JP2636320B2 - Radiator - Google Patents

Radiator

Info

Publication number
JP2636320B2
JP2636320B2 JP63101123A JP10112388A JP2636320B2 JP 2636320 B2 JP2636320 B2 JP 2636320B2 JP 63101123 A JP63101123 A JP 63101123A JP 10112388 A JP10112388 A JP 10112388A JP 2636320 B2 JP2636320 B2 JP 2636320B2
Authority
JP
Japan
Prior art keywords
heat
fin
radiator
air
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63101123A
Other languages
Japanese (ja)
Other versions
JPH01269881A (en
Inventor
雅雄 森下
慎一郎 守山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP63101123A priority Critical patent/JP2636320B2/en
Priority to KR1019890004747A priority patent/KR970009810B1/en
Publication of JPH01269881A publication Critical patent/JPH01269881A/en
Application granted granted Critical
Publication of JP2636320B2 publication Critical patent/JP2636320B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023Mounting details thereof

Landscapes

  • Drying Of Gases (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子冷却素子を使用した除湿装置,冷却装
置等における放熱器に関する。
Description: TECHNICAL FIELD The present invention relates to a radiator in a dehumidifying device, a cooling device, or the like using an electronic cooling element.

〔従来の技術〕[Conventional technology]

従来より、閉鎖配電盤や各制御装置等の設備において
は、内部機器の高信頼性確保のため、設備箱体内の結露
防止または高温防止が図られているが、この場合、ペル
テイエ効果を利用した電子冷却素子を用いて除湿装置ま
たは冷却装置を構成することが一般的に行なわれてい
る。
Conventionally, in equipment such as closed switchboards and various control devices, prevention of dew condensation or high temperature inside the equipment box has been attempted to ensure high reliability of internal equipment.In this case, electronic equipment utilizing the Peltier effect is used. It is common practice to configure a dehumidifying device or a cooling device using a cooling element.

たとえば、第4図及び第5図は電子冷却素子を使用し
た従来の冷却装置を示しており、箱体(1)の外壁に形
成された透孔に断熱材(2)を介して電子冷却素子
(3)が配置され、箱体(1)の外側に素子(3)の発
熱面に接して放熱器がある放熱フイン(4)が取付けら
れると共に、該放熱フイン(4)を強制空冷するフアン
(5)が設けられ、他方、箱体(1)の内側に素子
(3)の吸熱面に接して吸熱フイン(6)が取付けられ
ると共に、該フイン(6)に箱体(1)内の空気を送風
するフアン(7)が設けられている。
For example, FIGS. 4 and 5 show a conventional cooling device using an electronic cooling element. The electronic cooling element is provided in a through hole formed in an outer wall of a box body (1) through a heat insulating material (2). (3) is arranged, and a radiator fin (4) having a radiator in contact with the heat generating surface of the element (3) is attached to the outside of the box body (1), and a fan for forcibly air cooling the radiator fin (4) (5) is provided, on the other hand, a heat absorbing fin (6) is attached to the inside of the box (1) in contact with the heat absorbing surface of the element (3), and the fin (6) is attached to the inside of the box (1). A fan (7) for blowing air is provided.

そして、電子冷却素子(3)を駆動すると、発熱面の
温度上昇により放熱フイン(4)の温度が上昇すると共
に、吸熱面の温度低下により吸熱フイン(6)の温度が
低下し、フアン(5)の駆動により外気が放熱フイン
(4)に送風されることにより、放熱フイン(4)が強
制空冷される一方、箱体(1)内の空気がフアン(7)
の駆動によつて吸熱フイン(6)に吹付けられることに
より、箱体(1)内の空気温度は徐々に低下し、箱体
(1)内の空気に多量の水分を含む場合は、この水分が
フイン(6)において結露し、空気中より取除かれる。
When the electronic cooling element (3) is driven, the temperature of the heat radiation fin (4) rises due to the temperature rise of the heat generating surface, and the temperature of the heat absorbing fin (6) falls due to the temperature decrease of the heat absorbing surface. ), The outside air is blown to the radiating fin (4), whereby the radiating fin (4) is forcibly air-cooled, while the air in the box (1) is cooled by the fan (7).
When the air is blown onto the heat absorbing fin (6) by the driving of the box (1), the air temperature in the box (1) gradually decreases. Water condenses on the fins (6) and is removed from the air.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかし、従来技術にあつては、箱体(1)外に導出さ
れた放熱フイン(4)及びフアン(5)が露出する構成
であるため、高温度の放熱フイン(4)や回転中のフア
ン(5)に対する安全性に問題があり、しかも、フイン
(4)自身の保護もないので破損等の危険がある。
However, in the prior art, the radiating fin (4) and the fan (5) led out of the box (1) are exposed, so that the high-temperature radiating fin (4) and the rotating fan (4) are exposed. There is a problem in safety against (5), and there is no protection of the fin (4) itself.

ここで、従来技術において、同図の1点鎖線に示すよ
うに、放熱フイン(4)及びフアン(5)を金網等のカ
バー(8)により覆うことにより、前述の問題を解消す
ることができるが、この場合、別部品としてのカバー
(8)を要するため、コスト高となり、しかも、放熱器
全体としての大形化を招く不都合がある。
Here, in the prior art, the above-mentioned problem can be solved by covering the heat radiating fin (4) and the fan (5) with a cover (8) such as a wire mesh, as shown by the one-dot chain line in FIG. However, in this case, since the cover (8) as a separate part is required, the cost is increased, and further, there is a disadvantage that the entire radiator is increased in size.

本発明は、従来の技術の有するこのような問題点に留
意してなされたものであり、その目的とするところは、
外観ケース機能を一体に兼ね備えることができる放熱器
を提供しようとするものである。
The present invention has been made in consideration of such problems of the prior art, and the purpose thereof is to:
An object of the present invention is to provide a radiator capable of integrally having an external case function.

〔課題を解決するための手段〕[Means for solving the problem]

前記目的を達成するための本発明の構成を、実施例に
対応する第1図を用いて説明する。
The configuration of the present invention for achieving the above object will be described with reference to FIG. 1 corresponding to the embodiment.

本発明による放熱器は、電子冷却素子(22)の発熱面
に対する接合面を有する基板部(13)と,該基板部(1
3)の中央部より基板部(13)に直交する方向に突設さ
れた熱ガイド(14)と,該熱ガイド(14)の両側に設け
られそれぞれ複数のひれ片を前記直交する方向に並設し
てなるフイン部(15)と、,前記熱ガイド(14)の先端
に前記基板部(13)に平行に設けられた化粧板部(16)
とを一体に構成すると共に、前記基板部(13)の両側端
と前記化粧板部(16)の両側端とのそれぞれの間に前記
両フイン部(15)の外側を覆う側板(17)を圧入してな
ることを特徴とするものである。
A radiator according to the present invention comprises a substrate (13) having a bonding surface to a heating surface of an electronic cooling element (22);
A heat guide (14) projecting from the central portion of (3) in a direction orthogonal to the substrate (13), and a plurality of fins provided on both sides of the heat guide (14) are arranged in parallel in the orthogonal direction. A fin portion (15) provided, and a decorative plate portion (16) provided at the end of the heat guide (14) in parallel with the substrate portion (13).
And a side plate (17) for covering the outside of both fins (15) between both ends of the base plate (13) and both ends of the decorative plate (16). It is characterized by being press-fitted.

〔作用〕[Action]

電子冷却素子(22)の駆動により、その発熱面が温度
上昇すると、これに接合した基板部(13)が発熱面の熱
を吸熱し、これが基板部(13)及び熱ガイド(14)を通
つて両フイン部(15)に伝熱され、フイン部(15)の各
ひれ片の表面より放熱される。
When the temperature of the heat generating surface rises due to the driving of the electronic cooling element (22), the substrate (13) joined thereto absorbs the heat of the heat generating surface and passes through the substrate (13) and the heat guide (14). Then, heat is transferred to both fins (15) and radiated from the surface of each fin of the fin (15).

このとき、放熱器の下方より送風すれば放熱が促進さ
れる。
At this time, if air is blown from below the radiator, heat radiation is promoted.

また、この放熱基は、基板部(13),化粧板部(16)
及び両側板(17)によつてフイン部(17)が覆われ、外
観ケースを兼ねる。
In addition, this heat dissipation base is composed of a board part (13), a decorative board part (16)
The fin portion (17) is covered by the side plates (17) and also serves as an external case.

〔実施例〕〔Example〕

つぎに、本発明の実施例につき第1図ないし第3図を
用いて説明する。
Next, an embodiment of the present invention will be described with reference to FIGS.

これらの図面において、(9)は閉鎖配電盤や各種制
御装置等の箱体であり、外壁に除湿冷却装置の取付用の
角形透孔(10)が形成されている。
In these drawings, (9) is a box body of a closed switchboard, various control devices, and the like, and a rectangular through hole (10) for mounting a dehumidifying cooling device is formed on an outer wall.

(11)は透孔(10)の周縁の外側面に断熱・断水効果
を有する環状のパツキング(12)を介してねじ止めされ
た上下方向に長い放熱器であり、後述の電子冷却素子等
の取付面を有し透孔(10)を外側より閉塞した基板部
(13)と,該基板部(13)の中央部より後方へ突出され
た熱ガイド(14)と,該熱ガイド部(14)の両側面に設
けられそれぞれ複数のひれ片を前後方向に並設してなる
フイン部(15)と,熱ガイド(14)の後端部に基板部
(13)に平行に設けられた化粧板部(16)とを鋳造によ
り一体成形すると共に、基板部(13)の両側後面の溝と
化粧板部(16)の両側前面の溝とのそれぞれの間にフイ
ン部(15)の外側をそれぞれ覆う側板(17)を圧入して
構成されており、両側板(17)は、放熱器(11)の直下
に配置される後述の放熱フアンのフアンカバー(18)と
一体に形成されている。
(11) is a vertically long radiator screwed through an annular packing (12) having heat insulation and water cutoff effects on the outer surface of the periphery of the through hole (10). A board portion (13) having a mounting surface and having a through hole (10) closed from the outside, a heat guide (14) protruding rearward from the center of the board portion (13), and a heat guide portion (14). ), Which are provided on both sides of the fin (15), each of which has a plurality of fins arranged side by side in the front-rear direction, and a makeup provided parallel to the substrate (13) at the rear end of the heat guide (14). The plate (16) and the plate (16) are integrally formed by casting, and the outside of the fin (15) is interposed between the grooves on both rear surfaces of the substrate (13) and the grooves on both front surfaces of the decorative plate (16). Each of the side plates (17) is press-fitted, and the side plates (17) are arranged directly below the radiator (11). Cover (18) and are integrally formed.

この放熱器(11)には、第2図に示すように、基板部
(13)の後面,フイン部(15)の各ひれ片の表面及び化
粧板部(16)の前面に鋳造引抜きによる上下方向の細か
い溝が多数形成されており、放熱表面積を増大させて放
熱能力の大幅な向上が図られている。
As shown in FIG. 2, the radiator (11) has a vertical surface formed by casting and drawing on the rear surface of the substrate (13), the surface of each fin of the fin (15), and the front surface of the decorative plate (16). A large number of fine grooves in the direction are formed, and the heat radiation surface area is increased, thereby significantly improving the heat radiation ability.

(19)は放熱器(11)の直下にねじ止めされフアンカ
バー(18)内に収納された軸流フアンからなる放熱フア
ンであり、箱体(9)外の空気を放熱器(11)のフイン
部(15)における空間に下方より送風し、該放熱器(1
1)を強制空冷する。(20)はフアンガードである。
(19) is a radiating fan consisting of an axial flow fan screwed directly below the radiator (11) and housed in the fan cover (18), and circulates air outside the box (9) to the radiator (11). Air is blown into the space in the fin section (15) from below, and the radiator (1
1) Force air cooling. (20) is Juan Guard.

(21)は放熱器(11)の前面,すなわち基板部(13)
の取付面に添着され透孔(10)との対向面を覆う断熱シ
ートであり、電子冷却素子のための2個の角孔を有す
る。(22)はペルテイエ効果を利用した2個の電子冷却
素子であり、断熱シート(21)の両角孔にそれぞれ嵌装
されて発熱面を基板部(13)の前面に接合している。
(21) is the front of the radiator (11), that is, the substrate (13)
Is a heat insulating sheet attached to the mounting surface of (1) and covers the surface facing the through hole (10), and has two square holes for the electronic cooling element. Numerals (22) are two electronic cooling elements utilizing the Peltier effect, which are fitted into both square holes of the heat insulating sheet (21), respectively, and join the heat generating surface to the front surface of the substrate (13).

(23)は箱体(21)内に位置し上下方向の多数のひれ
片を並設してなる吸熱フインであり、基板部(13)と吸
熱フイン(23)とで2個の素子(22)を挾むようにして
基板部(13)にねじ止めされ、吸熱フイン(23)が素子
(22)の吸熱面に接触している。
(23) is an endothermic fin located in the box (21) and having a number of vertical fins arranged side by side. The substrate part (13) and the endothermic fin (23) have two elements (22). ) Is screwed to the substrate portion (13) so that the heat absorbing fin (23) is in contact with the heat absorbing surface of the element (22).

(24)は透孔(10)を介して基板部(13)の前面にね
じ止めされ吸熱フイン(23)を覆つた樹脂製のカバーで
あり、後面が開口されると共に、上面に吸気孔(25)
が,下部の左右側面に排気孔(26)がそれぞれ形成され
ている。このカバー(24)における吸熱フイン(23)の
直上の位置には、その前側を後方へ絞り込んで後述の吸
熱フアンからの空気を吸熱フイン(23)に集中案内する
絞り部(27)が形成されている。
A resin cover (24) is screwed to the front surface of the substrate (13) through the through hole (10) and covers the heat absorbing fin (23). The resin cover has an opening at the rear surface and an intake hole ( twenty five)
However, exhaust holes (26) are formed on the lower left and right side surfaces, respectively. At a position immediately above the heat absorbing fin (23) in the cover (24), a narrowing portion (27) for narrowing the front side to the rear to concentrate and guide the air from the heat absorbing fan (described later) to the heat absorbing fin (23) is formed. ing.

(28)はカバー(24)内の上部に位置しL形の取付板
(29)により断熱シート(21)を介して基板部(13)の
前面に固定された軸流フアンからなる吸気フアンであ
り、吸気孔(25)より箱体(9)内の空気をカバー(2
4)内に吸気し、下方の吸熱フイン(23)に送風する。
(28) is an intake fan consisting of an axial fan, which is located at the upper part of the cover (24) and is fixed to the front surface of the substrate (13) via the heat insulating sheet (21) by the L-shaped mounting plate (29). There is an air hole (25) that covers the air inside the box (9) (2
4) Intake air and blow it to the lower heat absorbing fin (23).

(30)はカバー(24)内の吸熱フイン(23)の下方に
設けられた山状の傾斜案内板であり、吸熱フイン(23)
を通過した空気を左右に分岐してそれぞれ排気孔(26)
に案内する。この案内板(30)の左右両側端とカバー
(24)の左右内面との間には、結露,滴下した除湿水を
カバー(24)の底面に案内するため、若干の隙間が形成
されている。
(30) is a mountain-shaped inclined guide plate provided below the heat absorbing fin (23) in the cover (24), and the heat absorbing fin (23)
The air that has passed through is diverged to the left and right, and exhaust holes (26)
To guide. Between the left and right ends of the guide plate (30) and the left and right inner surfaces of the cover (24), a slight gap is formed to guide dew condensation and dripping dehumidified water to the bottom surface of the cover (24). .

このカバー(24)の底面は右方へ下る傾斜面(31)と
なつており、カバー(24)の右側壁における傾斜面(3
1)の傾斜終端の位置に排水口が形成され、該排水口に
排水ホースが接続されると共に、この排水ホースが箱体
(9)の外壁を貫通して箱体(9)外に導出され、開口
されている。
The bottom surface of the cover (24) is a slope (31) descending to the right, and the slope (3) on the right side wall of the cover (24).
A drain port is formed at the position of the inclined end of 1), a drain hose is connected to the drain port, and this drain hose passes through the outer wall of the box (9) and is led out of the box (9). Is open.

そして、前記装置の駆動を開始すると、両電子冷却素
子(22)により温度上昇した箱体(9)外の放熱器(1
1)は、放熱フアン(19)からの外気がフアンカバー(1
8)より基板部(13),熱ガイド(14),化粧板部(1
6)及び側板(17)で形成する空間,すなわち両フイン
部(15)の各ひれ片間に案内されることにより、放熱器
(11)の熱がこの外気に放出されて上方へ排出され、強
制空冷される。
Then, when the operation of the device is started, the radiator (1) outside the box (9) whose temperature is increased by the two electronic cooling elements (22).
The outside air from the radiating fan (19) is covered by the fan cover (1).
8) Substrate (13), heat guide (14), decorative board (1
6) and the space formed by the side plate (17), that is, between the fins of both fins (15), the heat of the radiator (11) is released to the outside air and discharged upward, Forced air cooling.

一方、両素子(22)により温度低下した箱体(9)内
の吸熱フイン(23)には、吸気フアン(28)によりカバ
ー(24)内に吸気された箱体(9)内の高温多湿空気が
導入され、吸熱フイン(23)がこの空気より吸熱して該
空気中の水分を結露させ、吸熱フイン(23)を通つて低
温乾燥された空気は案内板(30)により案内されて排気
孔(26)より箱体(9)内に戻される。
On the other hand, the heat absorbing fin (23) in the box (9) whose temperature has been lowered by the two elements (22) has high temperature and high humidity in the box (9) sucked into the cover (24) by the suction fan (28). Air is introduced, and the heat absorbing fin (23) absorbs heat from this air to condense moisture in the air, and the air dried at a low temperature through the heat absorbing fin (23) is guided by the guide plate (30) and exhausted. It is returned into the box (9) through the hole (26).

このとき、吸気フアン(28)からの空気は、カバー
(24)の絞り部(27)で絞られて吸熱フイン(23)に集
中して案内されるので、フイン(23)における吸熱動作
が積極的に行われ、除湿,冷却効果が高まる。
At this time, the air from the intake fan (28) is constricted by the restricting portion (27) of the cover (24) and is guided intensively to the heat absorbing fin (23). The dehumidification and cooling effects are enhanced.

このようにして、吸熱フイン(23)で結露した水は、
案内板(30)及びカバー(24)の傾斜面(31)を通つて
排水口より流出し、排水ホースを介して箱体(9)外へ
排水される。
In this way, the water condensed in the endothermic fin (23)
The water flows out of the drain port through the guide plate (30) and the inclined surface (31) of the cover (24), and is drained out of the box (9) through a drain hose.

〔発明の効果〕〔The invention's effect〕

以上説明したように、本発明の放熱器によると、基板
部の両側端と,該基板部の中央部より突設された熱ガイ
ドの先端の化粧板部における両側端とのそれぞれの間
に、熱ガイドの両側面に設けられたフイン部を覆う側板
を圧入するようにしたので、フイン部が外部に露出する
ことはなく、高温のフイン部に触れる心配がなく、安全
性が確保されるうえ、フイン部の各ひれ片の破損の心配
もない。
As described above, according to the radiator of the present invention, between each side edge of the board portion and each side edge of the decorative plate portion at the tip of the heat guide protruding from the center portion of the board portion, The side plates that cover the fins provided on both sides of the heat guide are press-fitted, so that the fins are not exposed to the outside, there is no need to worry about touching the hot fins, and safety is ensured. There is no need to worry about breakage of each fin in the fin section.

しかも、化粧板部及び側板により外観ケースを構成で
きるので、フイン部を覆うための別部品が不要となり、
部品点数及び組立工数の削減が図れ、かつ小形化が図れ
るものである。
Moreover, since the exterior case can be constituted by the decorative plate portion and the side plate, a separate component for covering the fin portion is not required, and
The number of parts and the number of assembling steps can be reduced and the size can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図ないし第3図は本発明による放熱器を除湿冷却装
置に適用した場合の1実施例を示し、第1図は装置の平
面図、第2図は要部の切断平面図、第3図は装置の切断
側面図、第4図及び第5図は従来の放熱器を用いた冷却
装置の切断側面図及び切断平面図である。 (11)……放熱器、(13)……基板部、(14)……熱ガ
イド、(15)……フイン部、(16)……化粧板部、(1
7)……側板、(22)……電子冷却素子。
1 to 3 show an embodiment in which a radiator according to the present invention is applied to a dehumidifying / cooling device. FIG. 1 is a plan view of the device, FIG. The figure is a cut-away side view of the apparatus, and FIGS. 4 and 5 are a cut-away side view and a cut-away plan view of a cooling device using a conventional radiator. (11)… radiator, (13)… board part, (14)… heat guide, (15) fin part, (16)… decorative board part, (1)
7) Side plate, (22) Electronic cooling element.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】電子冷却素子の発熱面に取付けられ該発熱
面からの受熱を放熱する放熱器において、 前記発熱面との接合面を有する基板部と,該基板部の中
央部より基板部に直交する方向に突設された熱ガイド
と,該熱ガイドの両側に設けられそれぞれ複数のひれ片
を前記直交する方向に並設してなるフイン部と,前記熱
ガイドの先端に前記基板部に平行に設けられた化粧板部
とを一体に構成すると共に、前記基板部の両側端と前記
化粧板部の両側端とのそれぞれの間に前記両フイン部の
外側を覆う側板を圧入してなることを特徴とする放熱
器。
1. A radiator attached to a heat generating surface of an electronic cooling element for radiating heat received from the heat generating surface, comprising: a substrate having a joint surface with the heat generating surface; A heat guide protruding in the orthogonal direction, a fin portion provided on both sides of the heat guide, each having a plurality of fins juxtaposed in the orthogonal direction, and a tip of the heat guide attached to the substrate portion. A decorative plate portion provided in parallel is integrally formed, and a side plate that covers the outside of the fin portions is press-fitted between both side ends of the substrate portion and both side ends of the decorative plate portion. A radiator characterized in that:
JP63101123A 1988-04-22 1988-04-22 Radiator Expired - Lifetime JP2636320B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63101123A JP2636320B2 (en) 1988-04-22 1988-04-22 Radiator
KR1019890004747A KR970009810B1 (en) 1988-04-22 1989-04-11 Dehumidification and refrigeratory apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63101123A JP2636320B2 (en) 1988-04-22 1988-04-22 Radiator

Publications (2)

Publication Number Publication Date
JPH01269881A JPH01269881A (en) 1989-10-27
JP2636320B2 true JP2636320B2 (en) 1997-07-30

Family

ID=14292298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63101123A Expired - Lifetime JP2636320B2 (en) 1988-04-22 1988-04-22 Radiator

Country Status (1)

Country Link
JP (1) JP2636320B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295528U (en) * 1989-01-18 1990-07-30
CN102192613A (en) * 2010-03-19 2011-09-21 曹爱国 Semiconductor refrigerating chip subassembly

Also Published As

Publication number Publication date
JPH01269881A (en) 1989-10-27

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