JP2607641Y2 - Non-reciprocal circuit device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reciprocal circuit device used in the VHF, UHF and SHF bands, for example, a circulator and an isolator. The present invention relates to a structure capable of preventing poor connection from occurring.

[0002]

2. Description of the Related Art Generally, non-reciprocal circuit elements such as circulators and isolators allow signals to pass only in the signal transmission direction.
It has a function of preventing transmission in the reverse direction, and is employed in, for example, a transmission circuit of a mobile communication device such as a mobile phone or a car phone. As an example of such an isolator,
There is a structure shown in FIGS. This isolator 50 is an electrode substrate in which a resin block 52 is disposed in a magnetic metal yoke 51 in which an upper yoke 51a is mounted on a lower yoke 51b, and a plurality of center electrodes (not shown) are formed on the resin block 52 in a pattern. 53, and the substrate 5
A pair of ferrites 54a, 54b
And a permanent magnet 55a, 55b applies a DC magnetic field to both ferrites 54a, 54b.

A ground plate 56 is provided on the electrode substrate 53.
A concave portion 56a for accommodating the ferrite 54a is formed in the center of the ground plate 56. This ground plate 56 is pressed onto the electrode substrate 53 by a permanent magnet 55a attached to the inner surface of the top wall of the upper yoke 51a.

Further, cutouts 56b are formed in the left and right corners of the ground plate 56, and chip resistors R1 and R2 are formed on the electrode substrate 53 in the cutouts 56b.
2 are arranged. One end of the one central electrode and a ground electrode are connected to the resistors R1 and R2.

Conventionally, when assembling the isolator 50, solder is applied to a portion of the upper surface of the electrode substrate 53 where the ground plate 56 and the resistors R1 and R2 come into contact, and the ground plate 56 and the resistors R1 and R2 are applied thereto. The upper yoke 51a is mounted in a state where the R2 is arranged, and the earth plate 56 is pressed and fixed by the permanent magnet 55a of the upper yoke 51a. In this state, a method is used in which each solder is heated and melted to connect them.

[0006]

However, in the above-mentioned conventional non-reciprocal circuit device, the earth plate 56 is provided with a permanent magnet 55.
a, but each chip resistor R
Since R1 and R2 are merely placed on the electrode substrate 53, they are liable to be displaced when the solder is melted, and as a result, a connection failure may occur, and there is a problem that the reliability with respect to quality is low. .

Here, in order to prevent the above displacement,
Although the precision of assembling the chip resistor or the amount of solder applied has been controlled, the use of these techniques has not been enough to improve the displacement.

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a non-reciprocal circuit device capable of reliably preventing a connection failure due to a displacement of a matching circuit component.

[0009]

Means for Solving the Problems The present inventors have studied to prevent the above-mentioned displacement during soldering.
Focusing on the fact that there is a gap between the chip component and the permanent magnet to avoid contact between them and that this gap is dead space, The present invention was conceived to solve the problem of misalignment by pressing and fixing.

In the present invention, therefore, a matching chip component is arranged on a substrate on which a plurality of center electrodes are formed, a ferrite is arranged on an upper surface of the center electrode, and a permanent magnet is brought into contact with the upper surface of the ferrite. In a non-reciprocal circuit device for applying a DC magnetic field, an insulative and flat pressing sheet is disposed between the permanent magnet and the chip component, and the chip is applied via the pressing sheet by the permanent magnet. It is characterized in that components are pressed and fixed on the substrate.

Here, the matching chip component includes a chip resistor as a component of the above-described isolator, or a chip capacitor constituting an isolator and a circulator.

[0012]

According to the non-reciprocal circuit device of the present invention, an insulating and flat pressing sheet is disposed between the permanent magnet and the chip component, and the matching chip component is mounted on the substrate via the pressing sheet. Since it is pressed and fixed on the upper side, it is possible to surely prevent the displacement when the solder is melted. As a result, it is possible to eliminate the necessity of assembling a chip component or managing the amount of applied solder, and improve the reliability of quality due to poor connection.

Further, in the present invention, since the structure utilizing the dead space between the chip component and the permanent magnet is employed, the dimension in the thickness direction is not increased by disposing the pressing sheet. Can be avoided.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to 3 are views for explaining an isolator according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of the isolator, FIG. 2 is an exploded perspective view showing an arrangement state of a pressing sheet, and FIG. It is an exploded perspective view of the isolator.

In FIG. 1, reference numeral 1 denotes an isolator to which the structure of the present embodiment is applied. The isolator has a resin block 4 disposed on the upper surface of a lower yoke 2 made of a magnetic metal with a permanent magnet 3 interposed therebetween. The upper yoke 5 has a schematic structure in which an upper yoke 5 made of a magnetic metal is mounted on the upper yoke 4 and a permanent magnet 7 is attached to the inner surface of the top wall of the upper yoke 5 with a spacer 6 interposed therebetween.

At the center of the upper surface of the resin block 4, a first
The recess 4a in which the ferrite 8a is arranged is
a, three chip capacitors C1, C2, C
Each of the recesses 4b in which 3 is disposed is formed. Terminals 4c for input / output and ground are formed on each side wall of the resin block 4, and the chip capacitors C1 and C3 are connected to the input / output terminals 4c.

An electrode substrate 10 on which three center electrodes 12 are formed in a pattern is disposed above the resin block 4. The center electrode 12 on the electrode substrate 10 has the A second ferrite 8b opposed to one ferrite 8a is provided. Thus, the center electrodes 12 are inductively coupled by the ferrites 8a and 8b, and a DC magnetic field is applied by the permanent magnets 3 and 7.

In the electrode substrate 10, a part of each of the center electrodes 12 is formed on the upper surface of the insulating substrate 13, and the remaining portion of the center electrode 12 is formed on the lower surface of the substrate 13 so as to be symmetric with respect to a point. The ends are connected by through-hole electrodes, whereby the center electrodes 12 intersect with each other in an electrically non-contact state every 120 degrees.

A ground electrode 15 is formed on the periphery of the upper surface of the insulating substrate 13, and the outer end of each center electrode 12 on the upper surface is connected to the ground electrode 15. Further, three port electrodes (not shown) are formed on the periphery of the lower surface of the insulating substrate 13, and the outer ends of the center electrodes 12 on the lower surface are connected to the respective port electrodes. The chip capacitors C1, C2, and C3 are connected to the respective port electrodes.

A ground plate 11 is provided on the electrode substrate 10. A recess 11 is provided at the center of the ground plate 11.
The second ferrite 8b is housed in the recess 11a. The ground plate 11 is pressed by the permanent magnet 7 located above the ground plate 11, and the peripheral edge of the ground plate 11 is in contact with the upper surface of the substrate 10. Notches 11b are formed in the left and right corners of the ground plate 11, and a part of the ground electrode 15 of the electrode substrate 10 is exposed by the notches 11b.

The chip resistors R1, R2 are provided in the left and right cutouts 11b of the ground plate 11 on the upper surface of the electrode substrate 10, respectively.
R2 is disposed. One electrode of each of the resistors R1 and R2 is connected by soldering to the ground electrode 15, and the other electrode is connected by soldering to a connection electrode 16 formed at one edge of the insulating substrate 13. ing. The connection electrode 16 is connected to the one port electrode via a through-hole electrode, whereby the one center electrode 12 is connected to the chip capacitor C2 and the two resistors R1 and R2.

Each resistor R on the electrode substrate 10
A pressing sheet 18, which is a feature of the present embodiment, is disposed between the first magnet 1 and the permanent magnet 7 and the permanent magnet 7. This pressing sheet 1
Reference numeral 8 denotes an insulating flat plate made of, for example, Teflon (registered trademark) or the like, and an escape hole 18a through which the concave portion 11a of the ground plate 11 is inserted is formed at the center of the insulating plate. This pressing sheet 18 is connected to both resistors R through the permanent magnet 7.
1 and R2 are pressed and fixed on the electrode substrate 10, thereby preventing the occurrence of tombstone.

Next, the operation and effect of this embodiment will be described. To assemble the isolator 1 of the present embodiment, first, solder is applied to the ground electrode 15 and the connection electrode 16 on the upper surface of the electrode substrate 10, and solder is applied to the connection portion of each element. The permanent magnet 3 and the lower yoke 2 are arranged below the resin block 4, and the chip capacitors C1 to C3 and the first ferrite 8a are arranged in the upper concave portions 4a and 4b, respectively. Second ferrite 8
b, the chip resistor substrates R1, R2, and the ground plate 11 are sequentially arranged.

Next, the upper yoke 5 to which the permanent magnet 7 is attached
Is disposed on the resin block 4, and the upper yoke 5 is fitted to the lower yoke 2. By this attachment, the permanent magnet 7 of the upper yoke 5 presses the concave portion 11a of the ground plate 11 and also presses the pressing sheet 18, whereby the peripheral portion of the ground plate 11 is positioned and fixed on the ground electrode 15 of the electrode substrate 10. The chip resistors R1 and R2 are positioned and fixed on the electrode substrate 10 via the pressing sheet 18.

The above-mentioned solder is heated and melted in a state where the above-mentioned elements are assembled, whereby the above-mentioned chip resistors R1, R2
And the ground electrode 15 and the connection electrode 16, and each element is connected.

Here, when the above-mentioned solder is melted, there has conventionally been a problem that a connection failure occurs due to a displacement of each of the chip resistors R1 and R2. On the other hand, in the present embodiment, an insulating flat pressing sheet 18 is disposed in the gap between the chip resistors R1 and R2 on the electrode substrate 10 and the permanent magnet 7, and the pressing sheet is used for the above-described chip resistors. Since R1 and R2 are pressed and fixed to the electrode substrate 10, even if the above-mentioned solder is melted, there is no displacement and the poor connection can be reliably prevented.

In this embodiment, since the dead space between the permanent magnet 7 and the chip resistors R1 and R2 is filled by the pressing sheet 18, the height dimension of the isolator 1 does not increase. Larger parts can be avoided.

In the above embodiment, the case where the pressing sheet 18 is formed to have a size to cover the upper surface of the electrode substrate 10 has been described as an example.
It is only necessary to form a pressing sheet large enough to cover the upper surfaces of R1 and R2, and there is no particular limitation.

In the above embodiment, an isolator has been described as an example, but the present invention can of course be applied to a circulator. In the case of this circulator, a chip capacitor is arranged on an electrode substrate, and a pressing sheet is interposed between the chip capacitor and a permanent magnet.

[0030]

As described above, according to the non-reciprocal circuit device according to the present invention, an insulating and flat pressing sheet is disposed between the permanent magnet and the chip component, and the pressing sheet is used for alignment. Since the chip component is pressed and fixed on the substrate, there is an effect that it is possible to reliably prevent the displacement when the solder is melted while avoiding an increase in the size of the component.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an isolator according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing an inserted state of the pressing sheet of the embodiment.

FIG. 3 is an exploded perspective view of the isolator of the embodiment.

FIG. 4 is a cross-sectional view of a conventional isolator.

FIG. 5 is a perspective view of a conventional isolator.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Isolator (non-reciprocal circuit element) 7 Permanent magnet 8b Ferrite 10 Electrode board 12 Center electrode 18 Press sheet R1, R2 Chip resistor (matching chip part)

Continuation of the front page (56) References JP-A-6-252610 (JP, A) JP-A-2-55403 (JP, A) JP-A-2-804 (JP, U) JP-A-3-105008 (JP , U)

Claims (1)

(57) [Scope of request for utility model registration] 1. A matching chip component is arranged on a substrate on which a plurality of center electrodes are formed, a ferrite is arranged on the center electrode, and a permanent magnet is brought into contact with an upper surface of the ferrite to apply a DC magnetic field. In the non-reciprocal circuit device as described above, an insulating material is provided between the permanent magnet and the chip component .
A non-reciprocal circuit device, comprising: a flat sheet- shaped pressing sheet; and the chip component pressed and fixed on the substrate via the pressing sheet by the permanent magnet.