JP2608408B2 - Positive photosensitive resin composition - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a positive photosensitive resin composition useful for preparing a photoresist material having excellent sensitivity and resolution, a method for producing the same, and an electrodeposition solution containing the resin composition. .

2. Description of the Related Art Various kinds of so-called positive-type photosensitive substances which become soluble in a developer when irradiated with actinic radiation, such as polyoxymethylene polymer, 0-nitrocarbinol ester, O
-Nitrophenyl acetal, their polyesters,
Benzoquinone and naphthoquinonediazide sulfonic acid esters are known, among which phenolic novolak resins in which quinonediazide or naphthoquinonediazide compounds are incorporated have a higher luminous resolution than negative-type photosensitive compositions. Is widely used for forming an etching protection film in a manufacturing process of a printed wiring board, an integrated circuit board, and a printing plate. However, the conventional novolak-based positive photosensitive resin composition has a serious problem that, when a photoresist material is obtained, adhesion to a substrate is poor and damage to an image is inevitable.

Recently, a method of forming a positive photosensitive corrosion-resistant film by electrodeposition by introducing a salt-forming group into such a novolak resin-based positive photosensitive resin has been proposed (Japanese Patent Application Laid-Open No. 60-207139). I am collecting. That is, in the invention of Japanese Patent Application Laid-Open No. 60-207139, a phenolic novolak resin skeleton in which a quinonediazide group and a water-solubilizing group are carried on phenol is used as an aqueous solution of a salt and electrodeposited on a substrate. Japanese Patent Application Laid-Open No. 61-218616 also discloses a technique for electrodeposition coating a modified phenol resin product having an acid group and a quinonediazide group. According to such a technique, it is possible to improve the adhesion to the base material, and to form a uniform coating film on a portion difficult to be applied by ordinary coating, such as a circuit board having through holes, and to form a thin film. Is very useful because it is easy to form, but when thinned by electrodeposition coating,
The generation of pinholes due to the gas generated by the electrode reaction is inevitable, and the phenolic novolak resin is used as the skeletal resin. Problems such as disconnection of the circuit occur, so that the method cannot be applied to the formation of a fine line which has recently been particularly emphasized. It has also been pointed out that the photosensitive function deteriorates during storage of the electrodeposition liquid, and that the stability is not good.

Problems to be Solved by the Invention Therefore, the photosensitive group stability in the case of an aqueous dispersion is excellent, and it can be applied to various substrates by an electrodeposition method, and has high sensitivity, excellent alkali developability, and high resolution. Positive photosensitive resin compositions that can form images, have no defects such as circuit breaks due to pinholes even when thinned, and can provide a photoresist particularly useful for forming fine lines are expected. Accordingly, it is a main object of the present invention to provide such a resin composition and a method for producing the same.

According to the present invention, the object is to provide a salt-forming group, (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). Number average molecular weight having at least one side chain
This can be achieved by a positive photosensitive resin composition comprising 700 to 4000 polyester resin or polybutadiene resin.

Polyester resins and polybutadiene resins having a number average molecular weight in the range of 700 to 4000 are particularly excellent in heat flow properties and can form a much more flexible flexible film than phenolic novolak resins. Further, even if a pinhole is generated due to good heat flow property, it can be easily repaired, and sensitivity and resolution can be improved by thinning. The first feature of the present invention resides in that a salt-forming group and a photosensitive group are incorporated in the resin skeleton having good heat flow properties.

Further, in the conventional novolak resin-based positive photosensitive resin, a quinonediazide group and a salt-forming group are supported on the phenol of the skeleton resin, but in the resin of the present invention, the salt formation supported on the main chain of the resin is formed. The second feature is that the group and the quinonediazide group supported on the side chain phenol are unevenly distributed, and the quinonediazide group is supported on the phenol at the terminal of the side chain or the terminal of the main chain.

The uneven distribution of the salt-forming group and the quinonediazide group is combined with the first feature described above. When the electrodeposition solution is prepared, the resin molecule of the present invention has the hydrophobic quinonediazide part in the medium and the hydrophilic quinonediazide part in the medium. In which the salt-forming group is located on the outside to prevent degradation of the photosensitive function due to decomposition or coupling of quinonediazide with base / water. The fact that the quinonediazide group is located on the phenol at the side chain terminal or the main chain terminal means that the resin itself is easy to produce because there is no steric hindrance, the light absorption sensitivity at the time of exposure is good, and the alkali developability is also high. As a result, a high-resolution image with high contrast can be formed.

As the salt-forming group, any group used for electrodeposition, such as a carboxyl group, a sulfonic acid group, a phosphonic acid group, an amino group, and a substituted amino group, can be used. When producing polyester from alcohol, a compound having a nitrogen atom and a hydroxyl group, such as ethanolamine, diethanolamine, triethanolamine, and hydroxyethylethyleneimine, or a polybasic acid having a sulfonic acid group, or a sultone, such as propane sultone, is used. For the alcoholic hydroxyl group of the polyhydric alcohol, the carboxyl group is easily introduced by using a polybasic acid so as to be in excess, and in the case of a polybutadiene resin, it is epoxidized and a polybasic acid or Reacting primary or secondary amines or using double bonds It can be easily incorporated into the resin such as by maleinized by.

formula The photosensitive group represented by the formula is a polyester resin or an epoxidized polybutadiene resin into which the above-mentioned salt-forming group is incorporated. (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). Carboxylic acid, or (Wherein A is an alkylene group having or not having a substituent,
-COCH ₂ -, - represents a CH ₂ NH- or -CH = CH- group; R ₃ and R ₄
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, or a phenyl group; n is 0 or 1), and is reacted with a carboxylic acid having a phenolic hydroxyl group; It is easily introduced by reacting a sulfonic acid of 2-quinonediazides or a halide or ester thereof. However, since the quinonediazide group is decomposed at a high temperature, it is preferable to select as low a temperature condition as possible in the production of the resin, and it is desirable to avoid, for example, heating at 100 ° C. or more for a long time.

Introduction of a quinonediazide group to a phenolic hydroxyl group can be easily carried out by reacting quinonediazidesulfonic acid, its halide, anhydride, or a reactive derivative such as an ester.However, particularly when a halogen compound is used, the reaction is carried out at a low temperature. It is possible and preferable because there is no heat-induced deterioration of quinonediazide.

More specifically, in the case of a polyester resin or an alkyd resin, when a resin is produced from a polybasic acid (including a fatty acid) and a polyhydric alcohol (including a triglyceride of a fatty acid), (Wherein A, n, R ₃ , and R ₄ are as described above), and a phenolic hydroxyl group-containing polyester or alkyd is synthesized using a phenolic hydroxyl group-containing carboxylic acid. Or a polybasic acid having a sulfonic acid group or an excess of the polybasic acid to introduce a salt-forming group, and then use a quinonediazidesulfonic acid or a reactive derivative thereof to convert the quinonediazide group. After introducing or preparing a resin from an excess of a polyhydric alcohol and a polybasic acid, a carboxylic acid having a phenolic hydroxyl group represented by the above formula and a carboxylic acid for introducing a salt-forming group are reacted. A quinonediazide group of a phenolic hydroxyl group may be introduced in the same manner as described above. However, the expression (Wherein A, n, R ₁ and R ₂ are as described above) is directly reacted with the polyester or alkyd resin, since thermal deterioration of quinonediazide is easily caused, and thus it is not preferred.

On the other hand, in the case of the epoxidized polybutadiene resin, the reaction between the epoxy group and the carboxyl group easily proceeds at a relatively low temperature, Even if a quinonediazide group is introduced later using the compound of
Or the expression May be reacted.

A salt-forming group according to the present invention, The number average molecular weight of the resin having at least one photosensitive group represented by formula (1) must be in the range of 700 to 4,000. This means that if the number average molecular weight is less than 700, an image with good contrast cannot be obtained, and if it exceeds 4,000, the heat flow property is poor and the pinhole resistance is poor, and the alkali solubility is insufficient, and the developability is poor. Because it becomes.

The amount of the quinonediazide group may be the usual content of this kind of photosensitive resin.
2.5 × 10 ^{-4 to} 2 × 10 ^-3 equivalent / g, preferably 4 × 10 ^-4 to 2
A sufficient function as a photosensitive material is exhibited within the range of × 10 ⁻³ eq / g, and a high-contrast image is obtained.

Although the resin composition of the present invention can be used as a coating type paint, it has an aqueous liquid together with a compound having a counter ion group because it has a salt-forming group, and can be applied to a substrate by electrodeposition. Able to provide a photoresist film with high adhesion and particularly high sensitivity and high resolution, combined with good pinhole resistance, to obtain a photoresist material that is free of printed wiring circuit defects and ideal for forming fine wires. be able to. In addition, the resin itself is softer than conventional phenolic novolak resins, and since the salt-forming groups and functional groups are unevenly distributed, these groups are oriented to each other in the electrodeposition solution, and have excellent dispersion stability. Can be provided. Also, if desired
It can be used by mixing with other resins or photosensitizers.

 Hereinafter, the present invention will be described with reference to examples.

Resin Production Example 1 Adipic acid 13 was placed in a separable flask equipped with a thermometer, a condenser, a nitrogen inlet tube, and a stirring blade decanter.
1.4 times, 172.8 parts of trimellitic anhydride, 124.2 parts of 4-hydroxybenzoic acid, 187.2 parts of neopentyl glycol, 18.5 parts of xylene, 0.18 parts of dibutyltin oxide, and added at 180 ° C.
Then, the internal temperature was raised to 210 ° C. over 2 hours, and the reaction was continued until the acid value of the carboxylic acid reached 168. After the temperature was lowered to 130 ° C., 225 parts of glycidyl ester of versatic acid was added and reacted at 160 ° C. to stop the reaction at an acid value of carboxylic acid of 63. After cooling, 180 parts of dioxane was added and stirred well.

400 parts of this polyester resin varnish is placed in a 3-liter separable flask equipped with a thermometer, a condenser, and a stirring blade, and 96 parts of 1,2-naphthoquinonediazide-5-sulfonyl chloride and 1790 parts of acetone are added and dissolved well at room temperature. did. To this, 42.7 parts of triethylamine was added dropwise over 1 hour, and the reaction was maintained for another 2 hours to complete the reaction. After removing insoluble matter by filtration, the filtrate was dropped over about 1 hour to a place where about 20 times the amount of water was stirred, and the water was removed by drying, whereby a brownish resin was recovered. Its number average molecular weight was 1100, and quinonediazide equivalent by fluorescent X-ray was 8.9 × 10 ⁻⁴ equivalent / g.

Resin Production Example 2 Using the same apparatus as in Resin Production Example 1, phthalic anhydride 118.4
Parts, soybean fatty acid 224 parts, salicylic acid 110.4 parts, 1,6-hexanediol 94.4 parts, triethanolamine 119.2 parts,
19.3 parts of xylene and 0.12 parts of dibutyltin oxide were added, and 17
After heating to 0 ° C, raise the internal temperature to 210 ° C over 2 hours,
The reaction was continued until the acid value of the carboxylic acid became 2 or less.
After cooling, 140 parts of dioxane was added and stirred well.

400 parts of this alkyd resin varnish was placed in a separable flask equipped with a thermometer, a condenser, and a stirring blade.
Further, 96 parts of 1,2-naphthoquinonediazide-5-sulfonyl chloride and 1790 parts of acetone were added and dissolved well at room temperature. To this, 42.7 parts of triethylamine was added dropwise over 1 hour, and the reaction was maintained for another 2 hours to complete the reaction. After removing the insoluble matter by filtration, the filtrate was added dropwise over about 1 hour to a place where about 20 times the amount of water was stirred, and the water was removed by drying. As a result, a black-brown resin was recovered. This had a number average molecular weight of 1020 and a quinonediazide equivalent by fluorescent X-ray of 9.7 × 10 ⁻⁴ equivalent / g.

Resin Production Example 3 Using the same apparatus as in Resin Production Example 1, Idemitsu Polybutadiene
300 parts of R-45 ERI (epoxidized polybutadiene manufactured by Idemitsu Petrochemical Co., Ltd.), 207 parts of salicylic acid, 140 parts of ethylene glycol monomethyl ether acetate, and 5.1 parts of tetramethylammonium chloride were added and reacted at 100 ° C. After the epoxy equivalent reached 15,000 with a varnish, the reaction was stopped once, 47.8 parts of trimellitic anhydride was added, and the reaction was carried out at 145 ° C. The reaction was stopped when the varnish acid value reached 42.5.

300 parts of this polybutadiene varnish was placed in a 3 separable flask equipped with a thermometer, a condenser, and a stirring blade, and 139 parts of 1,2-benzoquinonediazide-4-sulfonyl chloride and 1880 parts of acetone were added and dissolved well at room temperature. . To this, 76.3 parts of triethylamine was added dropwise over 1 hour, and the reaction was completed after further keeping for 2 hours. After removing insolubles by filtration, the filtrate was dropped over about 1 hour to a place where about 20 times the amount of water was stirred, and water was removed by drying. As a result, a blackish-brown resin was recovered. This had a number average molecular weight of 3,500 and a quinonediazide equivalent by fluorescent X-ray of 1.58 × 10 ⁻³ equivalent / g.

Example 1 After 30 parts of the photosensitive polyester resin synthesized in Resin Production Example 1 was dissolved in a mixed solvent of 37 parts of ethylene glycol monoethyl ether and 20 parts of methyl ethyl ketone, the photosensitive resin was applied on a silicon oxide film wafer using a spinner. After applying the solution, it was dried in an oven at 80 ° C for 10 minutes,
A μm coating was obtained. A line and space pattern is adhered to this photosensitive layer, and irradiated with ultraviolet light having a light intensity of 3.5 mW / cm ² at 365 nm for 30 seconds, and irradiated with a 1% aqueous sodium metasilicate solution for 30 seconds.
When developed at 30 ° C. for 30 seconds, it was resolved to a line and space of 1.0 μm by observation with an electron microscope, and no pinhole, peeling or cracking of the resist was observed.

Example 2 After dissolving 60 parts of the photosensitive polyester resin synthesized in Resin Production Example 1 in 40 parts of methyl ethyl ketone, 3.2 parts of triethylamine and 497 parts of deionized water were added with stirring, and an aqueous dispersion of the photosensitive polyester resin was added. Obtained.

Next, electroless copper plating and electrolytic copper plating were performed on an insulating plate having a through hole of 0.6 mm in the aqueous dispersion. Immerse a double-sided circuit board for printed wiring boards with a copper film thickness of 35 μm, connect the positive electrode to the circuit board, connect the negative electrode to the metal container containing the aqueous dispersion, apply a DC voltage of 80 V for 2 minutes, and then apply the circuit. The substrate is washed with water and dried in an oven at 100 ° C. for 5 minutes.
A positive photosensitive resin film having a thickness of μm was formed. This resin film had no pinholes, had a uniform thickness, and was completely covered in the through holes.

Next, a positive-type photo tool mask having a circuit pattern is brought into close contact with the above-mentioned film, and the light intensity of 365 nm is 3.5 mW.
/ cm ² for 1 minute on each side and developed with 1% sodium metasilicate aqueous solution at 35 ° C for 1 minute. The line width faithful to the pattern was reproduced.
No crack was observed.

Next, the exposed copper is etched with a ferric chloride solution, and after washing with water, the resin film on the circuit pattern is removed with a 3% aqueous sodium hydroxide solution at 50 ° C. to obtain a defect having a desired minimum conductor width (circuit width) of 30 μm. No circuit pattern was obtained. At this time, the copper in the through-hole which was not irradiated with the ultraviolet rays was completely left without being etched, and the conduction on both surfaces was secured, indicating that the resin coating was complete.

The surface and cross section of each step were observed with an electron microscope, and no defects were found in any of the steps. Also, this aqueous dispersion was
After storage for months, the changes in pH and conductivity were slight.
No abnormalities were observed by electrodeposition.

Example 3 After dissolving 60 parts of the photosensitive alkyd resin synthesized in Resin Production Example 2 in 40 parts of ethylene glycol monobutyl ether, 2.6 parts of acetic acid and 697 parts of deionized water were added with stirring.
An aqueous dispersion of a photosensitive alkyd resin was obtained.

Next, electroless copper plating and electrolytic copper plating were performed on an insulating plate having a through hole of 0.6 mm in the aqueous dispersion. Immerse a double-sided circuit board for a printed wiring board with a copper film thickness of 35 μm, connect the negative electrode to the circuit board, connect the positive electrode to a metal container containing an aqueous dispersion, apply a DC voltage of 80 V for 2 minutes, and then apply the circuit The substrate is washed with water, dried in an oven at 100 ° C. for 5 minutes, and
m of a positive photosensitive resin film was formed. This resin film had no pinholes, had a uniform thickness, and was completely covered in the through holes.

Next, a positive type photo-retool mask having a circuit pattern is brought into close contact with the film, and the light intensity at 365 nm is 3.5 mW.
UV rays of 1 cm / cm ² on both sides for 1 minute each and developed with 1.5% aqueous sodium carbonate solution at 40 ° C for 1 minute, the line width faithful to the pattern was reproduced, and no pinhole, resist peeling or cracking was observed. .

Next, the exposed copper is etched with an ammonia-based alkaline etchant, washed with water, and the resin coating on the circuit pattern is removed with a 3% hydrochloric acid aqueous solution at 50 ° C. to obtain a defect having a desired minimum conductor width (circuit width) of 30 μm. No circuit pattern was obtained. At this time, the copper in the through-hole which was not irradiated with the ultraviolet rays was completely left without being etched, and the conduction of both surfaces was secured, indicating that the resin coating was completely completed.

The surface and cross section of each step were observed with an electron microscope, and no defects were found in any of the steps. Also, this aqueous dispersion was
After storage for months, changes in pH and conductivity were slight, and no abnormalities were observed by electrodeposition.

Example 4 After dissolving 60 parts of the photosensitive polybutadiene synthesized in Resin Production Example 3 in 20 parts of methyl ethyl ketone and 20 parts of ethylene glycol monobutyl ether, 4.2 parts of triethylamine and 896 parts of deionized water were added with stirring. An aqueous dispersion of polybutadiene was obtained.

Next, electroless copper plating and electrolytic copper plating were performed on an insulating plate having a through hole of 0.6 mm in the aqueous dispersion. A double-sided circuit board for a printed wiring board with a copper film thickness of 35 μm is immersed, the positive electrode is connected to the circuit board, the negative electrode is connected to a metal container containing an aqueous dispersion, and a DC voltage of 80 V is applied for 3 minutes. The substrate is washed with water and dried in an oven at 100 ° C. for 5 minutes.
A positive photosensitive resin film having a thickness of μm was formed. This resin film had no pinholes, had a uniform thickness, and was completely covered in the through holes.

Next, a positive-type photo tool mask having a circuit pattern is brought into close contact with the above-mentioned film, and the light intensity of 365 nm is 3.5 mW.
/ cm ² for 1 minute on each side and developed with 1.5% sodium metasilicate aqueous solution at 40 ° C for 1 minute, the line width faithful to the pattern was reproduced, and no pinhole, resist peeling or cracking was observed Was.

Next, the exposed copper is etched with a ferric chloride solution, and after washing with water, the resin coating on the circuit pattern is removed with a 3% aqueous sodium hydroxide solution at 50 ° C. to obtain a target minimum conductor width (circuit width) of 30 μm. A defect-free circuit pattern was obtained.
At this time, the copper in the through-hole which was not irradiated with the ultraviolet rays was completely left without being etched, and the conduction on both surfaces was secured, indicating that the resin coating was complete.

The surface and cross section of each step were observed with an electron microscope, and no defects were found in any of the steps. Also, this aqueous dispersion was
After storage for months, the changes in pH and conductivity were slight.
No abnormalities were observed by electrodeposition.

Comparative Example 1 Phenol, p-tert-butylphenol, hydroquinonesulfonic acid potassium salt and formaldehyde (3
8.8% formalin) in a molar ratio of 0.75: 0.25: 0.1: 0.8
Novolak is produced by heating at 8.
After distilling off all volatiles, a resin having a softening point of 146 ° C. is obtained. The novolak (18 g) was added to acetone (5
0g) and 1,2-naphthoquinone-2-diazide-
Treat with a solution of 5-sulfonyl chloride (6 g) in acetone (20 g). The mixture is adjusted to pH 8 by adding to a 10% aqueous sodium carbonate solution and then stirred at room temperature for 1 hour. Next, the mixture was added dropwise to a 0.2N HCl solution (2.5 g), and the precipitate was separated by filtration, washed with water, and dried at 35 ° C. in a vacuum oven to obtain a photosensitive resin.

This resin (10 g) is dissolved in 2-butoxyethanol (10 g) neutralized with 1N potassium hydroxide solution, and water is added to make up to 100 g. The resin is electrodeposited on a copper clad laminate anode using a stainless steel cathode. 80V
After 60 seconds, an electrodeposited layer having a thickness of 12 μm is formed. 90 ℃
After drying for 5 minutes, a positive type photo tool mask having a circuit pattern is brought into close contact with the resin film, and 365n
m light intensity of 3.5 mW / cm ² was irradiated on both sides for 1 minute, developed with 2% aqueous sodium hydroxide solution at 35 ° C for 1 minute, and the image was observed. The image was thin.

Further, when this aqueous dispersion was stored for 10 days and the characteristic number was measured, the pH was lowered and the conductivity was increased. When this was electrodeposited in the same manner, abnormal adhesion was observed, and there was defective development after exposure.

Continuation of front page (72) Inventor Katsumi Ishikawa 19-17 Ikedanakamachi, Neyagawa City Inside Japan Paint Co., Ltd. (56) References JP-A-61-295549 (JP, A) JP-A-50-117503 (JP A) JP-A-61-218616 (JP, A) JP-A-60-207139 (JP, A)

Claims (3)

(57) [Claims] 1. A salt-forming group comprising: (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). Number average molecular weight having at least one side chain
A positive photosensitive resin composition comprising a 700 to 4000 polyester resin or a polybutadiene resin. 2. A polyester resin having a salt-forming group or an epoxidized polybutadiene resin having the formula (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). React with the carboxylic acid (Wherein A is an alkylene group having or not having a substituent,
-COCH ₂ -, - represents a CH ₂ NH- or -CH = CH- group; R ₃ and R ₄
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, or a phenyl group; n is 0 or 1), and is reacted with a carboxylic acid having a phenolic hydroxyl group; A salt-forming group characterized by reacting a sulfonic acid of 2-quinonediazides or a halide or ester thereof; (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). Number average molecular weight having at least one side chain
A method for producing a positive photosensitive resin composition comprising 700 to 4000 polyester resins or polybutadiene resins. 3. A salt-forming group, having the formula: (Wherein A is an alkylene group having or not having a substituent,
—COCH ₂ —, —CH ₂ NH— or —CH ＝ CH— groups; R ₁ and R ₂
Each represents H, HO, an alkyl group, a lower alkoxy, a lower alkylthio, a substituted amino, a halogen, a phenyl or an —OSO ₂ B group; n is 0 or 1; and B represents a benzoquinone or naphthoquinonediazide group). Number average molecular weight having at least one side chain
A positive-type photosensitive resin composition comprising 700 to 4000 polyester resin or polybutadiene resin, and an aqueous solution containing a compound capable of forming a counter ion with the salt-forming group in an amount sufficient to neutralize the salt-forming group of the resin. Positive photosensitive resin electrodeposition liquid composed of liquid.