JP2590296Y2 - Floor heating system - Google Patents

Floor heating system

Info

Publication number
JP2590296Y2
JP2590296Y2 JP1990401561U JP40156190U JP2590296Y2 JP 2590296 Y2 JP2590296 Y2 JP 2590296Y2 JP 1990401561 U JP1990401561 U JP 1990401561U JP 40156190 U JP40156190 U JP 40156190U JP 2590296 Y2 JP2590296 Y2 JP 2590296Y2
Authority
JP
Japan
Prior art keywords
floor
panel
floor heating
base
base panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990401561U
Other languages
Japanese (ja)
Other versions
JPH0490812U (en
Inventor
一廣 徳田
隆 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP1990401561U priority Critical patent/JP2590296Y2/en
Publication of JPH0490812U publication Critical patent/JPH0490812U/ja
Application granted granted Critical
Publication of JP2590296Y2 publication Critical patent/JP2590296Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Central Heating Systems (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、室内の暖房を床面にお
いておこなうことができるようにした床暖房装置に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor heating apparatus capable of heating a room on a floor.

【0002】[0002]

【従来の技術】床面を発熱させて室内の暖房をおこなう
ことができるようにした床暖房装置が普及しつつある。
この床暖房装置の一つのタイプとして、電気発熱体を内
蔵して形成される床暖房パネルを床面に敷設して、床暖
房パネルで室内の床を形成させるようにしたものがあ
る。
2. Description of the Related Art Floor heating apparatuses that can heat a room by generating heat on a floor surface are becoming popular.
As one type of this floor heating device, there is a floor heating panel formed by incorporating an electric heating element on a floor surface, and the floor heating panel is used to form an indoor floor.

【0003】図2はその一例を示すものであり、大引1
1の上に根太12を取り付けて床組を施工すると共に根
太12の間にグラスウール等の断熱材13を詰め込み、
そして根太2の上に複数枚の床暖房パネル7を敷き並べ
て固定することによって、床暖房パネル7で室内の床を
構成するようにしてある。
FIG. 2 shows an example of such a system.
Attach a joist 12 on top of 1 and construct a floor set, and pack a heat insulating material 13 such as glass wool between the joists 12,
By laying and fixing a plurality of floor heating panels 7 on the joists 2, the floor heating panel 7 constitutes an indoor floor.

【0004】[0004]

【考案が解決しようとする課題】しかしこのものでは、
大引11や根太12などの床組の施工が必要となるとい
う問題があった。このために床組をおこなわずにスラブ
などの床下地の上に床暖房パネル7を直接貼り付ける、
直貼り工法が検討されている。しかしながら床下地の上
に床暖房パネル7を直貼りする場合には、床暖房パネル
7の下側に断熱材13を設けることができず熱効率が低
下すると共に、またいわゆるマンションなどの集合住宅
においては床上の物音が直接階下に伝わることになり、
さらに床暖房パネル7の下側において配線をおこなうこ
とができないために、直貼り工法を採用することは未だ
なされていない。
[Problem to be solved by the invention]
There was a problem that the construction of a floor group such as the Ohiki 11 and the joist 12 was required. For this reason, the floor heating panel 7 is directly adhered to a floor base such as a slab without performing a floor assembly.
A direct pasting method is being studied. However, when the floor heating panel 7 is directly attached on the floor base, the heat insulating material 13 cannot be provided below the floor heating panel 7 and the thermal efficiency is reduced. The sound on the floor is transmitted directly downstairs,
Furthermore, since wiring cannot be performed below the floor heating panel 7, the direct bonding method has not yet been adopted.

【0005】本考案は上記の点に鑑みてなされたもので
あり、直貼り工法で床暖房パネルを施工することができ
る床暖房装置を提供することを目的とするものである。
[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a floor heating apparatus which can install floor heating panels by a direct bonding method.

【0006】[0006]

【課題を解決するための手段】本考案に係る床暖房パネ
ルは、断熱材1を設けて形成される下地パネル2の下面
にクッション材3を設けると共に、断熱材1の上を電気
絶縁性のカバー板14で覆い、カバー板14の屈曲部で
下地パネル2の上面に開口する配線用溝をけ、床下地
5の上に直貼りで下地パネル2を固定し、電気発熱体6
を内蔵して形成される床暖房パネル7を下地パネル2上
に取付けて成ることを特徴とするものである。
In the floor heating panel according to the present invention, a cushioning material 3 is provided on a lower surface of a base panel 2 formed by providing a heat insulating material 1, and an electric power is provided on the heat insulating material 1.
Covered with a cover plate 14 of insulating, only setting the wiring groove that opens to the upper surface of <br/> underlying panel 2 at the bent portion of the cover plate 14, a base panel 2 is fixed with direct attachment onto the subfloor 5 , Electric heating element 6
Is mounted on the base panel 2 with the floor heating panel 7 formed therein.

【0007】[0007]

【作用】断熱材1を設けて形成される下地パネル2の下
面にクッション材3を設け、床下地5の上に直貼りで下
地パネル2を固定し、電気発熱体6を内蔵して形成され
る床暖房パネル7を下地パネル2上に取付けるようにし
ているために、下地パネル2を床下地5に貼ることによ
って、下地パネル2に設けた断熱材1で床暖房パネル7
の下側の断熱性を確保できると共に、下地パネル2に設
けたクッション材3で床面の物音を緩衝して階下に伝わ
ることを防ぐことができる。また、断熱材の上を電気絶
縁性のカバー板14で覆い、カバー板14の屈曲部で
地パネルの上面に開口する配線用溝4を設けたため、
線用溝4を利用して床暖房パネル7への給電のための配
線をおこなうことができると共に、配線用溝4を電気絶
縁性のカバー板14で形成することができ、配線用溝4
に配線される電線の電気絶縁性を確保することができ
The cushioning material is provided on the lower surface of the base panel formed by providing the heat insulating material, the base panel is fixed directly on the floor base, and the electric heating element is built therein. Since the floor heating panel 7 is mounted on the base panel 2, the base panel 2 is attached to the floor base 5, and the floor heating panel 7 is provided by the heat insulating material 1 provided on the base panel 2.
The heat insulation of the lower side can be ensured, and the sound of the floor can be buffered by the cushioning material 3 provided on the base panel 2 to prevent the sound from being transmitted downstairs. In addition , electrical insulation is
Covered with the edge of the cover plate 14, due to the provision of the wiring groove 4 having an opening on the upper surface of the lower <br/> locations panel at the bent portion of the cover plate 14, by using the wiring groove 4 to the floor heating panel 7 Wiring for power supply , and the wiring groove 4 is electrically disconnected.
The wiring groove 4 can be formed by the marginal cover plate 14.
Can secure the electrical insulation of the electric wire
You .

【0008】[0008]

【実施例】以下本考案を実施例によって詳述する。下地
パネル2は3インチ×6インチや1インチ×6インチの
大きさで厚みが30〜40mm程度の基板によって作成さ
れるものであり、図1のように上面が開口するコ字形断
面に形成してある。この下地パネル2の下面には全面に
亘ってゴムや軟質樹脂等の弾性を有する材料で形成した
クッション材3が接着等して設けてある。クッション材
3の厚みは10mm程度が好ましい。また下地パネル2内
には全面に亘って断熱材1が充填してある。この断熱材
1としては特に限定されるものでないが、本出願人によ
って特開平1−208376号公報において提供されて
いる高機能断熱材を用いることができる。この特開平1
−208376号公報で提供されている断熱材は、粉末
粒子を成形して作成される微細多孔体であり、粒子粉末
として超微粒子粉末を用いると共に粒子粉末に予め凝集
防止処理をしておくことを特徴とするものである。粒子
粉末としては少なくとも一部が比表面積4000m2
g以上の超微粒子シリカ粉末及び、又は粒径60Å以下
の超微粒子シリカ粉末が使用され、また凝集防止処理は
アルコキシシラン化合物やクロロシラン化合物、シラザ
ン化合物などの有機シラン化合物を用いておこなわれる
ものであり、粒子粉末を加圧成形することによって微細
多孔体の断熱材を得ることができる。この断熱材におい
ては、粒子粉末は超微粒子であってしかも凝集防止処理
がおこなわれているために粒子粉末間の間隙が小さく、
高い断熱性能を有するものである。そしてこのように断
熱材1を充填した下地パネル2の上面の中央部にはほぼ
全長に亘って配線用溝4が上方に開口させて設けてあ
る。尚、図1の実施例では断熱材1の上を熱伝導性が低
い電気絶縁性のカバー板14で覆い、カバー板14の屈
曲部で配線用溝4が形成されるようにしてある。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. The base panel 2 is made of a substrate having a size of 3 inches × 6 inches or 1 inch × 6 inches and a thickness of about 30 to 40 mm, and is formed in a U-shaped cross section having an open upper surface as shown in FIG. It is. A cushion material 3 made of an elastic material such as rubber or soft resin is provided on the lower surface of the base panel 2 by bonding or the like over the entire surface. The thickness of the cushion material 3 is preferably about 10 mm. The heat insulating material 1 is filled over the entire surface of the base panel 2. The heat insulating material 1 is not particularly limited, but a high-performance heat insulating material provided by the present applicant in JP-A-1-208376 can be used. This Japanese Patent Application Laid-Open
The heat insulating material provided in JP-A-208376 is a microporous body formed by molding powder particles, and it is necessary to use an ultrafine powder as the particle powder and to perform an anti-agglomeration treatment on the particle powder in advance. It is a feature. At least a part of the particle powder has a specific surface area of 4000 m 2 /
g or more of ultrafine silica powder and / or ultrafine silica powder having a particle size of 60 ° or less is used, and the aggregation prevention treatment is performed using an organosilane compound such as an alkoxysilane compound, a chlorosilane compound, or a silazane compound. By pressing the particle powder under pressure, a microporous heat insulating material can be obtained. In this heat insulating material, the gap between the particle powders is small because the particle powders are ultrafine particles and are subjected to an anti-agglomeration treatment,
It has high heat insulation performance. In the center of the upper surface of the base panel 2 filled with the heat insulating material 1 as described above, a wiring groove 4 is provided so as to open upward over substantially the entire length. In the embodiment shown in FIG. 1, the heat insulating material 1 is covered with an electrically insulating cover plate 14 having low thermal conductivity, and the wiring groove 4 is formed at a bent portion of the cover plate 14.

【0009】一方、床暖房パネル7は木質の基板15の
上面にフィルムヒータなどの電気発熱体6を積層すると
共にその上に金属板などの均熱板16を積層し、この上
にさらに木質の床表面板17を張ることによって形成さ
れるものである。しかして、大引や根太などの床組をせ
ずにコンクリートスラブなど床下地5の上に直貼りで床
暖房パネル7を取り付けるにあたっては、まず床下地5
の上面の不陸を調整したのちに、床下地5の上に複数枚
の下地パネル2を敷き並べて接着等することによって貼
り付け固定する。次に、各下地パネル2の配線用溝4に
沿って電線を通して配線工事をおこなうと共に各床暖房
パネル7の電気発熱体6に電線を結線し、各下地パネル
2に沿って各床暖房パネル7を配置すると共に下地パネ
ル2の上に床暖房パネル7を載置し、そして木ネジを床
暖房パネル7から下地パネル2にねじ込むと共に木栓で
木ネジの頭を隠すなどの作業をおこなうことによって、
各床暖房パネル7を各下地パネル2の上に取り付けるこ
とができ、下地パネル2を介して床暖房パネル7を床下
地5に直貼りすることができるものである。
On the other hand, the floor heating panel 7 has an electric heating element 6 such as a film heater laminated on the upper surface of a wooden substrate 15 and a heat equalizing plate 16 such as a metal plate laminated thereon. It is formed by stretching the floor surface plate 17. However, when directly attaching the floor heating panel 7 to a concrete slab, such as a concrete slab, without installing a floor structure such as a pulling or joist, first, the floor base 5
After adjusting the unevenness of the upper surface of the base material, a plurality of base panels 2 are laid on the floor base 5 and are attached and fixed by bonding or the like. Next, wiring work is performed through electric wires along the wiring grooves 4 of each base panel 2, wires are connected to the electric heating elements 6 of each floor heating panel 7, and each floor heating panel 7 is provided along each base panel 2. And placing the floor heating panel 7 on the base panel 2 and screwing wood screws from the floor heating panel 7 into the base panel 2 and concealing the heads of the wood screws with wooden plugs. ,
Each floor heating panel 7 can be mounted on each base panel 2, and the floor heating panel 7 can be directly attached to the floor base 5 via the base panel 2.

【0010】このように施工して形成される床暖房装置
にあって、床面を形成する床暖房パネル7の上で物音が
発生しても、この物音は下地パネル2に設けたクッショ
ン材3によって緩衝されて床下地5に伝達されることを
低減でき、床面の物音が階下に直接伝わることを防ぐこ
とができるものである。また床暖房パネル7の電気発熱
体6からの発熱が床下に逃げることは下地パネル2に設
けた断熱材1で防ぐことができ、暖房の熱効率を高めて
ランニングコストを低減することができるものである。
尚、置き床方式で床暖房パネル7を床下地5に取り付け
ることも可能であるが、この場合には床下地5の上面か
ら床暖房パネル7の上面までの厚みが100〜150mm
と厚くなって、室内スペースを狭めることになるために
好ましくない。これに対して本考案の方式では床下地5
の上面から床暖房パネル7の上面までの厚みは50〜6
0mmで済む。
[0010] In the floor heating device constructed in this manner, even if a noise is generated on the floor heating panel 7 forming the floor, the noise is generated by the cushion material 3 provided on the base panel 2. Thus, it is possible to reduce the transmission of the sound of the floor surface to the floor floor 5 and to prevent the sound of the floor surface from directly transmitting downstairs. Further, the heat generated from the electric heating element 6 of the floor heating panel 7 can be prevented from escaping below the floor by the heat insulating material 1 provided on the base panel 2, and the heating efficiency can be increased and the running cost can be reduced. is there.
It is also possible to attach the floor heating panel 7 to the floor base 5 in a floor-standing manner. In this case, the thickness from the upper surface of the floor base 5 to the upper surface of the floor heating panel 7 is 100 to 150 mm.
It is not preferable because it makes the room space narrow. On the other hand, in the method of the present invention, the floor
The thickness from the upper surface of the floor to the upper surface of the floor heating panel 7 is 50 to 6
0mm is enough.

【0011】[0011]

【考案の効果】上記のように本考案は、断熱材を設けて
形成される下地パネルの下面にクッション材を設け、床
下地の上に直貼りで下地パネルを固定し、電気発熱体を
内蔵して形成される床暖房パネルを下地パネル上に取付
けるようにしたので、下地パネルを床下地に貼ることに
よって、下地パネルに設けた断熱材で床暖房パネルの下
側の断熱性を確保できると共に、下地パネルに設けたク
ッション材で物音を緩衝して階下に伝わることを防ぐこ
とができ、しかも断熱材の上を電気絶縁性のカバー板で
覆い、カバー板の屈曲部で下地パネルの上面に開口する
配線用溝を設けたため、配線用溝を利用して床暖房パネ
ルへの給電のための配線をおこなうことができると共
に、配線用溝を電気絶縁性のカバー板で形成することが
でき、配線用溝に配線される電線の電気絶縁性を確保す
ることができるものであり、下地パネルを介して床暖房
パネルを床下地に直貼り施工することが可能になるもの
である。
[Effects of the Invention] As described above, the present invention provides a cushioning material on the lower surface of a base panel formed by providing a heat insulating material, directly fixes the base panel on a floor base, and incorporates an electric heating element. The floor heating panel is formed on the base panel, so that by attaching the base panel to the floor base, the heat insulating material provided on the base panel can secure the heat insulation property of the lower side of the floor heating panel. , and buffer the noises cushion material provided on the base panel can be prevented from being transmitted to the downstairs, yet over the insulation material with an electrically insulating cover plate
Cover, opening into the upper surface of the underlying panel at the bent portion of the cover plate
Due to the provision of the wiring trench, when using a wiring trench can perform wiring for power supply to the floor heating panel co
In addition, the wiring groove can be formed with an electrically insulating cover plate.
To ensure the electrical insulation of the wires routed in the wiring grooves
This makes it possible to directly attach the floor heating panel to the floor base through the base panel.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例の一部切欠分解斜視図であ
る。
FIG. 1 is an exploded perspective view showing a partially cutaway embodiment of the present invention.

【図2】従来例の概略断面図である。FIG. 2 is a schematic sectional view of a conventional example.

【符号の説明】[Explanation of symbols]

1 断熱材 2 下地パネル 3 クッション材 4 配線用溝 5 床下地 6 電気発熱体 7 床暖房パネル14 カバー板 DESCRIPTION OF SYMBOLS 1 Insulation material 2 Base panel 3 Cushion material 4 Wiring groove 5 Floor base 6 Electric heating element 7 Floor heating panel 14 Cover plate

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) F24D 13/02──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) F24D 13/02

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 断熱材を設けて形成される下地パネルの
下面にクッション材を設けると共に、断熱材の上を電気
絶縁性のカバー板で覆い、カバー板の屈曲部で下地パネ
ルの上面に開口する配線用溝をけ、床下地の上に直貼
りで下地パネルを固定し、電気発熱体を内蔵して形成さ
れる床暖房パネルを下地パネル上に取付けて成る床暖房
装置。
1. A cushioning material is provided on a lower surface of a base panel formed by providing a heat insulating material, and an electric
Covered with an insulating cover plate, only setting the wiring groove that opens to the upper surface of the underlying panel at the bent portion of the cover plate, a base panel fixed with direct attachment onto the subfloor, an internal electrical heating element formed Floor heating system consisting of an underfloor heating panel mounted on a base panel.
JP1990401561U 1990-12-25 1990-12-25 Floor heating system Expired - Fee Related JP2590296Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990401561U JP2590296Y2 (en) 1990-12-25 1990-12-25 Floor heating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990401561U JP2590296Y2 (en) 1990-12-25 1990-12-25 Floor heating system

Publications (2)

Publication Number Publication Date
JPH0490812U JPH0490812U (en) 1992-08-07
JP2590296Y2 true JP2590296Y2 (en) 1999-02-10

Family

ID=31879631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990401561U Expired - Fee Related JP2590296Y2 (en) 1990-12-25 1990-12-25 Floor heating system

Country Status (1)

Country Link
JP (1) JP2590296Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5151859B2 (en) * 2008-09-25 2013-02-27 パナソニック株式会社 Wall heating panel

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63125041U (en) * 1987-02-09 1988-08-15
JPH0622759Y2 (en) * 1988-09-14 1994-06-15 松下電工株式会社 Base material for floor heating

Also Published As

Publication number Publication date
JPH0490812U (en) 1992-08-07

Similar Documents

Publication Publication Date Title
EP1473706A4 (en) Floor laying material, piece mat, and arranging structure thereof
JP2590296Y2 (en) Floor heating system
JPH07229280A (en) Double floor
JP4537985B2 (en) Wooden floor structure of an apartment
JPH0740898Y2 (en) Floor heating panel
JP3179214B2 (en) Floor heating mat construction equipment
JPH06220983A (en) Floor panel structure for double floor
JP4203575B2 (en) Floor heating panel structure
JP2000303671A (en) Wiring structure of soundproof floor-heating panel
JPS591934A (en) Floor panel for space heating
JPH0431555A (en) Heating floor construction
JP3412864B2 (en) Heating mat and installation structure of the heating mat
JP2905964B2 (en) Thermal storage floor heating system
JPH08218608A (en) Ligneous heating floor member and work execution method therefor
JPH022825Y2 (en)
JP4043998B2 (en) Floor heating system construction method
JPH06281172A (en) Installation of floor heating device
JPH0740899Y2 (en) Floor heater
JPH0548003Y2 (en)
JP3924161B2 (en) Floor finishing material
JPH0494085A (en) Far infrared-ray radiating panel heater
JPH0640766Y2 (en) Panel type floor heating structure
JP2001201071A (en) Floor-heating panel
KR200178952Y1 (en) Stone mattress for bedstead
JP2003148754A (en) Electrical floor heating structure and execution method therefor

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19981117

LAPS Cancellation because of no payment of annual fees