JP2574976Y2 - Jig for paste filling - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for filling a through-hole for a through hole provided in a substrate for manufacturing a printed wiring board with a conductive or insulating hardening type paste.

More specifically, a novel method is provided in which a paste can be filled in a through hole for a through-hole provided in the substrate by being interposed between the substrate and a suction mechanism so that the paste protrudes from both sides of the through-hole. This is a paste filling jig.

[0003]

2. Description of the Related Art As a method for filling a paste into a through-hole of a substrate having a through-hole for a through-hole, an upper opening of a suction chamber is closed by the substrate, and the pressure in the suction chamber is reduced. A method of filling a paste into a through hole for a through hole by a method such as printing or roll printing is known.

[0004] However, in the above method, when the substrate is thin, the substrate is curved at the time of filling with the paste, and there is a problem that the filling of the paste near the central portion is not sufficiently performed.

Therefore, a plate-shaped jig having a through-hole at a position corresponding to the through-hole for a through-hole is mounted on the top of the suction chamber.
A method has also been proposed in which a suction stage, which is a well plate, is provided and interposed between the suction stage and a substrate.

The fixing of the substrate at a predetermined position on the jig is generally performed by providing a through-hole in the jig corresponding to a portion of the substrate where no through-hole exists, and using a suction force of a suction chamber.

However, in the above method, when the through holes for through holes are different in size, or when the through holes for through holes are close to each other, the through holes provided in the jig are correspondingly overlapped to form a large hole. When the holes are formed, a difference occurs in the suction force between the holes, and as a result, there is a problem that the filling state of the paste in each through-hole for a through-hole varies. In order to solve such a problem, a method of forming an orifice in each hole of the jig to make the suction pressure uniform has been proposed, but it is difficult to form the orifice, which is not practical.

Further, according to the above method, the jig is used to
While the through holes for through holes are sucked, the through holes are sequentially filled with the paste, so that the suction pressure in the remaining through holes for through holes gradually increases, and the filling amount in the through holes for through holes is reduced. If the through holes are changed or the through holes are formed continuously, the strength of the jig will be reduced.In some cases, a notch is formed in the jig within the area surrounded by the through hole. Sometimes I did.

[0009]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to uniformly and reliably apply paste to the through-holes regardless of the size difference of the through-holes provided in the substrate. To provide a paste filling jig which can be formed to protrude from both ends of the paste.

[0010]

Means for Solving the Problems In order to solve such problems, the present inventors have intensively studied . As a result,
From the upper opening surface of the through hole for the through hole provided on the plate
Communicates with the lower surface of the substrate and the suction chamber when filling with paste
Between the suction stage and the suction stage
A plate-shaped jig used in such a manner that a non-penetrating recess having a larger diameter than the through hole is formed at a position corresponding to the through hole for the through hole of the substrate, and at a position other than the recess and
A penetration is formed at a position corresponding to the suction hole of the suction stage.
By using a paste filling jig
All the problems are solved, and in some cases, when the paste is filled into the substrate, the closed space formed by the paste and the concave portion acts as a resistance to prevent excessive filling of the paste, and the filling of the paste with an appropriate protrusion amount And found that the present invention can be performed.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to these accompanying drawings.

FIGS. 1A and 1B show a typical embodiment of a paste filling jig according to the present invention, wherein FIG.
It is A 'sectional drawing.

That is, the paste filling jig 1 of the present invention comprises:
From the upper opening surface of the through hole for the through hole provided on the substrate
Ri when filling the paste, with the suction chamber and the lower surface of the substrate
Interposed between the suction stage and the suction stage with many suction holes
A plate-shaped jig that is used by, at positions corresponding to the through holes for through-hole of the substrate to form a recess 3 of the large diameter non-through from the through hole, further portions other than the recess And
It is configured by forming the penetrating portion 2 at a position corresponding to the suction hole of the suction stage .

In the present invention, the concave portion 3 of the paste filling jig is not particularly limited as long as it has a larger diameter than the through hole for the through hole into which the paste of the substrate is to be filled and is a non-through hole. It is preferable that the diameter is larger by 110 to 500% than the diameter of the through hole for a through hole.
That is, when the diameter of the concave portion is smaller than 110%, the filled paste adheres to the jig, and as a result, the shape of the paste protruding from the substrate is destroyed, and the work of removing the adhered paste from the jig is performed. Tends to be needed. Further, when the diameter of the concave portion is too large, as described later, depending on the position of the through hole for a through hole, the number of cases where the concave portions overlap to form a continuous hole increases, and as a result, the filling surface is easily deformed. And it tends to be difficult to uniformly fill the paste.

The size of the recess provided in the jig may be determined in accordance with the amount of the paste projected after filling the through hole for the through hole of the substrate with the paste. Generally, it is preferable that the volume is set to be 1.5 to 10 times the volume of the paste.

In the present invention, there is no particular limitation on the method of forming the concave portion in the plate-like material constituting the jig. In general, a method of forming a hole at a predetermined position on a flat plate by a drill having an appropriate diameter to a predetermined depth, a method of single-sided etching, and the like are given. In some cases, the jig having the concave portion may be directly formed by integral molding.

In another embodiment, a jig is formed by laminating a plate-shaped object 1-a having a through hole and a plate-shaped object 1-b having no through hole as shown in a sectional view of FIG. It is also possible.

Further, in the present invention, in order to fix the substrate to the jig by the suction mechanism, the through-hole 2 for sucking the substrate is provided at a position other than the concave portion of the jig and at a position corresponding to the suction hole of the suction stage. to form. The shape and size of the penetrating portion 2 are not particularly limited, and may be appropriately determined according to the position of the concave portion 3 and the like. By placing the substrate on the suction stage via the jig having the above structure, the substrate is fixed by suction from the suction through hole.

As the material of the paste filling jig of the present invention, a known structural material is used without any particular limitation. For example , polypropylene, polyethylene, resins such as polyvinyl chloride,
Trees and the like. Other well-known substrate materials, such as a glass woven substrate copper-clad laminate, a paper substrate phenol resin copper-clad laminate, and a polyester film copper-clad laminate, can also be used.

FIG. 3 is a process chart showing a typical mode of a method of filling a through-hole for a through hole of a substrate with a paste using the paste filling jig of the present invention.

The following is a description based on FIG.

(A) As a suction mechanism, a paste filling jig 1 is stacked on a suction stage 4 having a large number of suction holes communicating with a suction chamber 5 with a concave portion 3 facing upward. The substrate 7 is laminated on the substrate 1 such that the positions of the concave portion 3 and the through-hole 8 for the through-hole coincide with each other. Reference numeral 6 denotes a gas suction port.

In this case, the substrate is fixed on the stage 4 together with the jig by suction from the gas suction chamber through the suction penetrating portion 2 provided in the jig 1.

(C) Next, the paste 11 is pushed into the through-hole 8 with a squeegee 10 through a mask 7 having a through-hole at a position corresponding to the through-hole for through-hole. Uniform protrusions 12 on both sides of the through hole
To obtain a substrate filled with the paste so as to form.

When the method of fixing a substrate by suction is performed, the size of the paste filling jig is preferably larger than the size of the substrate. That is, when the size of the jig is smaller than that of the substrate, the substrate may warp when the paste is filled, and may cause a suction leak at the time of gas suction.

A known substrate can be used as the substrate 7 without any limitation. For example, a rigid board, a flexible board, a green sheet, and the like generally used as a printed circuit board, such as a glass woven fabric base epoxy resin copper-clad laminate, a paper base phenol resin copper-clad laminate, a polyester film copper-clad laminate, and the like. Metal core substrates, etc.
Substrates and the like generally used as electronic component materials are exemplified. The substrate may be plated with metal such as copper plating, or a circuit pattern may be formed in advance.

The method of filling the paste using the paste filling jig of the present invention can employ any known filling method without limitation. For example, a printing method using the screen, letterpress, roll or the like can be used. Is mentioned. As the paste to be filled, a known curable paste can be used without limitation, for example, those having properties such as conductivity, semi-conductivity, insulation, adhesion, acid resistance, and alkali resistance, and thermosetting And those having properties such as properties, photocurability, and dry curability.

The substrate having the projections of the filled paste obtained on both sides obtained by the jig of the present invention may be formed, for example, by grinding the projections when the paste is a curable conductive paste. The surface of the substrate including the surface can be made smooth. Thus, a substrate having a smooth surface is advantageous in that a circuit pattern can be further formed on the smooth surface.

[0029]

According to the paste filling jig of the present invention, a non-penetrating concave portion is formed corresponding to the through hole for a through hole. Therefore, a substrate is provided on the suction stage via the jig.
When the paste is filled in the through holes for through holes of the substrate, there are the following advantages over the conventional jig.

(1) Variations in the amount of paste to be filled can be prevented due to the difference in the size of the through hole or the difference in the size of the through hole provided in the jig.

(2) The suction pressure of the remaining through-hole through-hole does not change as the paste is filled in the through-hole through-hole of the substrate.

(3) Even when the through-holes for the through-holes of the substrate exist continuously, the strength of the jig is not extremely reduced.

(4) Since there is no through hole of the jig at a position other than the penetrating portion for sucking the substrate , suction leakage is small, and good fixation of the substrate can be achieved even with a small suction force.

(5) When the substrate is filled with the paste, the closed space formed by the paste and the concave portion acts as a resistance for preventing the paste from being excessively filled, and the paste can be filled with an appropriate amount of protrusion. .

[0035]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the invention thereto.

Example 1 A paste filling jig 1 of the embodiment shown in FIG. 1 was used. The paste filling jig 1 was made of a 1.6 mm thick glass base epoxy resin plate, and had four through holes 2 for sucking the substrate at one end and one at the center. Furthermore, the paste filling jig 1 has a through hole for a through hole (volume per hole; 0.2 m
m ² ) A non-penetrating concave portion 3 having a radius of 2 mm and a maximum depth of 1 mm corresponding to 8 was used.

Using the paste filling jig 1 described above, the conductive paste 11 was filled in the through holes 8 of the substrate 7 while adsorbing the substrate by gas suction in accordance with the process shown in FIG. . That is, first, the paste filling jig 1 was brought into contact with the gas suction stage and fixed by suction. Next, a substrate 7 having a through hole 8 for a through hole was brought into contact with the jig 1 for filling paste, and the pressure was 500 mmA.
The substrate 7 was suction-fixed by the gas suction from the suction chamber 5 of the gas suction stage at q.

As the substrate 7, a 1.6 mm thick non-woven glass substrate epoxy copper clad laminate (CEM-3)
Having a through-hole 6 for a through-hole having a diameter of 0.4 mm.

Next, a mask 9 for filling is placed on the substrate 5.
And the conductive paste 11 was filled with the squeegee 10. Thereafter, the filling mask 9 was removed, the gas suction was stopped, and a substrate in which the conductive paste 11 was filled in the through holes 8 for through holes was obtained.

Observation of the filling state of the obtained substrate 7 into 200 through-holes 8 for through-holes revealed that each had uniform projections on both sides of the through-holes for through-holes and filled the paste inside. The condition was also good.

On the other hand, the result of filling the curable conductive paste under the same conditions as above using a jig having a through-hole having the same pattern as the concave portion of the paste filling jig of the present invention was formed. The filling state of the part where the through-holes of the jig overlapped each other alone was excessively filled and the paste was present on one side of the backside.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view and a top view of a paste filling jig showing a typical embodiment of the present invention.

FIG. 2 is a sectional view of a paste filling jig showing a typical embodiment of the present invention.

FIG. 3 is a process diagram showing a typical filling method using the paste filling jig of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Paste filling jig 2 Substrate adsorption through-hole provided in paste filling jig 3 Non-penetrating recess corresponding to through hole for through hole of substrate 4 Suction stage 5 Suction chamber 6 Suction port 7 Substrate 8 Through hole Through hole 9 for mask 10 Squeegee 11 Paste 12 Projection

Claims (1)

(57) [Scope of request for utility model registration] 1. A through hole for a through hole provided in a substrate.
When filling the paste from the upper opening surface , the lower surface of the substrate
Stage having a number of suction holes communicating with the suction chamber
A plate-shaped jig to be used by interposing between the non-through recess of larger diameter than said through holes at positions corresponding to the through holes for through-hole of the substrate is formed, further recess Less than
Outside position corresponding to the suction hole of the suction stage
Filling jig with a penetrating part formed in the holder.