JP2582838Y2 - Substrate thickness self-adjusting clamp device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a clamping device for clamping an end of a flat plate such as a flat plate such as a printed circuit board or a general plate, and automatically responding to a change in the plate thickness. Related to the structure.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board inspection apparatus for performing various performance inspections such as the presence or absence of a component and a disconnection on a printed board on which electronic components are mounted or a bare board printed board on which no electronic components are mounted is fixed on the printed board in the inspection apparatus. After loading the printed circuit board to be inspected into the device and positioning and fixing it, a plurality of probes are moved to a predetermined measurement point and then brought into contact,
The obtained electric signal is determined by a measuring instrument and a microcomputer to determine the quality of the printed circuit board to be inspected.

[0003] Here, in order to fix a printed circuit board to a printed circuit board fixing device, a fixing method in which the reference position is simply adjusted and the edge of the printed circuit board is sandwiched is known. Can not correct the warpage of the printed circuit board, and the pitch of each measurement point is narrow and close to each other on the printed circuit board for high-density mounting.
There is a problem that the position of the measurement point is displaced due to the warp of the substrate and measurement cannot be performed, or a probe pin comes into contact with another measurement point to cause a mistouch.

In order to solve the above problems, the applicant of the present invention holds the printed circuit board in a vertical position, and further applies a tensile force to correct the warpage of the printed circuit board. A printed circuit board inspection apparatus for inspecting the quality of a mounted state has been provided (Japanese Patent Application No. 4-338530).

FIG. 6 shows the structure of the printed circuit board inspection apparatus 1.
This will be described with reference to FIGS. That is, the printed circuit board 2 to be inspected is carried into the apparatus main body, and the printed circuit board 2 is made vertical, and both end edges thereof are gripped by the clamp units 8, 8.
And a printed circuit board fixing device 9 for pulling at least one of the clamp units 8 in the vertical direction (Y direction) to apply a tensile stress to the printed circuit board 2. The keyboard is provided on both sides of the printed circuit board 2 held by the user. In addition, a keyboard 6 for operation, a display 7 for displaying measured values and pass / fail judgment, and an operation instruction for a servomotor, an air cylinder, etc. according to an inspection program. (Not shown).

In the printed circuit board fixing device 9, a clamp base 11 and a movable base 12 are vertically arranged between guide posts 10, 10 erected in the main body of the inspection device 1. It is erected. A gripping device 3 is mounted on an opposing surface of the base 11 and the movable base 12.

The gripping device 3 comprises the base 11, the movable base 1
L-shaped brackets 13 fixed to bolts 2
A transmission shaft 14 mounted on the bracket 13, and an end of the printed circuit board 2, which is mounted on the front end of the bracket 13 and is integrally rotated by a clamp shaft 51 via the transmission shaft 14 and the link 15. The movable claw 16 includes a movable claw 16 having a clamping surface in contact with an edge, and a fixed claw 17 fixedly mounted on the bracket 13 and having a clamping surface opposed to the clamping surface of the movable claw 16.

A transmission shaft 14 for rotating the movable claw 16
One end of the base 11 is connected to one side of the gripping device 3.
And the brackets 18, 18 erected from the movable base 12, and are pivoted by an air cylinder 19 provided on the bracket 18.

The movable claw 16 is rotated about 90 ° by the air cylinder 19 together with the clamp shaft 51 (indicated by an arrow in FIG. 8), and holds both edges of the printed circuit board 2 together with the holding surface of the fixed claw 17. Is what you do.

At one end of one of the holding surfaces of the fixing claws 17, a reference pin 20 which is inserted into a reference hole of the printed circuit board 2 and serves for positioning is protruded.

Further, as shown in FIG. 8, a concave groove is provided on the other holding surface of the fixed claw 17 along its longitudinal direction, and a suction port 17a is provided on the end surface thereof to be held. The edge of the printed circuit board 2 is sucked and held by a vacuum device.

The holding surfaces of the movable claw 16 and the fixed claw 17 are continuous holding surfaces in the X direction, and the length thereof is designed so that various printed circuit boards 2 can be inspected. Is to be sufficiently covered.

The movable base 12 is provided with the guide support 1.
Spline guides 21, 2 that can freely enter and exit inside 0, 10.
1 and the spline guide 21
Moves in the vertical direction (Y direction).

The movement of the movable base 12 in the vertical direction is due to the expansion and contraction of the ball screw 22. The ball screw 22 screwed to the bearing 23 having a thread groove is interposed through the timing belt 24. The rotary base 12 is rotated by a servomotor 25, whereby the ball screw 22 moves in the vertical direction with respect to the bearing portion 23, and accordingly, the rotary base 12 moves in the vertical direction while being guided by the spline guide 21. It is.

The tuning belt 26 rotates in the same manner as the rotation of the servo motor 25 and the timing belt 24, and the ball screw 22 at the other end of the movable base 12 is rotated. Is vertically movable by both spline guides 21 and 21 and both ball screws 22 and 22.

Next, the measurement probe 4 and the Y-axis arm 5 will be described with reference to FIG. 9. The measurement probe 4 is slidably mounted on the Y-axis arm 5 via a base 4a. The base 4a is moved in the Y direction by a ball screw 27 and a Y-axis servo motor 28 for rotating the ball screw 27.

If the printed circuit board 2 to be inspected is not mounted with electronic components, the measuring probe 4 is set to be perpendicular to the surface of the printed circuit board 2 fixed by the printed circuit board fixing device 9. It is fixed to the base 4a.

The Y-axis arm 5 is mounted on the X-axis beam 29 so as to be slidable in the X direction with one end supported, and is slidably movable in the X direction by a ball screw 30, a timing belt 31, and an X-axis servomotor 32. What is done.

As described above, the Y-axis arm 5 movable in the X direction is connected to the gripping device 3 of the printed circuit board fixing device 9.
The X-beam 29 is disposed on each side of the X-beam 29, with the printed circuit board 2 gripped therebetween being interposed therebetween.

In this way, the printed circuit board 2 is vertically held and supported on the printed circuit board inspection apparatus 1 by the gripping devices 3 and 3, and the quality of the printed circuit board 2 is determined by measuring with the measuring probe 4. .

[0021]

However, since the thickness of the printed circuit board 2 carried into the printed circuit board inspection apparatus 1 is frequently changed in various small-quantity productions,
Each time, it is necessary to appropriately change the position of the clamping surface of the movable claw 16 or the fixed claw 17 of the clamp unit 8.

As a method for making this change, the fixing pawl 17
Of the fixing claw 17 is moved by a predetermined amount in the thickness direction of the printed circuit board 2 at a screw pitch by adjusting bolts and nuts which are fastened to the bracket 13. There is a problem that workability is poor. A method of changing the position of the holding surface in accordance with a change in the thickness of the printed circuit board 2 by using a spring for the fixing claw 17 is also conceivable. However, the holding force is reduced by the spring set by repeated use. However, there is a problem in that when the difference in plate thickness is large, an appropriate clamping force is not exhibited.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and provides a clamp device capable of easily setting a clamping force to a constant value when the thickness of a printed circuit board to be inspected changes. With the goal.

[0024]

To solve the above problems of the present invention SUMMARY OF THE INVENTION The subject matter for achieving the above object is a clamping object
Over the entire length of both edges of the flat plate, each edge is
While holding each with two holding claws,
Applying a uniform tensile force with the claws for the entire length of
A clamp device for correcting warpage of a flat plate , wherein
One of the two holding claws at the edge was movable in the thickness direction of the flat body so as to hold the flat body with a predetermined pressing force regardless of the change in the thickness. Things. Also, one of the two holding claws is
Set the flat body between the two holding claws.
Vacuum suction pad with negative pressure sensor
A holding device consisting of a holding base for holding it is added.
It includes that it is.

[0025]

According to the substrate thickness self-adjusting clamp device of the present invention, when a printed circuit board or another flat plate body is clamped at an end thereof, the flat plate body having a different plate thickness is used for electrical equipment such as an inspection device. Even if it is carried in, one of the two holding claws is moved, and after the holding surface of the holding claw abuts on the end surface of the flat body, a predetermined pressing is performed by pressing means such as an air cylinder. Pressure is applied.

Therefore, even if the thickness of the flat plate becomes thinner or thicker, the pressing force applied to the end of the flat plate is always constant, and a desired clamping force can be obtained. In this way, in the inspection apparatus, the printed circuit board to be inspected is clamped by the clamp device, and the clamp device is further moved in the vertical direction (Y direction) to apply an appropriate tensile force to the printed circuit board and to warp the printed circuit board. It is corrected and inspected with a measuring probe with high accuracy. Also, print on the clamp device
With a holding device that holds a flat body such as a substrate,
Reliable body clamping operation improves reliability of inspection equipment
Is what you do.

[0027]

Next, an embodiment of the present invention will be described in detail with reference to the drawings. 1 to 3 are a longitudinal sectional view and a partially enlarged sectional view showing the structure of the substrate thickness self-adjusting clamp device according to the present invention. In the figure, reference numeral 40 is a fixed claw, 41 is an air cylinder, 42 is a clamp base,
43 is a cylinder, and 44 is a piston.
Note that the same reference numerals are given to portions corresponding to the conventional example.

The substrate thickness self-adjusting clamp device of the present invention is
Clamp unit 8 in conventional clamp device
As shown in FIG. 1, the fixing claw 4 (see FIG. 8) is movable along the thickness direction of the printed circuit board 2.
It is set to 0.

The structure in which the fixed claw 40 is movable in the plate thickness direction is described in detail with reference to FIG. 3. The cylinder 43 is provided on a clamp base 42 and a slidable piston 44 is provided on the cylinder 43. Is fitted.

The axis of the cylinder 43 is parallel to the thickness direction of the printed circuit board 2 to be inspected. A supply pipe 45 is connected to one end of the cylinder 43,
Compressed air is supplied into the cylinder by an air compressor (not shown) connected to one end of the supply pipe 45 as shown by an arrow a in FIG.

Accordingly, the piston 44 moves in the direction of the arrow b in FIG. 3, and the fixed claw 40 fixed to one end of the piston 44 by the bolt 46 or the like also moves in the same direction. The piston 44 is movable in the right direction on the paper of FIG. 1 so as to be sufficiently wider than the maximum thickness of the printed circuit board 2, and the left and right sides of the holding surface 16 a of the movable claw 16 and the fixed claw 40 are moved in the left direction on the paper. The holding surface 40a can be moved until it abuts as shown in FIG. Thus, the air cylinder 41 is formed.

With such a board thickness self-adjusting clamp device, first, the fixed claw 40 is sufficiently released to the right in FIG. 1, the printed circuit board 2 to be inspected is set on the clamp base 42, and the movable claw is 16 to clamp shaft 51
To rotate in the clockwise direction indicated by the arrow to lock the holding surface 16a at the reference position c. Although the movable claw 16 may be locked in advance, it is rotated and retracted counterclockwise so as not to be an obstacle when the printed circuit board 2 is set.

Then, air is supplied from the air supply pipe 45 by an air compressor.
To the cylinder and the fixed claw 4 together with the piston 44
1 is moved in the thickness direction of the printed circuit board 2, and the end of the printed circuit board 2 is held between the holding surface 16 a locked at the reference position and the holding surface 40 a of the fixed claw 40 as shown in FIG. 1.

Thereafter, high-pressure compressed air is supplied by an air compressor.
The gas is supplied through the supply pipe 45 to a predetermined pressure. By applying a pressing force to the piston 44 and the fixed claw 40 by the air cylinder 41, the value of the pressing force can be arbitrarily set, so that the adjustment is easy. That is, unlike the case where a spring is used, there is no fear that the pressing force changes due to uneven elasticity due to product variation.

Thus, the end of the printed circuit board 2 is held between the holding surface 40a and the holding surface 16a with a constant pressing force. Then, a predetermined tensile force is applied in the vertical direction (Y direction) with the end portion of the printed circuit board 2 held therebetween to correct the warpage of the printed circuit board 2.

FIGS. 4 and 5 show another embodiment of the substrate thickness self-adjusting clamp device according to the present invention.
This clamping device for self-adjusting substrate thickness is provided with a holding device for setting the printed circuit board 2.

That is, the vacuum suction pad 47 with a negative pressure sensor
Is attached to the holding base 48, and the holding base 48 is fixedly attached to the fixed claw 40. Then, the end surface position of the pad surface of the suction pad 47 and the holding surface 40a are made the same as shown in FIG.

The vacuum suction pad 47 discharges air from the exhaust port 47a to a vacuum device (not shown) to suction the printed circuit board 2.

When the printed circuit board 2 is set by using the holding device, the fixing claw 40 and the vacuum suction pad 47 are set.
4 is sufficiently released to the right in FIG. 4 so that one end surface of the printed circuit board 2 is sucked to the suction pad 47.

Then, the movable claw 16 is rotated clockwise to lock the holding surface 16a at the reference position c as described above. Next, air is supplied from the air compressor into the cylinder, and the fixed claw 40 is moved to the left (in the thickness direction) on the paper surface while the printed board 2 is being sucked by the vacuum suction pad 47 together with the piston 44. The end is clamped between the clamping surface 16a and the clamping surface 40a.

Then, high-pressure air is further supplied by an air compressor, and a predetermined pressing force is applied to the end portion of the printed circuit board 2 by the holding surface 40 a of the fixed claw 40 via the piston 44 to hold the printed circuit board 2. Further, the negative pressure sensor of the vacuum suction pad 47 with the negative pressure sensor is used when a mistake in setting the printed circuit board 2 or when an end portion of the printed circuit board 2 comes off from the clamp unit 8 due to a tensile force applied to the printed circuit board 2. , A change in pressure is detected to notify such an abnormality.

[0042]

As described above, the substrate thickness self-adjusting clamp device according to the present invention is applicable to a flat plate body to be clamped .
Around the entire length of both edges, each edge is
While holding each with the holding claw,
The tension force is uniformly applied by the holding claws over the flat plate.
A clamp device for straightening a body , wherein each of said edge portions
Since one of the two holding claws in (1) is movable in the thickness direction of the flat body, the flat body is held at a predetermined pressing force regardless of a change in the thickness. it is not necessary to plate thickness of the plate members such as a printed board to be inspected readjust the distance clamping claws each case clamping devices also vary, always sandwich the flat plate at a constant pressing force
Can correct the warpage of the flat body . Therefore, even if the thickness of the flat body changes, the man-hour for adjusting the holding force is reduced, the working efficiency is improved, and the pressing force of the holding claw is constant, and the reliability of the inspection apparatus is improved. It works. Further, one of the two holding claws is provided for holding the claw.
When setting the flat body between the two holding claws,
Vacuum suction pad with negative pressure sensor and hold it
A holding device consisting of a holding base to be held is added
As a result, the flat body is securely held and the reliability of the inspection device
Is improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a structure of a substrate thickness self-adjusting clamp device according to the present invention.

FIG. 2 is a longitudinal sectional view showing a state in which a fixing claw of the clamp device is moved in a thickness direction of a printed circuit board by an air cylinder and both holding surfaces are in contact with each other.

FIG. 3 is a partially enlarged sectional view showing details of an air cylinder.

FIG. 4 is a vertical sectional view of a clamp unit provided with a vacuum suction pad with a negative pressure sensor, which is a substrate thickness self-adjusting clamp device according to another embodiment.

FIG. 5 is a longitudinal sectional view showing a state in which the fixing claw is moved in a thickness direction of the printed circuit board so that both holding surfaces are in contact with each other.

FIG. 6 is a perspective view of a printed circuit board inspection device equipped with a conventional clamp device.

FIG. 7 is an enlarged perspective view of a main part showing a clamp device according to a conventional example.

FIG. 8 is a cross-sectional view showing a state in which a printed circuit board is held between a movable claw and a fixed claw of a clamp device according to a conventional example.

FIG. 9 is a perspective view of an essential part showing a structure of a measurement probe of the printed circuit board inspection apparatus.

[Description of Signs] 40 fixed claws, 41 air cylinders, 42 clamp bases, 43 cylinders, 44 pistons.

Claims (2)

(57) [Scope of request for utility model registration] 1. An apparatus according to claim 1 , wherein substantially the entire edge of both ends of a flat plate as an object to be clamped.
Over the length, each edge is sandwiched between two clamping claws.
While holding the entire length of the both edges.
Using a nail to evenly apply tension to straighten the flat body
A clamping device , wherein one of the two clamping claws at each of the edge portions is movable in the thickness direction of the flat body so that a predetermined pressing force is obtained regardless of a change in the plate thickness. A self-adjusting substrate thickness clamping device characterized in that a flat plate is held by pressure. 2. The method according to claim 1, wherein one of the two holding claws is attached to one of the holding claws.
When setting the flat body between the two claws,
Hold, vacuum suction pad with negative pressure sensor and hold it
A holding device consisting of a holding base
2. The substrate thickness self-adjusting tool according to claim 1, wherein
Lamp device.