JP2590715Y2 - Radiation noise reduction structure of electronic equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved structure for reducing radiation noise by grounding a printed circuit board in an electronic device such as a computer.

[0002]

2. Description of the Related Art In general, various measures have been taken in electronic devices such as computer devices in order to reduce radiation noise. As one of the measures against the radiation noise, there is a means for grounding a connector for pulling out a cable on a printed board, a panel of the printed board, and a chassis.

Conventionally, there has been a device using the above-mentioned means for grounding a printed circuit board as shown in FIGS. 3 and 4. FIG. This is configured by attaching a panel 2 to a chassis 1. The motherboard 3 provided with the connector 3a on the rear surface of the chassis 1 is provided, and a number of mounting holes 4 are formed in the upper and lower sides of the front surface.
The ground part 5 is formed. The panel 2 is formed by fixing a printed board 7 at right angles to a long mounting plate 6. Printed board 7
At the same time, an external connector 9 is installed on a mounting plate 6 on which a connection connector 8 is installed, and through holes 10 are formed at both ends thereof. Then, as shown in FIG.
Each of the through holes 10 is matched with the mounting hole 4 of the chassis 1 and is screwed into these holes and fixed with a nut.
With this configuration, the external connector 9 is grounded to the panel 2, and the panel 2 is grounded to the chassis 1.

[0004]

In the conventional structure for reducing radiation noise of electronic equipment as described above, the panel 2 and the chassis 1
Since the grounding area of the panel 2 is small and grounding with other members cannot be taken in the longitudinal direction of the panel 2, the impedance becomes high with respect to high frequency noise. For this reason, the conventional panel grounding structure has a problem that the effect of suppressing the radiation noise of the computer device is not sufficient. Further, since the shape of the conventional panel conforms to the standard of VME or the like, there is a problem that it is difficult to change the structure of the conventional panel to a structure that improves the grounding property.

In view of the above, the present invention provides a new radiated noise reduction structure for electronic equipment that enables good grounding between a printed circuit board, a panel, and a chassis and sufficiently reduces radiated noise. The purpose is to provide.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object,
The configuration of the present invention
A grounding part was provided on the opposite side, and a printed board was attached.
Both ends of the panel were fastened to the respective grounding parts and grounded
In the radiation noise reduction structure for electronic equipment, the panel plate
One side of the material is extended to form a ground side, and the ground side
Is fastened to the outer peripheral side of the opening and grounded.
Sign.

[0007]

With the above arrangement, the radiation noise generated from the printed board is released from the noise generating source to the chassis by contacting the chassis with the entire length of the panel board in the longitudinal direction. This has the effect of shortening the distance to the ground point and preventing the impedance from becoming high against high-frequency noise.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a radiation noise reduction structure of an electronic device according to the present invention will be described below with reference to FIGS. In addition,
In FIGS. 1 and 2, parts corresponding to those of the conventional example shown in FIGS.
A detailed description thereof will be omitted.

FIG. 1 is an exploded perspective view of FIG. 1 and FIG. 2 is an enlarged exploded perspective view of essential parts, wherein 1 is a chassis, 2 is a panel, 3 is a motherboard, 4 is a mounting hole, 5 is a grounding portion, 7 is a printed board,
8 is a connection connector, 9 is an external connector, and 10 is a through hole. The panel 2 of the present embodiment is a panel having only a plug-in type CPU board, in which a printed board 7 is fixedly integrated at right angles to a panel board 11. Printed board 7
Is provided with a connection connector 8. The panel plate 11 is provided with through holes 10 at both ends thereof. Further, a portion of the panel plate material 11 corresponding to the lower side in the figure is extended in the form of a protruding piece to form a ground side portion 11a. In this example, three through holes 10 are formed in the ground side portion 11a. The external connector 9 is provided on the panel plate 11.

Further, in order to close a vacant portion of the grounding portion 5,
A plurality of long plate-shaped blank panels 12 are prepared. The blank panel 12 is formed by piercing through holes 10 at both ends thereof.

The chassis 1 is a chassis of a computer device and has an opening 13 into which the printed board 7 is to be inserted.
In the figure, the grounding portions 5 are arranged at portions corresponding to both sides, respectively, and the lower portion thereof is configured as a ground connection portion 14. The ground connection part 14 has three holes corresponding to the through holes 10 of the ground side part 11a.
One mounting hole 15 is formed.

In order to assemble the panel 2 to the chassis 1 configured as described above, the following is performed. First, Panel 2
Is inserted into the opening 13 of the chassis 1, and the printed board 7 is accommodated inside the chassis 1. Then, as shown in FIG. 2, both ends of the panel plate material 11 are respectively brought into contact with the ground portion 5 so that the through holes 10 match the required mounting holes 4, and are fastened with screws 16. At the same time, the ground side portion 11a is brought into contact with the ground connection portion 14, and these through holes 10 and mounting holes 1 are attached.
5 and are fastened with screws 17.

Next, in a space in the opening 13 where the panel 2 is not installed, a required number of blank panels 12 are provided.
Install and close. That is, the through holes 10 at both ends of the blank panel 12 are aligned with the mounting holes 4 so that the screws 18
And is configured.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various other configurations can be adopted without departing from the scope of the present invention.

[0015]

As described above in detail, according to the radiation noise reduction structure for an electronic device of the present invention, in an electronic device in which a panel with a printed board is attached to an opening of a chassis, two opposing openings of the chassis are provided. Two ends of the panel panel material are fastened to the ground portion provided on one side portion, and a ground side portion formed by extending one side portion of the panel plate material in the longitudinal direction is fastened to the outer peripheral side portion of the opening. since the. Thus the gas escape to ground the chassis from the entire across the radiation noise generated from the printed circuit board in the longitudinal direction of the printed circuit board and integrated panel sheet, the distance from the noise source to the ground point of the chassis There is an effect that the length can be shortened and the impedance can be prevented from increasing even with respect to high-frequency noise, so that radiation noise can be reliably and largely reduced.

Further, since the panel plate is integrally mounted so as to cover a part of the opening of the chassis, there is an effect that the structural strength of the chassis can be increased. Further, since an expensive spring, shield packing, or the like is not required to improve the grounding, there is an effect that the configuration can be made inexpensively.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a radiation noise reduction structure of an electronic device of the present invention.

FIG. 2 is an enlarged exploded perspective view of a main part of the embodiment.

FIG. 3 is an exploded perspective view of a main part of a conventional electronic device.

FIG. 4 is an enlarged view of a main part of a conventional device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chassis 2 ... Panel 4 ... Mounting hole 5 ... Grounding part 7 ... Printed board 10 ... Through-hole 11 ... Panel board material 11a ... Grounding side 13 ... Opening 14 ... Grounding connection part 15 ... Mounting holes 16, 17 ... Screw

Claims (1)

(57) [Scope of request for utility model registration] 1. The method according to claim 1, wherein the openings are opposite to each other.
Panel with a printed circuit board attached to the grounding part on the side
An electronic machine that is grounded by fastening both ends of the plate to each grounding part
In the radiation noise reduction structure of the vessel, one side of the panel plate is extended to form a ground side,
The ground side is fastened to the outer peripheral side of the opening to ground.
A radiation noise reduction structure for electronic equipment, characterized in that: