JP2642538B2 - Semiconductor wafer manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer manufacturing apparatus most suitable for manufacturing a semiconductor wafer made of silicon, sapphire or gallium arsenide.

[0002]

2. Description of the Related Art As a method of manufacturing a semiconductor wafer which is a material for manufacturing a large integrated circuit such as an LSI, the applicant has proposed a method shown in FIG. 2 as Japanese Patent Application No. 57-169105.

That is, first, a slice 1a shown in FIG. 1B is cut out from a single crystal semiconductor rod 1 made of silicon or the like shown in FIG. 1A by using a diamond cutter or the like to produce a thin semiconductor wafer 2. . Next, as shown in FIG. 3C, the edge portion of the semiconductor wafer 2 is subjected to bevel processing (chamfering) to form a bevel surface 2c.

Here, the bevel processing is performed using, for example, a bevel apparatus 3 shown in FIG. That is, the bevel device 3 forms a concave portion 5 having inclined surfaces on both sides on the upper surface of a base metal 4 made of stainless steel or nickel, and attaches diamond 6, 6,... To the surface of the concave portion 5 by nickel plating. And a grindstone surface of about # 50-100 mesh. Then, beveling is performed by pressing the edge of the rotating semiconductor wafer 2 against the recess 5 and grinding it.

Then, as shown in FIG. 1D, a lapping process for simultaneously polishing both the front surface 2a and the back surface 2b of the semiconductor wafer 2 is performed, and then, as shown in FIG. Is etched by a mixed solution of acetic acid and hydrofluoric acid, etc., thereby removing cutter traces and the like to form a smooth surface.

Thereafter, as shown in FIG. 1F, at least the front surface 2a and the bevel surface 2c and, if necessary, the back surface 2b are also mirror-finished using a polishing cloth. This is to be a semiconductor wafer 7 to be subjected to a subsequent device process.

[0007]

However, even if the bevel surface formed at the edge of the semiconductor wafer is to be mirror-finished using a polishing cloth as described above, there is an apparatus for performing this mirror-finish. There is no present.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a semiconductor wafer manufacturing apparatus capable of easily and surely mirror-finishing a bevel surface formed at an edge portion of a semiconductor wafer.

[0009]

To achieve the above object, a semiconductor wafer manufacturing apparatus according to the present invention comprises: a rotating device for holding and rotating a semiconductor wafer having a bevel surface formed at an edge portion; And a polishing device in which a polishing cloth for mirror-finishing the bevel surface is attached to a surface of a contact portion with a bevel surface of the semiconductor wafer held by the rotating device, and the bevel surface is provided. It is characterized by a mirror finish. A rotating device for holding and rotating a semiconductor wafer having a bevel surface formed at an edge portion; and a rotating device that is stationaryly arranged so as to contact the bevel surface and a contact portion of the semiconductor wafer held by the rotating device with the bevel surface. A polishing apparatus having a polishing cloth for polishing the bevel surface to a mirror finish on the surface thereof, wherein the bevel surface is mirror-finished. A rotating device for clamping and rotating a semiconductor wafer having a bevel surface formed on an edge portion from both sides of the front and back surfaces thereof; and a bevel device for the semiconductor wafer held by the rotating device, the device being arranged to be in contact with the bevel surface. A polishing device in which a polishing cloth for polishing the bevel surface to a mirror finish is attached to a surface of a contact portion with the surface, and the bevel surface is mirror-finished. Also,
A rotating device for holding and rotating a semiconductor wafer having a bevel surface formed on an edge portion, and a rotating device arranged to be in contact with the bevel surface, and a contact portion surface of the semiconductor wafer held by the rotating device with a bevel surface; A polishing apparatus for attaching a polishing cloth for polishing the bevel surface to a mirror finish with a length corresponding to a part of the circumferential length of the semiconductor wafer, wherein the bevel surface is mirror-finished.

[0010]

According to the present invention constructed as described above, the semiconductor wafer is held by the rotating device in a state of crossing the horizontal axis, and the semiconductor wafer is rotated through the rotating device in this state, whereby the bevel is obtained. The mirror finish can be performed by polishing the bevel surface with a polishing cloth stuck on the surface of the polishing device so as to contact the surface.

[0011]

An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a side view of an apparatus for manufacturing a semiconductor wafer according to the present invention. This apparatus is mounted on a tip of a horizontally extending rotary shaft 9 of a motor 8 arranged horizontally. A rotating device 11 connected to a jig 10;
A polishing device 15 is provided near the rotating device 11 and has a concave portion 13 provided on the surface of the polishing base 12 and a polishing device 15 having a polishing cloth 14 attached to the surface inside the concave portion 13.

The wafer fixing jig 10 clamps and holds a substantially central portion of the semiconductor wafer 2 in the front-rear direction, thereby holding the semiconductor wafer 2 in a vertical direction crossing the horizontal axis at right angles. It will be kept in the arranged state.

The polishing cloth 14 is for polishing the bevel surface 2c to a mirror finish, and the fixing jig 1
0, the semiconductor wafer 2 is held at a position where the bevel surface 2c formed at the edge and the polishing pad 14 are in contact with each other, that is, the edge of the semiconductor wafer 2 enters the recess 13 and the recess 13 Polishing cloth 1 stuck on the surface of
4 and the bevel surface 2c are arranged at positions where they contact each other.

As a result, the semiconductor wafer 2 is held vertically by the wafer fixing jig 10 of the rotating device 11 and the semiconductor wafer 2 is rotated via the motor 8 in this state, whereby the bevel surface of the semiconductor wafer 2 is Polishing cloth 14 attached to the surface of the polishing device 15 so as to come into contact with 2c
The mirror surface finish can be performed by polishing the bevel surface 2c.

As described above, the bevel surface 2c of the semiconductor wafer 2 is mirror-finished with the polishing pad 14 by driving the motor 8, so that even if chemical etching, that is, chemical polishing, small unevenness and a pulverized layer remain at the edge portion. The bevel surface 2c can be a smooth mirror surface.

Then, a slice 1a shown in FIG. 2B is cut out from a single crystal semiconductor rod 1 made of silicon or the like shown in FIG. And as shown in the same figure (C),
The bevel surface 2c is formed by subjecting the edge portion of the semiconductor wafer 2 to bevel processing (chamfering) using, for example, a bevel device 3 shown in FIG. Then, as shown in FIG. 2D, the front surface 2 a and the back surface 2
After the lapping process of polishing both sides of b simultaneously,
As shown in FIG.
That is, all surfaces of the front surface 2a, the back surface 2b, and the bevel surface 2c are etched with a mixed solution of acetic acid and hydrofluoric acid, thereby removing cutter traces and the like to form a smooth surface.

Thereafter, as shown in FIG. 1F, at least the front surface 2a and the bevel surface 2c and, if necessary, the back surface 2b are also mirror-finished by polishing with a polishing cloth. Then, this is used as a semiconductor wafer 7 to be subjected to a subsequent device process. At this time, a semiconductor wafer manufacturing apparatus in which the mirror finish of the bevel surface 2c formed at the edge portion of the semiconductor wafer 2 is configured as described above is used. It is done using.

Experiments have confirmed that no dendrite crystal is generated on the mirror-finished bevel surface 2c during the deposition of silicon nitride or polysilicon.

In the practical example described above, an example is shown in which the semiconductor wafer 2 is held in a vertical state. However, the semiconductor wafer 2 is held in an inclined state, that is, the motor 8 in FIG. It can also be arranged in a state rotated by less than 90 degrees.

Further, the base metal 1 can be provided without providing the recess 13.
Needless to say, the polishing pad 14 may be attached to a contact position of the surface of the semiconductor wafer 2 with the bevel surface 2c formed at the edge of the semiconductor wafer 2.

[0022]

According to the present invention, the bevel surface is mirror-finished so that chips and chips are generated at an edge portion when a wafer is manufactured and when a device is manufactured from this wafer. And it is difficult for dendrite crystals to grow on the bevel surface during the deposition of silicon nitride and polysilicon, and Si bead, Si,
The mirror surface finish on the bevel surface of a semiconductor wafer which is capable of obtaining a high device yield without generation of fine particles in subsequent device processes without generating scraps of Si ₂ or the like is easily and reliably performed. Semiconductor wafers can be manufactured. In addition, since the polishing cloth is stationary, the entire apparatus can be configured with a compact and simple structure as compared with a case where both the polishing apparatus and the rotating apparatus have a rotating mechanism. In addition, since the rotating device is configured to hold and rotate the semiconductor wafer from both sides of the front and back surfaces, the semiconductor wafer is not subject to rotational shake compared to the case where the semiconductor wafer is held and rotated only on one side of the semiconductor wafer. , High-precision mirror finish is possible. In addition, since the polishing cloth is attached with a length corresponding to a part of the circumferential length of the semiconductor wafer, the length is shorter than when the polishing pad is attached over the entire circumference of the rotating body of the rotating device. Only the use of the polishing cloth is sufficient, and the consumption management and replacement of the polishing cloth can be easily performed. In addition, by performing mirror finishing in a state where the bevel surface is processed, the burden on the polishing pad can be reduced.

[Brief description of the drawings]

FIG. 1 is a side view showing one embodiment of the present invention.

FIG. 2 is a view showing a process of manufacturing a semiconductor wafer used in the present invention in the order of steps.

FIG. 3 is a side view of the bevel device.

[Explanation of symbols]

 2 Semiconductor wafer 2c Same bevel surface 8 Motor 10 Wafer fixing jig 11 Rotating device 14 Polishing cloth 15 Polishing device

Claims (3)

(57) [Claims] 1. A rotating device for holding and rotating a semiconductor wafer having a bevel surface formed at an edge portion, and a rotating device that is stationaryly arranged to be in contact with the bevel surface, and a bevel surface of the semiconductor wafer held by the rotating device. A polishing device having a polishing cloth for polishing the bevel surface to a mirror finish on the surface of the contact portion of the semiconductor device, wherein the bevel surface is mirror-finished. 2. A rotating device for holding and rotating a semiconductor wafer having a bevel surface formed on an edge portion from both sides of the front and back surfaces thereof; and a semiconductor device arranged to be in contact with the bevel surface and held by the rotating device. A polishing device having a polishing cloth for polishing the bevel surface to a mirror finish on the surface of a contact portion with the bevel surface of the wafer, wherein the bevel surface is mirror-finished. 3. A rotating device for holding and rotating a semiconductor wafer having a bevel surface formed at an edge portion, and a rotating device arranged to contact the bevel surface and a bevel surface of the semiconductor wafer held by the rotating device. A polishing device that has a polishing cloth attached to the surface of the contact portion to mirror-polish the bevel surface with a length corresponding to a part of a circumferential length of the semiconductor wafer, wherein the bevel surface is mirror-finished. Semiconductor wafer manufacturing equipment.