JP2613292B2 - Manufacturing method of composite brazing material - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for producing a composite brazing material for assembling electronic components, particularly for assembling electronic components using ceramics as a substrate.

(Prior Art) Conventionally, as a composite brazing material for assembling electronic parts, there is a composite brazing material 3 in which an In layer 2 is overlapped on both upper and lower sides with an Au layer 1 interposed therebetween as shown in FIG.

(Problems to be Solved by the Invention) Meanwhile, since the composite brazing material 3 has a high rolling reduction (working rate) at the time of pressure joining, cracks 4 and net-like cracks 5 occur as shown in FIG. Also, peeling occurred due to the difference in spreadability between Au and In. In addition, due to the adhesive property of In, it adhered to the roll during pressure bonding.

Accordingly, an object of the present invention is to provide a method for producing a composite brazing material which is free from cracking and peeling, has high bonding strength and is stable, and does not stick to a roll.

(Means for Solving the Problems) According to the method for manufacturing a composite brazing material of the present invention for solving the above-mentioned problems, an In layer is stacked on the upper and lower sides of the Au layer with dimensions close to the final finish. Ultra-thin Japanese paper is superimposed on the outside, inserted into a roll, and the Au layer and the In layer are pressure-bonded at a rolling reduction of 20 to 30%, and then the Japanese paper is removed by acid treatment. is there.

(Function) As described above, in the method for producing a composite brazing material of the present invention, Au
Layer and In layer will be pressure-bonded with dimensions close to the final finish, and will be pressure-bonded with a low rolling reduction of 20 to 30%, so there will be no cracking or peeling and high bonding strength It is stable. If the rolling reduction is less than 20%, peeling may occur due to insufficient bonding, and if it exceeds 30%, cracking or cracking occurs in a net shape, so that 20 to 30% is preferable.

Further, in the method for producing a composite brazing material of the present invention, ultra-thin Japanese paper is stacked on the upper and lower outer sides and inserted into the roll, and the Au layer and the In layer are pressure-bonded, so that In does not stick to the roll. In addition, since the washi can be easily removed by acid treatment after pressure bonding, it does not affect the quality of the composite brazing material at all.

(Example) One embodiment of the method for producing a composite brazing material of the present invention will be described with reference to the drawings. As shown in FIG. 1a, the width is 15 mm and the thickness is 73 μm.
15mm wide and 45μ thick on both sides of the Au tape 1 '
1b, and a 30 μm thick Japanese paper 6 as shown in FIG. 1c is placed on both upper and lower sides of the In tape 2 ', and pressure is applied vertically as shown in FIG. 1d. Inserted between the rolls 7 and 8, the Au tape 1 'and the In tape 2' were pressure-bonded at a rolling reduction of 24%, and then the acid was treated with dilute sulfuric acid to remove the Japanese paper 6. As shown in e, Au layer 55 μm, upper and lower In layers 34 μm
As a result, a composite brazing material tape 3 ′ having a total thickness of 123 μm and consisting of Au 73 wt% -In 27 wt% was obtained.

On the other hand, in Conventional Example 1, the same In tape as in the embodiment is laminated on the upper and lower outer sides with the same Au tape as in the embodiment interposed, and inserted between the upper and lower pressing rolls as it is, and the Au tape and the In tape at a reduction rate of 15%.
Au layer 63μm, upper and lower In layers 38μm by pressure bonding with tape
As a result, a composite brazing material tape of Au73% -In27% having a total thickness of 139 μm was obtained.

Further, as Conventional Example 2, the same In tape as in the embodiment is placed on the upper and lower outer sides with the same In tape as in the embodiment, inserted between the upper and lower pressing rolls as it is, and the Au tape is reduced at a reduction ratio of 40% with the Au tape.
Pressure bonding with In tape, Au layer 31μm, upper and lower In layers 20
An Au 73% -In27% composite brazing tape having a thickness of 71 μm and a total thickness of 71 μm was obtained.

The quality of the composite brazing material tapes of Examples and Conventional Examples 1 and 2 obtained as described above was examined, and the results shown in the following table were obtained.

As is clear from the above table, the composite brazing tape of Conventional Example 1 has peeling of the Au layer and the In layer, and the composite brazing tape of Conventional Example 2 has cracks and net-like cracks. In contrast, the tape of the composite brazing material of the embodiment has no such peeling or cracking.

(Effects of the Invention) As can be seen from the above description, according to the method for producing a composite brazing material of the present invention, the brazing material does not stick to the roll, and the brazing material does not crack or peel, and is stable without being broken. Material can be obtained.

[Brief description of the drawings]

1a to 1e are views showing steps of an embodiment of a method for manufacturing a composite brazing material according to the present invention, FIG. 2 is a view showing a conventional composite brazing material, and FIG. It is a figure which shows the quality defect of the composite brazing material which arises by a method.

Claims (1)

(57) [Claims] 1. An In layer is overlaid on the upper and lower outer sides with an Au layer interposed therebetween in dimensions close to the final finish, and ultra-thin Japanese paper is overlaid on both the upper and lower outer sides and inserted into a roll. A method for producing a composite brazing material, comprising pressure-bonding a layer and an In layer, and then removing Japanese paper by an acid treatment.