JP2659831B2 - Boiling evaporation method and apparatus - Google Patents

Boiling evaporation method and apparatus

Info

Publication number
JP2659831B2
JP2659831B2 JP29109389A JP29109389A JP2659831B2 JP 2659831 B2 JP2659831 B2 JP 2659831B2 JP 29109389 A JP29109389 A JP 29109389A JP 29109389 A JP29109389 A JP 29109389A JP 2659831 B2 JP2659831 B2 JP 2659831B2
Authority
JP
Japan
Prior art keywords
heat transfer
transfer surface
boiling
heat
bubbles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP29109389A
Other languages
Japanese (ja)
Other versions
JPH03152343A (en
Inventor
彰 矢部
潤司 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Mitsubishi Heavy Industries Ltd filed Critical Agency of Industrial Science and Technology
Priority to JP29109389A priority Critical patent/JP2659831B2/en
Publication of JPH03152343A publication Critical patent/JPH03152343A/en
Application granted granted Critical
Publication of JP2659831B2 publication Critical patent/JP2659831B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は沸騰蒸発方法及び装置に関する。Description: TECHNICAL FIELD The present invention relates to a method and an apparatus for boiling evaporation.

(従来の技術及びその課題) フロンR113とエタノールとの混合物やフロンR11とエ
タノールとの混合物からなる熱媒体、即ち、電気抵抗が
大きい誘電体とこれより電気抵抗が小さく、かつ、沸点
が高い誘電体とを混合してなる熱媒体は沸騰時の発泡周
期(気泡が発生した後、これが成長して伝熱面から離脱
し、次の気泡が発生するまでの時間)よりも小さい電荷
の緩和時間(熱媒体の誘電率と電気伝導度との比)を有
する。
(Prior art and its problems) Heat medium composed of a mixture of Freon R113 and ethanol or a mixture of Freon R11 and ethanol, that is, a dielectric having a high electric resistance and a dielectric having a lower electric resistance and a higher boiling point The heat medium formed by mixing with the body has a charge relaxation time smaller than the bubbling cycle at the time of boiling (time after bubbles are generated, they grow and separate from the heat transfer surface, and the next bubbles are generated). (The ratio between the dielectric constant of the heat medium and the electrical conductivity).

この熱媒体中に配置された電極と伝熱面との間に高電
圧を印加した状態でこの熱媒体を伝熱面を介して加熱
し、この熱媒体をその核沸騰領域において沸騰蒸発させ
ると、沸騰が抑制されて熱伝達が促進される場合と、沸
騰が盛んになって熱伝達が促進される場合があることが
知られている。
When a high voltage is applied between the electrode disposed in the heat medium and the heat transfer surface, the heat medium is heated through the heat transfer surface, and the heat medium is boiled and evaporated in the nucleate boiling region. It is known that boiling can be suppressed to promote heat transfer, and that boiling can be increased to promote heat transfer.

そして、熱伝達の促進率は後者の場合が圧倒的に大き
く、伝熱面過熱度が1/50以下にまで減少することが知ら
れている。
It is known that the heat transfer promotion rate is overwhelmingly large in the latter case, and the superheat degree of the heat transfer surface is reduced to 1/50 or less.

しかし、発泡現象の変化や熱伝達促進現象のメカニズ
ムはこれまで殆ど知られていなかった。
However, little has been known so far about the mechanism of the change of the foaming phenomenon or the heat transfer promoting phenomenon.

(課題を解決するための手段) 本発明は上記課題を解決するために発明されたもので
あって、第1の発明の要旨とするところは、沸騰時の発
泡周期よりも小さい電荷の緩和時間を有する熱媒体中に
配置された電極と接地された伝熱面との間に高電圧を印
加した状態で上記伝熱面を介して上記熱媒体を加熱する
ことにより沸騰蒸発させる沸騰蒸発方法において、上記
伝熱面の外周縁から気泡を供給することを特徴とする沸
騰蒸発方法にある。
(Means for Solving the Problems) The present invention was invented to solve the above problems, and the gist of the first invention is that a charge relaxation time smaller than a foaming cycle at the time of boiling. In the boiling evaporation method, the heating medium is heated through the heat transfer surface in a state where a high voltage is applied between the electrode disposed in the heat transfer medium and the grounded heat transfer surface to thereby evaporate. In addition, the boiling evaporation method is characterized in that bubbles are supplied from an outer peripheral edge of the heat transfer surface.

第2の発明の要旨とするところは、沸騰時の発泡周期
よりも小さい電荷の緩和時間を有する熱媒体中に配置さ
れた電極と、熱流速の高い部分を有し上記熱媒体を加熱
するための接地された伝熱面と、上記電極と上記伝熱面
との間に高電圧を印加する手段とを備えていることを特
徴とする沸騰蒸発装置にある。
The gist of the second invention is to provide an electrode disposed in a heat medium having a charge relaxation time smaller than the bubbling cycle at the time of boiling, and a portion having a high heat flow rate to heat the heat medium. And a means for applying a high voltage between the electrode and the heat transfer surface.

第3の発明の要旨とするところは、沸騰時の発泡周期
よりも小さい電荷の緩和時間を有する熱媒体中に配置さ
れた電極と、多孔材によって構成され上記熱媒体を加熱
するための接地された伝熱面と、上記電極と上記伝熱面
との間に高電圧を印加する手段とを備えていることを特
徴とする沸騰蒸発装置にある。
The gist of the third invention resides in that an electrode arranged in a heat medium having a charge relaxation time smaller than a foaming cycle at the time of boiling and an earthed ground made of a porous material for heating the heat medium. A heat transfer surface and means for applying a high voltage between the electrode and the heat transfer surface.

(作用) 電極と伝熱面との間に高電圧を印加した状態で上記伝
熱面を介して熱媒体を加熱すると、この伝熱面に供給さ
れた気泡が所謂火種となって発泡が促進され、沸騰熱伝
達が促進される。
(Function) When the heat medium is heated via the heat transfer surface while a high voltage is applied between the electrode and the heat transfer surface, the bubbles supplied to the heat transfer surface become a so-called kind of fire and foaming is promoted. And promotes boiling heat transfer.

(実施例) 第1図には実験装置の1例が示されている。(Example) FIG. 1 shows an example of an experimental apparatus.

容器1内にはフロンR113とエタノールとの混合物やフ
ロンR11とエタノールとの混合物からなる熱媒体2が収
容されている。この容器1の底には円板状の伝熱面3が
配設され、この伝熱面3はシースヒータ4に電源5から
通電することによって加熱されるようになっている。こ
の伝熱面3と若干の距離(例えば5mm)を隔ててこれと
平行するようにメッシュ電極6が熱媒体2中に配設され
ている。伝熱面3は接地され、電極6は直流高電圧電源
7の正極に連結されていて、これら伝熱面3とメッシュ
電極6との間に高電圧を印加しうるようになっている。
The heating medium 2 made of a mixture of Freon R113 and ethanol or a mixture of Freon R11 and ethanol is contained in the container 1. A disc-shaped heat transfer surface 3 is provided on the bottom of the container 1, and the heat transfer surface 3 is heated by energizing a sheath heater 4 from a power supply 5. A mesh electrode 6 is disposed in the heat medium 2 so as to be parallel to the heat transfer surface 3 at a slight distance (for example, 5 mm). The heat transfer surface 3 is grounded, and the electrode 6 is connected to the positive electrode of the DC high voltage power supply 7 so that a high voltage can be applied between the heat transfer surface 3 and the mesh electrode 6.

伝熱面3とメッシュ電極6との間に高電圧を印加しな
いで、即ち、伝熱面3に電場を印加しない状態で伝熱面
3を介して熱媒体2をその沸騰温度以上に加熱すると、
熱媒体2が沸騰して伝熱面3から多数の気泡が発生す
る。
When the heating medium 2 is heated to a temperature higher than its boiling temperature via the heat transfer surface 3 without applying a high voltage between the heat transfer surface 3 and the mesh electrode 6, that is, without applying an electric field to the heat transfer surface 3. ,
The heating medium 2 boils and a large number of bubbles are generated from the heat transfer surface 3.

しかし、熱媒体を沸騰温度以上に加熱した状態で伝熱
面3とメッシュ電極6との間に電圧を印加し、この印加
電圧を徐々に上昇させて行くと、印加電圧が10KVに上昇
するまでは伝熱面3の上面からの発泡を抑制しうるが、
伝熱面3の外周縁、即ち、熱伝達が悪く熱流速が局所的
に高い部分から気泡が発生する。
However, when a voltage is applied between the heat transfer surface 3 and the mesh electrode 6 in a state where the heat medium is heated to the boiling temperature or higher, and the applied voltage is gradually increased, the applied voltage is increased to 10 KV. Can suppress foaming from the upper surface of the heat transfer surface 3,
Bubbles are generated from the outer peripheral edge of the heat transfer surface 3, that is, a portion where heat transfer is poor and the heat flow rate is locally high.

印加電圧を更に上昇させていくと、伝熱面3と電極6
との間に形成される電場の外部の気泡、即ち、伝熱面3
の外周縁から発生した気泡が電場内に引き込まれるよう
になる。印加電圧が10KVを越えると、気泡が誘電泳動力
によって伝熱面3に抑え付けられ、その上を激しく動き
回る。印加電圧が20KVを越えると、気泡の径が小さくな
るとともに気泡の上昇速度も速くなる。そして、伝熱面
3上の気泡の運動が更に激しくなると同時に次々に新し
い発泡点を作り出し、これら新しい発泡点からの気泡が
上記と同様の現象を惹起するため伝熱面3は気泡によっ
て覆われてしまう。その後、この気泡は伝熱面3から一
掃されて伝熱面3上の気泡が少なくなるが、残った気泡
は再び伝熱面3上を激しく運動して上記の挙動を繰り返
す。
When the applied voltage is further increased, the heat transfer surface 3 and the electrode 6
Air bubbles formed outside of the electric field, ie, the heat transfer surface 3
Bubbles generated from the outer peripheral edge are drawn into the electric field. When the applied voltage exceeds 10 KV, the bubbles are suppressed by the dielectrophoretic force on the heat transfer surface 3 and move around vigorously. When the applied voltage exceeds 20 KV, the bubble diameter becomes smaller and the rising speed of the bubble becomes faster. Then, at the same time as the movement of the bubbles on the heat transfer surface 3 becomes more intense, new foaming points are created one after another. Since the bubbles from these new foaming points cause the same phenomenon as described above, the heat transfer surface 3 is covered with the bubbles. Would. Thereafter, the bubbles are wiped out of the heat transfer surface 3 to reduce the number of bubbles on the heat transfer surface 3, but the remaining bubbles move vigorously on the heat transfer surface 3 again and repeat the above-described behavior.

この結果、第2図に示すように、印加電圧の増大に従
って同一の熱流束における過熱度が小さくなり、また、
第3図に示すように印加電圧の増大に従って同一の熱流
束における伝熱促進率が上昇して、伝熱促進率は最大で
約50倍にも達する。
As a result, as shown in FIG. 2, as the applied voltage increases, the degree of superheat at the same heat flux decreases, and
As shown in FIG. 3, the heat transfer promotion rate for the same heat flux increases as the applied voltage increases, and the heat transfer promotion rate reaches up to about 50 times.

伝熱面3が容器1と一体化され、又は、容器1が伝熱
面3を構成する場合には伝熱面3の表面に凹凸を形成し
又は断熱材を接着する等の方法により局所的に熱流束が
高い部分を形成することができる。熱流速が高い部分は
電場による沸騰抑制が小さく、この部分に気泡が残るの
で、この気泡を電場内に伝熱面に火種として連続的に供
給できる。
When the heat transfer surface 3 is integrated with the container 1, or when the container 1 forms the heat transfer surface 3, the heat transfer surface 3 is locally formed by forming irregularities on the surface of the heat transfer surface 3 or bonding a heat insulating material. Therefore, a portion having a high heat flux can be formed. In a portion where the heat flow rate is high, the suppression of boiling by the electric field is small, and bubbles remain in this portion. Therefore, the bubbles can be continuously supplied to the heat transfer surface in the electric field as a kind of fire.

また、伝熱面3を多孔材によって構成すれば、この多
孔材の多数の孔内に存在する気泡が伝熱面3に出て来る
まで伝熱面3に印加された電圧と同じ電圧に維持され電
場の影響を受けないので、常に火種となる気泡の供給が
可能となる。
Further, if the heat transfer surface 3 is made of a porous material, the same voltage as the voltage applied to the heat transfer surface 3 is maintained until bubbles existing in a large number of holes of the porous material come out of the heat transfer surface 3. Since it is not affected by the electric field, it is possible to always supply the air bubbles which are the kind of fire.

第4図に示すように、伝熱管11の周囲に絶縁スペーサ
9を介して線状の多数の電極10を配設する場合には伝熱
管11のスペーサ9と対向する部分が局所的に熱流束の高
い部分を形成し、伝熱管11とスペーサ9との間の小さな
間隙から火種となる気泡が発生する。
As shown in FIG. 4, when a large number of linear electrodes 10 are provided around the heat transfer tube 11 with the insulating spacer 9 interposed therebetween, the portion of the heat transfer tube 11 facing the spacer 9 has a local heat flux. And a small gap between the heat transfer tube 11 and the spacer 9 generates bubbles serving as a kind of fire.

(発明の効果) 本発明においては、電場内の伝熱面に火種となる気泡
を供給することによって、発泡を促進し沸騰熱伝達率を
飛躍的に向上することができる。
(Effects of the Invention) In the present invention, by supplying bubbles serving as a fire source to the heat transfer surface in the electric field, foaming can be promoted and the boiling heat transfer coefficient can be dramatically improved.

伝熱面に熱流速の高い部分を形成すれば、この熱流速
の高い部分は電場による沸騰抑制が小さくこの部分に気
泡が残るので、この気泡を電場内に伝熱面に連続的に供
給できる。
If a portion having a high heat flow rate is formed on the heat transfer surface, the portion having a high heat flow rate has a small amount of suppression of boiling by the electric field and bubbles remain in this portion, so that the bubbles can be continuously supplied to the heat transfer surface in the electric field .

伝熱面を多孔材によって構成すれば、多孔材の多数の
孔内の存在する気泡が伝熱面に出て来るまで伝熱面に印
加される電圧と同じ電圧に維持され電場の影響を受けな
いので、この気泡を電場内の伝熱面に火種として供給で
きる。
If the heat transfer surface is made of a porous material, it is maintained at the same voltage as the voltage applied to the heat transfer surface until bubbles existing in many holes of the porous material come out to the heat transfer surface, and the heat transfer surface is affected by the electric field. Since there are no such bubbles, the bubbles can be supplied as a fire to the heat transfer surface in the electric field.

【図面の簡単な説明】 第1図は本発明の実験に供しうる実験装置の1例を示す
略示的断面図、第2図は過熱度と印加電圧と熱流束との
関係を示す線図、第3図は電気伝導度と印加電圧と伝熱
促進率との関係を示す線図、第4図は本発明の実施に供
しうる伝熱管の1例を示し、第4図(a)は斜視図、第
4図(b)は断面図である。 電極……6、伝熱面……3、高電圧印加手段……7、気
泡供給手段……8、1……容器、2……熱媒体、4……
シースヒータ、5……電源
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an example of an experimental apparatus that can be used for an experiment of the present invention, and FIG. 2 is a diagram showing a relationship between a degree of superheat, an applied voltage, and a heat flux. , FIG. 3 is a diagram showing the relationship between electric conductivity, applied voltage and heat transfer promotion rate, FIG. 4 shows an example of a heat transfer tube which can be used for carrying out the present invention, and FIG. FIG. 4 (b) is a sectional view. Electrodes: 6, heat transfer surface: 3, high voltage applying means: 7, bubble supply means: 8, 1 ... container, 2: heat medium, 4 ...
Sheath heater, 5 ... Power supply

───────────────────────────────────────────────────── フロントページの続き 審査官 関口 哲生 (56)参考文献 特開 平2−19453(JP,A) 特公 平2−3918(JP,B2) ──────────────────────────────────────────────────続 き Continuation of the front page Examiner Tetsuo Sekiguchi (56) References JP-A-2-19453 (JP, A) JP-JP-2-3918 (JP, B2)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】沸騰時の発泡周期よりも小さい電荷の緩和
時間を有する熱媒体中に配置された電極と接地された伝
熱面との間に高電圧を印加した状態で上記伝熱面を介し
て上記熱媒体を加熱することにより沸騰蒸発させる沸騰
蒸発方法において、上記伝熱面の外周縁から気泡を供給
することを特徴とする沸騰蒸発方法。
1. A method in which a high voltage is applied between an electrode disposed in a heat medium having a charge relaxation time smaller than a bubbling cycle at the time of boiling and a grounded heat transfer surface. In the boiling evaporation method, the heating medium is heated to evaporate by boiling, wherein bubbles are supplied from an outer peripheral edge of the heat transfer surface.
【請求項2】沸騰時の発泡周期よりも小さい電荷の緩和
時間を有する熱媒体中に配置された電極と、熱流速の高
い部分を有し上記熱媒体を加熱するための接地された伝
熱面と、上記電極と上記伝熱面との間に高電圧を印加す
る手段とを備えていることを特徴とする沸騰蒸発装置。
2. An electrode disposed in a heat medium having a charge relaxation time smaller than a bubbling cycle at the time of boiling, and a grounded heat transfer having a portion having a high heat flow rate for heating the heat medium. A boiling evaporator, comprising: a surface; and means for applying a high voltage between the electrode and the heat transfer surface.
【請求項3】沸騰時の発泡周期よりも小さい電荷の緩和
時間を有する熱媒体中に配置された電極と、多孔材によ
って構成され上記熱媒体を加熱するための接地された伝
熱面と、上記電極と上記伝熱面との間に高電圧を印加す
る手段とを備えていることを特徴とする沸騰蒸発装置。
3. An electrode arranged in a heat medium having a charge relaxation time smaller than a bubbling cycle during boiling, a grounded heat transfer surface made of a porous material for heating the heat medium, and Means for applying a high voltage between the electrode and the heat transfer surface.
JP29109389A 1989-11-10 1989-11-10 Boiling evaporation method and apparatus Expired - Lifetime JP2659831B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29109389A JP2659831B2 (en) 1989-11-10 1989-11-10 Boiling evaporation method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29109389A JP2659831B2 (en) 1989-11-10 1989-11-10 Boiling evaporation method and apparatus

Publications (2)

Publication Number Publication Date
JPH03152343A JPH03152343A (en) 1991-06-28
JP2659831B2 true JP2659831B2 (en) 1997-09-30

Family

ID=17764356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29109389A Expired - Lifetime JP2659831B2 (en) 1989-11-10 1989-11-10 Boiling evaporation method and apparatus

Country Status (1)

Country Link
JP (1) JP2659831B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704063B2 (en) * 2001-07-03 2005-10-05 ジャパン・フィールド株式会社 Method and apparatus for heating target liquid to be heated
DE102006053157A1 (en) * 2006-11-10 2008-05-15 Wacker Chemie Ag Method for vaporizing constituents of a liquid

Also Published As

Publication number Publication date
JPH03152343A (en) 1991-06-28

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