JP2674172B2 - Hot runner mold equipment - Google Patents
Hot runner mold equipmentInfo
- Publication number
- JP2674172B2 JP2674172B2 JP1008804A JP880489A JP2674172B2 JP 2674172 B2 JP2674172 B2 JP 2674172B2 JP 1008804 A JP1008804 A JP 1008804A JP 880489 A JP880489 A JP 880489A JP 2674172 B2 JP2674172 B2 JP 2674172B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- hot runner
- pin
- molded product
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、ホットランナ金型におけるゲート周囲の湯
ジワ、フローマークによる成形不良を無くし、成形サイ
クルを短縮させるためのホットランナ金型装置関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot runner mold apparatus for eliminating molding defects due to hot wrinkles around the gate and flow marks in a hot runner mold and shortening the molding cycle. is there.
従来の技術 従来のこの種の金型装置は、第４図に示す構造となっ
ていた。2. Description of the Related Art A conventional mold device of this type has a structure shown in FIG.
つまり、８はホットランナチップで（図示しない）成
形機より射出された樹脂の流路であり、成形品９の形状
をするキャビティ内に樹脂流し込むゲートを備えてい
る。10は固定側型板で、ホットランナチップ８を保持し
ている。11は固定側型板10に設けられ、ゲート、成形品
９を冷却固化させる冷却用穴である。12はゲート対向配
置された可定側凸部で、ゲート付近の冷却性を高めるた
めの成形品９を薄肉にするものである。That is, 8 is a hot runner chip, which is a flow path of resin injected from a molding machine (not shown), and is provided with a gate for pouring the resin into the cavity having the shape of the molded product 9. Reference numeral 10 denotes a fixed-side template that holds the hot runner chip 8. Reference numeral 11 is a cooling hole provided in the fixed-side template 10 for cooling and solidifying the gate and the molded product 9. Reference numeral 12 denotes an adjustable-side convex portion arranged opposite to the gate, which thins the molded product 9 for enhancing the cooling property in the vicinity of the gate.
発明が解決しようとする課題 しかしながら上記のような構造では、成形品への樹脂
流路が締られるため、成形サイクルが延長され、なおか
つゲート付近の冷却効果が意外に低く、ゲート付近に湯
ジワ、フローマーク等の成形不良を越こしやすい等の問
題点を有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the structure as described above, since the resin flow path to the molded product is tightened, the molding cycle is extended, and the cooling effect in the vicinity of the gate is unexpectedly low. There was a problem that it was easy to pass molding defects such as flow marks.
そこで、本発明は上記問題点に鑑み、ゲート周囲の湯
ジワ、フローマークによる成形不良を無くし、成形サイ
クルを短縮することができるホットランナ金型装置提供
するものである。Therefore, in view of the above problems, the present invention provides a hot runner die device which can eliminate molding defects due to wrinkles and flow marks around the gate and shorten the molding cycle.
課題を解決するための手段 上記問題点を解消するために本発明のホットランナ金
型装置は、ゲートに対向配置され、型締め方向に往復動
可能で冷却用穴を有するピンと、前記ピンを往復させる
駆動手段とを備えたことを特徴とする。Means for Solving the Problems In order to solve the above problems, a hot runner die device according to the present invention includes a pin which is arranged to face a gate and which is capable of reciprocating in a mold clamping direction and has a cooling hole, and reciprocates the pin. And driving means for driving.
作用 上記構成において、樹脂を充填する隙はピンをゲート
から離し、ゲートを広くすることができるので、成形サ
イクルを短縮し、成形品のコストを低減することができ
る。充填完了後はピンをゲートに接近させてゲートを絞
るとともに、ゲート近傍の樹脂を冷却することにより、
ゲート周囲の湯ジロ、フローマークによる成形不良を無
くし、成形品の外観品質を向上させることができる。Function In the above configuration, the pin can be separated from the gate and the gate can be widened in the gap filled with the resin, so that the molding cycle can be shortened and the cost of the molded product can be reduced. After the filling is completed, the pin is brought close to the gate to squeeze the gate, and by cooling the resin near the gate,
It is possible to improve the appearance quality of the molded product by eliminating molding defects due to hot water giro and flow marks around the gate.
実 施 例 以下、本発明の一実施例について第１図〜第３図を参
照しながら説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS.
第１図において、１はホットランナチップで、成形機
より射出された樹脂の流路であり、成形品２の形状を有
するキャビティ内に樹脂を流し込むゲート1aを備えてい
る。３は固定側型板で、ホットランナチップ１を保持
し、４は固定側型板３に設けられ、ゲート1a、成形品２
を冷却固化させる冷却用穴である。５は冷却用穴5aを備
えたピンで、６はピン５の下端に連結され、ピン５を型
締め方向に往復動させるシリンダーであり、可動側取付
板７に固定されている。In FIG. 1, reference numeral 1 denotes a hot runner chip, which is a flow path of resin injected from a molding machine, and is provided with a gate 1a for pouring the resin into a cavity having the shape of a molded product 2. Reference numeral 3 is a fixed-side template, which holds the hot runner chip 1, and 4 is provided on the fixed-side template 3, which includes a gate 1a and a molded product 2.
Is a cooling hole for cooling and solidifying. Reference numeral 5 is a pin having a cooling hole 5a, 6 is a cylinder which is connected to the lower end of the pin 5 and reciprocates the pin 5 in the mold clamping direction, and is fixed to the movable side mounting plate 7.
以上のように構成されたホットランナ金型装置につい
てその動作を説明する。The operation of the hot runner die device configured as described above will be described.
第２図に示す樹脂の充填時において、射出時冷却用穴
を有するピン５がＡ位置にあり、ゲート1aを締ることに
よって樹脂の射出量を低下させるということなく、キャ
ビティ内に樹脂を充填させる。樹脂充填後、第３図のご
とく、ピン５がＢ位置にシリンダ６により押し上げら
れ、成形品２のゲート裏面部位を薄肉化するとともに、
素早くゲート部位の冷却を行う。When the resin shown in FIG. 2 is filled, the pin 5 having the injection cooling hole is at the A position, and the cavity is filled with the resin without reducing the injection amount of the resin by tightening the gate 1a. Let After the resin is filled, as shown in FIG. 3, the pin 5 is pushed up to the B position by the cylinder 6 to thin the back surface portion of the gate of the molded product 2 and
Cool the gate area quickly.
本実施例のホットランナ金型装置によれば、ゲート周
囲の湯ジワ、フローマークによる成形不良が無く成形サ
イクルを短縮させ、成形品２のコスト低減並びに成形品
２の外観品質の向上が図れる。According to the hot runner die apparatus of the present embodiment, there are no hot water wrinkles around the gate and defective molding due to flow marks, the molding cycle is shortened, the cost of the molded product 2 is reduced, and the appearance quality of the molded product 2 is improved.
発明の効果 以上のように本発明は射出時ピン下げ樹脂射出量を増
し、樹脂射出後、ピンを押し上げ成形品のゲート裏面を
薄肉化し素早くゲート部の冷却を行うことにより、ゲー
ト周囲の湯ジワ、フローマークのない成品の外観品質を
向上させ、かつ、成形サイクルを短縮させ成形品コスト
の低減が図れる等、その実用的効果は大なるものがあ
る。EFFECTS OF THE INVENTION As described above, the present invention increases the amount of pin-down resin injection at the time of injection, pushes up the pins after resin injection, thins the back surface of the gate of the molded product, and quickly cools the gate portion, thereby making it possible to cool the water around the gate. In addition, the practical quality of the product without flow marks can be improved, the molding cycle can be shortened, and the cost of the molded product can be reduced.
第１図は本発明の一実施例におけるホットランナ金型装
置射出時の断面図、第２図は同ホットランナ金型装置の
射出時ゲート詳細図、第３図は同ホットランナ金型装置
の射出直後のゲート詳細図、第４図は、従来のホットラ
ンナ金型の断面図である。 1a……ゲート、5a……冷却用穴、６……シリンダー。FIG. 1 is a sectional view of a hot runner mold apparatus during injection according to an embodiment of the present invention, FIG. 2 is a detailed view of an injection gate of the hot runner mold apparatus, and FIG. 3 is a view of the hot runner mold apparatus. FIG. 4 is a detailed view of the gate immediately after injection, and FIG. 4 is a sectional view of a conventional hot runner die. 1a ... gate, 5a ... cooling hole, 6 ... cylinder.
Claims (2)
動可能で冷却用穴を有するピンと前記ピンを往復動させ
る駆動手段とを備えたことを特徴とするホットランナ金
型装置。1. A hot runner mold apparatus comprising a pin, which is arranged to face a gate and is capable of reciprocating in a mold clamping direction and having a cooling hole, and a drive means for reciprocating the pin.
ホットランナ金型装置。2. The hot runner mold apparatus according to claim 1, wherein the pin is made of a high thermal conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008804A JP2674172B2 (en) | 1989-01-18 | 1989-01-18 | Hot runner mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008804A JP2674172B2 (en) | 1989-01-18 | 1989-01-18 | Hot runner mold equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02188217A JPH02188217A (en) | 1990-07-24 |
| JP2674172B2 true JP2674172B2 (en) | 1997-11-12 |
Family
ID=11703033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1008804A Expired - Lifetime JP2674172B2 (en) | 1989-01-18 | 1989-01-18 | Hot runner mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2674172B2 (en) |
-
1989
- 1989-01-18 JP JP1008804A patent/JP2674172B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02188217A (en) | 1990-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4440377A (en) | Mold for footwear sole | |
| JPH0694135B2 (en) | Resin sealing device | |
| JP2674172B2 (en) | Hot runner mold equipment | |
| JPS5926244U (en) | Molding equipment for semiconductor resin encapsulation molding | |
| JPH0890600A (en) | Ic card manufacturing mold | |
| JPH0374892B2 (en) | ||
| JPH0136583Y2 (en) | ||
| JP2859494B2 (en) | Multi-material injection molding machine | |
| JP2577079B2 (en) | Mold ejection device for injection molding machine | |
| JPH0798345B2 (en) | Mold device for injection press molding and molding method thereof | |
| JPH0222265Y2 (en) | ||
| JPH08267524A (en) | Mold clamping device of injection molder | |
| JPS5839889Y2 (en) | Mold equipment for semiconductor encapsulation molding | |
| KR920008770B1 (en) | Mould | |
| JPH09169045A (en) | Injection mold | |
| JPH0254768B2 (en) | ||
| JP3342088B2 (en) | Molding equipment | |
| JPS6141728B2 (en) | ||
| JP2856327B2 (en) | Injection molding method | |
| JPH04327919A (en) | Injection molding method for thick walled product | |
| JPH0221217Y2 (en) | ||
| JPH03204163A (en) | Method and apparatus for casting sprue part by rapid cooling | |
| JPH07108571A (en) | Side gate-type injection molding method and machine | |
| JPH0222018A (en) | Injection molding machine | |
| JPS6262435U (en) |