JP2610846B2 - How to attach or remove electronic components to a single wiring board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for attaching or detaching an electronic component to or from a single wiring board in a wiring board or the like of an electronic device.

BACKGROUND ART A typical prior art is shown in FIG. A notch 4 is formed in the wiring board 3 on which the wiring patterns 1 and 2 are formed on the back surface. In the notch 4, a thick-film linear integrated circuit 5 in which a power amplifier circuit and the like are built is arranged. The thick film linear integrated circuit 5 is fixed to a casing 6 or a mounting base 7 formed on a heat radiating plate or the like by screws 8 in order to improve heat radiation efficiency. Terminal 9 of thick film linear integrated circuit 5
Are electrically connected to lands 10 formed on the surface of the wiring board 3 by soldering.

In forming the notch 4 for accommodating the thick-film linear integrated circuit 5 in this manner, the wiring patterns 1a and 2a formed on the edge of the wiring board 3 largely detour around the notch 4. And a wiring pattern formed on the edge of the wiring board 3.
Connected to 1b and 2b. Therefore, the routing of the wiring patterns 1 and 2 becomes complicated and the circuit design is restricted, and when the number of conductors of the wiring patterns 1 and 2 increases, the wiring area increases and the wiring board 3 becomes large. There is a problem. In order to solve this problem, a method of connecting a plurality of so-called jumper wires between the wiring patterns 1a and 2a and the wiring patterns 1b and 2b is considered. It is necessary to provide a jumper wire with a long margin to allow easy installation or removal of the wire. For this reason, circuit characteristics deteriorate in a high frequency band.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of attaching or detaching an electronic component to or from a single wiring board so that the electronic component can be easily attached or detached.

Means for Solving the Problems The present invention is directed to a single unit having an electronic component fixed to a bottom surface of a casing having a heat radiation effect, and a notch on a peripheral edge for arranging the electronic component stored in the casing. In the method of attaching or detaching in the notch of one wiring board, one end of a lead wire disposed on a surface of the single wiring board facing the opposite side to the bottom surface of the casing, One side in the direction along the periphery of the single wiring board is fixedly connected, and the other end of the lead wire has the other end in the notch of the single wiring board in the direction along the periphery of the single wiring board. Side is removed from the connector previously fixed and connected to the side, mounting or removing the electronic components in the notch in a state where the lead wire is raised from the single wiring board, Lead The other end is attached or detached method of the electronic component to a single wiring substrate, characterized by removably connected to the connector.

According to the present invention, the electronic component is fixed to the bottom surface of the casing so as to have a heat radiation effect, the electronic component is arranged in a notch formed on the periphery of the single wiring board, and the lead wire is
One end of the lead wire is disposed on the surface of the single wiring board facing the opposite side to the bottom surface of the casing, and one end of the lead wire in the direction along the periphery of the single wiring board in the notch is formed on the single wiring board. It is fixed and connected to the wiring board, and when mounting or removing electronic components on the bottom of the casing,
The other end of the lead wire is detached from a connector previously fixed and connected to the other side of the cutout of the wiring board along the periphery of the single wiring board, and in this state, Is mounted or removed from the single wiring board. Accordingly, the other end of the lead wire is detachably connected to the connector, so that attachment or detachment of the electronic component can be easily performed, and workability is remarkably improved. Further, since it is not necessary to route a wiring pattern on a single wiring board around electronic components, the size of the wiring board can be reduced.

Embodiment FIG. 1 is an exploded perspective view of an embodiment of the present invention, which is used as a vehicle-mounted radio. Various electronic components 16, 17, 18, etc. are mounted on a single wiring board 15, and these are mounted on the wiring board 15.
Pattern 1 formed on the back surface of FIG.
Selectively connected by 9, 20, etc. A notch 22 for accommodating the thick-film linear integrated circuit 21 is also formed on the periphery of the wiring board 15.

The thick-film linear integrated circuit 21 amplifies the power of a transmission signal having a frequency of 150 to 200 MHz or an audio signal in an audible frequency band to be acousticized by a speaker. The thick film linear integrated circuit 21 has a plurality of terminals 24 formed on the wiring board 15 so as to protrude from one end surface of the main body 23, and is provided with lands 25 and solders individually corresponding to these terminals 24. The screws 30 and 31 are inserted into the mounting holes 28 and 29 formed in the pair of mounting pieces 26 and 27 on which the main body 24 is placed, and the mounting is formed integrally with the casing 32. Attached to the table 33.

The casing 32 is made of, for example, aluminum die cast, and has a bottom surface 34 on which a projection 35 for supporting the wiring board 15 is provided in addition to the mounting base 33. The wiring board 15 is placed on the protrusion 35, and a screw 37 is inserted through an insertion hole 36 formed in the wiring board 15 and screwed into a mounting hole 38 formed in the protrusion 35.

On the back surface of the wiring board 15, wiring patterns 41, 42; 43, 44 are formed along the periphery of the wiring board 15. The wiring pattern 41 and the wiring pattern 43 are patterns to be connected to each other, and both are cut off on both sides of the notch 22. Similarly, the wiring pattern 42 and the wiring pattern 44 are patterns to be connected to each other, and both are cut off on both sides of the notch 22. In order to connect the wiring patterns 41, 42; 43, 44 thus cut, jumper wires 45, which are lead wires, are used.

The jumper wire 45 is flexible and has a circular cross section perpendicular to the axis as shown in the cross-sectional shape in FIG. 2, and the core wire 46 formed uniformly in the longitudinal direction is made of synthetic resin or the like. Coating 47,4
As shown in FIG. 3, a substrate 49 made of synthetic resin or the like formed on a long plate has a rectangular cross section perpendicular to the axis, and the cross section in the longitudinal direction. A uniformly formed core wire 50 is placed and covered with synthetic resin, etc.
51 may be applied.

The coating 47, 48 is removed from one end of the jumper wire 45, and the tip 46a of the core wire 46 is exposed. Exposed core 46
In the wiring patterns 43, 44, the leading end 46a is formed with an insertion hole 5 formed in lands 52, 53 formed at the end on the notch 22 side.
4, 55 are inserted, soldered to lands 52, 53, and electrically connected to wiring patterns 43, 44 individually.

Terminals 62 of a connector 61 are inserted into insertion holes 58, 59 in lands 56, 57 formed at the ends of the notches 22 of the wiring patterns 41, 42.
Is inserted and soldered. The other end of jumper wire 45
In 62, the coatings 47 and 48 are removed, and the end 46b of the core wire 46 is exposed. The exposed end 46b of the core wire 46 is processed by solder or the like to have rigidity, is formed in the main body 62 of the connector 61, is opened upward, and is connected to the connection hole 64 which is individually electrically connected to the terminal 63. Inserted individually. In this manner, the tip 46a of the core wire 46 and the wiring patterns 41 and 42 are individually connected, and accordingly, the wiring patterns 41 and 42 and the wiring patterns 43 and 44 are individually connected. The notch 22 is formed on the periphery of the wiring board 15, and the insertion holes 54 and 55 are formed on one side (the right side in FIG. 1) of the notch 22 in the direction along the periphery of the wiring board 15. The tip 46a of the jumper wire 45
Is disposed on the surface of the wiring board 15 facing the side opposite to the bottom surface of the casing 32. The insertion holes 58 and 59 are formed on the other side (the left side in FIG. 1) of the notch 22 in the direction along the peripheral edge of the wiring board 15, and a connector 61 is provided here.

Subsequently, an assembling order of the wiring board 15 will be described. The wiring board 15 has a notch 22, an insertion hole 36, and insertion holes 54, 55, 58, 59.
After the wiring patterns 19, 20, 41, 42, 43, 44 and the lands 25 are printed, the electronic components 16 to 18 are mounted and electrically connected by soldering or the like.

Next, the connector 61 is mounted, the terminal 63 and the lands 56 and 57 are soldered, and the tip 46a of the core wire 46 of the jumper wire 45 and the lands 52 and 53 are soldered.

The wiring board 15 thus formed is placed on a projection 35 formed on the bottom surface 34 of the casing 32 and fixed by screws 37.

When the fixing of the wiring board 15 is completed, as shown in FIG. 4, the thick film linear integrated circuit 21 is fixed to the mounting base 33 of the casing 32 by screws 30 and 31 with the jumper wire 45 raised.
, And the terminals 24 are soldered to lands 25 formed on the surface of the wiring board 15.

Subsequently, the jumper wire 45 that has been raised is bent, and the distal end 46b of the core wire 46 of the jumper wire 45 is inserted into the connection hole 64 of the connector 61.
As will be described later, it is detached and detachably fitted to complete the assembly.

When removing the thick film linear integrated circuit 21, remove the tip 46 b of the core wire 46 of the jumper wire 45 from the connection hole 64 of the connector 61 and remove the solder on the land 25 to remove the thick film linear integrated circuit 21.
Release the soldering between the terminal 24 of 21 and the land 25, and screw 30,3
Loosen 1 and remove thick film linear integrated circuit 21 from mounting base 33 of casing 32. When replacing the thick-film linear integrated circuit 21, the thick-film linear integrated circuit 21 is detached in this manner, and then another thick-film linear integrated circuit 21 is attached by the above-described method. Then, the tip 46b of the core wire 46 of the jumper wire 45 is fitted into the connection hole 64 of the connector 61, and the replacement is completed.

By making the tip 46b of the core wire 46 of the jumper wire 45 detachable from the connection hole 64 of the connector 61 in this manner, the attachment or detachment of the thick film linear integrated circuit 21 can be performed with good workability. .

The mounting base 33 in the notch 22 is provided with a so-called power transistor 71 as shown in FIG. 6, an integrated circuit for power amplification 73 as shown in FIG. It can be widely implemented for components mounted on 33.

Since the end of the jumper line 45 is detachably configured from the wiring board 15 via the connector 61 in this manner, the thick film linear integrated circuit 21, the power transistor 71, and the power amplification integrated circuit covered by the jumper line 45 are provided. The attachment or detachment of the circuit 73, the integrated circuit, and the like can be easily performed. Therefore, the workability of maintenance management such as replacement and repair of these electronic components is remarkably improved, and the order of assembly can be made relatively free. In addition, it is not necessary to route the wiring pattern around these electronic components, so that the area of the wiring pattern can be reduced and downsized, and the degree of freedom in circuit design can be improved. Furthermore, the length of the jumper wire 45 can be minimized, and the deterioration of the frequency characteristic as described in relation to the related art can be minimized.

The attachment or detachment method of the present invention may be used only when attaching or detaching an electronic component.

Effect As described above, according to the present invention, one end of the lead wire is fixedly connected to the wiring board, and the other end of the lead wire is connected to the connector fixed and connected to the wiring board in advance. The detachable connection makes it easy to install or remove electronic components, greatly improving the workability of maintenance management such as replacement and repair of electronic components, and the order of assembly. Can be relatively free. In addition, there is no need to route the wiring around the electronic component, and the wiring board can be downsized.
The degree of freedom in circuit design can be improved. In this way, according to the present invention, the electronic component is fixed to the bottom surface of the casing to achieve a heat radiation effect, a notch is formed in the periphery of a single wiring board, and the electronic component is arranged in the notch. When mounting or removing the electronic component on the side opposite to the bottom surface of the casing with respect to the single layout board, fix one end of the lead wire on one side in the direction along the periphery of the single wiring board in the notch And the other end of the lead wire is detached from a connector previously fixed and connected to the other side of the notch in the direction along the periphery of the single wiring board, and the lead wire is removed. , The workability is improved, and the assembling order can be made relatively free as described above. Further, there is no need to form a bypass wiring, and the size is reduced. Is possible,
The degree of freedom in circuit design is improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of the present invention, FIG. 2 is a sectional view of a jumper wire 45, FIG. 3 is a sectional view of a jumper wire 45, and FIG. FIG. 5 is a perspective view showing a raised state, and FIG.
FIG. 6 is a perspective view showing a state in which a power transistor 71 is mounted on a mount 33, and FIG. 7 is a perspective view showing a state in which a power amplification integrated circuit 73 is mounted on the mount 33. FIG. 8 is a perspective view of the prior art. 15,75: Wiring board, 16-18: Electronic components, 19, 20, 41-4
4,77,78,83-86 ... wiring pattern, 21 ... thick film linear integrated circuit, 22 ... notch, 25 ... land, 32 ... casing, 33 ... mounting stand, 45 ... jumper wire , 61 ... connector, 71 ... power transistor, 73 ... power amplification integrated circuit

Claims (1)

(57) [Claims] An electronic component fixed to a bottom surface of a casing having a heat radiation effect, and a notch for disposing the electronic component housed in the casing on a peripheral edge of the single wiring board. In the method of attaching or detaching the inside of the single wiring board, one end of a lead wire arranged on a surface facing the opposite side to the bottom surface of the casing in the single wiring board, at a periphery of the single wiring board in a notch On one side in the direction along the line, it is fixedly connected, and the other end of the lead wire is fixed in advance on the other side in the notch of the single wiring board along the periphery of the single wiring board. Attach or remove the electronic component in the notch in a state where the lead wire is raised from the single wiring board, which has been removed from the connected connector, and then the other end of the lead wire is removed. To the connector Installing or removing method of the electronic component to a single wiring substrate, characterized by detachably connected.