JP2641041B2 - Integrated circuit mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for electronic parts, and in particular, a socket of a surface mounting integrated circuit (hereinafter referred to as an IC) and a heat sink for heat radiation are integrally assembled to simultaneously provide casing, heat radiation and electrostatic shielding. The present invention relates to an integrated circuit mounting structure.

[0002]

2. Description of the Related Art Conventionally, high density is required for mounting electronic circuits, and for mounting ICs, double-sided mounting is performed in addition to single-sided mounting on a substrate. More recently, a surface mounting method has been proposed in which a surface of a plurality of ICs (the side on which a seal is usually imprinted by a manufacturer) and a back surface are overlapped and a printed circuit board is soldered to a surface from which each terminal is exposed (Japanese Patent Laid-Open No. 6-112624). Issue).

[0003]

In the above-mentioned conventional mounting method, only double-sided mounting of the IC on the substrate has a limit in increasing the density, and does not contribute much to downsizing of the device. And multiple I
In the method of superposing the front surface and the back surface of C, multi-layer lamination is possible. However, if the superposition is brought into close contact, there is a problem in that heat is insufficient and there is a problem. An air blowing mechanism for sending air is required. Also, solder the printed circuit board to the surface where each terminal is exposed, and since only one end of the circuit board is supported by the mounting board, it is vulnerable to external shocks and vibrations. The method of supporting each part at the time is also complicated. Moreover, it is extremely difficult to replace the IC once it has been assembled.
In order to replace C, there is a disadvantage that the soldering of all the terminals of a large number of ICs must be completely removed before replacement. If electrostatic shielding is required, a separate shield structure must be provided to surround the mounting structure.

An object of the present invention is to eliminate such drawbacks, and to at least integrally assemble an integrated circuit socket and an interlayer heat sink to perform high-performance and high-performance electrical connection, heat radiation and electrostatic shielding in the structure at the same time. It is an object of the present invention to provide a high-density integrated circuit mounting structure.

[0005]

In order to achieve the above object, an integrated circuit mounting structure of the present invention has a structure in which a plurality of integrated circuits 2, 3 and 4 are mounted on a substrate 1 in a vertically stacked manner. At least the socket body 10 and the interlayer radiators 20 and 3
The socket body 10 has a box shape without an upper lid, and has cutouts 11 at four corners of the side wall surface facing downward from the upper end surface.
The inter-layer heat radiators 20 and 30 are provided between the integrated circuits arranged one above the other and between the integrated circuits (between 2 and 3 or between 3 and 4). 31), a connecting part (22 or 32) that fits into the notch 11 of the socket body 10 following the laminated part (21 or 31), and the connecting part (22 or 3).
Subsequent to 2), a configuration is provided in which a heat radiating portion (23 or 33) is disposed outward along the side wall surface of the socket body 10.

Further, an upper heat sink 40 for heat dissipation along the upper surface of the uppermost integrated circuit is provided, and the cushion material 5, the integrated circuit 2, the cushion material 5, and the interlayer heat dissipation member are inserted into the internal space of the socket body 10 from below. The laminated portion (21 or 31) is repeatedly stacked in this order, and the cushion material 5 and the upper heat sink 40 are arranged and mounted on the uppermost integrated circuit 4.

The terminals 2t, 3 of the integrated circuit (2, 3, 4) to be mounted are formed on the inner surface of the side wall of the socket body 10.
A contact terminal group 13, 13 ... 13 that abuts t, 4t is provided, and each of the contact terminals 13 passes through the wall surface of the socket body 10 and the socket external terminal 1 at the bottom of the socket body
14, 14,..., And the interlayer heat radiator 2
The heat dissipation portions 23 and 33 of 0 and 30 surround the socket along the outer circumference of the wall surface of the socket body 10 and are electrically connected to the upper heat sink 40 to form a shield body.

Alternatively, an integrated circuit 52 to be mounted,
A difference is provided between the outer diameters of the integrated circuits 53 and 54, and the lateral and depth dimensions are sequentially increased from the integrated circuit arranged at the bottom to the upper one. A step is provided on the wall surface, and a contact terminal group that comes into contact with the terminal of the integrated circuit is provided at a corresponding portion of the upward end portion of each step, and the contact terminal passes through the wall surface of the socket body and the lower socket external terminal. To be electrically connected to.

Further, at least a portion including a heat radiating portion of the interlayer heat radiator is formed of a metal thin plate 71, and a tube 72 which is in contact with the metal thin plate 71 and is bent in the laminated portion of the interlayer heat radiator is provided. Of the integrated circuit by passing the fluid. In this case, the material of the tube 72 is made of a soft resin
Can also serve as a cushioning material along the line. Alternatively, a gap may be provided in the laminated portion of the interlayer heat radiator, a nozzle 82 may be provided at the entrance of the gap, and a fluid may be ejected from the nozzle 82 into the gap to release heat from the integrated circuit. In this case, the shape of the heat radiating hollow constituent part 81 in the laminated portion is configured to fit at least two adjacent side walls of the socket body and surround the side wall at the part of the heat radiating hollow constituent part 81.

[0010]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a cross-sectional view of an embodiment of the present invention cut along a plane parallel to the x-axis and including a center line in the y-axis direction. 2 is a cross-sectional view of the embodiment of FIG. 1 taken along a plane parallel to a line rotated 45 degrees from the x-axis to the z-axis and including a center line in the y-axis direction. FIG. 3 is a perspective external view showing the embodiment of FIG. 1 mounted on a substrate. FIG. 3 shows the x-axis, y-axis, and z-axis directions assumed above. In FIG. 4, to show the internal structure, the left side is cut along a plane parallel to the x axis with the central axis in the y axis direction as a boundary, and the right side is x.
It is the perspective view fractured | ruptured in the plane parallel to the line rotated 45 degrees in the direction of the z-axis from the axis.

FIGS. 5 to 8 are exploded perspective views of the embodiment of FIG. 1. The uppermost part of FIG. 5 is the lowermost part of FIG. 6, and the uppermost part of FIG. In addition, it is assumed that the uppermost part in FIG. 7 continues to the lowermost part in FIG. 1 to 8, 1 is a substrate, 2, 3 and 4 have the same dimensions, and the package is PL.
It is a CC type IC. 5, 5,..., 5 are cushion materials, which are made of an insulating material having high flexibility and high thermal conductivity, such as silicon, and have a plate shape. 10 is a socket body, 20, 30
Denotes a heat sink as an interlayer heat radiator, and 40 denotes an upper heat sink. Reference numeral 6 denotes a thin metal plate for shielding laid in the lowermost portion of the internal space of the socket body 10, and reference numeral 7 denotes a metal plate for electrically connecting the metal plate 6, the heat sinks 20, 30, and the upper heat sink 40 to ground. Wiring.
Reference numeral 100 denotes a foot for providing a gap between the substrate 1 and the socket body 10, and the problem at the time of soldering is solved by attaching the foot 100.

The socket body 10 has a box-like shape without an upper lid, and has four deep cutouts 11, 11, 1 downward from the upper end at the four corners.
1, 2 and the side walls 12, 12, 12, 12 surround the internal cavity with two sets of opposing surfaces. And the side wall 12,
On the inner surfaces of 12, 12, 12, terminals 2t, 2t... 2t, 3t of ICs (2, 3, 4) inserted and mounted therein.
The contact terminals 13, 13 ... 13 are arranged at positions corresponding to t, 3t ... 3t, 4t, 4t ... 4t, and the contact terminals 13, 13 ... 13 are insulators. It passes through the side wall of the socket body 10 and is connected to or integrally formed with the connection terminals 14, 14,...

Numerals 15, 15, 15, 15 are screw holes for fixing the upper heat sink 40 with screws 41, 41, 41, 41, and 16, 16,... The grooves are provided on the inner surfaces of 11, 11, 11 that face each other. 17, 17, 17, 17 are spacers inserted between the socket body 10 and the interlayer heat sink 20; 18, 18, 18, 18 are spacers inserted between the interlayer heat sink 20 and the interlayer heat sink 30; 19, 19 and 19 are interlayer heat sinks 30.
And a spacer inserted between the upper heat sink 40 and the upper heat sink 40. When these spacers are assembled, the position on the plane is regulated by the pair of protrusions on the side faces being fitted into the opposed grooves and the grooves 16 and 16.

On the interlayer heat sinks 20 and 30, there are laminated portions 21 (or 31) inserted between the ICs 2 and 3 (or 3 and 4) via spacers, respectively.
Following the stacking section 21 (or 31), the socket body 10
Notch 11, 11, 11, 11 which is fitted to the connecting portion 2
2 (or 32) and a heat radiating portion 23 (or 33) which extends further outward and surrounds the socket body 10 along the side walls 12, 12, 12, 12 of the socket body 10. Note that 20t and 30t are ground terminals for grounding the interlayer heat sinks 20 and 30, respectively. The ground terminals 20t and 30t are the ground terminal 40t of the upper heat sink 40 and the socket body 1
0 A thin metal plate 6 laid along the socket body at the lowermost portion of the internal space is connected by a wiring 7 and grounded.

FIG. 9 is an explanatory view (plan view) of the upper heat sink 40 and the IC (4) of the uppermost layer removed to explain the relationship between the interlayer heat sink 30 and the socket body 10. The same applies to the relationship between the interlayer heat sink 20 and the socket body 10, and the two-dot chain line in the figure indicates the position where the cushion material 5 contacts the interlayer heat sink 30. An IC (2,
When incorporating (3, 4), the cushion material 5, the IC (2), the cushion material 5, and the interlayer heat sink 20 are laminated on a thin metal plate 6 for shielding laid at the bottom of the internal space of the socket body 10. Part 21, cushion material 5, IC
(3) The cushion member 5, the laminated portion 31 of the interlayer heat sink 30, the cushion member 5, the IC (4), the cushion member 5, and the upper heat sink 40 are stacked, and the set screws 41, 4
At 1, 41, 41, the upper heat sink 40 may be screwed into the screw holes 15, 15, 15, 15 of the socket body 10 and fixed.

FIG. 10 has almost the same outer shape, but FIG.
9 shows an embodiment having an internal structure different from that of the embodiment of FIG. 9 and a package capable of supporting a QFP type IC, and is a cross-sectional view cut along a plane according to the xy plane shown in FIG. It is. It should be noted that the partial view shown in the circle in the same figure is an enlarged view showing a state where the terminals of the IC and the contact terminals of the socket are electrically connected by pressing contact.

In FIG. 10, reference numeral 50 denotes a socket body;
2, 53, 54 are ICs of different sizes, 55, 55, etc.
55 is a cushion material, 56 is a thin metal plate for electrostatic shield, 57, 57 ... 57 are spacers, 58, 59
Is an interlayer heat sink, and 60 is an upper heat sink.
The shape of the socket body 50 substantially conforms to that of the socket body 10 in FIGS. 1 to 8, but a step is provided on the inner surface of the side wall of the socket body 50 in order to make a step in the internal space. The contact terminals 61 on the socket side are on shoulders of steps on the inner surface of the socket body 50, and the terminals 54t (or 52t, 53t,) of the IC are superimposed thereon.
From above, the spacer 57 is pressed down from above simultaneously with the assembly.

In the embodiment shown in FIG.
When (52, 53, 54) is incorporated, the cushion member 55, the IC (52), the cushion member 55, and the interlayer heat sink are placed on a thin metal plate 56 for shielding laid at the bottom of the internal space of the socket body 50. 58, cushion material 55, IC (53), cushion material 55, interlayer heat sink 59, laminated portion 69, cushion material 55, I
C (54), cushion material 55, upper heat sink 60
Then, the upper heat sink 60 may be fixed to a screw hole (not shown) of the socket body 50 with a set screw (not shown). Simultaneously with the assembling, the terminals of the IC come into strong contact with the contact terminals on the socket side as described above, and are securely connected to the terminals of the socket body 50.

IC2 and IC3 (or IC3 and IC
The effect of the shield between layers 4) is ensured by applying a conductive powder and a curable liquid to the entire surface of the heat sink. In addition, the embodiment of FIGS.
In the embodiment of FIG. 10 as well, the three ICs are incorporated, but the number of ICs is not limited to three.
The individual ICs are not integrated even if they are incorporated in the socket body, so that it is convenient for individual replacement after assembly, and the removal, insertion, and fixing of the ICs can be easily performed using a heat sink. Moreover, at the same time, the metal plate on the bottom surface and the heat sink itself can shield the entire package at once. Further, when mounting on the substrate of this embodiment, since the IC is mounted through the socket,
There is no thermal stress on the IC body during flow and reflow. Further, since the position of the spacer is fixed, it is possible to prevent dust from entering the internal electrical contact portion, and to minimize dust accumulation.

FIG. 11 is a plan view showing an example of an interlayer radiator different from that used in the embodiment of FIGS.
FIG. 12 is a cross-sectional view (taken along the line AA in FIG. 11) of an example in which the interlayer heat radiator in FIG. 11 is incorporated. 11 and 12, 70 is the position of the socket body, 71 is a thin metal plate instead of a heat sink, and 72 is a tube for heat radiation, through which a cooling fluid flows. The cooling fluid may be any of water, oil, air and the like. In the embodiment shown in FIG. 12, the tube is formed of a soft and elastic resin material and also serves as a cushion material. In addition,
Reference numeral 73 denotes an upper cover, and reference numerals 2, 3, and 4 denote ICs to be mounted.

FIG. 13 is an explanatory view (plan view) showing an example of another interlayer radiator different from those shown in FIGS.
However, a part near the nozzle is shown broken. FIG.
FIG. 14 is a front view of the interlayer heat radiator of FIG. 13. Figures 13 and 1
4, reference numeral 80 denotes a position of the socket body; 81, a heat-dissipating hollow component instead of a heat sink; 82, a heat-dissipating hollow component 81 for restricting a fluid flowing therethrough and jetting the fluid toward the center of the heat-dissipating hollow component 81; This is a nozzle provided inside the vicinity of the entrance. The fluid may be a compressed gas, air, water, or the like. The heat radiator may be incorporated according to the case of FIG.

[0022]

As has been described in detail above, the present invention integrates at least the socket body and the inter-layer heat radiator of the multilayered integrated circuit to achieve electrical connection within the structure.
There is an effect that heat radiation can be performed simultaneously. In addition, an upper heat sink is arranged at the top to further improve the heat radiation effect, and at the same time, enables electrostatic shielding.
Further, by using this embodiment, it is easy to replace individual ICs even after mounting, and the ICs can be used during flow and reflow.
No thermal stress is applied to the body. In addition, there is an advantage that the degree of freedom is high except for the height, and that a high-performance and high-density integrated circuit can be mounted three-dimensionally.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view cut along an xy plane according to an embodiment of the present invention.

2 is a cross-sectional view of the embodiment of FIG. 1 cut along a plane including a bisector of xz and a y-axis.

FIG. 3 is a perspective external view of the embodiment of FIG. 1;

FIG. 4 is a perspective view showing a cutaway part of the embodiment of FIG.

FIG. 5 is a partial (lowermost) perspective view of the embodiment of FIG. 1 exploded.

FIG. 6 is a part of a perspective view (part continuing to the upper side of FIG. 5) showing the embodiment of FIG. 1 in an exploded manner.

7 is an exploded perspective view of a part of the embodiment of FIG. 1 (a part following the upper part of FIG. 6).

FIG. 8 is a part (top) of an exploded perspective view of the embodiment of FIG. 1;

FIG. 9 is an explanatory view (plan view) showing a relationship between the socket body and the interlayer heat radiator of the embodiment of FIG. 1;

FIG. 10 is a sectional view taken along the xy plane of another embodiment.

FIG. 11 is a plan view showing an example of an interlayer radiator according to another embodiment.

12 is a cross-sectional view (taken along the line AA in FIG. 11) of an example in which the interlayer heat radiator of FIG. 11 is incorporated.

FIG. 13 is an explanatory view (plan view) showing an example of an interlayer radiator according to another embodiment.

FIG. 14 is a front view of the interlayer heat radiator of FIG. 13;

[Explanation of symbols]

 1 substrate 2,3,4,52,53,54 IC 5,55 cushion material 6,56 metal plate 10,50,70,80 socket body 17,18,19,57 spacer 20,30,58,59 interlayer heat radiation Body (heat sink) 40, 60 Upper heat sink 71 Metal thin plate 72 Tube 81 Heat radiating hollow component 82 Nozzle

Claims (6)

(57) [Claims] 1. A structure in which a plurality of integrated circuits are mounted on a substrate in a vertically stacked manner, having at least a socket body and an interlayer heat sink, and the socket body has a box shape without an upper lid and is mounted on four corners of a side wall surface. A notch portion is provided downward from an end face; the inter-layer heat radiator is a stacked portion inserted between the integrated circuits arranged one above the other, and the socket body following the stacked portion; 3. A mounting structure for an electronic component, comprising: a connecting portion that fits into the notch portion; and a heat radiating portion that is disposed outside the side wall surface of the socket body following the connecting portion. 2. An upper heat sink for heat dissipation along the upper surface of the uppermost integrated circuit is provided, and the cushion material, the integrated circuit, the cushion material, and the laminated portion of the interlayer radiator are repeatedly stacked in this order from the bottom in the internal space of the socket body. 2. The integrated circuit mounting structure according to claim 1, wherein the cushioning material and the upper heat sink are arranged and mounted on an uppermost integrated circuit. 3. A contact terminal group, which contacts an integrated circuit terminal to be mounted, is provided on an inner surface of a side wall of the socket body, and each of the contact terminals passes through a wall surface of the socket body and is a socket external terminal at a lower portion of the socket body. The heat radiation portion of the interlayer heat radiator surrounds the socket body along the outer periphery of the wall surface of the socket body, and is electrically connected to the upper heat sink to form a shield body. The mounting structure of the integrated circuit according to claim 1. 4. An integrated circuit to be mounted is provided with a difference in an outer diameter dimension, and lateral and depth dimensions are sequentially increased from an integrated circuit arranged at a lower position to an upper position. Correspondingly, a step is provided on the inner wall surface of the socket body, and a contact terminal group for contacting the terminal of the integrated circuit is provided at a corresponding portion of the upward end of each step, and each of the contact terminals passes through the wall surface of the socket body. And electrically connected to a lower socket external terminal.
3. The mounting structure of the integrated circuit according to any one of 2. 5. An interlayer heat dissipation member including at least a heat dissipation portion is formed of a thin metal plate, and a tube is provided which is in contact with the thin metal plate and bends in a laminated portion of the interlayer heat dissipation member, and a cooling fluid is passed through the tube. The mounting structure of an integrated circuit according to claim 1, wherein heat is radiated from the integrated circuit. 6. The heat dissipation of an integrated circuit according to claim 1, wherein a gap is provided in a laminated portion of the interlayer radiator, a nozzle is provided at an inlet of the gap, and a fluid is jetted from the nozzle into the gap to radiate heat of the integrated circuit. A mounting structure of the integrated circuit according to any one of the above.