JP2615855B2 - Electronic device substrate cutting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION A. Object of the Invention (1) Field of Industrial Application The present invention relates to an electronic device substrate having a heating element or a photoelectric conversion element formed on its surface by a thin film or thick film forming technique. Cutting method.

Examples of the electronic device substrate include a thermal head insulating substrate in which heating resistors are arranged in a thin film, a facsimile ceramic substrate in which photoelectric conversion elements are arranged, and the like.

(2) Prior Art FIGS. 5 and 6 show an example of a conventional long contact image sensor S. FIG. This long contact type image sensor S
A plurality of ceramic substrates 02, 02 are respectively formed on the front end portion (upper portion in FIG. 5) of the upper surface of the support plate 01 along the longitudinal direction (X direction in FIG. 5). In FIG. 5, left and right end surfaces are supported in a state where they are close to each other.

On the surface of the ceramic substrate 02, its longitudinal direction (the fifth
A large number of individual electrodes 03, 03, ... Are arranged in a row along the X direction). Each individual electrode 03 is formed on the individual electrode body portion 04 and the base end portion (right side portion in FIG. 6) of the body portion 04.
It is composed of an IC connection terminal 05 and a rectangular pixel electrode 06 formed at the tip portion (left side portion in FIG. 6) of the main body portion 04. On the upper surface of the pixel electrode 06, a strip-shaped photoconductive layer 07 made of amorphous silicon (a-Si) and a transparent common electrode 08 are sequentially laminated. These pixel electrode 06, photoconductive layer 07 and common electrode 08 are stacked. Thus, a light receiving element 09 as an operation element is formed.

In addition, the long image sensor S has a plurality of resin portions along a longitudinal direction (X direction in FIG. 5) on a base end portion (lower portion in FIG. 5) on the upper surface of the support plate 01. ... are supported with their side end surfaces close to each other.

On the surface of the printed wiring board 010, its longitudinal direction (the fifth
The wiring pattern for external connection 011 along the X direction in the figure)
Are formed. The wiring pattern 011 extends from the front end portion (the upper portion in FIG. 5) of the printed wiring board 010 toward the base end portion, and the IC mounting electrode line 011a, the plurality of IC control lines 011b, 011b, , And a read signal transmission line 011c and the like.

On the IC mounting power supply line 011a, a plurality of driving ICs 012 are mounted along the longitudinal direction thereof, and the driving IC 012 has the individual electrode IC connection terminals 05 and Wiring pattern 011 IC
It is connected to the control line 011b and the read signal transmission line 011c.

The square light receiving element 09 on the ceramic substrate 02 is
In many cases, eight light emitting elements are formed with a width of 85 μm per 1 mm. In this case, the interval between the light receiving elements 09 is 40 μm. Then, the outer peripheral edge of the end light receiving element 09a disposed at the outer end of the light receiving elements 09 on each ceramic substrate 02 is located at a position 20 μm from the side end surface of the ceramic substrate 02.

Therefore, it is necessary to form the end light receiving element 09a at a position extremely close to the side end surface of the ceramic substrate 02.

(3) Problems to be Solved by the Invention As described above, as a method of forming the end light receiving element 09a at a position close to the side end surface of the ceramic substrate 02,
A method (first method) of forming the light receiving elements 09, 09, ... Rows including the end light receiving elements 09a on the ceramic substrate 02 cut from the beginning to a predetermined length is conceivable.

However, in the first method, when a film is formed on the ceramic substrate 02 for forming light receiving elements 09, 09... Since the deposition film cannot be formed uniformly, the finished light receiving element 09 has a ceramic substrate 02.
There is a problem in that the one formed near the side end face and the one formed apart from the side end face are not homogeneous and have different characteristics.

Therefore, as shown in FIG. 7, after forming the light receiving elements 09, 09, ... Rows on the ceramic substrate 02 cut to an appropriate length, they are located at a position 20 μm from the edge of the end light receiving element 09a. A method (second method) in which the ceramic substrate 02 is cut along a cutting line l to make it a predetermined length is conceivable.

However, in the second method, after the light receiving elements 09, 09, ... Are formed on the ceramic substrate 02 having an appropriate length, the ceramic substrate 02 is cut into a predetermined length by a dicer or a laser beam. In this case, there has been a problem that some light receiving elements 09 including the end light receiving element 09a near the cut portion are mechanically or thermally damaged and their characteristics are changed.

For example, as shown in FIG. 7, the ceramic substrate 02 is cut along a cutting line l- 20 μm from the edge of the end light receiving element 09a.
When cut by a dicer along the line l, some of the light receiving elements 09 including the end light receiving element 09a near the cut surface have an I
The -V characteristic has a relatively high dark output. It is considered that this is because the photoconductive layer 07 forming the light receiving element 09 near the cut surface is peeled off or the characteristics of the photoconductive layer 07 or the transparent common electrode 08 are changed by the heat generated when cutting.

In the above, the problem of cutting the ceramic substrate 02 on which the light receiving element 09 is formed by the film forming technique has been described using the example of the contact type image sensor S, but the above-described problem is not limited to the ceramic substrate 02. In general, there is a problem that occurs when an electronic device substrate on which an active element (a light receiving element of an image sensor, a heating resistor of a thermal head, etc.) formed by a film forming technique is formed at a position close to the active element. is there.

The present invention has been made in view of the above circumstances, and has an object to reduce a change in characteristics of an active element in the vicinity of a cut portion when cutting an electronic device substrate having an active element formed on a surface (film-formed surface). And

B. Configuration of the Invention (1) Means for Solving the Problems In order to achieve the above object, a method for cutting an electronic device substrate according to the present invention provides an electronic device in which an action element is formed on a deposition surface by a film forming technique. In the method for cutting a device substrate, after forming an active element component which is liable to cause a change in characteristics at the time of cutting on a deposition surface on which a cutting groove is formed, a portion where the cutting groove is formed is cut. Characterized by cutting with a cutting blade along.

(2) Function In the above-described method for cutting an electronic device substrate of the present invention, when an action element is formed by a film forming technique on a deposition surface on which a cutting groove is formed, a characteristic change occurs when the electronic device substrate is cut. The operative element component is easily formed after the cutting groove is formed. When cutting the electronic device substrate on which such an action element is formed, when the portion where the cutting groove is formed is cut by a cutting blade along the cutting groove, the cut surface is formed on the deposition surface near the cutting groove. It becomes possible to bring the cutting blade into contact with the electronic device substrate at a position distant from the working element formed on the. Therefore, the working element is less affected by the cutting blade when the electronic device substrate is cut, so that the characteristic change is reduced.

(3) Example An example of the method for cutting a film-coated substrate according to the present invention will be described below with reference to the drawings. FIG. 1 (A),
FIGS. 4 (B) to 4 (A) and 4 (B) are explanatory views of a method of cutting a ceramic substrate used in a contact type image sensor as an example of an electronic device substrate.

As shown in FIGS. 1 (A) and 1 (B), individual electrodes 2, 2,.
To form. Each of these individual electrodes 2 is composed of an individual electrode main body 3, IC connection terminals 4 formed at both ends of the main body 3, and a pixel electrode 5 as a working element component.

Next, as shown in FIGS. 2A and 2B, the pixel electrode 5
A cutting groove 6 having a width of 500 μm and a depth of 150 to 200 μm is formed at a position of 20 μm from the edge of the. This cutting groove 6 is formed by a dicer or a laser.

Next, as shown in FIGS. 3 (A) and 3 (B), a band-shaped light as a working element component is formed on the pixel electrode 5 on the upper surface (coating surface) of the ceramic substrate 1 on which the cutting groove 6 is formed. A conductive layer 7 and a transparent common electrode 8 as a working element component are sequentially laminated. .., The photoconductive layer 7 and the transparent common electrode 8 form light receiving elements 9, 9,. Among the pixel electrodes 5, 5,..., The photoconductive layer 7 and the transparent common electrode 8, which are the components of the light receiving element 9, those components that are likely to change in characteristics when cut.
7, 8 are formed after forming the cutting groove 6 as described above.

Next, as shown in FIG. 4B, the inside of the cutting groove 6 is cut by a dicer using a blade 10 as a cutting blade having a width of 300 μm. At the time of cutting, as shown in FIG. 4 (B), the attitude of the blade 10 with respect to the ceramic substrate 1 is set to the groove 6 for cutting.
By inclining obliquely downward and inward from the vertical wall 7a adjacent to the light receiving element 9, no burr remains on the outer end face of the ceramic substrate 1 after the end is cut off.

Next, the operation of the embodiment of the present invention having the above configuration will be described.

As described above, when the ceramic substrate (coating substrate) 1 on which the light receiving elements 9, 9,... Are formed is cut, the photoconductive layer 7 and the transparent common electrode 8 on the ceramic substrate 1 are directly cut at the time of cutting. Since the blade 10 does not contact, the photoconductive layer 7 and the transparent common electrode 8 are less likely to be peeled off, and the influence of heat is reduced.

As described above, the embodiment of the method for cutting an electronic device substrate according to the present invention has been described in detail. However, the present invention is not limited to the above-described embodiment, and departs from the present invention described in the claims. Instead, various design changes can be made.

For example, the present invention can be applied not only to the ceramic substrate 1 of the contact image sensor but also to a substrate of a thermal head having a large number of heating resistors formed by a film forming technique.

C. Effects of the Invention According to the above-described method for cutting an electronic device substrate of the present invention, when cutting an electronic device substrate on which a working element is formed on a surface (deposited surface), a portion of a cutting groove formed in advance is used. Since the cutting is performed at the position, it is possible to prevent a change in the characteristics of the working element near the cut portion.

[Brief description of the drawings]

1 (A) and (B) to FIGS. 4 (A) and 4 (B) are explanatory views of an embodiment of a method for cutting an electronic device substrate according to the present invention, and FIG. 1 (A) is an electronic device substrate. Action element (pixel electrode) with little change in characteristics when cutting the electronic device substrate on the top surface
FIG. 1 (B) is a partial plan view showing a state in which
FIG. 2A is a sectional view taken along line IB-IB in FIG. 2A, FIG. 2A is a partial plan view showing a state in which a cutting groove is formed in a portion to be cut of an electronic device substrate, and FIG. II in Fig. 2 (A)
FIG. 3 (A) is a cross-sectional view taken along line B-II B, in which an action element (photoconductive layer and transparent common electrode) is formed on an electronic device substrate in which a cutting groove is formed, the characteristics of which are likely to change during cutting. Partial plan view showing the state, FIG. 3 (B) is FIG. 3 (A)
4 (A) is a partial plan view illustrating a case where the electronic device substrate is cut by a cutting blade, and FIG. 4 (B) is a sectional view of FIG. 4 (A). FIG. 5 is a sectional view taken along the line IV B-IV B, and FIGS. 1 ... Electronic device substrate (ceramic substrate), 6 ... cutting groove, 7 ... photoconductive layer (working element component), 8 ...
Transparent common electrode (acting element component), 9 ... Light receiving element (acting element), 10 ... Cutting blade (blade)

Claims (1)

(57) [Claims] 1. A method for cutting an electronic device substrate (1) in which an operating element (9) is formed on a film-deposited surface by a film forming technique, wherein an operating element component (7, 8) which is liable to change in characteristics at the time of cutting.
Is formed on the deposition surface on which the cutting groove (6) is formed, and the portion where the cutting groove (6) is formed is cut along the cutting groove (6) by a cutting blade (10). A method for cutting an electronic device substrate to be cut.