JP2580491Y2 - IC transport mechanism with lead frame by carrier - Google Patents

Description

[Detailed description of the invention]

[0001]

This invention relates to an IC carrier with a lead frame for contacting or carrying a plurality of IC sockets attached to a contact board while a plurality of ICs with a lead frame are kept in a carrier. It is about the mechanism.

[0002]

2. Description of the Related Art The construction of a conventional transfer mechanism for an IC with a lead frame will be described with reference to FIG. 3 in FIG.
Is a contact board, 4 is a tray, 5 is a thermostat, 6 is a supply plate, 7 is a suction hand, 8 is a storage plate, and 9 is a classification tray. In FIG. 6, the IC with the lead frame is sucked and transported by the suction hand 7, the IC with the lead frame is transferred from the supply plate 6 to the contact board 3 in the thermostat 5, and the IC with the lead frame is transferred to the IC socket 3 A of the contact board 3. Contact. After measuring the IC with the lead frame by the contact board 3, the IC is attached by suction with the suction hand 7, and the IC with the lead frame is transferred from the contact board 3 to the accommodation plate 8, and from the accommodation plate 8 to the classification tray 9.

The time required to transfer the IC with the lead frame from the contact board 3 to the receiving plate 8 and the time required to transfer the IC with the lead frame from the supply plate 6 to the contact board 3 is the time from the end of measurement to the start of measurement. There is no problem when measuring a small number of ICs with lead frames, but when simultaneously measuring a large number of ICs with lead frames, it is required to shorten the time from the end of measurement to the start of measurement.

[0004]

In FIG. 6, after the measurement is completed, the IC with the lead frame is transferred to the accommodation plate 8 by the suction hand 7, and the next IC with the lead frame is transferred from the supply plate 6 to the contact board 3 by the suction hand 7. Takes a long time to move, and jamming may occur when moving. In order to shorten the time from the end of measurement to the start of measurement and reduce the occurrence of jamming, this invention uses a plurality of IC sockets attached to a contact board while keeping a plurality of ICs with lead frames in a carrier. It is an object of the present invention to provide a lead frame-equipped IC transport mechanism for simultaneously contacting a lead frame-equipped IC.

[0005]

In order to achieve this object, according to the present invention, a plurality of tapered holes 2B having guide holes 2A at both ends and accommodating a plurality of ICs 1 with lead frames are provided.
And a plurality of holes 2 that are not in contact with the leads 1A of the IC 1 with a lead frame housed in the recess 2C.
D, and a contact board 3 having guide pins 3A attached to both ends and a plurality of IC sockets 3B attached thereto. The carrier 2 containing the IC 1 with a lead frame is transported, and a guide is inserted into the guide hole 2A. By inserting the pin 3A, the IC 1 with the lead frame housed in the recess 2C is transferred onto the IC socket 3B of the contact board 3 and makes contact therewith.

[0006]

Next, the configuration of an IC transport mechanism with a lead frame using a carrier according to the present invention will be described with reference to FIG. 1 is a carrier, and 3 is a contact board. The carrier 2 has guide holes 2A at both ends, and is provided with a plurality of concave portions 2C having a plurality of tapered portions 2B for accommodating a plurality of ICs 1 with lead frames. The recess 2C is provided with a plurality of holes 2D that are not in contact with the leads 1A of the accommodated IC 1 with a lead frame. Guide pins 3A are attached to both ends of the contact board 3, and a plurality of IC sockets 3B that are in contact with the IC 1 with a lead frame accommodated in the recess 2C at the hole 2D are attached.

Next, a state in which the carrier 2 of FIG. 1 is mounted on the contact board 3 will be described with reference to FIG. When the guide pin 3A of the contact board 3 is inserted into the guide hole 2A of the carrier 2, the IC 1 with a lead frame accommodated in the carrier 2 comes into contact with the IC socket 3B of the contact board 3. Reference numeral 10 in FIG. 2 denotes a lead pusher, which presses an IC 1 with a lead frame to thereby obtain an I with a lead frame.
C1 is securely brought into contact with the IC socket 3B. That is, the measurement is performed with the IC 1 with the lead frame inserted in the carrier 2.

Next, an example of circulation by the carrier 2 will be described with reference to FIG. As shown in FIG. 4, the IC 1 with the lead frame before measurement is transferred from the tray 4 to the carrier 2 by the suction hand 7.
Put on. FIG. 4 shows the state of the supply unit 11 in FIG. 3, and the IC 1 with the lead frame is moved from the tray 4 to the carrier 2,
The IC 1 with the lead frame is preheated by the preheating unit 12 in the thermostat 5. The measuring unit 13 measures the IC 1 with a lead frame, and the carrier 2 is pulled out to the housing unit 14. Classification is performed on the classification tray 9 in the storage unit 14. According to FIG. 3, a plurality of ICs with lead frames can be transported and measured in the carrier 2, and the time from the end of measurement to the start of measurement can be shortened. Further, since there is no delivery of the IC 1 with a lead frame in the thermostat 5, jamming in the thermostat 5 can be reduced.

[0009]

Next, the structure of the measuring section 13 shown in FIG. 3 will be described with reference to FIG. In the first step, the carrier 2 is positioned along the guide pins 3A provided on the contact board 3. In the second step, the IC 1 with the lead frame is positioned by the guide 3C provided on the IC socket 3B. The IC 1 with the lead frame in the carrier 2 is an IC
It is moved onto the socket 3B. The carrier 2 is further lowered from the IC contact position, and the IC 1 with the lead frame and the carrier 2 are separated. At this time, the displacement caused by the thermal expansion of the carrier 2 can be solved by setting the IC 1 with the lead frame to a state in which the IC 1 can be finely moved in the carrier 2. Also,
At the end of the contact, the IC 1 with a lead frame can be transported reliably with the rise of the carrier 2, so that the IC 1 with a lead frame on the IC socket 3B does not remain.

[0010]

According to the present invention, since a large number of ICs with lead frames are transported simultaneously by the carrier, the number of jams in the tank can be reduced, and the time from the end of measurement to the start of measurement can be shortened. it can.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a transport mechanism of an IC with a lead frame according to the present invention.

FIG. 2 is a view showing a state where the carrier 2 of FIG. 1 is placed on a contact board 3;

FIG. 3 is an explanatory diagram of circulation by a carrier 2;

FIG. 4 is a diagram showing a state in which the IC 1 with a lead frame is placed on the carrier 2 by the suction hand 7;

FIG. 5 is a structural diagram of a measuring unit 13 of FIG.

FIG. 6 is a configuration diagram of a transport mechanism of an IC with a lead frame according to the related art.

[Explanation of symbols]

 Reference Signs List 1 IC with lead frame 1A lead 2 carrier 2A guide hole 2B taper 3 contact board 3A guide pin 3B IC socket 3C guide

Claims (1)

(57) [Scope of request for utility model registration] 1. A plurality of tapered recesses (2C) having guide holes (2A) at both ends and accommodating a plurality of ICs (1) with a lead frame are provided in said recesses (2C). A carrier (2) having a plurality of holes (2D) that are not in contact with the leads (1A) of the accommodated IC (1) with a lead frame, and guide pins (3A) attached to both ends, and a plurality of ICs A contact board (3) to which a socket (3B) is attached, and a carrier (2) accommodating the IC (1) with a lead frame.
And by inserting the guide pin (3A) into the guide hole (2A), the IC (1) with the lead frame housed in the recess (2C) is inserted into the IC socket (3B) of the contact board (3). ) A lead frame-equipped IC transport mechanism using a carrier, which is mounted on and comes into contact with the carrier.