodiment as a ground terminal, a common mode filter can be obtained.

Embodiment 3 FIG. 6 to 14 show another embodiment of the present invention. 6 and 7 show a plan view and a front view of the conductor sheet. 8, 9, and 10 are a plan view, a front view, and an equivalent circuit of a single-layer LC filter, respectively. FIGS. 11, 12, and 13 are a plan view, a front view, and an equivalent circuit of a multilayer LC filter in which the above-described single-layer LC filters are laminated in N layers. FIG. 14 is an external view of the multilayer LC filter in which a ferrite core is inserted.

6 and 7, reference numeral 1a denotes a ring-shaped conductive sheet having a cut portion extending from the opening to the outer periphery, 20a denotes a terminal provided at one cut end of the conductive sheet, 21a
Is a terminal provided on the other cut end of the conductor sheet. 17 is a hole for inserting a core. In FIGS. 8, 9, and 10, 2a is a ring-shaped conductor sheet having a cut portion extending from the opening to the outer periphery in the same manner as 1a, and has terminals 22a and 23a as in the conductor sheet 1a. Reference numeral 4 denotes a ring-shaped dielectric film which is inserted between the conductive sheets 1a and 2a in a sandwich shape to form a single-layer LC filter shown in the equivalent circuit of FIG. At this time, the conductive sheet 1
The terminals a and 2a are shifted from each other in the circumferential direction so that the terminals 20a and 21a are not in contact with the terminals 22a and 23a.

Next, N single-layer LC filters are laminated via the dielectric film 4, and the corresponding terminals are connected to form a multilayer LC filter. 11 and 12,
The terminal 21-1 of the conductor sheet 1-1 and the conductor sheet 1-
2, one terminal 20-2 of the conductor sheet 1-2 and one terminal 20- of the conductor sheet 1-3.
3. Similarly, terminal 21-n of conductor sheet 1-n-1
-1 and one terminal 20-n of the conductor sheet 1-n are connected to each other to form a multi-stage coiled first conductor.
Similarly, the conductor sheets 2-1 2-2,..., 2-n-1, 2-n are connected to form a multi-stage coil-shaped second conductor. By making the single-layer LC filter multilayer as described above, the capacitor-1 shown in the equivalent circuit of FIG.
2. An LC filter having large inductances 7 and 8 can be obtained.

In this embodiment, there is no need to overlap and wind a strip-shaped conductive foil and a dielectric film as in the first and second embodiments, and a ring-shaped conductive sheet and a dielectric film are stacked to form a multilayer. This has the advantage that the filter can be easily manufactured.

In this embodiment, the dielectric film is formed in a ring shape, but may be formed in a disk shape when a core such as ferrite is not used. Further, the connection terminal may be integrated with the conductor sheet or may be separately formed. FIG.
In 2, the filter may be provided with a dielectric film or an insulating film at the top and bottom of the filter.

Embodiment 4 FIG. 15 and 16 show another embodiment of the present invention. In the present embodiment, the third conductor screen is interposed between the single-layer LC filters of the multilayer LC filter of the third embodiment via a dielectric film.
This is a multi-layer LC filter composed of N layers into which a filter is inserted.
FIG. 15 is a front view of the present multilayer LC filter, and FIG. 16 is an equivalent circuit. 15 and 16, 3-1 and 3-2,.
.., 3-n-1 are ring-shaped third conductor sheets having no cut portions, and terminals 25-1,..., 25-n
-1, the terminals are connected to each other, inserted between the single-layer LC filters through the dielectric film 4, and the terminals 2
Connect with 5-n. The conductor sheets 3-1, 3-2,.
.., 3-n-1 form capacitors 10 and 11. That is, the capacitor 10 is connected to the first conductor sheet 1.
, 1-3, ..., 1-n, third conductor sheet 3
-1, 3-2,..., 3-n-1 and the dielectric sheet 4 therebetween. The capacitor 11 is
Second conductor sheets 2-1, 2-2, ..., 2-n-
1, third conductor sheet 3-1, 3-2,..., 3-
n-1 and a dielectric sheet 4 between them.

Further, the present conductor sheets 3-1 and 3-2,
, 3-n-1 can provide an LC filter with reduced interlayer distribution capacitance and improved high-frequency characteristics by shielding between the single-layer LC filters. Further, the shielding effect can be increased by making the shape larger than that of the first and second conductor sheets.

When a core such as ferrite is not used, the third conductor sheets 3-1, 3-2,.
-N-1 and the dielectric film 4 may be disk-shaped instead of ring-shaped. In FIG. 15, a third conductive sheet may be provided at the uppermost and lowermost portions of the filter, and a dielectric film or an insulating film may be provided outside the third conductive sheet.

Embodiment 5 FIG. By using the third conductor sheet terminal 25-n of the fourth embodiment as a ground terminal, a common mode filter can be obtained.

Embodiment 6 FIG. FIG. 17 is a plan view of a laminate in which a dielectric film and a ring-shaped conductive sheet having a cut portion extending from the opening to the outer periphery are stacked. In the figure, reference numeral 14 denotes the radiation drawn from the center of the ring to the cut end. In the present embodiment, the terminals of the first and second conductive sheets are provided on the radiation 14 to produce the multilayer LC filter including N layers of the fourth embodiment. According to this embodiment, when laminating in multiple layers and connecting the corresponding terminals,
There is no terminal displacement, and production becomes easy.

Further, at the time of lamination, upper and lower conductive sheets,
By bonding and fixing the dielectric film with an adhesive, a multilayer LC filter having good adhesion without displacement can be manufactured. The external view and the equivalent circuit of the multilayer LC filter of this embodiment in which a ferrite core is inserted at the center of the laminated ring are the same as those in FIGS. 14 and 16, respectively.

Embodiment 7 FIG. In this embodiment, a copper foil portion is etched using a single-sided flexible board to form a polyester film or a dielectric film of a polyimide film and a ring-shaped conductor sheet with terminals as shown in FIG. A multilayer LC filter similar to that of the sixth embodiment was formed by combining these components and combining them. According to the present embodiment, there is an advantage that the labor for manufacturing can be omitted.

Embodiment 8 FIG. In the present embodiment, the connection method of each layer for multilayering the multilayer LC filter having the third conductive sheet described in Embodiment 4 is changed. FIGS. 18 and 19 are a plan view and a front view showing the configuration of the first layer of the single-layer LC filter having the third conductive sheet. FIG. 20 is a diagram showing a connection state when the single-layer LC filter is multi-layered, and particularly shows a connection between the (N-1) th layer and the N-th layer of the single-layer LC filter. In FIG. 18, reference numeral 31 denotes a cut portion cut on the radiation from the center of the ring-shaped conductive sheet 1 a, and 32 denotes a cut portion cut on the radiation from the center of the ring-shaped dielectric film 4. This is a cutting section provided at a shifted position. Similarly, reference numerals 33, 34, 35, and 36 denote cutting portions provided at positions shifted several degrees from the center of the conductive sheet 2a, the dielectric film 4, the conductive sheet 3a, and the dielectric film 4 on the radiation, respectively. is there.

In FIG. 20, 21-n-1 is a single layer LC.
In the (N-1) th layer of the filter, the connection terminals of the conductive sheet 1-n-1 exposed between the cut portions 31 and 32,
23-n-1 is a connection terminal of the conductive sheet 2-n-1 exposed between the cut portions 33 and 34, and 25-n-1 is a conductive terminal 3-exposed between the cut portions 35 and 36. n-1 connection terminal. Similarly, 20-n, 22-n and 24-
n is a connection terminal of each of the conductive sheets 1-n, 2-n and 3-n of the N-th layer of the single-layer LC filter. These connection terminals 21-n-1 and 20-n, 23-n-1 and 22
-N and 25-n-1 are connected to 24-n to form a first conductor sheet, a second conductor sheet, and a third conductor sheet, respectively.
The conductor sheet can be connected, and the N-th single-layer LC filter can be connected.
The connection between the -1st layer and the Nth layer is completed. Similarly, an N-layer multilayer LC filter is obtained by connecting the first-layer single-layer LC filter to the (N-1) -th single-layer LC filter. The equivalent circuit is shown in FIG. 16 of the fourth embodiment.

According to this embodiment, the connecting portion for multilayering can be accommodated in the surface of the ring-shaped conductor sheet without going outside, and the LC filter can be reduced in size.

Embodiment 9 FIG. In the present embodiment, as shown in FIG.
The dielectric film 4 is removed, and a non-conductive ring-shaped magnetic plate is used instead. In the figure, 1
Reference numeral 5 denotes a ring-shaped magnetic plate. FIG. 22 shows an equivalent circuit. By inserting this magnetic plate, 3 in the equivalent circuit is obtained.
The effects of adding magnetic beads shown in FIGS. That is, as the LC filter, an improvement in frequency characteristics, particularly, an improvement in characteristics in a high frequency region can be obtained. The capacitors 10, 11, and 12 in the equivalent circuit of FIG. 22 are formed by the conductor sheets and the gaps between them, or by the permittivity of the magnetic plate. Of course, when the capacity of the capacitor is insufficient, a dielectric film may be added as in the fourth embodiment. For example, in FIG. 21, the configuration may be such that a conductor sheet, a magnetic plate, a dielectric film, a conductor sheet... Are repeated.

Further, as shown in the sixth embodiment, each component is bonded and fixed with an adhesive at the time of lamination, thereby preventing displacement during lamination. In the case of bonding and fixing with an adhesive, if insulation between the conductive sheet and the magnetic plate can be maintained, the magnetic plate can be widely selected without being limited to a non-conductive magnetic material.

Further, by providing the input and output terminals of the first and second conductor sheets as shown in 20a and 21a of FIG. 17 shown in the sixth embodiment, it is possible to prevent the connection terminal from being displaced during multilayering.
Also, in the case of an LC filter in which a magnetic plate is inserted, by performing the processing shown in the eighth embodiment, the connection means at the time of multilayering of the eighth embodiment can be applied, and the LC filter can be downsized. Furthermore, as shown in Embodiment 7, a flexible substrate can be used on one side.

The appearance of the multilayer LC filter of the present embodiment in which a ferrite core is inserted at the center of the laminate is the same as that shown in FIG.

Embodiment 10 FIG. This embodiment is different from the third embodiment in that the single-layer LC filter N
A multi-layer LC filter consisting of one layer was formed, while in Example 4, a multi-layer LC filter consisting of N2 layers of a single-layer LC filter provided with a third conductor sheet was formed. Alternatively, a multilayer LC filter composed of N1 + N2 layers is formed by connecting corresponding terminals of the first and second conductor sheets in the same manner as in the fourth embodiment. According to the present embodiment, the inductance and capacitance in the equivalent circuit of FIG. 16 can be changed by arbitrarily selecting the number of laminations N1 and N2 of the above two types of multilayer LC filters. Can be set relatively easily.

Further, it is needless to say that a similar multilayer LC filter can be formed even when the layers are connected to each other in the surface of the conductor sheet to form a multilayer as shown in the eighth embodiment.

Embodiment 11 FIG. FIG. 23 is a plan view of a conductive foil showing one embodiment of the present invention, FIG. 24 is a plan view of a dielectric film, and FIG. 25 is a view when the conductive plate and the dielectric film of FIGS. 24 shows a sectional view at A in FIG. 26, 29, and 32 are plan views of other conductive foils, FIGS. 27, 30, and 33 are plan views of other dielectric films, and FIGS. 28, 31, and 34 are FIGS. 27, 29, 30, 30, 32, 33
27 and 3 when the conductive plate and the dielectric film of FIG.
0, and a sectional view at A in FIG. 33 is shown. FIG. 35 shows FIG.
3, FIG. 26, FIG. 29, FIG.
Shows an equivalent circuit of the LC filter of the present invention. FIG.
In FIG. 36, 1 is a conductive plate, 20a, 20b, 20c,
20d, 20e, 20f, 20g, 20h are terminals, 17
Is a hole for inserting a core, 4 is a dielectric film, 5a and 5b are holes for connecting a conductive plate, 6 is a projection for positioning, 7 is an inductance, and 12 is a line capacitor.

23, 26, 29 and 32, reference numeral 1 denotes a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery. At both cut ends of the conductive plate 1, terminals 20 are integrated with the conductive foil. The conductive plate 1 shown in FIG. 23 forms a one-turn coil by making one turn around the core insertion hole 17 formed in the center of the dielectric film 4 from the terminals 20a to 20b. Further, the terminal 20b is shown in FIG.
25, 27, and 28, and is connected to the terminal 20c of FIG. 29 by a conductive adhesive or through a hole 5a for connecting a conductive plate, and continues to the terminal 20d to form a two-turn coil 7a. Similarly, the conductive plate 1 of FIG. 26 makes one round of the hole 17 for inserting the core from the terminal 20e,
8, through the hole 5b for connecting the conductive plate shown in FIGS. 30 and 31, it is connected to the terminal 20g shown in FIG. 32 or connected by a conductive adhesive, and continues to the terminal 20h to form a two-turn coil 7b. The terminals 20 are connected as described above, and the connection diagram is as shown in FIG. The line-to-line capacitor 12 is constituted by the conductive plate 1 and the dielectric film 4 shown in FIGS. 23 and 26, FIGS. 26 and 29, and FIGS. 29 and 32. Therefore, an equivalent circuit of the LC filter of the present invention is as shown in FIG. In addition, positioning for connecting predetermined terminals can be performed by aligning the positioning projections 6 attached to the dielectric film 4 in FIGS. 24, 27, 30, and 33.

Embodiment 12 FIG. FIG. 37 is a front view of a double-sided board showing another embodiment of the present invention, FIG. 38 is a rear view of FIG. 37, and FIG. 39 is a cross-sectional view of A in FIG. 40, 43, and 46 are front views of another double-sided board, and FIGS. 41, 44, and 47 are rear views thereof.
42, 45, and 48 correspond to FIGS. 40, 43, respectively.
FIG. 47 shows a sectional view taken along A in FIG. 46. 37 to 48, reference numeral 1 denotes a conductive plate, 20a, 20b, 20c, 20d, 2
0e, 20f, 20g, and 20h are terminals, 17 is a hole for inserting a core, 4 is a dielectric film, 5a and 5b are holes for connecting a conductive plate, 6 is a projection for positioning, and 13 is copper on the inner surface. 3 shows a through hole plated with a highly conductive metal.
The following is simply referred to as a through hole.

In FIGS. 37, 40, 43, and 46, reference numeral 1 denotes a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery. Terminals 20 are provided on the back surface connected to one cut end and the other cut end of the conductive plate 1 by through holes 13. The conductive plate 1 in FIG.
From the other cut end to the terminal 20b on the back surface connected to the other cut end through the through hole 13, one round of the core insertion hole 17 formed in the center of the dielectric film 4 to form a one-turn coil. Further, the terminal 20b is connected to the terminal 20c shown in FIG. 43 through a hole 5 for connecting a conductive plate shown in FIGS. 40, 41 and 42 or is connected to the terminal 20c shown in FIG. 43 by a conductive adhesive. A turn coil is formed. Here, the thickness of the terminal 20b is shown in FIGS.
As shown in FIG. 45 and FIG. 48, the thickness is increased by the thickness of the dielectric film 4 and the adhesive between the conductive plate and the dielectric film 4 as compared with the conductive plate 1, so that good connection with the terminal 20c is possible. . Similarly, the conductive plate 1 shown in FIG. 40 goes around the core insertion hole 17 from the terminal 20e, is connected by the through hole 13, and has the thickness of the rear terminal 2 adjusted like the terminal 20b.
0f, the hole 5 for connecting the conductive plate shown in FIGS. 43, 44 and 45.
47, and is connected to the terminal 20g in FIG. 46 by a contact or a conductive adhesive, and continues to the terminal 20h in FIG. 47 connected to the back surface through the through hole 13 to form a two-turn coil. The terminals 20 are connected as described above, and the connection diagram is as shown in FIG. 35 as in the eleventh embodiment. Further, the conductive plate 1 and the dielectric film 4 of FIGS. 37 and 40, FIGS. 40 and 43, and FIGS. 43 and 46 constitute a line capacitor. Therefore, an equivalent circuit of the LC filter according to another embodiment of the present invention is as shown in FIG. 36 as in the eleventh embodiment. Also, by aligning the positioning protrusions 6 attached to the dielectric film 4 in FIGS. 37, 40, 43, and 46, positioning for connecting predetermined terminals can be performed. Further, in this embodiment, the shape of the conductive plate is a ring shape, but it is not necessarily limited to a disk shape. The same applies to the following embodiments.

Embodiment 13 FIG. FIG. 49 is a development view of a multilayer substrate showing another embodiment of the present invention. In FIG. 49, reference numerals 1a, 1b, 1c, and 1d denote first to fourth-layer conductive plates, 20a, 20b, 20c, and 2, respectively.
0d, 20e, 20f, 20g, 20h, 20i, 20
j and 20k are terminals; 17 is a hole for inserting a core;
Reference numerals b, 4c, and 4d denote first to fourth dielectric films, 6 denotes a projection for positioning, and 13 denotes a through hole.

In FIG. 49, reference numeral 1 denotes a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery. Both cut ends of the conductive plate 1 are provided with terminals 20. FIG.
Is connected to the terminal 20a at the other cut end from the terminal 20a.
One turn is formed around the core insertion hole 17 up to b to form a one-turn coil. Further, the terminal 20b is connected to the terminal 20c of the third-layer conductive plate 1c through the through hole 13, forms a second-turn coil up to the terminal 20d of the same layer, and is connected again to the terminal 20i through the through hole 13. . Further, the terminal 20j of the first layer is formed in the through hole 13.
Is connected to the terminal 20e provided on the second-layer conductive plate 1b, and then connected to the terminal 20k via the terminals 20f, 20g, and 20h to form a two-turn coil. Further, the first and second layers, the second and third layers, and the third and fourth layers of the conductive plate 1 constitute a line-to-line capacitor via a dielectric film 4. Therefore, this equivalent circuit is as shown in FIG. 36 as in the eleventh embodiment, and an LC filter is formed by connecting this multilayer substrate in one or more stages.
At this time, the positioning protrusions 6 provided on the dielectric film 4 are aligned, and the terminals 20i of one multilayer substrate are in contact with the terminals 20a of the other multilayer substrate, and the terminals 20k are in contact with the terminals 20j or by a conductive adhesive. Connected.

Embodiment 14 FIG. 50 is a front view of a double-sided board showing another embodiment of the present invention, FIG. 51 is a rear view of FIG. 50, and FIG. 52 is a cross-sectional view of A in FIG. 53 is a front view of another double-sided board, FIG. 54 is a rear view thereof, and FIG. 55 is a cross-sectional view taken along line A in FIG. FIG. 56 is a connection diagram of the conductive plates of FIGS. 50 and 53, and FIG. 57 shows an equivalent circuit of the LC filter of the present invention. 50 to 57, reference numeral 1 denotes a conductive plate;
1, 20m, 20n, 20p are terminals, 17 is a hole for inserting a core, 4 is a dielectric film, 5 is a hole for connecting a conductive plate, 6
Denotes a convex for positioning, 12 denotes a line capacitor, and 13 denotes a through hole.

In FIGS. 50 and 53, reference numeral 1 denotes a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery. Terminals 20 are provided on the back surface connected to both cut ends of the conductive plate 1 by the through holes 13. A plurality of double-sided boards of FIG. 50 are prepared, and the terminals 201 and the terminals 20m of FIG. 51 are connected to each other or connected using a conductive adhesive, that is, a plurality of conductive plates 1 are connected in parallel. Similarly, a plurality of double-sided boards of FIG. 53 are prepared, and the terminals 20n of FIG. 54 and the terminals 20p are connected to each other or connected using a conductive adhesive.
In this connection, the positioning for connecting predetermined terminals can be performed by aligning the positioning projections 6 attached to the dielectric film 4 of FIGS. 50, 51, 53, and 54. The thickness of the terminal 20 shown in FIGS. 51 and 54 is larger than that of the conductive plate 1 by the thickness of the dielectric film 4 and the adhesive between the conductive plate and the dielectric film 4 as shown in FIGS. , Terminals 20 can be connected well. The two sets of conductive plates 1 connected in parallel as described above are alternately stacked as shown in the connection diagram of FIG.
7, a line capacitor 12 as shown in FIG. In this configuration, similarly to the connection between the same double-sided substrates, the positioning protrusion 6 is used for positioning the substrate, and one terminal 2
Numeral 0 is connected by a terminal whose thickness has been adjusted through a hole 5 for connecting a conductive plate formed in the other substrate.

Embodiment 15 FIG. FIG. 58 is a front view of a double-sided board showing another embodiment of the present invention, FIG. 59 is a rear view of FIG. 58, and FIGS.
Shows cross-sectional views at A, B, and C in FIG. 58, respectively.
63, FIG. 68, FIG. 73, FIG. 78, FIG. 83, FIG. 88, and FIG. 93 are surface views of another double-sided board, FIG. 64, FIG.
4, FIG. 79, FIG. 84, FIG. 89, and FIG. 94 are rear views, FIG. 65 to FIG. 67, FIG. 70 to FIG.
0 to 82, 85 to 87, 90 to 92, and 95
To FIG. 97 correspond to FIG. 63, FIG. 68, FIG.
8, FIG. 83, FIG. 88, and FIG. 93 show cross-sectional views at A, B, and C. FIG. 98 shows a connection diagram of the conductive plates of each double-sided board, and FIG. 99 shows an equivalent circuit of the LC filter of the present invention. 58 to 99, reference numerals 1a and 1b denote conductive plates;
a, 20b, 20c, 20d, 20e, 20f, 20
g, 20h, 20i, 20q, 20r, 20s, 20
t, 20u, 20v, and 20w are terminals, 17 is a hole for inserting a core, 4 is a dielectric film, 5a, 5b, and 5c are holes for connecting a conductive plate, 6 is a projection for positioning, and 7a and 7b are inductances. , 13 are through holes and 10 and 11 are line-to-ground capacitors.

In FIGS. 58, 68, 78 and 88, reference numeral 1a denotes a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery. Terminals 20 are provided on the back surface connected to one cut end and the other cut end of the conductive plate 1a by the through-hole 13. The conductive plate 1a shown in FIG. 58 extends around the core insertion hole 17 opened in the center of the dielectric film 4 from the terminal 20a to the terminal 20b on the back surface connected to the other cut end by the through hole 13. One turn of the coil is formed. Further, the terminal 20b is shown in FIGS.
The terminal 20c of FIG. 78 passes through the conductive plate connecting hole 5a of FIG. 65 and is in contact with or connected to the terminal 20u of FIG. 68 by a conductive adhesive. And is connected by a conductive adhesive to the terminal 20d to form a two-turn coil 7a. Further, it is connected to the terminal 20w of FIG. 88 through the hole 5a for connecting the conductive plate of FIGS. 83 to 85. Here terminal 2
0b, 20u, 20d and 20w are shown in FIGS.
As shown in FIGS. 0, 80, and 90, the thickness is increased by the thickness of the dielectric film 4 and the adhesive between the conductive plate and the dielectric film 4 as compared with the conductive plate 1a. It is possible. Similarly, the conductive plate 1a of FIG. 68 is connected to the terminal 20e of FIG. 58 through the hole 5b for connecting the conductive plate of FIGS. 63, 64, and 66 and is connected to the terminal 20e or is connected by a conductive adhesive. A one-turn coil is formed up to the terminal 20f on the back surface connected to the cut end of the through hole 13 through the through hole 13. 73, 74, 7
The terminal 20g shown in FIG. 88 passes through the hole 5b for connecting a conductive plate and is connected to the terminal 20v shown in FIG. 78 by a conductive adhesive or through the hole 5b for connecting a conductive plate shown in FIGS. 83, 84 and 86. And a second turn of the coil 7b which is connected to the terminal or by a conductive adhesive and continues to the terminal 20h. Here, the thickness of the terminals 20i, 20f, 20v, and 20h is larger than that of the conductive plate 1a as shown in FIGS. 61, 71, 81, and 91. Since the thickness is increased by the amount of the agent, good connection between the terminals is possible. The conductive plate 1b shown in FIG. 63 is provided with a terminal 20q with a through hole 13 and a terminal shown in FIG.
8, after passing through the conductive plate connecting hole 5c of FIG. 69 and FIG. 72 and contacting with the terminal 20r or being connected by a conductive adhesive, pass through the conductive plate connecting hole 5c of FIG. 78, FIG. 79 and FIG. The terminal 20s of FIG. 83 is contacted or connected by a conductive adhesive, and is connected to the terminal 20t of FIG. 93 through the hole 5c for connecting a conductive plate of FIGS. 88, 89, and 92 or connected by a conductive adhesive. Then it is grounded. As described above, the terminals 20 are connected, and the wiring diagram is as shown in FIG. 58 and 63, FIGS. 63 and 68, FIG.
8 and FIG. 73, FIG. 73 and FIG. 78, FIG. 78 and FIG.
88, and the conductive plate 1 and the dielectric film 4 of FIGS. 88 and 93 constitute the line-to-ground capacitors 10 and 11. Therefore, the equivalent circuit of this LC filter is as shown in FIG. By aligning the positioning projections 6 attached to the dielectric film 4 of each double-sided board, positioning for connecting predetermined terminals can be performed. A new LC filter is formed by connecting the LC filters configured as described above in series in one or multiple stages and connecting them in series with the filters of the twelfth and fourteenth embodiments. This LC filter comprises a first filter in which conductive plates for inductance and line capacitors are connected in series, a second filter in which conductive plates for line capacitors are connected in parallel, and a line-to-ground capacitor. A third filter in which another conductive plate and a dielectric are inserted between each conductive plate for inductance, and the inserted conductive is grounded, and the number of conductive plates to be stacked in multiple layers in each filter is adjusted. Thus, each constant can be set independently. FIG. 100 shows an equivalent circuit of the filter.

[0053]

Since the present invention is configured as described above, it has the following effects.

In addition to the first and second conductive sheets,
The third conductor sheet shields between the first and second conductor layers by fabricating the LC filter using a third conductor sheet that covers them wider than the second conductor sheet. As a result, the distributed capacitance of the coil between layers can be reduced, the resonance frequency of the coil can be increased, and the high frequency characteristics of the LC filter can be improved.

Further, an LC filter manufactured by laminating a dielectric film and a ring-shaped conductive plate having a cut portion extending from the opening to the outer periphery does not require winding of the conductive plate and the dielectric film. Can be easily manufactured. Furthermore, in the connection method in which the cut portions of the conductive plate and the dielectric film of the repeating unit layer in the configuration are shifted while being shifted, and the corresponding cut end of the next unit layer is connected, the conductive plate is connected in the plane. , Without connecting terminals
The size of the C filter can be reduced.

Further, it has an opening provided at the center and a cut portion extending from the opening to the outer periphery, and the conductive plate having terminals at the cut portion and a dielectric film are used to form inductance and capacitance, thereby forming the conductive plate into a multilayer. It can be realized by overlapping, and the work of taking out the electrode as in the conventional case is not required. Furthermore, since they are aligned by the angle positioning means provided on the dielectric film and need only be connected with a conductive adhesive or the like, the production can be automated and the production cost can be reduced.

Further, an LC filter is composed of a double-sided substrate, and the contact can be made by making the terminal thickness of the lower surface thicker than the terminal thickness of the upper surface by the thickness of the dielectric layer or the like. And the manufacturing cost can be reduced.

Further, the degree of freedom in designing the LC filter can be increased by stacking the respective LC filters in multiple stages.

[Brief description of the drawings]

FIG. 1 is a development view of Embodiment 1 of the present invention.

FIG. 2 is a layer configuration diagram according to a first embodiment of the present invention.

FIG. 3 is an equivalent circuit of the first embodiment of the present invention.

FIG. 4 is an external view of a first embodiment of the present invention.

FIG. 5 is an impedance characteristic diagram according to the first embodiment of the present invention.

FIG. 6 is a plan view of a conductor sheet according to a third embodiment of the present invention.

FIG. 7 is a front view of a conductor sheet according to a third embodiment of the present invention.

FIG. 8 is a plan view of a single-layer LC filter according to Embodiment 3 of the present invention.

FIG. 9 is a front view of a single-layer LC filter according to Embodiment 3 of the present invention.

FIG. 10 is an equivalent circuit of a single-layer LC filter according to Embodiment 3 of the present invention.

FIG. 11 is a plan view of a multilayer LC filter according to Embodiment 3 of the present invention.

FIG. 12 is a front view of a multilayer LC filter according to Embodiment 3 of the present invention.

FIG. 13 is an equivalent circuit of a multilayer LC filter according to Embodiment 3 of the present invention.

FIG. 14 is an external view of a multilayer LC filter according to Embodiment 3 of the present invention.

FIG. 15 is a front view of a multilayer LC filter according to Embodiment 4 of the present invention.

FIG. 16 is an equivalent circuit of a multilayer LC filter according to Embodiment 4 of the present invention.

FIG. 17 is a plan view of a laminate of a conductive sheet and a dielectric film according to Example 6 of the present invention.

FIG. 18 is a plan view of a single-layer LC filter according to Example 8 of the present invention.

FIG. 19 is a front view of a single-layer LC filter according to Example 8 of the present invention.

FIG. 20 is a diagram illustrating connection of a single-layer LC filter according to Example 8 of the present invention.

FIG. 21 is a front view of a multilayer LC filter according to Embodiment 9 of the present invention.

FIG. 22 is an equivalent circuit of a multilayer LC filter according to Embodiment 9 of the present invention.

FIG. 23 is a plan view of a conductive plate according to Embodiment 11 of the present invention.

FIG. 24 is a plan view of a dielectric film of Example 11 of the present invention.

FIG. 25 is a cross-sectional view when a conductive plate and a dielectric film according to Embodiment 11 of the present invention are overlaid.

FIG. 26 is a plan view of another conductive plate according to the eleventh embodiment of the present invention.

FIG. 27 is a plan view of another dielectric film of Example 11 of the present invention.

FIG. 28 is a cross-sectional view when another conductive plate and another dielectric film of Example 11 of the present invention are overlaid.

FIG. 29 is a plan view of another conductive plate according to the eleventh embodiment of the present invention.

FIG. 30 is a plan view of another dielectric film of Example 11 of the present invention.

FIG. 31 is a cross-sectional view when another conductive plate and another dielectric film according to Example 11 of the present invention are overlaid.

FIG. 32 is a plan view of another conductive plate according to the eleventh embodiment of the present invention.

FIG. 33 is a plan view of another dielectric film of Example 11 of the present invention.

FIG. 34 is a cross-sectional view when another conductive plate and another dielectric film of Example 11 of the present invention are overlaid.

FIG. 35 is a connection diagram of a conductive plate according to Embodiment 11 of the present invention.

FIG. 36 is an equivalent circuit of Example 11 of the present invention.

FIG. 37 is a front view showing a double-sided board according to Example 12 of the present invention.

FIG. 38 is a rear view showing a double-sided board according to Example 12 of the present invention.

FIG. 39 is a sectional view of a double-sided substrate according to Example 12 of the present invention.

FIG. 40 is a front view showing another double-sided board according to Example 12 of the present invention.

FIG. 41 is a rear view showing another double-sided board according to Embodiment 12 of the present invention;

FIG. 42 is a sectional view of another double-sided board according to the twelfth embodiment of the present invention.

FIG. 43 is a front view showing another double-sided board according to Example 12 of the present invention.

FIG. 44 is a rear view showing another double-sided board according to the twelfth embodiment of the present invention;

FIG. 45 is a sectional view of another double-sided board according to the twelfth embodiment of the present invention.

FIG. 46 is a front view showing another double-sided board according to Example 12 of the present invention.

FIG. 47 is a rear view showing another double-sided board according to Embodiment 12 of the present invention;

FIG. 48 is a sectional view of another double-sided board according to the twelfth embodiment of the present invention;

FIG. 49 is a developed view of a multilayer substrate according to Embodiment 13 of the present invention.

FIG. 50 is a front view showing a double-sided board according to Example 14 of the present invention.

FIG. 51 is a rear view showing a double-sided board according to Embodiment 14 of the present invention.

FIG. 52 is a sectional view of a double-sided board according to Example 14 of the present invention.

FIG. 53 is a front view showing another double-sided board according to Embodiment 14 of the present invention;

FIG. 54 is a rear view showing another double-sided board according to Embodiment 14 of the present invention;

FIG. 55 is a sectional view of another double-sided board according to the fourteenth embodiment of the present invention;

FIG. 56 is a connection diagram of a conductive plate according to Example 14 of the present invention.

FIG. 57 is an equivalent circuit of Example 14 of the present invention.

FIG. 58 is a front view showing a double-sided board according to Embodiment 15 of the present invention.

FIG. 59 is a back view showing a double-sided board according to Embodiment 15 of the present invention.

FIG. 60 is a cross-sectional view of a double-sided board according to Embodiment 15 of the present invention.

FIG. 61 is another cross-sectional view of the double-sided board according to Embodiment 15 of the present invention.

FIG. 62 is another cross-sectional view of the double-sided board according to Embodiment 15 of the present invention.

FIG. 63 is a front view showing another double-sided board according to Embodiment 15 of the present invention;

FIG. 64 is a rear view showing another double-sided board according to Embodiment 15 of the present invention;

FIG. 65 is a cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 66 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 67 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 68 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 69 is a rear view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 70 is a sectional view of another double-sided board according to Embodiment 15 of the present invention;

FIG. 71 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 72 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 73 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 74 is a rear view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 75 is a sectional view of another double-sided board according to Embodiment 15 of the present invention;

FIG. 76 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 77 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 78 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 79 is a rear view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 80 is a cross-sectional view of another double-sided board according to Embodiment 15 of the present invention;

FIG. 81 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 82 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention;

FIG. 83 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 84 is a rear view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 85 is a cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 86 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 87 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 88 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 89 is a rear view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 90 is a cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 91 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 92 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 93 is a front view showing another double-sided board according to Embodiment 15 of the present invention.

FIG. 94 is a rear view showing another double-sided board according to Embodiment 15 of the present invention;

FIG. 95 is a sectional view of another double-sided board according to Embodiment 15 of the present invention;

FIG. 96 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 97 is another cross-sectional view of another double-sided board according to Embodiment 15 of the present invention.

FIG. 98 is a connection diagram of a conductive plate according to Embodiment 15 of the present invention.

FIG. 99 is an equivalent circuit of Example 15 of the present invention.

FIG. 100 is an equivalent circuit of Example 15 of the present invention.

FIG. 101 is a developed view of a conventional noise filter.

FIG. 102 is a perspective view of a conventional noise filter.

FIG. 103 is an equivalent circuit of a conventional noise filter.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st conductor sheet (conductor, conductive foil, conductive plate) 2 2nd conductor sheet (conductor, conductive foil, conductive plate) 3 3rd conductor sheet (conductor, conductive foil, conductive plate) 4 Dielectric Body film 5 Opening for connection of conductive plate 13 Through hole 14 Radiation from ring center 15 Magnetic plate 17 Opening provided at center (hole for core insertion) 20-25 Input / output terminals

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor, Nao Hirashiro, 2-14-40, Ofuna, Kamakura-shi Mitsubishi Electric Corp. Inside Life Systems Research Institute, Inc. (72) Inventor Naoto Oka 2--14-40, Ofuna, Kamakura City Mitsubishi Electric Corporation Inside Life Systems Research Institute, (72) Inventor, Toshio Ohtake 2--14-40, Ofuna, Kamakura Mitsubishi Electric Corporation Lifestyle Research Institute (72) Inventor Mitsuhiko Kanda 2-14-40 Ofuna, Kamakura City Mitsubishi Electric Corporation Lifestyle Research Institute (72) Inventor Hironobu Tsutsumi 1-1-57 Miyashita Sagamihara-shi Mitsubishi Electric Corporation Sagami Works (72) Inventor Yoshio Igawa 1-57 Miyashita 1-chome, Sagamihara City Mitsubishi Electric Corporation Sagami (56) References JP-A-54-83736 (JP, A) JP-A-62-233911 (JP, A) JP-A-57-100218 (JP, U) JP-A-54-113344 (JP, U) ) Tokiko 36-1321 (JP, B1)

Claims (5)

(57) [Claims] 2. The method of claim 1, wherein the first, second and third dielectric films are arranged in parallel.
And first and second conductor sheets and first and second conductors
A third conductive sheet wider than the sheet;
Body film and conductor sheet alternately in this order
To insulate the first, second and third conductor sheets,
The first and second conductors with the conductor sheet of No. 3 outside.
Wound to enclose the sheet, the first conductive sheet and
Each end of the second conductor sheet is wound on the axis of the winding.
An input terminal and an output terminal formed by extending in the same direction as
A terminal formed by extending an end of the third conductive sheet;
An LC filter, comprising: 2. A cutting portion extending from a central opening to an outer periphery.
Ring-shaped first, second and third conductive plates and first and second
And a third dielectric film are alternately stacked in this order.
To insulate the first, second and third conductive plates and
A first dielectric fill is provided at one end of the cut portion of the conductive plate.
, Second conductive plate, second dielectric film, third conductive
Plate, the third dielectric film, and the first conductive film.
At the other end of the cut section of the plate, the first dielectric film, the second
Conductive plate, second dielectric film, third conductive plate, third conductive film
The first, so as to be drawn in the order of the dielectric film of
Second and third conductive plates and first, second and third dielectric members
Rotate the film to shift the position of each cut.
And the other end of the cut portion of the first conductive plate
Is twisted so as to be adjacent to the third dielectric film.
A first laminated body formed by adding
It has a second laminated body formed in the same manner, and the second laminated body of the first laminated body
One end of the cut portion of the first, second and third conductive plates and the second end
The other of the cut portions of the first, second and third conductive plates of the laminate
The first laminate and the second laminate are arranged so that the edges abut each other.
Lay the body with its openings aligned and
The first, second and third laminates
At least 2 turns by electrically connecting the conductive plates of
Having a first coil and a second coil formed with
LC filter characterized by the above-mentioned. 3. The opening provided with the angle positioning means is located at the center.
Ring-shaped first, second, third and fourth dielectric members having
Film on a specific diameter relative to the angle positioning means
Has a first hole and a second hole arranged with the opening interposed therebetween.
However, in the first dielectric film, the first hole is close to the opening,
The second hole is near the outer periphery, and the first hole is in the second dielectric film.
The hole and the second hole are close to the opening, and the third dielectric film
The first hole is closer to the outer periphery, and the second hole is closer to the opening.
In the electronic film, the first hole and the second hole are provided near the outer periphery.
The first, second, third and fourth dielectric films are also
Align the openings and use the angle positioning means
The first, second, and third positions are arranged in order in accordance with the angles.
And on the upper surface of each of the fourth dielectric films in order.
The first, second, third and fourth conductive plates, the first conductive plate
Open at the position corresponding to the opening of the first dielectric film.
Mouth, the position of the first hole from the opening to the outer periphery and its outer periphery
Cut part to form a terminal on each side, at the position of the second hole
A cutout is formed, and a second dielectric plate is formed on the second conductive plate.
Opening at the position corresponding to the opening of the room, from the above opening to the outer periphery
Terminals are formed at the position of the second hole and its outer peripheral side
The cut portion to be cut is formed at the position of the first hole, and the cut portion is formed at the third hole.
In the conductive plate of (3), the position corresponding to the opening of the third dielectric film is
And the position of the first hole extending from the opening to the outer periphery.
Cut portions forming terminals on the opening side of the second hole
A cutout is formed at the position, and a fourth dielectric plate is formed at the fourth conductive plate.
Opening at a position corresponding to the opening of the body film, from the above opening
Terminals are provided at the position of the second hole and the opening side
A cut portion is formed, and a cut portion is formed at the position of the first hole.
Having the first, second, third, and fourth conductive plates,
The terminal at the position of the first hole of the first conductive plate and the terminal of the third conductive plate
The terminal at the position of the first hole is connected to the first
Holes, cutouts of the second conductive plate, and second cuts of the second dielectric film.
Electrical connection through one hole for at least 2 turns
A first coil formed, and a second hole in the second conductive plate.
And the terminal at the position of the second hole of the fourth conductive plate.
Cutting off the second hole of the second dielectric film and the third conductive plate
Part, electrically through the second hole of the third dielectric film
A second coil connected to form at least two turns;
An LC filter comprising: 4. An opening provided with an angle positioning means is provided at the center.
Ring-shaped first, second, third and fourth dielectric members having
Angular positioning hand with aligning the respective apertures of Irumu
Adjust the angles at the steps and arrange them in order.
First, second, third and fourth conductive plates are provided on the upper surface in order,
The first, second, third and fourth dielectric films are
The opening above a specific diameter for the angle positioning means
Insert the through hole into the hole
A thick conductive plate terminal on the lower surface connected by a
In the case of dielectric film, the thick conductive plate terminal is close to the opening and the hole is
Around the periphery, the second dielectric film has a thick conductive plate terminal.
The hole is close to the opening, and the third dielectric film is a thick conductive plate.
The terminal is near the outer periphery and the hole is near the opening.
The thick conductive plate terminal and the hole are provided near the outer circumference in the
The first, second, third and fourth conductive plates are dielectric films
Opening at a position corresponding to the opening from the opening to the outer periphery
Place the terminal on the position of the thick conductive plate terminal and the outer peripheral side
A cutting portion forming a cutout portion is formed at the position of the hole,
The first, second, third and fourth dielectric films, and
The first, second, third, and fourth conductive plates are overlapped, and
The thick conductive plate terminal of the first dielectric film is connected to the third conductive plate.
The cutout of the second conductive plate and the second dielectric
Electrically connected through a hole in the body film to at least 2
A first coil having a turn formed therein, and the second dielectric
The thick conductive plate terminal of the film is connected to the terminal on the opening side of the fourth conductive plate.
A cut portion of the third conductive plate, a hole in the third dielectric film
Electrically connected through to form at least two turns
LC filter characterized by comprising a second coil having
Tar. 5. The L according to claim 1, wherein
Equipped with multiple C filters, each LC filter
Are connected in series to form a multi-stage LC filter.
Luther.