JP2582446Y2 - Heat dissipation structure of electronic equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure of an electronic apparatus which is preferably used in an on-vehicle sound reproducing apparatus or a wireless apparatus.

[0002]

2. Description of the Related Art An in-vehicle device which is used by being embedded in a console or instrument panel of an automobile, reproduces a recording medium such as a magnetic tape, amplifies a reproduced acoustic signal by power, and drives a speaker. Sound reproduction device, or a wireless device that receives data such as dispatch instructions,
With the recent increase in power of amplifiers, the amount of heat generated inside the device is increasing. However, when recording media such as compact discs and cassette packs are heated to a high temperature, the operator may be burned when replacing the recording media, or may not be able to compensate for the stable operation of the device. There's a problem.

Therefore, for example, the temperature rise of the cassette pack in a state where the four-channel speaker is continuously driven with the specified output for several hours is set to be equal to or lower than the specified temperature. The design has been made. Further, in the case of a compact disc reproducing apparatus, there is a demand for a lower heat guarantee temperature of the optical pickup and a more efficient heat radiation structure. Similarly, in a wireless device, an efficient heat dissipation structure for ensuring stable operation of devices and improving sensitivity and selectivity is required.

FIG. 4 is a perspective view for explaining a typical conventional heat dissipation structure. The wireless device 1 is generally
A transmission system that amplifies an audio signal or a data signal and frequency-modulates, a reception system that converts a received wave to an intermediate frequency, detects the signal, and obtains the audio signal or the data signal, and selectively selects the transmission system and the reception system. A duplexer connected to an antenna and a microcomputer for controlling these components are housed in a housing 2. One of the heat-generating components included in these components is, for example, a power IC that amplifies the audio signal and the data signal.

[0005] The power IC is fixed to a heat radiating member 3 attached to a rear end 2a of the housing 2 via a holder. Therefore, the heat generated in the power IC is transmitted to the heat radiating member 3 via the holder, and is radiated to the outside from the heat radiating fins 3a, 3b, 3c of the heat radiating member 3.

Therefore, in such a conventional technique, the shape of the heat dissipating member 3, such as the thickness of the heat dissipating member 3, the height H1 of the heat dissipating fins 3a, 3b, 3c and the arrangement pitch W1,
In addition, by designing the shape of the housing 2 such as improving the radiation efficiency by forming the housing 2 in black, a design is performed so as to obtain a desired heat radiation characteristic.

[0007]

However, in such a conventional technique, since the heat radiation member 3 is entirely exposed to the outside, the appearance is poor.

[0008] The purpose of the present invention is, without impairing the aesthetics,
An object of the present invention is to provide a heat dissipation structure of an electronic device that can efficiently dissipate heat.

[0009]

According to the present invention, there is provided an electronic apparatus including a housing provided with a heat dissipating member having a plurality of heat dissipating fins erected on a support base, wherein a lid fitted to the housing is provided. A plurality of slits are individually formed on the lid body, each of which corresponds to each radiating fin of the heat radiating member, and the width and depth of each slit are formed so as to be entirely larger than that of the corresponding radiating fin. When the lid is fitted into the housing, the tip of each of the radiating fins protrudes from the surface of the lid through a slit and a flow path of cooling air is provided between the radiating fin and the slit. A heat dissipation structure of an electronic device characterized by being formed.

[0010]

According to the present invention, an electronic device such as a wireless device including a housing provided with a heat dissipating member is provided with a lid fitted to the housing. The lid is provided with at least one slit, and when the lid is fitted to the housing, a tip of the heat radiation member projects from the surface of the lid through the slit, and the heat radiation member and the lid A passage for cooling air flowing from outside is formed between the body and the body.

Therefore, the heat radiated directly from the distal end of the heat radiating member to the outside and the heat radiated from the vicinity of the base end of the heat radiating member are also radiated to the outside without the heat remaining in the lid. The heat dissipating member provided can efficiently dissipate heat without deteriorating the appearance.

[0012]

FIG. 1 is an exploded perspective view for explaining a heat radiation structure according to an embodiment of the present invention. FIG. 2 is a sectional view taken along a line A of FIG.
It is sectional drawing seen from -A. Wireless device 1 that is an electronic device
1 is used by being embedded in a console or an instrument panel of an automobile, receiving a voice signal or a data signal such as a dispatch instruction, amplifying the power, and outputting the amplified signal to a speaker. A response signal can be transmitted.

Therefore, in the housing 12, in addition to a receiving system and a transmitting system for receiving or transmitting the voice signal and the data signal, a duplexer for selectively connecting the transmitting system and the receiving system to an antenna, A microcomputer for controlling these components is housed. Also, connector 1
9 is connected to a handset having a built-in microphone such as a press talk switch for switching between transmission and reception.

A heat radiating member 1 is provided at a rear end 12a of the housing 12.
3 are arranged. The heat radiating member 13 includes a support base 14.
A plurality of radiating fins 13a, 13b, 13c are provided upright, and are made of a material having good thermal conductivity such as iron or aluminum. On the support 14, a power module 18 such as a power IC for amplifying a signal to be transmitted is mounted on a surface opposite to a surface on which the radiating fins 13 a to 13 c are erected.

The heat generated from the power module 18 is transferred from the support base 14 of the heat radiating member 13 to the radiating fins 13a,
The light is propagated to 13b and 13c and is radiated. From the support 14 on which the power module 18 is mounted,
By forming a, 13b, and 13c, the heat radiation area can be increased.

A cover 15 is formed so as to be fitted to the rear part of the housing 12 including the heat radiating member 13. A support piece 20 and a support base 21 are provided on the housing 12 so as to support the fitted lid 15. Each heat radiation fin 13 is provided on the lid 15.
slits 16 individually corresponding to a, 13b, 13c
a, 16b, 16c are provided, and when fitted to the housing 12, the radiation fins 13a, 13b, 13c
The positions of the slits 16a, 16b, 16c, the support pieces 20, the support 21 and the slits 16a, 16b, 16c are arranged in accordance with the arrangement pitch W2 and the height H2 of the radiation fins 13a, 13b, 13c so as to slightly protrude from the heat radiation fins 13a, 16b, 16c. Height H2 is adjusted.

That is, the radiation fins 13a, 13b, 1
The height H2 of the support piece 20 and the support base 21 is formed to be slightly smaller than the height H3 of the radiation fins 13a, 13b, 13c so that 3c can protrude from the slits 16a, 16b, 16c of the lid 15. Also, the slits 16a, 1
The width and depth of 6b and 16c are the radiation fins 13a and 1c.
3b and 13c are formed so as to be entirely larger than those of the lids 15b and 13c.
Are fitted, and when the radiation fins 13a, 13b, 13c protrude from the slits 16a, 16b, 16c, the radiation fins 13a, 13b, 13c and the slits 16a, 16b,
A gap 17 is formed between the gap 17 and the gap 16c.

Therefore, the heat generated from the power module 18 is transmitted to the heat radiating member 13 and is directly radiated to the outside from the tips of the heat radiating fins 13a, 13b, 13c protruding outside, and the heat inside the cover 15 is also removed. Dissipation fin 1
The heat radiated from the vicinity of the base ends of 3a, 13b, and 13c is cooled by the outside air flowing through the gap 17, so that heat is prevented from being trapped between the housing 12 and the lid 15, and the heat is radiated. It can be carried out.

As a result, it is possible to maintain the electronic device such as the wireless device 11 within the operation assurance temperature and perform a stable operation. Further, since the lid 15 is fitted to the housing 12, the entire heat radiation fins 13a, 13b, and 13c are not exposed to the outside, and the appearance is not spoiled.

FIG. 3 is a cross-sectional view showing a heat radiation structure according to another embodiment of the present invention. The difference from the embodiment shown in FIG. 2 is that the height H4 of the radiating fins 23a to 23c is low, and the housing 25 is directly in contact with and fitted to the support 24 of the radiating member 23.

Therefore, the heat from the power module 18 is also radiated from the tips of the radiating fins 23a, 23b, 23c and the gap 17, and propagates from the support base 24 to the lid 25, and the efficiency from the lid 25 is reduced. Dissipated well.

According to the present invention, the radiation fins 13a to 13c;
The present invention can be suitably applied not only to in-vehicle electronic devices formed on the upper surfaces of the housings 12 and 22 but also to home electronic devices formed on the back surface or the like.

[0023]

As described above, according to the present invention, the tip of each radiating fin of the radiating member is projected through the slit to the surface of the lid, and flows from the outside between the radiating fin and the slit. Since the cooling air flow path is formed, the aesthetic appearance is not impaired by the heat dissipating member provided in the housing,
In addition, heat can be efficiently dissipated.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view illustrating a heat dissipation structure according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a cross-sectional view illustrating a heat dissipation structure according to another embodiment of the present invention.

FIG. 4 is a perspective view for explaining a typical conventional heat dissipation structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Wireless apparatus 12, 22 Housing 13, 23 Heat radiating member 13a, 13b, 13c; 23a, 23b, 23c Heat radiating fin 14, 24 Support base 15, 25 Lid 16a, 16b, 16c Slit 17 Clearance 20 Support piece

Claims (1)

(57) [Scope of request for utility model registration] 1. An electronic device including a housing provided with a heat dissipating member having a plurality of heat dissipating fins erected on a support base, wherein a lid fitted to the housing is provided, and the lid is provided on the lid. A plurality of slits individually corresponding to each radiating fin of the heat radiating member, the width and depth of each slit are formed generally larger than that of the corresponding radiating fin, and the lid is When fitted to the housing, the tip of each of the radiating fins protrudes from the surface of the lid through a slit, and a cooling air flow path is formed between the radiating fin and the slit. Heat dissipation structure of electronic equipment.