JP2580798B2 - Transistor module for power converter - Google Patents

Transistor module for power converter

Info

Publication number
JP2580798B2
JP2580798B2 JP1271101A JP27110189A JP2580798B2 JP 2580798 B2 JP2580798 B2 JP 2580798B2 JP 1271101 A JP1271101 A JP 1271101A JP 27110189 A JP27110189 A JP 27110189A JP 2580798 B2 JP2580798 B2 JP 2580798B2
Authority
JP
Japan
Prior art keywords
transistor
terminal
connection
connection conductor
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1271101A
Other languages
Japanese (ja)
Other versions
JPH03132066A (en
Inventor
清志 飯田
喜隆 藤原
広志 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1271101A priority Critical patent/JP2580798B2/en
Publication of JPH03132066A publication Critical patent/JPH03132066A/en
Application granted granted Critical
Publication of JP2580798B2 publication Critical patent/JP2580798B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、トランジスタと、それらを保護するための
非対称素子およびコンデンサからなるスナバ回路とによ
って構成された電力変換装置に使用されるトランジスタ
モジュールに関する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transistor module used in a power conversion device including a transistor and a snubber circuit including an asymmetric element and a capacitor for protecting the transistor. .

〔従来の技術〕[Conventional technology]

電力変換装置に用いられるトランジスタモジュール
は、トランジスタだけあるいはトランジスタと並列また
は直列に接続され、トランジスタとは逆方向または同方
向に電流を流すダイオードとからなり、これらトランジ
スタとダイオードは同一の基板上に固着され、さらに一
つの容器に納められ、かつ主たる電流を流すための外部
端子とトランジスタを駆動するための端子とが容器の外
周部に設けられていた。更に、トランジスタのターンオ
フ時あるいはダイオードの逆回復時に回路の浮遊インダ
クタンスによって発生するサージ電圧が素子に印加さ
れ、素子が破壊するのを防止するために、特願平1-8311
号によりトランジスタの端子間に順方向電圧降下が小で
逆方向電圧降下が大である非対称素子、例えば、定電圧
ダイオードとコンデンサの直列回路からなるスナバ回路
を並列接続する方法が提案されている。第9図はこの回
路を示す。このようなトランジスタモジュールでは、ト
ランジスタ21のコレクタと定電圧ダイオード23のアノー
ドを導体で接続し、さらに定電圧ダイオード23のカソー
ドとトランジスタ21のエミッタとの間にコンデンサ24を
接続していた。しかし、このような構成においては以下
の問題点があった。
Transistor modules used in power converters consist of only transistors or diodes connected in parallel or in series with transistors and flowing current in the opposite direction or the same direction as the transistors, and these transistors and diodes are fixed on the same substrate. In addition, an external terminal that is housed in one container, and through which a main current flows, and a terminal that drives a transistor are provided on the outer peripheral portion of the container. Furthermore, in order to prevent the surge voltage generated by the floating inductance of the circuit from being applied when the transistor is turned off or the diode reversely recovers and the element is destroyed, Japanese Patent Application No. 1-8311 discloses
A method of connecting an asymmetric element having a small forward voltage drop and a large reverse voltage drop between terminals of a transistor, for example, a snubber circuit composed of a series circuit of a constant voltage diode and a capacitor in parallel has been proposed. FIG. 9 shows this circuit. In such a transistor module, the collector of the transistor 21 and the anode of the constant voltage diode 23 are connected by a conductor, and the capacitor 24 is connected between the cathode of the constant voltage diode 23 and the emitter of the transistor 21. However, such a configuration has the following problems.

(1) 定電圧ダイオードが発熱するため、これを放熱
させなければならないが、一般にスナバ回路はトランジ
スタ素子の容器の上部に設けられる配線用導体に取り付
けられるため充分に放熱できず、大きなチップサイズの
定電圧ダイオード素子を必要とする。
(1) Since the constant voltage diode generates heat, it must dissipate heat. However, in general, the snubber circuit cannot be sufficiently dissipated because it is attached to the wiring conductor provided on the upper part of the transistor element container. Requires a constant voltage diode element.

(2) 前記の問題を解決するため、トランジスタ素子
と同一冷却体上に定電圧ダイオード素子を取り付けた場
合、トランジスタ素子の端子との距離が長くなり、接続
のために別の配線用導体が必要となる。さらにコンデン
サとトランジスタの端子との間の配線が長くなり、これ
ら配線のもつインダクタンス分によりスバナ回路のサー
ジ電圧吸収効果が小さくなる。
(2) In order to solve the above problem, when a constant voltage diode element is mounted on the same cooling body as the transistor element, the distance from the terminal of the transistor element becomes longer, and another wiring conductor is required for connection. Becomes Further, the wiring between the capacitor and the terminal of the transistor becomes longer, and the inductance of these wirings reduces the surge voltage absorbing effect of the Suvana circuit.

これに対して、特願平1-161339号によって、第6図〜
第8図に示されるトランジスタモジュールが提案されて
いる。第6図は前記の提案における各素子および部品の
配置図で、例えば、銅からなる容器底部11の上に絶縁基
板2を介して銅からなる接続導体31,32,33,34が固定さ
れている。接続導体32の上には、トランジスタチップ41
が下面のコレクタ電極により、ダイオードチップ42が下
面のカソード電極により、定電圧ダイオードチップ43が
下面のアノード電極により固着されている。トランジス
タチップ41の上面のエミッタ電極は接続導体31と、ベー
ス電極は接続導体33と、ダイオードチップ42の上面のア
ノード電極は接続導体31と、また定電圧ダイオードチッ
プ43の上面のカソード電極は接続導体34とそれぞれ金属
細線5によって接続されている。第7図は第6図に示し
た底板11上に側壁12および上蓋13を組立ててなるトラン
ジスタモジュール容器の外観で、上蓋13上には、外部端
子、すなわちエミッタ(E)端子61,コレクタ(C)端
子62,ベース(B)端子63およびカソード(K)端子64
が設けられている。図示されない立上り部を介して、エ
ミッタ端子61は接続導体31とコレクタ端子62は接続導体
32と、ベース端子63は接続導体33と、カソード端子64は
接続導体34とそれぞれ接続されている。スナバ用のコン
デンサ7はエミッタ端子61とカソード端子64との間に接
続する。第8図はその等価回路を示す。前述の第9図と
回路上は同じである。
On the other hand, according to Japanese Patent Application No. 1-161339, FIG.
A transistor module shown in FIG. 8 has been proposed. FIG. 6 is an arrangement diagram of each element and component in the above proposal. For example, connection conductors 31, 32, 33, and 34 made of copper are fixed on a container bottom 11 made of copper via an insulating substrate 2. I have. On the connection conductor 32, a transistor chip 41
Are fixed by the collector electrode on the lower surface, the diode chip 42 is fixed by the cathode electrode on the lower surface, and the constant voltage diode chip 43 is fixed by the anode electrode on the lower surface. The emitter electrode on the upper surface of the transistor chip 41 is the connection conductor 31, the base electrode is the connection conductor 33, the anode electrode on the upper surface of the diode chip 42 is the connection conductor 31, and the cathode electrode on the upper surface of the constant voltage diode chip 43 is the connection conductor. 34 are connected to each other by thin metal wires 5. FIG. 7 is an external view of a transistor module container in which the side wall 12 and the upper lid 13 are assembled on the bottom plate 11 shown in FIG. 6. The upper terminal 13 has external terminals, ie, an emitter (E) terminal 61 and a collector (C). ) Terminal 62, base (B) terminal 63 and cathode (K) terminal 64
Is provided. The emitter terminal 61 is connected to the connection conductor 31 and the collector terminal 62 is connected to the connection conductor via a rising portion (not shown).
32, the base terminal 63 is connected to the connection conductor 33, and the cathode terminal 64 is connected to the connection conductor. The snubber capacitor 7 is connected between the emitter terminal 61 and the cathode terminal 64. FIG. 8 shows an equivalent circuit thereof. The circuit is the same as FIG. 9 described above.

このトランジスタモジュールの出力は使用される半導
体素子の容量により定まるが、これら半導体素子の容量
の大きさには限度があるので、トランジスタモジュール
の出力の増加のためにはこれら半導体素子を必要個数並
列に接続するようにする。
The output of this transistor module is determined by the capacity of the semiconductor elements used. However, since the capacity of these semiconductor elements is limited, in order to increase the output of the transistor module, a required number of these semiconductor elements are connected in parallel. Make a connection.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

前述の電力変換装置用トランジスタモジュールにおい
て、出力の増加のために各半導体素子を必要個数並列に
接続するようにするが、この場合、並列に接続された各
半導体素子とトランジスタモジュールの外部端子との位
置関係が異なるため、この間の配線のもつインダクタン
スが異なり、このためトランジスタにあっては、並列に
接続される素子間のON,OFF時刻にずれが生じその素子の
定格容量まで充分使用できない問題がある。定電圧ダイ
オードにおいても、このインダクタンスのずれにより均
等に負荷がかからず、同様定格容量まで充分使用できな
い問題がある。
In the above-described transistor module for a power converter, a required number of semiconductor elements are connected in parallel in order to increase the output. In this case, however, each semiconductor element connected in parallel is connected to an external terminal of the transistor module. Since the positional relationship is different, the inductance of the wiring during this period is different, which causes a problem in the transistor that the ON and OFF times between the elements connected in parallel deviate, and the rated capacity of the element cannot be used sufficiently. is there. Even in the case of a constant voltage diode, there is a problem that a load is not evenly applied due to the deviation of the inductance, so that the rated capacity cannot be sufficiently used.

本発明の課題は並列に接続された各半導体素子と外部
端子との配線をもつ各インダクタンスを等しくしたトラ
ンジスタモジュールを提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a transistor module having wirings of semiconductor devices connected in parallel and external terminals and having the same inductance.

〔課題を解決するための手段〕[Means for solving the problem]

前述の課題を解決するために、本発明にかかるトラン
ジスタモジュールは、一つの容器内に収容されるトラン
ジスタ素子と電流・電圧特性の順逆非対称素子とが容器
底板上の一接続導体上に各素子の一面側の電極を下にし
て固定され、他面側の電極はそれぞれ金属細線を介して
異なる接続導体とが接続され、さらにこれら接続導体
と、それぞれ容器の上蓋を介して容器外に引出されてな
る外部端子とが接続導線を介して接続されてなる電力変
換装置用トランジスタモジュールにおいて、前記トラン
ジスタ素子および前記非対称素子がそれぞれにおいて複
数個の並列接続からなり、該並列接続が少なくとも同種
の素子を別の接続導体上に固定して前記接続導線によっ
て並列接続するものを含んでおり、該並列接続する接続
導線がほぼ等しい長さからなるようにする。
In order to solve the above-described problems, a transistor module according to the present invention includes a transistor element housed in one container and a forward / reverse asymmetric element having current / voltage characteristics on one connection conductor on a container bottom plate. The electrodes on one side are fixed with the electrodes on the lower side, and the electrodes on the other side are connected to different connection conductors via thin metal wires, respectively, and these connection conductors are drawn out of the container via the upper lid of the container. In the transistor module for a power conversion device, the transistor element and the asymmetric element each include a plurality of parallel connections, and the parallel connection separates at least the same type of element. Fixed on the connection conductor of the connection conductor and connected in parallel by the connection conductor, and the connection conductors connected in parallel have substantially the same length. Ranaru so to.

〔作用〕[Action]

配線のもつインダクタンスは基本的に配線の長さに比
例する。本発明のトランジスタモジュールでは並列に接
続された各半導体素子のうち、少なくとも並列接続が同
種の素子を別の接続導体上に固定して接続導線によって
並列接続するものを含んでおり、該並列接続する接続導
線の長さを大略等しくして配線をするようにしたので、
そのインダクタンスは大略等しくなる。なお、並列に接
続される各半導体素子と外部端子の位置関係はそれぞれ
異なるため、接続導線は場合によっては途中で弛む場合
が生じるが、この場合は第3図に示す留め具により固定
するようにしたので問題は生じない。
The inductance of a wiring is basically proportional to the length of the wiring. In the transistor module of the present invention, among the semiconductor elements connected in parallel, at least the parallel connection includes one in which the same kind of element is fixed on another connection conductor and connected in parallel by a connection conductor, and the parallel connection is performed. Since the length of the connecting wire was made almost equal,
The inductances are approximately equal. In addition, since the positional relationship between each semiconductor element connected in parallel and the external terminal is different from each other, the connection conductor may be loosened in the middle in some cases, but in this case, the connection conductor should be fixed with the fastener shown in FIG. No problem arises.

〔実施例〕〔Example〕

第1図は本発明の一実施例における並列に接続された
各半導体素子と外部端子との配線図、第2図は第1図の
実施例における各半導体素子および部品の配置を示す平
面図である。この例ではトランジスタ4個、ダイオード
4個、定電圧ダイオード2個がそれぞれ並列に接続され
た場合を示している。
FIG. 1 is a wiring diagram of each semiconductor element connected in parallel and an external terminal in one embodiment of the present invention, and FIG. 2 is a plan view showing an arrangement of each semiconductor element and components in the embodiment of FIG. is there. This example shows a case where four transistors, four diodes, and two constant voltage diodes are connected in parallel.

第2図において、例えば銅からなる容器底部11の上に
絶縁基板2を介して銅からなる接続導体31A,32A,33A,34
A及び31B,32B,33B,34Bが固定されている。接続導体32A
の上には、トランジスタチップ41A及び41Bがそれぞれ下
面のコレクタ電極により、ダイオードチップ42A及び42B
がそれぞれ下面のカソード電極により、定電圧ダイオー
ドチップ43Aが下面のアノード電極により固着されてい
る。図を見やすくするために、詳細な図示は省略した
が、トランジスタチップ41A及び41Bの上面のエミッタ電
極は接続導体31Aと、ベース電極は接続導体33Aと、ダイ
オードチップ42A及び42Bの上面のアノード電極は接続導
体31Aと、また定電圧ダイオードチップ43Aの上面のカソ
ード電極は接続導体34Aとそれぞれ金属細線5によって
接続されている。また、接続導体32Bの上にはトランジ
スタチップ41C及び41Dがそれぞれ下面のコレクタ電極に
より、ダイオードチップ42C及び42Dがそれぞれ下面のカ
ソード電極により定電圧ダイオードチップ43Bが下面の
アノード電極により固着されている。前述と同様に図を
見やすくするために、詳細な図示は省略したが、トラン
ジスタチップ41C及び41Dの上面のエミッタ電極は接続導
体31Bと、ベース電極は接続導体33Bと、ダイオードチッ
プ42C及び42Dの上面のアノード電極は接続導体31Bと、
また定電圧ダイオードチップ43Bの上面のカソード電極
は接続導体34Bとそれぞれ金属細線5によって接続され
ている。第1図は第2図に示された各接続導体と各外部
端子との接続導線の配線図で、図中◎印で示される外部
端子、すなわちエミッタ(E)端子、コレクタ(C)端
子、ベース(B)端子、カソード(K)端子及び制御エ
ミッタ(E)端子は、図示の位置の上部のトランジスタ
モジュールの上蓋に取り付けられている。太線の点線は
外部端子と各接続導体との間の接続導線8である。各接
続導体には各半導体チップの電極が接続されている。す
なわち、エミッタ端子61と各トランジスタ41A,41B,41C,
41Dを接続する接続導線の内、一つはトランジスタ41A,4
1Bのエミッタが接続される接続導体31Aの両トランジス
タのエミッタの接続された点のほぼ中間よりエミッタ端
子61へ、他の一つはトランジスタ41c,41Dのエミッタが
接続された接続導体31Bの両トランジスタのエミッタの
接続された点のほぼ中間よりエミッタ端子61へ接続され
る。この場合、これらの接続導線は長さの等しいものを
用いる。このようにしてエミッタ端子61から各トランジ
スタへの接続導線によるインダクタンスはほぼ等しくな
る。同様な方法でコレクタ端子62はコレクタの接続され
ている接続導体32A及び32Bとの間を、ベース端子はベー
スの接続されている接続導体33A及び33Bとの間を、カソ
ード端子64は非対称素子のカソードが接続されている接
続導体34A及び34Bとの間をそれぞれ等しい長さの接続導
線8で接続している。コレクタ端子62、ベース端子63、
カソード端子64の接続導線に見られるように、端子と各
接続導体の位置関係から、二個の接続導体の長さを等し
くすると場合によっては途中で弛む場合が生じるが、こ
の場合は第1図のP部に示すように、接続導体を保持す
るようにする。P部の詳細は第3図に示すが、図の如き
留め具9で接続導体を保持する。
In FIG. 2, connection conductors 31A, 32A, 33A, 34 made of copper are placed on a container bottom 11 made of, for example, copper via an insulating substrate 2.
A and 31B, 32B, 33B, 34B are fixed. Connection conductor 32A
Above, transistor chips 41A and 41B are respectively connected to diode chips 42A and 42B by collector electrodes on the lower surface.
Are fixed by the cathode electrode on the lower surface, and the constant voltage diode chip 43A is fixed by the anode electrode on the lower surface. For simplicity of illustration, detailed illustration is omitted, but the emitter electrode on the upper surface of the transistor chips 41A and 41B is the connection conductor 31A, the base electrode is the connection conductor 33A, and the anode electrode on the upper surface of the diode chips 42A and 42B is The connection conductor 31A and the cathode electrode on the upper surface of the constant voltage diode chip 43A are connected to the connection conductor 34A by the thin metal wires 5, respectively. Further, on the connection conductor 32B, the transistor chips 41C and 41D are fixed by the lower collector electrode, the diode chips 42C and 42D are fixed by the lower cathode electrode, and the constant voltage diode chip 43B is fixed by the lower anode electrode. Similar to the above, detailed illustration is omitted to make the drawing easy to see, but the emitter electrode on the upper surface of the transistor chips 41C and 41D is the connection conductor 31B, the base electrode is the connection conductor 33B, and the upper surfaces of the diode chips 42C and 42D are The anode electrode of the connection conductor 31B and
The cathode electrode on the upper surface of the constant voltage diode chip 43B is connected to the connection conductor 34B by the thin metal wire 5, respectively. FIG. 1 is a wiring diagram of connection wires between each connection conductor and each external terminal shown in FIG. 2, and external terminals indicated by ◎ in the figure, ie, an emitter (E) terminal, a collector (C) terminal, The base (B) terminal, the cathode (K) terminal, and the control emitter (E) terminal are attached to the upper lid of the transistor module at the upper part of the drawing. The bold dotted line is the connection conductor 8 between the external terminal and each connection conductor. The electrode of each semiconductor chip is connected to each connection conductor. That is, the emitter terminal 61 and each of the transistors 41A, 41B, 41C,
One of the connecting wires connecting 41D is a transistor 41A, 4
The emitter of the connection conductor 31A to which the emitter of 1B is connected is connected to the emitter terminal 61 from almost the midpoint of the connection point of the emitters of the two transistors. Are connected to the emitter terminal 61 from almost the middle of the point where the emitters are connected. In this case, these connection conductors have the same length. In this way, the inductance of the connection conductor from the emitter terminal 61 to each transistor becomes substantially equal. In a similar manner, the collector terminal 62 is between the connection conductors 32A and 32B to which the collector is connected, the base terminal is between the connection conductors 33A and 33B to which the base is connected, and the cathode terminal 64 is the asymmetric element. The connecting conductors 34A and 34B to which the cathodes are connected are connected by connecting wires 8 having the same length. Collector terminal 62, base terminal 63,
As can be seen from the connection conductor of the cathode terminal 64, if the lengths of the two connection conductors are made equal from each other, depending on the positional relationship between the terminal and each connection conductor, the connection conductor may loosen in some cases. As shown in the section P, the connection conductor is held. The details of the portion P are shown in FIG. 3, but the connecting conductor is held by a fastener 9 as shown.

なお、本例ではトランジスタの制御用にベース
(B)、端子63と隣接して制御エミッタ(E)端子67を
設け、容器内で接続してある。これによって、トランジ
スタモジュールの外部の制御線の配線がより容易にな
る。
In this embodiment, a control emitter (E) terminal 67 is provided adjacent to the base (B) and the terminal 63 for controlling the transistor, and is connected in the container. Thereby, wiring of the control line outside the transistor module becomes easier.

第4図は第2図に示した容器底板11上に側壁及び上蓋
を組み立ててなるトランジスタモジュールの平面図であ
り、外部端子、すなわち、エミッタ(E)端子61、コレ
クタ(C)端子62、ベース(B)端子63、カソード
(K)端子64、制御エミッタ(E)端子67の位置は第1
図のそれと対応している。スナバ回路用のコンデンサ7
はカソード端子64とエミッタ端子61との間に接続するよ
うにする。
FIG. 4 is a plan view of a transistor module obtained by assembling a side wall and an upper lid on the container bottom plate 11 shown in FIG. 2, and includes external terminals, that is, an emitter (E) terminal 61, a collector (C) terminal 62, and a base. The positions of the (B) terminal 63, the cathode (K) terminal 64, and the control emitter (E) terminal 67 are the first position.
It corresponds to that in the figure. Capacitor for snubber circuit 7
Is connected between the cathode terminal 64 and the emitter terminal 61.

第5図はこのようにして得られたトランジスタモジュ
ールの回路図である。
FIG. 5 is a circuit diagram of the transistor module thus obtained.

〔発明の効果〕〔The invention's effect〕

本発明によれば、電力変換装置用モジュールにおい
て、各半導体素子を並列に接続する場合に、少なくとも
並列接続が同種の素子を別の接続導体上に固定して接続
導線によって並列接続するものを含んでおり、該並列接
続する接続導線の長さを等しくして、この配線のもつイ
ンダクタンスを等しくしたので、並列に接続される各素
子に均等に負荷がかかるようになり、各素子の定格容量
まで充分使用できるようになった。これによって従来の
トランジスタモジュールに比して5〜8%出力が増加し
た。
According to the present invention, in the power conversion device module, when each semiconductor element is connected in parallel, at least the parallel connection includes one in which the same kind of element is fixed on another connection conductor and connected in parallel by a connection conductor. Since the lengths of the connecting wires connected in parallel were made equal and the inductance of this wiring was made equal, loads were equally applied to the elements connected in parallel, up to the rated capacity of each element. It has become fully usable. This increased the output by 5 to 8% compared to the conventional transistor module.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の一実施例における並列に接続された各
半導体素子と外部端子との配線図、第2図は第1図の実
施例における各半導体素子および部品の配置を示す平面
図、第3図は第1図のP部の拡大詳細図、第4図は第2
図の容器底板上に組み立てられた本発明にかかる電力変
換装置用トランジスタモジュールの平面図、第5図は第
4図に示した電力変換装置用トランジスタモジュールの
等価回路図、第6図は従来の電力変換装置用トランジス
タモジュールにおける容器底板上の素子および部品の配
置を示す斜視図、第7図は第6図の容器底板上に組み立
てられた従来の電力変換装置用トランジスタモジュール
の斜視図、第8図は第7図に示した従来の電力変換装置
用トランジスタモジュールの等価回路図、第9図は特願
平1-8311号に示されるスナバ回路の回路図である。 41A,41B,41C,41D……トランジスタ、43A,43B,43C,43D…
…定電圧ダイオード、61……エミッタ(E)端子(外部
端子)、62……コレクタ(C)端子(外部端子)、63…
…ベース(B)端子(外部端子)、64……カソード
(K)端子(外部端子)、8……接続導線。
FIG. 1 is a wiring diagram of each semiconductor element connected in parallel and an external terminal in one embodiment of the present invention, FIG. 2 is a plan view showing an arrangement of each semiconductor element and components in the embodiment of FIG. FIG. 3 is an enlarged detailed view of a portion P in FIG. 1, and FIG.
FIG. 5 is a plan view of a transistor module for a power converter according to the present invention assembled on the container bottom plate shown in FIG. 5, FIG. 5 is an equivalent circuit diagram of the transistor module for a power converter shown in FIG. 4, and FIG. FIG. 7 is a perspective view showing the arrangement of elements and components on a container bottom plate in a transistor module for a power converter, FIG. 7 is a perspective view of a conventional transistor module for a power converter assembled on the container bottom plate in FIG. 6, and FIG. FIG. 1 is an equivalent circuit diagram of the conventional transistor module for a power converter shown in FIG. 7, and FIG. 9 is a circuit diagram of a snubber circuit disclosed in Japanese Patent Application No. 1-8311. 41A, 41B, 41C, 41D …… Transistors, 43A, 43B, 43C, 43D…
... constant voltage diode, 61 ... emitter (E) terminal (external terminal), 62 ... collector (C) terminal (external terminal), 63 ...
... Base (B) terminal (external terminal), 64... Cathode (K) terminal (external terminal), 8.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平3−136412(JP,A) 特開 平3−108749(JP,A) 特開 昭59−68958(JP,A) 特開 昭61−139051(JP,A) 特開 平2−130954(JP,A) 実開 昭60−151186(JP,U) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-136412 (JP, A) JP-A-3-108749 (JP, A) JP-A-59-68958 (JP, A) JP-A-61-68 139051 (JP, A) JP-A-2-130954 (JP, A) JP-A-60-151186 (JP, U)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】一つの容器内に収容されるトランジスタ素
子と電流・電圧特性の順逆非対称素子とが容器底板上の
一接続導体上に各素子の一面側の電極を下にして固定さ
れ、他面側の電極はそれぞれ金属細線を介して異なる接
続導体と接続され、さらにこれら接続導体と、それぞれ
容器の上蓋を介して容器外に引出されてなる外部端子と
が接続導線を介して接続されてなる電力変換装置用トラ
ンジスタモジュールにおいて、前記トランジスタ素子お
よび前記非対称素子がそれぞれにおいて複数個の並列接
続からなり、該並列接続が少なくとも同種の素子を別の
接続導体上に固定して前記接続導線によって並列接続す
るものを含んでおり、該並列接続する接続導線がほぼ等
しい長さからなることを特徴とする電力変換装置用トラ
ンジスタモジュール。
1. A transistor element accommodated in one container and a forward / reverse asymmetric element having a current / voltage characteristic are fixed on one connection conductor on a container bottom plate with an electrode on one side of each element facing down. The surface-side electrodes are respectively connected to different connection conductors via thin metal wires, and further, these connection conductors and external terminals which are respectively drawn out of the container via the upper lid of the container are connected via connection conductors. In the transistor module for a power conversion device, the transistor element and the asymmetric element each include a plurality of parallel connections, and the parallel connection is such that at least the same type of element is fixed on another connection conductor and the connection is performed in parallel by the connection conductor. A transistor module for a power converter, wherein the connection conductors connected in parallel have substantially the same length. .
JP1271101A 1989-10-18 1989-10-18 Transistor module for power converter Expired - Lifetime JP2580798B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1271101A JP2580798B2 (en) 1989-10-18 1989-10-18 Transistor module for power converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1271101A JP2580798B2 (en) 1989-10-18 1989-10-18 Transistor module for power converter

Publications (2)

Publication Number Publication Date
JPH03132066A JPH03132066A (en) 1991-06-05
JP2580798B2 true JP2580798B2 (en) 1997-02-12

Family

ID=17495363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1271101A Expired - Lifetime JP2580798B2 (en) 1989-10-18 1989-10-18 Transistor module for power converter

Country Status (1)

Country Link
JP (1) JP2580798B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141463A (en) * 2000-10-31 2002-05-17 Mitsubishi Electric Corp Semiconductor module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968958A (en) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp Gate turn-off thyristor assembled body
JPS61139051A (en) * 1984-12-11 1986-06-26 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPH03132066A (en) 1991-06-05

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