JP2570619B2 - Multilayer printed wiring board and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method for manufacturing the same, and more particularly, to a multilayer printed wiring board and a method for manufacturing the same which can easily confirm the order of lamination.

[0002]

2. Description of the Related Art In an example of a conventional laminating operation, a worker orders the laminating order displayed on a work drawing for instructing a laminating operation by a symbol of an inner printed wiring board (hereinafter referred to as an inner layer plate) and a symbol of a drawing. While confirming the above, the inner layer plate is selected and stacked without mistake.

[0003] Alternatively, a method of arranging and confirming a symbol at a predetermined position in each inner layer plate, for example, as shown in FIG. 10 disclosed in Japanese Patent Application Laid-Open No. 2-54995, discloses a plurality of inner layer plates 8a to 8a. 8d, a series of symbols A9a to D indicating the order of lamination
9d and the stacked display in which the shielding patterns 10a to 10d having the same size or more as the series symbols A9a to D9d are arranged adjacent to each other in the stacking order of the inner layers 8a to 8d. If the stacking order is normal, as shown in FIG.
A series of symbols A9a to D9d in a to 8d can be decoded by being arranged in the stacking order, and if the stacking order is different, as shown in FIG. 11B, a part B9b of the series of symbols A9a to D9d is covered by shielding patterns 10c and 10d. A9a-D9 for shielding
d is not aligned and can not be decoded. Thus, the sequence symbol A9
a to D9d were found to find a misalignment in the stack.

[0004]

However, according to the prior art, a series of symbols cannot be deciphered visually after the lamination is assembled, and a device that transmits the inner layer plate after the lamination is assembled, that is, X is used.
A wire device is required. That is, expensive investment is required. In addition, the X-ray device installation location and the
Equipment and the like for transporting inside the wire device are required, and the equipment becomes considerably large.

SUMMARY OF THE INVENTION An object of the present invention is to provide a highly reliable inner layer printed wiring board which can surely prevent erroneous incorporation of laminations without the necessity of introducing new equipment and the like, and a method of manufacturing the same. I do.

[0006]

According to a first aspect of the present invention, there is provided a multilayer printed wiring board having at least a first through hole provided at a first position and a first through hole connected to the first through hole. A first land printed wiring board having a first land provided at position 2; a second land provided on a surface of the second position facing the first land at the second position; A second through hole connected to the second land and provided at a third position and a third land connected to the second through hole and provided at a fourth position on the back surface of the second land. A second inner printed wiring board having the second inner printed wiring board and the second inner printed wiring board laminated between the second inner printed wiring board and the first inner printed wiring board.
And a conductive member fitted into the through hole and connecting the first land and the second land.

A multilayer printed wiring board according to a second aspect of the present invention has at least a first through hole provided at a first position and a second through hole connected to the first through hole and located at an inner layer side. A first inner-layer printed wiring board having a first land, a through-hole provided at the first position to form the first through-hole and the front-back through-hole, and the second inner-layer printed wiring board at the second position. A second land provided on a surface facing the first land, a second through hole connected to the second land and connected to the second land, and a second land connected to the second through hole and connected to the second through hole; A second inner-layer printed wiring board having a third land provided at a fourth position on the back surface of the land, and between the second inner-layer printed wiring board and the first inner-layer printed wiring board A pre-stack having through holes at the first position and the second position which is laminated A leg and, a conductive member connecting the is fitted into each of the through holes and the first land and the second land and the first through hole and the through hole of the prepreg.

The method of manufacturing a multilayer printed wiring board according to the present invention comprises the steps of: forming a hole in an insulating substrate; forming a plurality of inner printed wiring boards by providing a wiring pattern, through holes and lands at predetermined positions; A step of forming a through hole at a predetermined position, a step of inserting a conductive member into the through hole, inserting the prepreg between the inner layer printed wiring boards and laminating, and forming an outermost layer of the laminated inner layer printed wiring board. The method includes a step of checking the state of lamination of the inner layer printed wiring board by conduction between through holes or lands, and a step of crimping the laminated inner layer printed wiring board.

[0009]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 (a) and 1 (b) are a plan view and a sectional view of a main part of an inner layer plate for explaining a laminated structure of a multilayer printed wiring board according to a first embodiment of the present invention. As shown in FIGS. 1 (a) and (b), a first embodiment of the present invention
a is provided with a first through-hole 2a, and a land 3a connected to the first through-hole 2a is provided in a lower surface during lamination. The second inner plate 1b is provided with a second through hole 2b at a second position, and the land 3b ₁ and the land 3b connected to the second through hole 2b are provided on both front and back surfaces.
₂ is provided. The land 3b ₁ via the lands 3a and the land 3b ₁ to lands 3a plane facing the during the lamination the first
Provided the through hole 2a and the second through-hole 2b in the circuit a position to be connected, the lands 3b ₂ land 3b ₁
The second through hole 2b is provided at a position opposite to the center in the opposite plane. A third through hole 2c is provided at a third position in the third inner layer plate 1c, and lands 3c ₁ and 3c connected to the third through hole 2c are formed on both front and back surfaces.
₂ is provided. This land 3c ₁ is used as the land 3b ₂
Land 3c ₂ land 3c provided in the circuit a position where the plane facing the through land 3b ₂ and the land 3c ₁ connects the second through-hole 2b and the third through-hole 2c on
_A third through hole 2c is provided at a position opposite to the center of the third through hole 2c in a plane opposite to the first plane. The fourth of the inner plate 1d of the fourth through-hole 2d is provided to the fourth position, the lands 3c ₂ and the land 3d land 3d than the fourth through-hole 2d when stacked in the land 3c ₂ plane facing the Are provided at positions where a circuit connecting the third through hole 2c and the fourth through hole 2d is formed.

FIG. 2 is a plan view of a main part of the prepreg connected between the respective inner layers of FIG. The prepreg used in the first embodiment of the present invention, as shown in FIG. 2, the land 3a-3b ₁ facing each of the inner layer plate 1a, 1b, 1c, 1d in the case of stacking, 3b ₂ -3c ₁ , 3c ₂ -3d, through holes are provided in advance at the positions of the prepregs 4a, 4b, 4c. Prepreg 4a is cut out portion corresponding to the land 3a and the land 3b _1, prepreg 4b is cut out portion corresponding to the land 3b ₂ and the land 3c _1, prepreg 4c crop a portion corresponding to the land 3c ₂ and the land 4d. When assembling into a laminate, the prepregs 4a, 4
Anisotropic conductive rubber is attached to the positions cut out in advance in b and 4c. Here, the reason why the conductive rubber is used in the cutout portion of the prepreg is to ensure the connection between the upper and lower layers after the lamination is assembled. There is also a method of filling this portion with a conductive member (silver paste or the like).

FIG. 3 is a sectional view of a main part showing a laminated structure of a multilayer printed wiring board according to a first embodiment of the present invention. The multilayer printed wiring board according to the first embodiment of the present invention shown in FIG. 3 can be obtained by laminating and incorporating the inner layer board shown in FIG. 1, 1a, 1b, 1c, 1d and the prepregs 4a, 4b, 4c shown in FIG. .
As shown in FIG. 3, from the first through-hole 2a to the fourth through-hole 2d (not shown), land 3a-3b ₁ of opposing _{layers, 3b 2 -3c 1, 3c 2} -3d
A circuit configured in a step-like manner through an anisotropic conductive rubber 5 at a position between (not shown). With such a circuit configuration, the conduction between the first through hole 2a and the fourth through hole 2d is detected by the tester 6, so that the state of assembling the lamination can be confirmed before the lamination and pressure bonding. become.

Next, a description will be given of a method of confirming the state of assembling the layers according to the first embodiment.

FIG. 4 is a sectional view of a main part of a multilayer printed wiring board before crimping which has been normally laminated in the first embodiment of the present invention. As shown in FIG. 4, in the state before the crimping after the normal lamination and assembly, the space between the first through-hole 2a and the fourth through-hole 2d is the land 3a-conductive rubber 5-land 3b.
_1- second through hole 2b-land 3b ₂ -conductive rubber 5-land 3c _1- third through hole 2c-land 3
One circuit is formed via c ₂ -conductive rubber 5-land 3d. In such a state, conduction is obtained through the first through-hole 2a and the fourth through-hole 2d. Therefore, by detecting with the tester 6, it can be confirmed that the layers are stacked normally.

FIG. 5 is a sectional view of a main part of a multilayer printed wiring board before crimping, showing an example of erroneous assembly in the first embodiment of the present invention. As shown in FIG. 5, the second inner plate 1b and the third
When the inner layer plate 1c is incorrectly assembled, the circuit between the third through hole 2c and the second through hole 2b is cut off, so that the circuit does not become a single circuit. The conduction between the through holes 2d cannot be established.

FIG. 6 is a sectional view of a main part of a multilayer printed wiring board before crimping, showing another example of erroneous assembling in the first embodiment of the present invention. As shown in FIG. 6, in this example, when the second inner layer plate 1b is not inserted without being inserted, the circuit between the first through hole 2a and the third through hole 2c is cut off, so that one circuit is formed. Therefore, conduction between the first through hole 2a and the fourth through hole 2d cannot be established.

In the case where the inner plate is erroneously assembled or the inner plate is not removed and assembled, the circuit is cut and does not become a single circuit. By detecting that there is no continuity between the through holes 2d of No. 4, mis-lamination and omission of lamination can be prevented in the laminating step.

FIGS. 7 (a) and 7 (b) are a plan view and a sectional view of a main part of an inner layer plate for explaining a laminated structure of a multilayer printed wiring board according to a second embodiment of the present invention. FIG. 7 shows a second embodiment.
As shown in (a) and (b), through holes and lands are arranged at the same positions as in the first embodiment on each layer surface. Also,
When laminated, the first inner plate 1a to the fourth inner plate 1d
Through hole 2a
(7a), 7b, 7c, 7d are connected to the inner layers 1a, 1b, 1
c, 1d. These through holes 7a, 7b, 7
The positions of c and 7d are changed for each product. In the case of this embodiment, the position is the position of the through hole 2a. As in the first embodiment, the prepreg used in the second embodiment has a position where lands face upper and lower layers and through holes 7a, 7b,
The connection portions of 7c and 7d are cut out, and a conductive rubber is used at the time of assembling the layers.

FIG. 8 is a sectional view of a main part of a multilayer printed wiring board before crimping which has been normally laminated in the second embodiment of the present invention. As shown in FIG. 8, in the state before the crimping after the normal lamination and incorporation, between the first through hole 2 a (7 a) and the fourth through hole 2 d, as in the first embodiment, the through hole, land, And one circuit via the conductive rubber 5. On the other hand, the through holes 7a, 7b, 7c, 7d become through through holes via the conductive rubber 5. By detecting the continuity between the circuit and the hole penetrating by the tester 6, it is possible to confirm that the inner layers are properly laminated and that the inner layer having a different name is not incorporated.

FIG. 9 is a cross-sectional view of a main part of a multilayer printed wiring board before crimping, showing an example in which an inner layer board of a different product name is incorporated in the second embodiment of the present invention. As shown in FIG. 9, when the inner layer plate 1b is replaced with an inner layer plate 11b having a different product name, the first
A single circuit is provided between the through hole 2a and the fourth through hole 2d, but no through hole is formed between the through hole 7a and the through hole 7d. On the other hand, when the inner layer plate is incorrectly assembled or when the inner layer plate is pulled out and not incorporated, the circuit is cut off to form one circuit.

As described above, in the second embodiment, the through holes 7a to 7d are provided, and the first through hole 2a, the fourth through hole 2d, the through hole 7a, and the through hole 7a are formed.
By detecting the continuity between d, in the laminating step, in addition to the misalignment of the lamination and the omission of lamination in the first embodiment, the incorporation of an inner layer plate of another product name can be prevented.

[0022]

As described above, according to the present invention, each inner layer plate is connected to a through hole and the front and back surfaces are connected to the through hole, and a land is provided at a position opposed to each land and a conductive rubber is provided between the opposed land. Since the circuit is formed, the conduction of the circuit is detected, so that it is possible to prevent the incorporation of the lamination and the omission of the lamination in the lamination process. Further, by providing through holes at predetermined positions of the respective inner layer plates so as to form front and back through holes through the conductive rubber, the incorporation of an inner layer plate of a different product name can be prevented.

As a result, there is no need to make a transparent check after assembling the layers, and there is no need for an expensive investment, so that an inexpensive and highly reliable multilayer printed wiring board can be easily obtained.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are a plan view and a sectional view of a main part of an inner layer plate for explaining a laminated structure of a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a plan view of a main part of a prepreg laminated between respective inner layer plates of FIG. 1;

FIG. 3 is a sectional view of a main part showing a laminated structure of the multilayer printed wiring board according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of a main part of a multilayer printed wiring board before crimping that has been normally laminated in the first embodiment of the present invention.

FIG. 5 is a cross-sectional view of a main part of the multilayer printed wiring board before crimping, showing an example of erroneous assembly in the first embodiment of the present invention.

FIG. 6 is a cross-sectional view of a main part of the multilayer printed wiring board before crimping, showing another example of erroneous assembly in the first embodiment of the present invention.

FIGS. 7 (a) and 7 (b) are a plan view and a cross-sectional view of an essential part of an inner layer plate for explaining a laminated structure of a multilayer printed wiring board according to a second embodiment of the present invention.

FIG. 8 is a cross-sectional view of a main part of a multilayer printed wiring board before crimping which has been normally laminated in a second embodiment of the present invention.

FIG. 9 is a cross-sectional view of a main part of a multilayer printed wiring board before crimping, showing an example in which an inner layer board of a different product name is incorporated in the second embodiment of the present invention.

FIG. 10 is a plan view of relevant parts for explaining a laminated structure of a conventional multilayer printed wiring board.

FIGS. 11 (a) and 11 (b) are plan views of relevant parts for explaining a conventional method for inspecting a multilayer printed wiring board.

[Explanation of symbols]

1a first inner layer board 1b second inner layer board 1c third inner layer board 1d fourth inner layer board 2a first through hole 2b second through hole 2c third through hole 2d fourth through hole 3a, _{3b 1, 3b 2, 3c 1} , 3c 2, 3d lands 4a, 4b, 4c prepreg 5 conductive rubber 6 tester 7a, 7b, 7c, 7d through holes 8a, 8b, 8c, 8d, 11b inner plate 9a, 9b, 9c, 9d Series symbol 10a, 10b, 10c, 10d Shielding pattern

Claims (3)

(57) [Claims] 1. At least a first position provided in a first position.
A first inner-layer printed wiring board having a through-hole and a first land connected to the first through-hole and provided at a second position on the inner layer side, and the first inner-layer printed wiring board at the second position. A second land provided on a surface facing the land and the second land;
A second through hole connected to the second land and provided at a third position and a third land connected to the second through hole and provided at a fourth position on the back surface of the second land. A second internal printed wiring board, a prepreg having a through hole at the second position laminated between the second internal printed wiring board and the first internal printed wiring board, and the through hole A multilayer printed wiring board, comprising: a conductive member that is fitted into the first land and connects the first land and the second land. 2. At least a first position provided at a first position.
A first inner-layer printed wiring board having a through-hole and a first land connected to the first through-hole and provided at a second position on the inner layer side, and the first inner-layer printed wiring board provided at the first position. A first through-hole, a through-hole forming a front-back through-hole, a second land provided on a surface facing the first land at the second position, and a third land connected to the second land. A second inner-layer printed wiring board having a second through hole provided at a position and a third land connected to the second through hole and provided at a fourth position on the back surface of the second land. A prepreg laminated between the second inner-layer printed wiring board and the first inner-layer printed wiring board and having through holes at the first position and the second position; The first land and the first land Multilayer printed wiring board and having a conductive member for connecting the second land and the first through hole and said through hole. Forming a plurality of inner printed wiring boards by providing a wiring pattern, a through hole, and a land at predetermined positions; and forming a through hole at a predetermined position of the prepreg. A step of inserting a conductive member into the through-hole, inserting the prepreg between the inner-layer printed wiring boards and laminating the same, and conducting between the through-holes or lands of the outermost layer of the laminated inner-layer printed wiring board by the conduction. A method for manufacturing a multilayer printed wiring board, comprising: a step of checking a lamination state of an inner printed wiring board; and a step of crimping the laminated inner printed wiring board.