JP2591496B2 - Antenna and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna, and more particularly to a receiving antenna used by being inserted into a waveguide.

[0002]

2. Description of the Related Art In artificial satellites, waveguides are used as signal transmission means. Then, a transmission wave of a specific frequency may be taken out by inserting an antenna for a band pass filter in a waveguide. The band-pass filter antenna is often formed in a cylindrical shape in terms of high-frequency characteristics and silver-plated on its surface.

[0003] The conventional antenna will be described with reference to FIG. FIG. 2A is an external view of a conventional antenna. Referring to FIG. 1, the conventional antenna has a cylindrical metal antenna portion 1 having a hole formed along a central axis, and a connector portion 10 having a lead 2 inserted into the hole and serving as a radio wave converter.

The connector section 10 includes a flange 8 having a screw hole (not shown) and a screw section 9 for connecting to a cable (not shown).

[0005] The antenna section 1 has a solder supply hole 3 through which the solder flows into the inside of the connector section 10 with the lead 2 inserted therein. The state where the unit 1 and the connector unit 10 are connected is shown.

Next, the internal structure of the antenna unit 1 will be described. FIG. 2B is a partial sectional view of the antenna viewed from the direction of arrow Y in FIG. 2A, and the same parts as those in FIG. 2A are denoted by the same reference numerals. Note that the drawing shows a cross section of the antenna unit 1.

As shown in the drawing, the conventional antenna has a blind hole 6 provided along the center axis of the cylindrical antenna portion 1. The solder supply hole 3 is provided to penetrate the blind hole 6 perpendicularly.

The surface of the antenna section 1 is provided with silver (Ag) plating 7 (shaded portion). Gold instead of silver (Au)
In some cases, plating is applied.

The lead 2 of the connector portion 10 serving as a radio wave converter is inserted into the blind hole 6.
When the solder 5 enters the gap between the hole 5 and the stop hole 6, the two are joined.

This antenna is manufactured as follows.

First, the lead 2 is inserted into the blind hole 6 of the antenna unit 1. In this inserted state, the antenna unit 1
Heat the whole with a soldering iron. Next, solder (thread solder) is supplied from the solder supply hole 3 to the inside of the stop hole 6.

Then, the solder is melted by heat and enters the gap between the lead 2 and the blind hole 6. After confirming that the solder 5 has flowed out to the entrance of the blind hole 6, the supply of the solder is stopped.
By performing natural cooling in this state, the antenna shown in the figure is completed.

[0013]

In the conventional antenna described above, the antenna and the connector are joined by supplying solder from a solder supply hole. For this reason, the supplied solder flows excessively around the solder supply hole, and the solder rises or projects in an icicle shape,
There is a disadvantage that it adversely affects the electrical characteristics. That is, as shown in FIG. 2 (b), when the solder 5 flows around the solder supply hole and rises or protrudes, disadvantages such as an increase in the attenuation of the used frequency occur. .

To solve this problem, as disclosed in JP-A-61-2387 concerning printed wiring boards and JP-A-63-62396 concerning substrate structures,
It is conceivable to apply a solder resist around the solder supply hole. However, since the solder resist is an organic resin and acts as a dielectric in the case of high-frequency circuits,
There is a disadvantage that the electrical characteristics are similarly adversely affected.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide an antenna formed by solder bonding without adversely affecting electric characteristics and a method of manufacturing the same. It is.

[0016]

An antenna according to the present invention is an antenna having a solder supply hole for flowing solder therein, wherein an oxide film is formed around a solder supply port of the supply hole. It is characterized by the following.

[0017] A method of manufacturing an antenna according to the present invention is a method of manufacturing an antenna having a solder supply hole for flowing solder therein, wherein silver plating is performed on the entire surface of the antenna, and thereafter, the supply of silver is performed. Forming a nickel oxide film around the solder supply port of the hole.

Another manufacturing method of the antenna according to the present invention is as follows.
A method for manufacturing an antenna having a solder supply hole for flowing solder therein, wherein the step of forming the antenna with nickel, the step of applying silver plating to the entire surface of the formed antenna, and the step of Removing silver plating around the solder supply port of the supply hole.

[0019]

In an antenna having a solder supply hole into which solder flows, an oxide film is formed around the solder supply port of the supply hole.

[0020]

Next, the present invention will be described with reference to the drawings.

FIG. 1A is an external view of an embodiment of the antenna according to the present invention, and the same parts as those in FIG. 2 are denoted by the same reference numerals.

In the figure, the antenna according to the present invention is different from the conventional antenna in that an oxide film 4 is provided around the solder supply port of the solder supply hole 3 of the antenna unit 1. Since the oxide film 4 impairs the wettability of the solder, the surface does not wet the solder. Therefore, the solder does not flow around the solder supply hole and rise or protrude.

Next, the internal structure of the antenna unit 1 will be described. FIG. 1B is a partial cross-sectional view of the antenna as viewed from the direction of arrow Y in FIG. 1A, and the same parts as those in FIG. 1A and FIG. Note that the drawing shows a cross section of the antenna unit 1.

As shown in the drawing, the antenna of this embodiment is different from the conventional antenna in that an oxidized portion is formed around the supply port of the solder supply hole 3 penetrating perpendicularly to the blind hole 6. The coating 4 is provided (hatched portion). The oxide film 4 serves as a solder mask, and the solder does not wet the portions other than the solder supply holes 3 during the solder supply. Therefore, the solder does not flow around the solder supply hole and rises or does not protrude in an icicle-like manner, and the electrical characteristics are improved.

Unlike an organic resin solder resist which has been conventionally used, since an inorganic oxide film is formed, the electric characteristics are not hindered.

The antenna unit 1 can be manufactured as follows.

First, the blind hole 6 and the solder supply hole 3 are provided in the cylindrical antenna portion 1. Next, silver plating is applied to the entire surface of the antenna unit 1. Thereafter, nickel (Ni) plating is performed in a circular shape around the solder supply port of the supply hole 3.

After that, as in the conventional case, the lead 2 is inserted into the blind hole 6 of the antenna 1, then the entire antenna 1 is heated and the solder is supplied from the solder supply hole 3.

Here, since the nickel plating is oxidized in the air, an oxide film 4 is formed. The portion of the oxide film 4 functions as an inorganic solder mask, and the solder does not wet. Therefore, the solder does not rise or protrude, and the electrical characteristics are improved.

Further, the antenna unit 1 can be manufactured as follows.

First, a cylindrical antenna portion 1 is formed from nickel, and a blind hole 6 and a solder supply hole 3 are provided in this. Next, silver plating is applied to the entire surface of the antenna unit 1.

Thereafter, the silver plating around the solder supply port of the supply hole 3 is removed to expose the underlying nickel portion in a circular shape. Since the exposed nickel portion is oxidized in the air, an oxide film is formed. Therefore, the solder is not wetted at this portion, the solder does not rise or protrude, and the electric characteristics are improved.

It is apparent that not only nickel but also various oxide films can be used. However, since silver plating is often performed on the surface due to the characteristics of the antenna, a nickel oxide film is generally formed in relation to silver. When plating with a material other than silver, such as gold, the material of the oxide film should be determined in relation to the material.

[0034]

As described above, according to the present invention, by providing an oxide film around the solder supply port, the solder does not get wet in portions other than the solder supply holes, and the solder rises,
This has the effect of not only protruding but also improving the electrical characteristics.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an antenna according to an embodiment of the present invention, where (a) is an external view and (b) is a partial cross-sectional view.

FIG. 2 is a configuration diagram of a conventional antenna, in which (a) is an external view and (b) is a partial cross-sectional view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Antenna part 2 Lead 3 Solder supply hole 4 Oxide film 5 Solder 6 Stop hole 7 Plating 8 Flange 9 Screw part 10 Connector part

Claims (4)

(57) [Claims] 1. An antenna having a solder supply hole for flowing solder therein, wherein an oxide film is formed around a solder supply port of the supply hole. 2. The antenna according to claim 1, wherein the oxide film is a nickel oxide film, and the surface other than the oxide film portion is made of silver. 3. A method of manufacturing an antenna having a solder supply hole for flowing solder into the inside, wherein silver plating is performed on the entire surface of the antenna, and thereafter, a periphery of the solder supply port of the supply hole is provided. Forming a nickel oxide film on the antenna. 4. A method of manufacturing an antenna having a solder supply hole for flowing solder therein, wherein the step of forming the antenna from nickel and the step of applying silver plating to the entire surface of the formed antenna. And thereafter removing silver plating around the solder supply port of the supply hole.