JP2702321B2 - Semiconductor device manufacturing equipment - Google Patents
Semiconductor device manufacturing equipmentInfo
- Publication number
- JP2702321B2 JP2702321B2 JP3193362A JP19336291A JP2702321B2 JP 2702321 B2 JP2702321 B2 JP 2702321B2 JP 3193362 A JP3193362 A JP 3193362A JP 19336291 A JP19336291 A JP 19336291A JP 2702321 B2 JP2702321 B2 JP 2702321B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- island
- device manufacturing
- manufacturing equipment
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置の製造装置に
関し、特にダイボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a die bonding apparatus.
【０００２】[0002]
【従来の技術】従来のダイボンディング装置は、１ピッ
チずつ送られるリードフレームのアイランド部へ接着材
料を供給又は転写し、その上に吸着治具を用いてペレッ
トを接着するという機能を有している。2. Description of the Related Art A conventional die bonding apparatus has a function of supplying or transferring an adhesive material to an island portion of a lead frame fed one pitch at a time, and bonding a pellet thereon using a suction jig. I have.
【０００３】[0003]
【発明が解決しようとする課題】従来、ダイボンディン
グされたペレットの履歴やロット番号等は、樹脂封止
後、樹脂の外面に捺印により印字している。しかし、外
面の捺印は擦れて消えることがあり、樹脂内に封止され
ているペレットの履歴がわからなくなるという問題があ
った。Conventionally, the history, lot number, etc., of the die-bonded pellets are printed by stamping on the outer surface of the resin after sealing with the resin. However, there is a problem that the stamp on the outer surface may be rubbed and disappeared, and the history of the pellets sealed in the resin may not be known.
【０００４】[0004]
【課題を解決するための手段】本発明のダイボンディン
グ装置は、ペレットをダイボンディングした後、リード
フレームのアイランド裏面に対しそのペレットの履歴や
型名を捺印する機能を付加した構造を有している。The die bonding apparatus of the present invention has a structure in which after the pellets are die-bonded, a function of imprinting the history or model name of the pellets on the back surface of the island of the lead frame is added. I have.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００６】図１は本発明の一実施例の装置構成図であ
る。本実施例では、ダイボンディング後に、そのアイラ
ンド裏面にペレットの履歴を捺印する捺印部を設けてい
る。リードフレームを１ピッチずつ送り、まず接着材供
給部において、リードフレーム１が有しているペレット
を接着する位置であるアイランド２に、接着材料３を塗
布または転写し、次いでダイボンディング部において、
位置決めされたペレット４を吸着治具５にて吸着し、ア
イランド２へ接着する。その後、捺印位置において、捺
印インクを表面に有する捺印部６がリードフレーム裏面
へ接触し捺印を行う。FIG. 1 is a block diagram of an apparatus according to an embodiment of the present invention. In this embodiment, after the die bonding, a marking portion for marking the history of the pellet is provided on the back surface of the island. The lead frame is fed one pitch at a time. First, in the adhesive supply section, the adhesive material 3 is applied or transferred to the island 2 where the pellets of the lead frame 1 are bonded, and then in the die bonding section,
The positioned pellet 4 is sucked by the suction jig 5 and adhered to the island 2. Thereafter, at the marking position, the marking portion 6 having the marking ink on the front surface contacts the rear surface of the lead frame to perform the marking.
【０００７】図２はアイランド裏面へ捺印されたＩＣの
裏面側から見た斜視図である。アイランド２に接着され
たペレット４は、金属細線７にて外部リード８と電気的
に接続されている。そのアイランド２の裏面には捺印部
６によって捺印されたロット記号９ａやシリアル番号９
ｂ等が有る。そして、それ全体を封止樹脂１０で封止し
ている。FIG. 2 is a perspective view of the IC stamped on the back surface of the island as viewed from the back surface side. The pellet 4 bonded to the island 2 is electrically connected to an external lead 8 by a thin metal wire 7. On the back surface of the island 2, the lot code 9a or the serial number 9
b etc. Then, the whole is sealed with a sealing resin 10.
【０００８】[0008]
【発明の効果】以上説明したように本発明は、ダイボン
ディング時にダイボンディングされたペレットの履歴等
をアイランド裏面に捺印することにより、封止樹脂へ捺
印された履歴が消えた場合においても、内部のペレット
の履歴を知ることが出来るという効果が有る。As described above, according to the present invention, the history of the die-bonded pellets is stamped on the back surface of the island at the time of die bonding, so that even if the history printed on the sealing resin disappears, The effect is that the history of the pellets can be known.
【図１】本発明の一実施例の装置構成図である。FIG. 1 is a configuration diagram of an apparatus according to an embodiment of the present invention.
【図２】捺印されたＩＣを裏面側から見た切欠き斜視図
である。FIG. 2 is a cutaway perspective view of the stamped IC viewed from the back side.
１ リードフレーム ２ アイランド ３ 接着材料 ４ ペレット ５ 吸着治具 ６ 捺印部 ７ 金属細線 ８ 外部リード ９ａ ロット記号 ９ｂ シリアル番号 １０ 封止樹脂 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Island 3 Adhesive material 4 Pellet 5 Suction jig 6 Marking part 7 Fine metal wire 8 External lead 9a Lot symbol 9b Serial number 10 Sealing resin
Claims (1)
する半導体装置の製造装置において、ダイボンディング
後リードフレームのアイランド部裏面にボンディングさ
れたペレットの履歴を捺印する捺印部を有する事を特徴
とする半導体装置の製造装置1. A semiconductor device manufacturing apparatus for bonding a semiconductor pellet to a lead frame, the semiconductor device having a marking portion for marking the history of the pellet bonded to the back surface of the island portion of the lead frame after die bonding. Manufacturing equipment
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3193362A JP2702321B2 (en) | 1991-08-02 | 1991-08-02 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3193362A JP2702321B2 (en) | 1991-08-02 | 1991-08-02 | Semiconductor device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0536739A JPH0536739A (en) | 1993-02-12 |
| JP2702321B2 true JP2702321B2 (en) | 1998-01-21 |
Family
ID=16306652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3193362A Expired - Fee Related JP2702321B2 (en) | 1991-08-02 | 1991-08-02 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2702321B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069741A (en) | 2011-09-21 | 2013-04-18 | Renesas Electronics Corp | Lead frame, semiconductor device, method for manufacturing lead frame and method for manufacturing semiconductor device |
| DE102019110191A1 (en) * | 2019-04-17 | 2020-10-22 | Infineon Technologies Ag | Package comprising an identifier on and / or in a carrier |
-
1991
- 1991-08-02 JP JP3193362A patent/JP2702321B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536739A (en) | 1993-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970819 |
|
| LAPS | Cancellation because of no payment of annual fees |