JP2650369B2 - Mold equipment - Google Patents
Mold equipmentInfo
- Publication number
- JP2650369B2 JP2650369B2 JP29647688A JP29647688A JP2650369B2 JP 2650369 B2 JP2650369 B2 JP 2650369B2 JP 29647688 A JP29647688 A JP 29647688A JP 29647688 A JP29647688 A JP 29647688A JP 2650369 B2 JP2650369 B2 JP 2650369B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- ram
- base
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Press Drives And Press Lines (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はヒータ付金型の断熱を行う金型装置に関する
ものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold apparatus for thermally insulating a mold with a heater.
従来の技術 従来、この種の金型装置は第４図のような構造になっ
ていた。すなわち、22,25はヒータであり、これらのヒ
ータ22,25は上型23,下型24に内蔵されている。この上型
23,下型24は、各々、断熱材21,26を介して各々ラム20,
ベース27に設けられている。2. Description of the Related Art Conventionally, this type of mold apparatus has a structure as shown in FIG. That is, 22 and 25 are heaters, and these heaters 22 and 25 are built in the upper die 23 and the lower die 24. This upper model
23, the lower mold 24, respectively, the ram 20,
It is provided on the base 27.
発明が解決しようとする課題 しかしながら上記の構造では完全な断熱ができず、断
熱材21,26を介してラム20,ベース27に熱が伝達され、金
型の熱の損失による電力の消費増を生じ又、ラム20,ベ
ース27の温度が上昇することによる全体的な精度の低
下、付属計器の性能低下や破損等の悪影響を及ぼすとい
う問題点を有していた。Problems to be Solved by the Invention However, with the above structure, complete heat insulation is not possible, and heat is transmitted to the ram 20, base 27 via the heat insulating materials 21, 26, thereby increasing power consumption due to heat loss of the mold. In addition, there is a problem that the temperature of the ram 20 and the base 27 rises, thereby lowering the overall accuracy and deteriorating the performance and breakage of the attached meter.
そこで本発明は、金型からラム・ベースに伝わる熱を
遮断し、精度向上を図ることを目的としたものである。Therefore, an object of the present invention is to cut off heat transmitted from a mold to a ram base and improve accuracy.
課題を解決するための手段 そして上記問題点を解決する本発明の技術的な手段
は、上下金型とラム・ベース間に球を設け、金型と本体
との温度遮断をしようというものである。Means for Solving the Problems The technical means of the present invention for solving the above-mentioned problems is to provide a ball between the upper and lower molds and the ram base so as to cut off the temperature between the mold and the main body. .
作用 この技術的手段による作用は次のようになる。すなわ
ち、上下金型と本体との間に鋼球をはさみ込み接触面積
を減少させ又、空間をつくることにより放熱しやすく
し、金型と本体との熱の伝達を遮断させることができ
る。Operation The operation of this technical means is as follows. That is, a steel ball is inserted between the upper and lower molds and the main body to reduce the contact area, and it is possible to facilitate heat radiation by creating a space, thereby cutting off heat transfer between the mold and the main body.
この結果、製品の精度のばらつきが少なくなり、周囲
に取付けられている計器にも悪影響を与えず精度が向上
する。As a result, variations in the accuracy of the product are reduced, and the accuracy is improved without adversely affecting instruments mounted around the product.
実 施 例 以下、本発明の一実施例を第１図から第３図を用いて
説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS.
第１図において、鋼球４はリテーナ3,3′により固定
され、第１板２と第２板５により締め付けられている。
第１板２にはエアー冷却をするための穴があり、又第１
板２側のリテーナ３にも穴がある。この第１板２はラム
・ベース１側に固定され、第２板５は断熱材６を介して
金型７側に固定されている。In FIG. 1, a steel ball 4 is fixed by retainers 3, 3 'and is fastened by a first plate 2 and a second plate 5.
The first plate 2 has a hole for air cooling, and the first plate 2
The retainer 3 on the plate 2 side also has a hole. The first plate 2 is fixed to the ram base 1 side, and the second plate 5 is fixed to the mold 7 via a heat insulating material 6.
第２図において、リテーナ９とリテーナ11はビス締め
され、カラー10を用いて第１板８と第２板12を締め付け
る様子を示している。ここでリテーナ９に示される８個
の穴はエアー冷却用の穴である。FIG. 2 shows a state in which the retainer 9 and the retainer 11 are screwed together, and the first plate 8 and the second plate 12 are tightened using the collar 10. Here, eight holes shown in the retainer 9 are holes for air cooling.
第３図において、15,17はヒータで、16,18は金型であ
る。第１図，第２図で説明した金型断熱装置14をラム13
とベース19側にそれぞれ使用することによってヒータ1
5,17より発生する熱が金型断熱装置で遮断され、ラム1
3,ベース19と金型16,18との間は断熱される。In FIG. 3, 15 and 17 are heaters, and 16 and 18 are molds. The mold heat insulating device 14 described with reference to FIGS.
And heater 19 by using each on the base 19 side
The heat generated from 5, 17 is cut off by the mold insulation device, and the ram 1
3, the space between the base 19 and the dies 16, 18 is insulated.
尚、本実施例では、鋼球としたが、これはセラミック
ス製でもよい。In this embodiment, the steel balls are used, but they may be made of ceramics.
発明の効果 以上のように、本発明によれば鋼球を用いて熱の伝わ
る断面積を少なくし、又空間をつくり、そこをエアー冷
却することにより断熱効果を増し、製品の精度の向上に
大きく貢献するものである。Effect of the Invention As described above, according to the present invention, a steel ball is used to reduce the cross-sectional area through which heat is transmitted, create a space, and increase the heat insulation effect by air-cooling the space, thereby improving the accuracy of products. It is a great contribution.
第１図は本発明の一実施例における金型装置の要部断面
図、第２図は同分解斜視図、第３図は金型装置の正面
図、第４図は従来の金型装置の正面図である。 １……ラム・ベース、２……第１板、３……リテーナ、
４……鋼球、５……第２板、６……断熱材、７……金
型。FIG. 1 is a sectional view of a main part of a mold apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view, FIG. 3 is a front view of the mold apparatus, and FIG. It is a front view. 1 ... ram base, 2 ... first plate, 3 ... retainer,
4 ... steel ball, 5 ... second plate, 6 ... heat insulating material, 7 ... mold.
Claims (4)
設けてなる装置であって、この断熱部はラムまたはベー
ス側に第１板を、金型側に第２板を各々設け、これら２
枚の板の間に複数の球をはさみ込んだ構成とした金型装
置。An apparatus comprising a ram or a base and a mold provided with a heat insulating portion, wherein the heat insulating portion has a first plate on the ram or base side and a second plate on the mold side. , These two
A mold device in which a plurality of balls are sandwiched between two plates.
る特許請求の範囲第１項記載の金型装置。2. The mold apparatus according to claim 1, wherein the sphere is made of ceramics.
請求の範囲第１項記載の金型装置。3. The mold apparatus according to claim 1, further comprising a device for air cooling the heat insulating portion.
求の範囲第１項記載の金型装置。4. The mold apparatus according to claim 1, wherein a heat insulating material is provided between the second plate and the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29647688A JP2650369B2 (en) | 1988-11-24 | 1988-11-24 | Mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29647688A JP2650369B2 (en) | 1988-11-24 | 1988-11-24 | Mold equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142700A JPH02142700A (en) | 1990-05-31 |
| JP2650369B2 true JP2650369B2 (en) | 1997-09-03 |
Family
ID=17834048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29647688A Expired - Lifetime JP2650369B2 (en) | 1988-11-24 | 1988-11-24 | Mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2650369B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020003846A (en) * | 2001-11-08 | 2002-01-15 | 임승용 | Septic Float Cleaner |
| KR101244230B1 (en) * | 2012-10-23 | 2013-03-18 | 임선빈 | Minute controlling device for press mold |
| CN107186029A (en) * | 2017-06-22 | 2017-09-22 | 苏州普热斯勒先进成型技术有限公司 | A kind of heater, production line and method for producing subregion intensity heat-punch member |
-
1988
- 1988-11-24 JP JP29647688A patent/JP2650369B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02142700A (en) | 1990-05-31 |
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