JP2583553Y2 - Thermal print head device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention consists of a split board obtained by cracking a mother board along a snap line formed on the mother board, and the side face thereof is formed by cracking. A head substrate serving as a formed surface; and a heat radiating portion for positioning a side surface of the head substrate with the protrusions on one surface, the head substrate having a positioning protrusion on one surface, and the head substrate being mounted on the surface. And a thermal print head device comprising a plate.

(Prior Art) A manufacturing procedure and a configuration of a thermal print head device of this type of a conventional example will be described.

Among the manufacturing procedures of the thermal print head device of the prior art, the manufacturing procedure of the head substrate will be described first with reference to FIGS. 3 to 6. FIG. 3 shows the plane, and FIG. Are formed on the mother substrate 1 corresponding to each size of the head substrate. The mother substrate 1 is cracked along its snap line 2, whereby a plurality of divided substrates whose planes are shown in FIG. 5 and whose side cross sections are shown in FIG.
Is obtained. In this case, each side surface 4 of each head substrate 3 is a surface formed by the cracking.

Next, a manufacturing procedure for mounting the head substrate 3 on the heat radiating plate 5 will be described. The head substrate 3 is mounted on one surface of the heat radiating plate 5 as shown in FIG. The side surface 4 is positioned by a plurality of positioning projections 6 erected on the heat sink 5.
Mounted on top.

In this manner, a conventional thermal print head device 7 as shown in FIG. 7 is obtained.

(Problem to be Solved by the Invention) The head substrate 3 in the thermal print head device 7 having the above configuration.
Can be obtained by dividing the mother substrate 1 along the snap line 2, but for cracking along the snap line 2, the side surface of the head substrate 3 as shown in FIG. 5 and FIG. 4 has a structure in which deformation such as burr 8 or dent 9 is likely to occur.

When the head substrate 3 having such deformation is to be positioned on the surface of the heat radiating plate 5 by the positioning protrusion 6, as shown in FIG.
The head substrate 3 to be accurately positioned by the projections 6 at the regular position shown by the dashed line is shifted from the regular position due to the deformation, that is, the head substrate 3 is at the regular position of the heat sink 5. Positioning is performed at the position of the solid line that is inclined. In the positioning of the head substrate 3 with respect to the heat radiating plate 5 in such an inclined state, the thermal printing head device 7 cannot face the printing paper (not shown) in a correct positional relationship, and as a result, correct printing can be performed. It will be impossible.

Therefore, the present invention enables the thermal printing head device to be positioned at a regular position on the heat sink even if the head substrate is deformed due to cracking of the mother substrate, so that the thermal printing head device can be properly positioned with respect to the printing paper. The purpose of the present invention is to make it possible to face each other so that problems on printing do not occur.

(Means for Solving the Problems) In order to achieve such an object, in the thermal printing head device of the present invention, a rectangular board constituted by divided boards obtained by cracking a mother board along a snap line. A head substrate, and a radiating plate for positioning the head substrate on one surface with a projection for positioning the head substrate, and positioning the side surface of the head substrate with the projection when the head substrate is mounted on the surface. In a thermal print head, the inner peripheral wall of a through-hole formed along a snap line of the mother substrate is formed only on a pair of adjacent side surfaces of the head substrate, while being opposed to the inner peripheral wall of the through-hole. The protrusion is provided only at a position on one surface of the heat radiating plate, and the protrusion is locked to an inner peripheral wall of the through hole, and the head substrate is positioned on the heat radiating plate. It is characterized by being attached.

(Operation) Each of the protrusions provided only at positions on one surface of the heat sink opposite to the inner peripheral walls is engaged with the inner peripheral walls of the through holes formed only on a pair of adjacent side surfaces of the head substrate. As a result, the head substrate is positioned on the heat sink. Therefore, even when the head substrate is deformed, the head substrate is mounted at a regular position without being inclined in both the vertical direction and the lateral direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of a thermal print head device according to an embodiment of the present invention, and FIG. 2 is a plan view of a mother substrate for obtaining a head substrate of the thermal print head device.

The configuration of the thermal print head device 10 according to the present embodiment that is different from that of the conventional example is as follows.

That is, the inner peripheral wall 16 of the through-hole 15 formed along the snap line 14 of the mother substrate 13 is formed on the side surface 12 of the head substrate 11 in the thermal print head device 10 of the present embodiment. In addition, a positioning projection 18 of a heat radiating plate 17 is locked to the inner peripheral wall 16.

Therefore, when the head substrate 11 is attached to the heat radiating plate 17, the positioning projections 18 on the heat radiating plate 17 are locked to the inner peripheral wall 16 of the through hole 15. Even if there is a deformation such as the above-mentioned burr 19 or dent 20 due to the cracking along 14, the head substrate 11 is accurately positioned and attached to a proper position on the heat radiating plate 17 irrespective of the deformation.

Here, the configuration of the motherboard 13 will be described in detail with reference to FIG.
Along with the through hole 14, a through hole 15 into which each positioning projection 18 on the heat radiating plate 17 can enter is formed. And mother board 13
Cracking along its snap line 14,
The inner peripheral wall 16 of the through hole 15 is partially left on the divided substrate obtained by the cracking, that is, on the side surface 12 of the head substrate 11.

(Effects of the Invention) As is clear from the above description, according to the present invention, the inner peripheral walls of the through-holes formed only on the pair of adjacent side surfaces of the head substrate are provided with the heat radiation plate facing the inner peripheral walls. By locking each of the protrusions provided only at a position on one surface, the head substrate is positioned on the heat sink. Therefore, even when the head substrate is deformed, the head substrate can be mounted at a regular position without being inclined in both the vertical direction and the lateral direction, whereby the printing portion is relatively positioned on the printing paper at the correct position. The present invention can provide a thermal printing head device having excellent printing performance.

In addition, each of the protrusions provided only at positions on one surface of the heat sink opposite to the inner peripheral walls is engaged with the inner peripheral walls of the through holes formed only on a pair of adjacent side surfaces of the head substrate. With this structure, the head substrate can be mounted on the heat radiating plate while the head substrate is slid in the horizontal direction from the side of the heat radiating plate where the protrusions are not present.

[Brief description of the drawings]

1 and 2 relate to an embodiment of the present invention. FIG. 1 is a plan view of a thermal printing head device according to an embodiment of the present invention.
FIG. 2 is a plan view of a mother substrate for producing a head substrate of the thermal print head device of FIG. 3 to 7 relate to a conventional example, FIG. 3 is a plan view of a mother substrate for manufacturing a head substrate of a thermal print head device of the conventional example, and FIG. 4 is a sectional view taken along a line IV-IV in FIG. FIG. 5 is a plan view showing a state where the mother substrate is divided along snap lines, FIG. 6 is a side sectional view taken along line VI-VI in FIG. 5, and FIG. FIG. 3 is a plan view of the print head device. 10 ... thermal print head device, 11 ... head substrate, 12 ... side surface, 14
... Snap line, 15 ... Through hole, 16 ... Inner peripheral wall, 17 ... Heat sink, 18 ... Positioning protrusion, 19 ... Burr, 20 ... Dec.

Claims (1)

(57) [Scope of request for utility model registration] 1. A rectangular head substrate comprising a divided substrate obtained by cracking a mother substrate along a snap line; and a head substrate positioning projection on one surface, wherein the head substrate has A thermal print head device comprising: a heat radiating plate that positions the side surface of the head substrate with the protrusion in a state where the mother substrate is mounted on the surface; only the pair of adjacent side surfaces of the head substrate, While the inner peripheral wall of the through hole formed along the snap line is formed, the protrusion is provided only at a position on one surface of the heat sink opposite to the inner peripheral wall of the through hole, The thermal printing head device, wherein the projection is locked to an inner peripheral wall, and the head substrate is positioned and mounted on the heat radiating plate.