JP2660547B2 - Insert molding method of thermotropic liquid crystal polymer - Google Patents
Insert molding method of thermotropic liquid crystal polymerInfo
- Publication number
- JP2660547B2 JP2660547B2 JP63141592A JP14159288A JP2660547B2 JP 2660547 B2 JP2660547 B2 JP 2660547B2 JP 63141592 A JP63141592 A JP 63141592A JP 14159288 A JP14159288 A JP 14159288A JP 2660547 B2 JP2660547 B2 JP 2660547B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- acid
- insert
- crystal polymer
- thermotropic liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000465 moulding Methods 0.000 title claims description 13
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims description 9
- 238000000034 method Methods 0.000 title claims description 9
- 239000004974 Thermotropic liquid crystal Substances 0.000 title claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 claims description 12
- 239000004973 liquid crystal related substance Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 2
- 230000032798 delamination Effects 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 9
- -1 aromatic diol compound Chemical class 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 2
- AULKDLUOQCUNOK-UHFFFAOYSA-N 3,5-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(O)C(Cl)=C1 AULKDLUOQCUNOK-UHFFFAOYSA-N 0.000 description 2
- XMEQDAIDOBVHEK-UHFFFAOYSA-N 3-bromo-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Br)=C1 XMEQDAIDOBVHEK-UHFFFAOYSA-N 0.000 description 2
- QGNLHMKIGMZKJX-UHFFFAOYSA-N 3-chloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Cl)=C1 QGNLHMKIGMZKJX-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- OMNHTTWQSSUZHO-UHFFFAOYSA-N 4-hydroxy-3,5-dimethylbenzoic acid Chemical compound CC1=CC(C(O)=O)=CC(C)=C1O OMNHTTWQSSUZHO-UHFFFAOYSA-N 0.000 description 2
- LTFHNKUKQYVHDX-UHFFFAOYSA-N 4-hydroxy-3-methylbenzoic acid Chemical compound CC1=CC(C(O)=O)=CC=C1O LTFHNKUKQYVHDX-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- JMSVCTWVEWCHDZ-UHFFFAOYSA-N syringic acid Chemical compound COC1=CC(C(O)=O)=CC(OC)=C1O JMSVCTWVEWCHDZ-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- MWQVQEFJAIFHFZ-UHFFFAOYSA-N 2,3-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Cl)=C1Cl MWQVQEFJAIFHFZ-UHFFFAOYSA-N 0.000 description 1
- NAQNEMNLLODUCG-UHFFFAOYSA-N 2,3-dichloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1Cl NAQNEMNLLODUCG-UHFFFAOYSA-N 0.000 description 1
- RYRZSXJVEILFRR-UHFFFAOYSA-N 2,3-dimethylterephthalic acid Chemical compound CC1=C(C)C(C(O)=O)=CC=C1C(O)=O RYRZSXJVEILFRR-UHFFFAOYSA-N 0.000 description 1
- QTHMEINNGLIDSU-UHFFFAOYSA-N 2,5-dichloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(O)C=C1Cl QTHMEINNGLIDSU-UHFFFAOYSA-N 0.000 description 1
- QPBGNSFASPVGTP-UHFFFAOYSA-N 2-bromoterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Br)=C1 QPBGNSFASPVGTP-UHFFFAOYSA-N 0.000 description 1
- WIPYZRZPNMUSER-UHFFFAOYSA-N 2-chloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1Cl WIPYZRZPNMUSER-UHFFFAOYSA-N 0.000 description 1
- ZPXGNBIFHQKREO-UHFFFAOYSA-N 2-chloroterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(Cl)=C1 ZPXGNBIFHQKREO-UHFFFAOYSA-N 0.000 description 1
- IWFVHBRPBOMFMG-UHFFFAOYSA-N 2-ethoxyterephthalic acid Chemical compound CCOC1=CC(C(O)=O)=CC=C1C(O)=O IWFVHBRPBOMFMG-UHFFFAOYSA-N 0.000 description 1
- NAUKGYJLYAEUBD-UHFFFAOYSA-N 2-ethylterephthalic acid Chemical compound CCC1=CC(C(O)=O)=CC=C1C(O)=O NAUKGYJLYAEUBD-UHFFFAOYSA-N 0.000 description 1
- VQBBXLZPRXHYBO-UHFFFAOYSA-N 2-methoxyterephthalic acid Chemical compound COC1=CC(C(O)=O)=CC=C1C(O)=O VQBBXLZPRXHYBO-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- NTKLFSYUWYPMCJ-UHFFFAOYSA-N 2-phenoxybenzene-1,4-diol Chemical compound OC1=CC=C(O)C(OC=2C=CC=CC=2)=C1 NTKLFSYUWYPMCJ-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- AHLDBNUMCNFUMG-UHFFFAOYSA-N 4-[1-(4-hydroxyphenoxy)ethoxy]phenol Chemical compound C=1C=C(O)C=CC=1OC(C)OC1=CC=C(O)C=C1 AHLDBNUMCNFUMG-UHFFFAOYSA-N 0.000 description 1
- JQVAPEJNIZULEK-UHFFFAOYSA-N 4-chlorobenzene-1,3-diol Chemical compound OC1=CC=C(Cl)C(O)=C1 JQVAPEJNIZULEK-UHFFFAOYSA-N 0.000 description 1
- FFUMDYCIOSWRLV-UHFFFAOYSA-N 4-hydroxy-2,6-dimethylbenzoic acid Chemical compound CC1=CC(O)=CC(C)=C1C(O)=O FFUMDYCIOSWRLV-UHFFFAOYSA-N 0.000 description 1
- FNYDIAAMUCQQDE-UHFFFAOYSA-N 4-methylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C=C1O FNYDIAAMUCQQDE-UHFFFAOYSA-N 0.000 description 1
- VARPGHCVZGMTLL-UHFFFAOYSA-N 5,7-dichloro-6-hydroxynaphthalene-2-carboxylic acid Chemical compound ClC1=C(O)C(Cl)=CC2=CC(C(=O)O)=CC=C21 VARPGHCVZGMTLL-UHFFFAOYSA-N 0.000 description 1
- MIBYFOLNIIUGNA-UHFFFAOYSA-N 5-chloro-6-hydroxynaphthalene-2-carboxylic acid Chemical compound ClC1=C(O)C=CC2=CC(C(=O)O)=CC=C21 MIBYFOLNIIUGNA-UHFFFAOYSA-N 0.000 description 1
- RHXQHKDRWDVLBY-UHFFFAOYSA-N 6-hydroxy-5-methoxynaphthalene-2-carboxylic acid Chemical compound OC(=O)C1=CC=C2C(OC)=C(O)C=CC2=C1 RHXQHKDRWDVLBY-UHFFFAOYSA-N 0.000 description 1
- XKFNZRZICQABOD-UHFFFAOYSA-N 6-hydroxy-5-methylnaphthalene-2-carboxylic acid Chemical compound OC(=O)C1=CC=C2C(C)=C(O)C=CC2=C1 XKFNZRZICQABOD-UHFFFAOYSA-N 0.000 description 1
- JCJUKCIXTRWAQY-UHFFFAOYSA-N 6-hydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=CC=CC2=C1 JCJUKCIXTRWAQY-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical compound OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- WKOLLVMJNQIZCI-UHFFFAOYSA-N vanillic acid Chemical compound COC1=CC(C(O)=O)=CC=C1O WKOLLVMJNQIZCI-UHFFFAOYSA-N 0.000 description 1
- TUUBOHWZSQXCSW-UHFFFAOYSA-N vanillic acid Natural products COC1=CC(O)=CC(C(O)=O)=C1 TUUBOHWZSQXCSW-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、全芳香族液晶ポリエステルのインサート成
形法に関するものである。The present invention relates to a method for insert molding a wholly aromatic liquid crystal polyester.
(従来技術) 従来よりインサート成形は異なる機能を持つ、異種材
料を一体化する手段として、電気電子部品、自動車部品
などの製造に応用されている。近年、インサート成形部
品に対して、耐熱性、強靭性、寸法精度などを要求され
る例が多くなり、これらの要求を満足させる樹脂とし
て、全芳香族液晶ポリエステルが使用されるに至ってい
る。(Prior art) Conventionally, insert molding has been applied to the manufacture of electric and electronic parts, automobile parts, and the like as a means for integrating different materials having different functions. In recent years, there are many cases where heat resistance, toughness, dimensional accuracy, etc. are required for insert molded parts, and a wholly aromatic liquid crystal polyester has been used as a resin satisfying these requirements.
しかし、全芳香族液晶ポリエステルは金型内での固化
速度が早く、インサート部品との界面におけるぬれが悪
く、外部からの応力や熱によって、容易に界面に剥離を
生じ、位置ずれや割れ、気体、液体の漏れの原因になる
という欠点があり、製品の用途や形状に制限があるのが
現状である。However, the wholly aromatic liquid crystal polyester has a high solidification rate in the mold, has poor wettability at the interface with the insert part, and easily peels off at the interface due to external stress or heat, resulting in misalignment, cracking, and gas. However, there is a drawback that it causes liquid leakage, and at present the use and shape of the product are limited.
(発明が解決しようとする課題) 本発明は、上記全芳香族液晶ポリエステルのインサー
ト成形において、インサート部品と該ポリマーのぬれが
悪いという課題を解決することを目的とする。(Problems to be Solved by the Invention) An object of the present invention is to solve the problem of poor wettability between an insert part and the polymer in the insert molding of the wholly aromatic liquid crystal polyester.
(課題を解決するための手段) 本発明はサーモトロピック液晶ポリマーに、金属また
はセラミックス製部品を包埋するインサート成形におい
て、該サーモトロピック液晶ポリマーとして一般式 であらわされるモノマー単位を含む全芳香族液晶ポリエ
ステルを用い、成形時に金型に樹脂が充填される時点で
のインサート部品の表面温度を200〜350℃にすることに
より界面剥離を防止することを特徴とする成形法に関す
るものである。(Means for Solving the Problems) The present invention relates to a thermotropic liquid crystal polymer, in insert molding for embedding a metal or ceramic part, using a general formula as the thermotropic liquid crystal polymer. By using a wholly aromatic liquid crystal polyester containing a monomer unit represented by the formula, the surface temperature of the insert part at the time when the resin is filled into the mold during molding is set to 200 to 350 ° C to prevent interfacial delamination. And a molding method.
以下詳細に説明する。 This will be described in detail below.
本発明で言う全芳香族液晶ポリエステルとは、溶融時
に光学的異方性を示す熱可塑性溶融可能なポリマーであ
る。このような溶融時に光学的異方性を示すポリマー
は、溶融状態でポリマー分子鎖が規則的な並行配列をと
る性質を有している。光学的異方性溶融相の性質は、直
交偏光子を利用した通常の偏光検査法により確認でき
る。The wholly aromatic liquid crystal polyester referred to in the present invention is a thermoplastic meltable polymer that exhibits optical anisotropy when melted. Such a polymer exhibiting optical anisotropy at the time of melting has a property that polymer molecular chains take a regular parallel arrangement in a molten state. The properties of the optically anisotropic molten phase can be confirmed by a normal polarization inspection method using an orthogonal polarizer.
全芳香族液晶ポリエステルは、一般に細長く、偏平
で、分子の長鎖に沿って剛性が高く同軸または並行のい
ずれかの関係にある複数の連鎖伸長結合を有しているよ
うなモノマーから製造される。Wholly aromatic liquid crystalline polyesters are generally made from monomers that are elongated, flat, rigid and have multiple chain extension bonds in either a coaxial or parallel relationship along the long chain of the molecule. .
上記のように光学的異方性溶融相を形成するポリマー
の構成成分としては (A)芳香族ジカルボン酸系化合物の少なくとも1種、 (B)芳香族ヒドロキシカルボン酸系化合物の少なくと
も1種、 (C)芳香族ジオール系化合物の少なくとも1種、 等があげられる。これ等は単独で構成される場合もある
が、多くは(A)と(C)、(A)(B)と(C)等の
様に組合せて構成される。As the constituent components of the polymer forming the optically anisotropic molten phase as described above, (A) at least one kind of aromatic dicarboxylic acid-based compound, (B) at least one kind of aromatic hydroxycarboxylic acid-based compound, ( And C) at least one aromatic diol compound. These may be configured alone, but are often configured in combination such as (A) and (C), (A), (B) and (C).
上記(A)芳香族ジカルボン酸系化合物としては、テ
レフタル酸、4,4′−ジフェニルジカルボン酸、4,4′−
トリフェニルジカルボン酸、2,6−ナフタレンジカルボ
ン酸、1,4−ナフタレンジカルボン酸、2,7−ナフタレン
ジカルボン酸、ジフェニルエーテル−4,4′−ジカルボ
ン酸、ジフェノキシエタン−4,4′−ジカルボン酸、ジ
フェノキシブタン−4,4′−ジカルボン酸、ジフェニル
エタン−4,4′−ジカルボン酸、イソフタル酸、ジフェ
ニルエーテル−3,3′−ジカルボン酸、ジフェノキシエ
タン−3,3′−ジカルボン酸、ジフェニルエタン−3,3′
−ジカルボン酸、1,6−ナフタレンジカルボン酸のごと
き芳香族ジカルボン酸またはクロロテレフタル酸、ジク
ロロテレフタル酸、ブロモテレフタル酸、メチルテレフ
タル酸、ジメチルテレフタル酸、エチルテレフタル酸、
メトキシテレフタル酸、エトキシテレフタル酸等、上記
芳香族ジカルボン酸のアルキル、アルコキシまたはハロ
ゲン置換体が挙げられる。Examples of the aromatic dicarboxylic acid compound (A) include terephthalic acid, 4,4'-diphenyldicarboxylic acid, and 4,4'-
Triphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, diphenylether-4,4'-dicarboxylic acid, diphenoxyethane-4,4'-dicarboxylic acid , Diphenoxybutane-4,4'-dicarboxylic acid, diphenylethane-4,4'-dicarboxylic acid, isophthalic acid, diphenylether-3,3'-dicarboxylic acid, diphenoxyethane-3,3'-dicarboxylic acid, diphenyl Ethane-3,3 '
-Dicarboxylic acid, aromatic dicarboxylic acid such as 1,6-naphthalenedicarboxylic acid or chloroterephthalic acid, dichloroterephthalic acid, bromoterephthalic acid, methylterephthalic acid, dimethylterephthalic acid, ethylterephthalic acid,
Alkyl, alkoxy or halogen-substituted aromatic dicarboxylic acids such as methoxy terephthalic acid and ethoxy terephthalic acid are mentioned.
(B)芳香族ヒドロキシカルボン酸系化合物として
は、4−ヒドロキシ安息香酸、3−ヒドロキシ安息香
酸、6−ヒドロキシ−2−ナフノエ酸、6−ヒドロキシ
−1−ナフトエ酸等の芳香族ヒドロキシカルボン酸また
は3−メチル−4−ヒドロキシ安息香酸、3,5−ジメチ
ル−4−ヒドロキシ安息香酸、2,6−ジメチル−4−ヒ
ドロキシ安息香酸、3−メトキシ−4−ヒドロキシ安息
香酸、3,5−ジメトキシ−4−ヒドロキシ安息香酸、6
−ヒドロキシ−5−メチル−2−ナフトエ酸、6−ヒド
ロキシ−5−メトキシ−2−ナフトエ酸、2−クロロ−
4−ヒドロキシ安息香酸、3−クロロ−4−ヒドロキシ
安息香酸、2,3−ジクロロ−4−ヒドロキシ安息香酸、
3,5−ジクロロ−4−ヒドロキシ安息香酸、2,5−ジクロ
ロ−4−ヒドロキシ安息香酸、3−ブロモ−4−ヒドロ
キシ安息香酸、6−ヒドロキシ−5−クロロ−2−ナフ
トエ酸、6−ヒドロキシ−7−クロロ−2−ナフトエ
酸、6−ヒドロキシ−5,7−ジクロロ−2−ナフトエ酸
等の芳香族ヒドロキシカルボン酸のアルキル、アルコキ
シまたはハロゲン置換体が挙げられる。(B) Examples of the aromatic hydroxycarboxylic acid-based compound include aromatic hydroxycarboxylic acids such as 4-hydroxybenzoic acid, 3-hydroxybenzoic acid, 6-hydroxy-2-naphnoic acid, and 6-hydroxy-1-naphthoic acid; 3-methyl-4-hydroxybenzoic acid, 3,5-dimethyl-4-hydroxybenzoic acid, 2,6-dimethyl-4-hydroxybenzoic acid, 3-methoxy-4-hydroxybenzoic acid, 3,5-dimethoxy- 4-hydroxybenzoic acid, 6
-Hydroxy-5-methyl-2-naphthoic acid, 6-hydroxy-5-methoxy-2-naphthoic acid, 2-chloro-
4-hydroxybenzoic acid, 3-chloro-4-hydroxybenzoic acid, 2,3-dichloro-4-hydroxybenzoic acid,
3,5-dichloro-4-hydroxybenzoic acid, 2,5-dichloro-4-hydroxybenzoic acid, 3-bromo-4-hydroxybenzoic acid, 6-hydroxy-5-chloro-2-naphthoic acid, 6-hydroxy Alkyl, alkoxy or halogen-substituted aromatic hydroxycarboxylic acids such as -7-chloro-2-naphthoic acid and 6-hydroxy-5,7-dichloro-2-naphthoic acid.
(C)芳香族ジオールとしては、4,4′−ジヒドロキ
シジフェニル、3,3′−ジヒドロキシジフェニル、4,4′
−ジヒドロキシトリフェニル、ハイドロキノン、レゾル
シン、2,6−ナフタレンジオール、4,4′−ジヒドロキシ
ジフェニルエーテル、ビス(4−ヒドロキシフェノキ
シ)エタン、3,3′−ジヒドロキシジフェニルエーテ
ル、1,6−ナフタレンジオール、2,2−ビス(4−ヒドロ
キシフェニル)プロパン、ビス(4−ヒドロキシフェニ
ル)メタン等の芳香族ジオールまたはクロロハイドロキ
ノン、メチルハイドロキノン、t−ブチルハイドロキノ
ン、フェニルハイドロキノン、メトキシハイドロキノ
ン、フェノキシハイドロキノン、4−クロロレゾルシ
ン、4−メチルレゾルシン等の芳香族ジオールのアルキ
ル、アルコキシまたはハロゲン置換体が挙げられる。(C) As aromatic diols, 4,4'-dihydroxydiphenyl, 3,3'-dihydroxydiphenyl, 4,4 '
-Dihydroxytriphenyl, hydroquinone, resorcinol, 2,6-naphthalenediol, 4,4'-dihydroxydiphenylether, bis (4-hydroxyphenoxy) ethane, 3,3'-dihydroxydiphenylether, 1,6-naphthalenediol, Aromatic diols such as 2-bis (4-hydroxyphenyl) propane and bis (4-hydroxyphenyl) methane or chlorohydroquinone, methylhydroquinone, t-butylhydroquinone, phenylhydroquinone, methoxyhydroquinone, phenoxyhydroquinone, 4-chlororesorcinol, Alkyl, alkoxy or halogen-substituted aromatic diols such as 4-methylresorcin.
本発明で用いる全芳香族液晶ポリエステルは、上記化
合物を溶融アシドリシス法やスラリー重合法等の多様な
エステル形成法により製造することが出来る。The wholly aromatic liquid crystal polyester used in the present invention can be produced from the above compound by various ester forming methods such as a melt acidilysis method and a slurry polymerization method.
本発明で用いる全芳香族液晶ポリエステルには、一つ
の高分子鎖の一部が異方性溶融相を形成するポリマーの
セグメントで構成され、残りの部分が異方性溶融相を形
成しない熱可塑性樹脂のセグメントから構成されるポリ
マーも含まれる。また、複数の全芳香族液晶ポリエステ
ルを複合したものも含まれる。In the wholly aromatic liquid crystal polyester used in the present invention, a part of one polymer chain is composed of a segment of a polymer that forms an anisotropic molten phase, and the remaining part is a thermoplastic resin that does not form an anisotropic molten phase. Polymers composed of resin segments are also included. Further, a composite of a plurality of wholly aromatic liquid crystal polyesters is also included.
本発明で用いる全芳香族液晶ポリエステルは、少なく
とも一般式 で表わされるモノマー単位を含む(共)重合体であっ
て、具体的には 等がある。The wholly aromatic liquid crystal polyester used in the present invention has at least a general formula A (co) polymer containing a monomer unit represented by the formula: Etc.
液晶ポリマーは、そのまま単独で使用してもよく、あ
るいは所望に応じてフィラー等を加えてもよい。フィラ
ーとしては公知のものを使用してよく、ガラス繊維、炭
素繊維、金属繊維、およびそれらをエポキシ系、シラン
系化合物などで表面処理した繊維状補強材、また、シリ
カ、アルミナ、シリカアルミナ、シリカマグネシア、チ
タニア、炭酸カルシウム、硫酸バリウム、タルク、石こ
う、ガラスフレークなどの無機フィラーなどが例示され
る。The liquid crystal polymer may be used alone as it is, or a filler or the like may be added as desired. Known fillers may be used as the filler, such as glass fiber, carbon fiber, metal fiber, and a fibrous reinforcing material surface-treated with an epoxy-based or silane-based compound, and also include silica, alumina, silica-alumina, and silica. Examples include inorganic fillers such as magnesia, titania, calcium carbonate, barium sulfate, talc, gypsum, and glass flake.
樹脂にインサートする素材はその特性を生かし、か
つ、樹脂の欠点を補う目的で使用される。主にアルミニ
ウム、銅、鉄、しんちゅうおよびそれらの合金などの金
属類や、セラミックスのような無機固体類からあらかじ
め、棒、ピン、ネジ等の部品に成形されているものが使
用される。The material to be inserted into the resin is used for the purpose of taking advantage of its characteristics and compensating for the defects of the resin. Metals such as aluminum, copper, iron, brass, and alloys thereof, and inorganic solids such as ceramics, which are previously formed into parts such as rods, pins, and screws are used.
インサート部品は金型に装着される前、あるいは装着
後に電気ヒーター、電磁誘導加熱、火炎などの熱源によ
り、直接あるいは熱媒体を通じて間接的に加熱される。
加熱温度は金型に樹脂が充填される時点で、インサート
部品の表面温度が、200〜350℃になるように設定する。
温度が低いと効果が少なく、逆に高いと、インサート部
品の変形、劣化、充填される樹脂の劣化を引き起こすの
で好ましくない。The insert component is heated directly or indirectly through a heat medium by a heat source such as an electric heater, electromagnetic induction heating, or a flame before or after being mounted on the mold.
The heating temperature is set so that the surface temperature of the insert part becomes 200 to 350 ° C. when the resin is filled in the mold.
If the temperature is low, the effect is small, and if the temperature is high, on the other hand, deformation and deterioration of the insert part and deterioration of the resin to be filled are caused, which is not preferable.
インサート部品の加熱終了から樹脂の充填までの時間
は、インサート部品の熱容量、熱伝導度、金型との接触
面積、金型温度などにより異なるが、可能な限り短くす
る。品質の安定と、安全の点から加熱操作およびインサ
ート部品の金型内への装着は自動化されていることが好
ましい。The time from the end of the heating of the insert part to the filling of the resin varies depending on the heat capacity, thermal conductivity, contact area with the mold, mold temperature, etc. of the insert part, but should be as short as possible. From the viewpoints of quality stability and safety, it is preferable that the heating operation and the mounting of the insert part in the mold are automated.
(実施例) 以下、実施例により、この発明を具体的に説明する。(Examples) Hereinafter, the present invention will be specifically described with reference to examples.
実施例 1 テレフタル酸、4−ヒドロキシ安息香酸、および4,
4′−ジヒドロキシジフェニルよりなるサーモトロピッ
ク液晶ポリマーであるザイダー(商品名、米国アモコパ
ーフォーマンスプロダクツ社製)SRT−500ペレットを、
住友ネスタールSG25型射出成形機と試験片成形用金型
(縦12mm,横25mm,厚さ4mmの板状の内部に縦6mm,横12mm,
厚さ1.5mmのセラミックス製部品をインサートする金
型)を用いて、シリンダー前部温度390℃、ノズル温度3
90℃、金型温度150℃、射出時間6秒、射出圧力1300kg/
cm2、冷却時間15秒で射出成形を行った。Example 1 Terephthalic acid, 4-hydroxybenzoic acid, and 4,
Zyder (trade name, manufactured by Amoco Performance Products Inc., USA) SRT-500 pellets, which is a thermotropic liquid crystal polymer composed of 4'-dihydroxydiphenyl,
SUMITOMO NESTAL SG25 type injection molding machine and a test piece molding die (6 mm long, 12 mm wide, inside a 12 mm long, 25 mm wide, 4 mm thick plate)
Using a die that inserts a ceramic part with a thickness of 1.5 mm), the temperature at the front of the cylinder is 390 ° C and the nozzle temperature is 3
90 ° C, Mold temperature 150 ° C, Injection time 6 seconds, Injection pressure 1300kg /
Injection molding was performed with cm 2 and a cooling time of 15 seconds.
セラミックス製インサート部品はオーブン中であらか
じめ400℃に加熱され、オーブン中よりただちに金型内
にセットされた。オーブンより取り出し、射出が開始さ
れるまでの時間は約10秒であった。金型を閉じないで、
同じ時間経過した後、インサート部品の表面温度を赤外
線温度計で測定したところ、300〜330℃の範囲に入って
いた。得られた成形品の形状を第1図、第2図に示す。The ceramic insert was preheated to 400 ° C. in an oven and immediately set in a mold from the oven. The time taken from the oven to the start of injection was about 10 seconds. Do not close the mold,
After a lapse of the same time, the surface temperature of the insert part was measured with an infrared thermometer and found to be in the range of 300 to 330 ° C. The shape of the obtained molded product is shown in FIGS. 1 and 2.
図中4に示す穴にひもを通し、10kgの重りを静かにつ
るし、他端を治具で固定し、樹脂とインサート部品の剥
離の発生の有無を判定した。結果は表1に示す通りであ
った。A string was passed through a hole shown in 4 in the figure, a 10 kg weight was gently suspended, and the other end was fixed with a jig to determine whether or not the resin and the insert part had peeled off. The results were as shown in Table 1.
実施例 2 ザイダー SRT−500のかわりに、ガラスファイバー40
%入りのザイダー FC−100を使用して、実施例1と同
様の方法で試験した結果を表1に示す。Example 2 Zyder Glass fiber 40 instead of SRT-500
% Zaider Same as Example 1 using FC-100
Table 1 shows the results of the tests performed in the same manner.
実施例 3 インサート部品をオーブン中で300℃に加熱した他
は、実施例2と同様の方法で試験した結果を表1に示
す。Example 3 The results of a test performed in the same manner as in Example 2 except that the insert part was heated to 300 ° C. in an oven are shown in Table 1.
比較例1,2 インサート部品をあらかじめ加熱することなしに金型
内にセットし、実施例1および実施例2と同様の方法で
試験した結果を表1に示す。Comparative Examples 1 and 2 Table 1 shows the results of tests performed in the same manner as in Examples 1 and 2 by setting the insert parts in a mold without heating them beforehand.
実施例 4 実施例1のザイダーのかわりにベクトラ(米国セラニ
ーズ社の商品名)A130ペレットを使用し、シリンダー前
部温度290℃、ノズル温度290℃、金型温度100℃、その
他の射出条件は実施例1と同様の方法で射出成形を行っ
た。Example 4 Vectra (trade name of Celanese, USA) A130 pellets was used in place of Zyder in Example 1, cylinder front temperature 290 ° C, nozzle temperature 290 ° C, mold temperature 100 ° C, and other injection conditions were implemented. Injection molding was performed in the same manner as in Example 1.
セラミックス製インサート部品も実施例1と同じもの
を使用し、オーブン中で300℃に加熱した後、ただちに
金型内にセットされた。実施例1と同様の方法でインサ
ート部品の表面温度を測定したところ、射出開始相当時
の温度は220〜235℃の範囲に入っていた。得られた成形
品を実施例1と同様の方法で試験した結果を表1に示
す。The same ceramic insert part as in Example 1 was used, and after being heated to 300 ° C. in an oven, it was immediately set in a mold. When the surface temperature of the insert part was measured in the same manner as in Example 1, the temperature at the time of starting the injection was in the range of 220 to 235 ° C. Table 1 shows the results of testing the obtained molded articles in the same manner as in Example 1.
比較例3 インサート部品をあらかじめ加熱することなしに金型
内にセットし、実施例4と同様の方法で試験した結果を
表1に示す。Comparative Example 3 Table 1 shows the results of a test performed in the same manner as in Example 4 by setting the insert component in a mold without heating it in advance.
(発明の効果) 本発明によれば、サーモトロピック液晶ポリマーのイ
ンサート成形において以下のような特有な効果がある。 (Effects of the Invention) According to the present invention, the following specific effects are obtained in the insert molding of a thermotropic liquid crystal polymer.
(1) インサート部品と該ポリマーのぬれが改善され
ることから、密着性が向上し、界面の剥離によって生じ
る、位置ずれや割れ、気体、液体の漏れなどがなくな
る。(1) Since the wettability between the insert component and the polymer is improved, the adhesion is improved, and the displacement, crack, gas, liquid leakage, and the like caused by separation of the interface are eliminated.
第1図、第2図は本発明の実施例に用いられた、インサ
ート成形品を示したものでり、第1図は上面図、第2図
は側面図である。 サーモトロピック液晶ポリマー1、インサート部品2、
貫通した穴3,4。1 and 2 show an insert molded product used in an embodiment of the present invention. FIG. 1 is a top view and FIG. 2 is a side view. Thermotropic liquid crystal polymer 1, insert part 2,
Through holes 3,4.
Claims (2)
たはセラミックス製部品を包埋するインサート成形にお
いて、該サーモトロピック液晶ポリマーとして一般式 であらわされるモノマー単位を含む全芳香族液晶ポリエ
ステルを用い、成形時に金型に樹脂が充填される時点で
のインサート部品の表面温度を200〜350℃にすることに
より界面剥離を防止することを特徴とする成形法。In the insert molding for embedding a metal or ceramic part in a thermotropic liquid crystal polymer, a general formula is used as the thermotropic liquid crystal polymer. By using a wholly aromatic liquid crystal polyester containing a monomer unit represented by the formula, the surface temperature of the insert part at the time when the resin is filled into the mold during molding is set to 200 to 350 ° C to prevent interfacial delamination. Molding method.
独あるいはそれらの複合材からなる請求項1に記載の成
形法。2. The molding method according to claim 1, wherein the insert part is made of a metal or ceramic alone or a composite material thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63141592A JP2660547B2 (en) | 1988-06-10 | 1988-06-10 | Insert molding method of thermotropic liquid crystal polymer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63141592A JP2660547B2 (en) | 1988-06-10 | 1988-06-10 | Insert molding method of thermotropic liquid crystal polymer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01310924A JPH01310924A (en) | 1989-12-15 |
JP2660547B2 true JP2660547B2 (en) | 1997-10-08 |
Family
ID=15295592
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63141592A Expired - Fee Related JP2660547B2 (en) | 1988-06-10 | 1988-06-10 | Insert molding method of thermotropic liquid crystal polymer |
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JP (1) | JP2660547B2 (en) |
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JP2006035831A (en) * | 2004-07-30 | 2006-02-09 | Uchihama Kasei Kk | Method for manufacturing rotor for motor |
JP2010214589A (en) * | 2007-07-12 | 2010-09-30 | Agc Matex Co Ltd | Glass-integrated resin molding, and molding method therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5739922A (en) * | 1980-08-22 | 1982-03-05 | Idemitsu Kosan Co Ltd | Molding method for insert |
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JPS60168516U (en) * | 1984-04-16 | 1985-11-08 | 東京特殊電線株式会社 | Active circulation filtration device for bathtubs |
JPH0350139Y2 (en) * | 1985-06-03 | 1991-10-25 | ||
JPH0722657B2 (en) * | 1986-03-08 | 1995-03-15 | 修三 中園 | Bath water purification device |
JPS63190692A (en) * | 1987-01-30 | 1988-08-08 | Nippon Sootouea Kk | Hot water filtering and mineralizing apparatus |
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1988
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JPH06231947A (en) | Swing-type actuator |
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Date | Code | Title | Description |
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LAPS | Cancellation because of no payment of annual fees |