JP2568506B2 - Semiconductor light receiving device - Google Patents
Semiconductor light receiving deviceInfo
- Publication number
- JP2568506B2 JP2568506B2 JP61111008A JP11100886A JP2568506B2 JP 2568506 B2 JP2568506 B2 JP 2568506B2 JP 61111008 A JP61111008 A JP 61111008A JP 11100886 A JP11100886 A JP 11100886A JP 2568506 B2 JP2568506 B2 JP 2568506B2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- microlens
- optical axis
- radius
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 230000003287 optical effect Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 description 20
- 230000035945 sensitivity Effects 0.000 description 13
- 238000004891 communication Methods 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、半導体受光装置に、特に、光通信用受光素
子の光ファイバー結合受光部パッケージ構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light receiving device, and more particularly to an optical fiber coupled light receiving portion package structure of a light receiving element for optical communication.
従来の技術 光LANなどに代表されるニューメディア分野の急激な
展開期を迎え、光通信分野が大きな注目をあびている。
この光通信システムにとって重要な点は、次の２点に集
約される。その一つは、伝送損失の少ない高性能な光フ
ァイバーの開発であり、他の一つは、システムを構成す
る光部品と受発光素子の高性能化と高信頼化である。2. Description of the Related Art With the rapid development of the new media field represented by optical LAN and the like, the optical communication field has received great attention.
Important points for this optical communication system are summarized in the following two points. One is the development of a high-performance optical fiber with a small transmission loss, and the other is the high-performance and high-reliability of the optical components and the light-receiving / emitting elements constituting the system.
光通信用受光素子にとって重要な特性とは、第一に、
光ファイバーとの結合が高く、受光感度が高いこと、第
二に、パルス信号の応答性にかかる処断周波数が高いこ
との二つである。これらの特性を満たすため、デバイス
構造としては、PINフォトダイオードやアバランシェフ
ォトダイオード（APD）が使用され、これによって、1GH
z程度のパルス信号に応答可能な高速化を達成してい
る。しかしながら、上記第一の点を解決できる決定的な
有効なパッケージ構造は、今のところ見出されていな
い。The important characteristics for light receiving elements for optical communication are, first,
The second is that the coupling with the optical fiber is high and the light receiving sensitivity is high, and the second is that the processing frequency related to the response of the pulse signal is high. In order to satisfy these characteristics, PIN photodiodes and avalanche photodiodes (APDs) are used as device structures.
Achieving high-speed response to pulse signals of about z is achieved. However, no definitive and effective package structure that can solve the first point has been found so far.
通常、使用される光ファイバーは、コア直径が50μｍ
のG150/125タイプの光ファイバーであり、開口角（NA）
は、約0.2である。このGI50/125タイプの光ファイバー
を伝搬した光伝送信号を受光素子の受光部に有効に入射
させるには、第２図に示されるように、光ファイバー１
と受光素子３との間をできる限り近づけて、パッケージ
に組み込まれたガラスのフラットレンズ６の外面に、最
接近のところまで、持ってくる結合方式がもっぱら用い
られている。第２図の構造により、長波長帯PINフォト
ダイオードの場合、受光径:80μｍで、最大受光感度0.7
〜0.8A/W、量子効率70〜80％が実現されている。Usually, the optical fiber used has a core diameter of 50 μm
G150 / 125 type optical fiber, aperture angle (NA)
Is about 0.2. In order for the optical transmission signal propagated through the GI50 / 125 type optical fiber to be effectively incident on the light receiving portion of the light receiving element, as shown in FIG.
And the light receiving element 3 are brought as close as possible, and a coupling method for bringing the outermost surface of the glass flat lens 6 incorporated in the package to the closest position is used exclusively. According to the structure shown in Fig. 2, in the case of a long wavelength band PIN photodiode, the light receiving diameter is 80 µm,
0.8 A / W and a quantum efficiency of 70-80% have been realized.
発明が解決しようとする問題点 しかしながら、第２図に示されるような従来の構造の
光通信用受光素子のパッケージには、以下に述べるよう
な問題点を有している。まず、受光素子３とフラットレ
ンズ６との間隔ｄをできる限り小さくすることが、感度
の向上を計るうえで、必須条件である。ところが、間隔
ｄの大きさは、ステム５の高さ、受光素子３のチップの
厚み、フラットレンズ６のサブマウント４の高さの大小
で、±100μｍ程度のばらつきを有する。Problems to be Solved by the Invention However, the package of the light receiving element for optical communication having the conventional structure as shown in FIG. 2 has the following problems. First, it is an essential condition to reduce the distance d between the light receiving element 3 and the flat lens 6 as much as possible in order to improve the sensitivity. However, the size of the interval d has a variation of about ± 100 μm depending on the height of the stem 5, the thickness of the chip of the light receiving element 3, and the height of the submount 4 of the flat lens 6.
一方、光ファイバー１を出た光信号のビームは、開口
角NA＝0.2の大きさで広がるため、光ファイバー１の先
端と受光素子３との間の距離が最大200μｍ程度変動す
ると、受光感度は、1/2以下に低下してしまう。したが
って、パッケージの寸法公差の範囲内で、受光感度は大
きくばらつくことになる。また、受光素子３のチップ上
に設けた内部結線用の金細線が、盛り上がると、これが
フラットレンズ６の内面と衝突し内部結線お損傷を発生
することがある。On the other hand, since the beam of the optical signal that has exited the optical fiber 1 spreads with a size of the aperture angle NA = 0.2, if the distance between the tip of the optical fiber 1 and the light receiving element 3 fluctuates by a maximum of about 200 μm, the light receiving sensitivity becomes 1 / 2 or less. Therefore, the light receiving sensitivity greatly varies within the range of the dimensional tolerance of the package. In addition, when the gold wire for internal connection provided on the chip of the light receiving element 3 swells, it collides with the inner surface of the flat lens 6 and may cause damage to the internal connection.
さらに、フラットレンズ６のガラス厚が薄いほど、光
ファイバー１と受光素子３との間隔を小さくすることが
できるが、機械的な強度を保つ必要性から、板厚は0.3m
m以上必要となり、この面からも、感度向上を実現する
のは困難である。一般に、ガラス面での入射光の反射を
防ぐため、受光波長の1/4波長の無反射コーティング（A
Rコート）を施し、受光感度の向上を計っているが、こ
のことは、フラットレンズ６のコスト高にもつながって
いる。Further, as the glass thickness of the flat lens 6 is smaller, the distance between the optical fiber 1 and the light receiving element 3 can be reduced, but the thickness is 0.3 m because of the need to maintain mechanical strength.
m or more, and it is difficult to improve the sensitivity in this respect as well. In general, to prevent reflection of incident light on the glass surface, antireflection coating (A
R coat) is applied to improve the light receiving sensitivity, but this also leads to an increase in the cost of the flat lens 6.
なお光ファイバーとの結合性を高めるために、例え
ば、実開昭61−41213号の明細書に記載のように、受光
素子に球状レンズを結合させた受光モジュールも知られ
ているが、かかる受光モジュールでは、光ファイバーの
寸法選択の自由度が小さい。In order to enhance the coupling with the optical fiber, for example, as described in Japanese Utility Model Application Laid-Open No. 41213/1986, a light receiving module in which a spherical lens is connected to a light receiving element is also known. In this case, the degree of freedom in selecting the dimensions of the optical fiber is small.
本発明は、以上述べた光通信用受光素子の課題となる
問題点を解決する方策を提案するものである。The present invention proposes a measure for solving the above-mentioned problem of the light receiving element for optical communication.
問題点を解決するための手段 今まで述べたような問題点を解決するため、本発明
は、入射光ビーム径を100μｍ以下に絞り得ることがで
き、受光素子への入射光軸上に曲率半径がr1、r2で、か
つ、r1＞r2の両面凸形状のマイクロレンズを設け、前記
マイクロレンズに前記入射光軸に対して直角面と前記入
射光軸に対して平行で前記入射光軸からの距離が前記r1
よりも小さい平行面とで構成される切り欠き部を前記曲
率半径r2曲面側に設け、前記受光素子を載置したステム
と共に前記受光素子をキャッピングするキャップに前記
入射光軸に沿って前記平行面と対応する穴を設けて前記
マイクロレンズが前記穴に前記キャップの外側から前記
受光素子に対して前記曲率半径r2曲面後を向けて挿入さ
れており、前記切り欠き部が前記穴の周囲に当接されと
ことを特徴とする半導体受光装置である。Means for Solving the Problems In order to solve the problems described above, the present invention can reduce the diameter of the incident light beam to 100 μm or less, and has a radius of curvature on the incident optical axis to the light receiving element. Are r1, r2, and provided a microlens with a double-sided convex shape of r1> r2, and the microlens is perpendicular to the incident optical axis and parallel to the incident optical axis and is parallel to the incident optical axis from the incident optical axis. Distance is r1
A notch formed by a smaller parallel surface is provided on the curved surface with the radius of curvature r2, and the parallel surface along the incident optical axis is provided on a cap for capping the light receiving element together with the stem on which the light receiving element is mounted. The microlens is inserted into the hole from the outside of the cap toward the light receiving element with the radius of curvature r2 facing the rear of the light receiving element, and the cutout portion is provided around the hole. A semiconductor light receiving device characterized by being in contact with.
作用 本発明によると、受光素子への入射光軸上に、曲率半
径がr1、r2で、かつ、r1＞r2の両面凸形状のマイクロレ
ンズを、前記マイクロレンズの所定の切り欠き部を用い
てキャップに設けることができるので、光ファイバーが
出力した光信号のビームは、前述のようにNA＝0.2の開
口角で広がるが、このビームを両面凸形状のマイクロレ
ンズの曲率半径r1曲面側で集光し、曲率半径r2曲面側で
受光素子が受け得て、光ファイバーとの結合性が高く、
受光感度の優れたパッケージ構造の受光デバイスを容易
に実現することができる。According to the present invention, on the incident optical axis to the light receiving element, the radius of curvature is r1, r2, and a double-sided convex microlens with r1> r2 is formed by using a predetermined notch of the microlens. Since the beam of the optical signal output from the optical fiber can be provided on the cap, the beam spreads at an aperture angle of NA = 0.2 as described above, but this beam is focused on the curved surface side of the curvature radius r1 of the microlens having a double-sided convex shape. And the light receiving element can receive on the curved surface side with the radius of curvature r2, and the coupling with the optical fiber is high,
A light receiving device having a package structure with excellent light receiving sensitivity can be easily realized.
実施例 第１図は本発明実施例の半導体受光装置の概要側断面
図であり、光ファイバー１、両面の曲率が互いに異なる
凸形状のマイクロレンズ系２、受光素子（チップ）３、
サブマウント４、ステム５をそなえている。つぎに、こ
の受光素子３に、角度αの光ビームが入射する場合を述
べる。FIG. 1 is a schematic side sectional view of a semiconductor light receiving device according to an embodiment of the present invention. The semiconductor device includes an optical fiber 1, a convex microlens system 2 having different curvatures on both surfaces, a light receiving element (chip) 3,
Submount 4 and stem 5 are provided. Next, a case where a light beam having an angle α is incident on the light receiving element 3 will be described.
マイクロレンズ２は、一面の曲率半径がr1で、他面の
曲率半径がr2であり、かつ、r1＞r2の関係にあり、単体
レンズとしての集点距離をｆ、前側焦点位置をfF、後側
焦点位置をfBとする。物点すなわち、光ファイバー１の
先端からの距離Ｓは、マイクロレンズ先端からファイバ
ー端距離をＶとして、Ｓ＝Ｖ＋ｆ−fF、像点の位置まで
の距離Ｓ′は、同図よりＳ′＝ｂ＋ｆ−fBである。1/S
＋1/S＝1/f（レンズの公式）の像倍率 が成り立ち、全てのパラメータを決定できる。Microlenses 2 is a curvature of one surface radius r 1, a r 2 is the other surface of the radius of curvature, and have a relationship of r 1> r 2, a collecting point distance as a single lens f, the front focal position As f F and the rear focal position as f B. Object point In other words, the distance S from the tip of the optical fiber 1, the fiber end distance from the microlens tip as V, S = V + f- f F, the distance to the position of the image point S 'is S from FIG' = b + f −f B. 1 / S
+ 1 / S = 1 / f (lens formula) image magnification Holds, and all parameters can be determined.
通常、ステム５の形状が決まれば、距離ｂ−Ｘが決ま
り、受光径φＤも既知であるから、受光径φＤの大きさ
に入射ビームが絞れるファイバー１とマイクロレンズ２
間距離Ｖを求めればよい。Usually, if the shape of the stem 5 is determined, the distance bX is determined and the light receiving diameter φD is also known, so that the fiber 1 and the micro lens 2 that can narrow the incident beam to the size of the light receiving diameter φD
The distance V may be obtained.
このように使用するファイバーの開口角と受光素子の
受光径φＤによって、最適な受光感度が得られる距離Ｖ
を実験的に求めればよい。ただし、このような光学系
が、有効に作用するのは、受光径が、100μｍ以下の場
合に特に顕著な効果がある。なお、受光径が300μｍ程
度では、第２図に示すフラットレンズ６で間隔ｄを相当
大きくしても、十分な結合効率が得られるため、実用
上、マイクロレンズ系の集光効果を必要としない。The distance V at which the optimum light receiving sensitivity is obtained depends on the aperture angle of the fiber used and the light receiving diameter φD of the light receiving element.
May be obtained experimentally. However, such an optical system effectively works particularly when the light receiving diameter is 100 μm or less. When the light receiving diameter is about 300 μm, a sufficient coupling efficiency can be obtained even if the distance d is considerably increased in the flat lens 6 shown in FIG. 2, so that the light collecting effect of the micro lens system is not practically required. .
本発明の実施例について述べる。ここでは、InGaAsを
用いた長波長PINフォトダイオードへの適応例について
説明する。An embodiment of the present invention will be described. Here, an example of application to a long-wavelength PIN photodiode using InGaAs will be described.
ＳドープのＮ型InP基板上に、液相成長法により低不
純物濃度のＮ型InP層とＮ型InGaAs層をそれぞれ２μｍ
ずつ成長させた。キャリア濃度は、５×1015cm-3であ
る。On an S-doped N-type InP substrate, a low-impurity-concentration N-type InP layer and an N-type InGaAs layer each having a thickness of 2 μm were formed by a liquid phase growth method.
It grew at a time. The carrier concentration is 5 × 10 15 cm −3 .
この成長基板にZn拡散を行ないＮ型InGaAs層の一部分
をP+領域に反転させ、電極を形成し、PINフォトダイオ
ードとした。チップ表面にARコート膜を形成し、厚さ20
0μｍのチップを作成した。受光径φＤは、80μｍであ
る。暗電流は、VR＝10Vで1nAである。Zn was diffused into this growth substrate, a part of the N-type InGaAs layer was inverted to a P + region, and an electrode was formed to form a PIN photodiode. AR coating film is formed on the chip surface, thickness 20
A 0 μm chip was made. The light receiving diameter φD is 80 μm. The dark current is 1 nA at V R = 10V.
このチップをTO−18ステムにダイスボンドした後、ワ
イヤーボンドを行なった。この後、外半径r1＝0.8mm、
内半径r2＝0.5mm、厚さ1mm、屈折率ｎ＝1.5の両面凸形
状のマイクロレンズ２のついたキャップをチップが搭載
されたTO−18ステムにキャッピングすることで両凸マイ
クロレンズ付のパッケージによる光通信用受光装置を得
た。After die-bonding this chip to the TO-18 stem, wire bonding was performed. After this, the outer radius r 1 = 0.8 mm,
A cap with a biconvex microlens 2 having an inner radius r 2 = 0.5 mm, a thickness of 1 mm, and a refractive index n = 1.5 is attached to a TO-18 stem on which a chip is mounted, thereby providing a biconvex microlens. A light receiving device for optical communication using a package was obtained.
本実施例による受光感度特性を、下表に従来例と対比
して示す。The light receiving sensitivity characteristics according to this embodiment are shown in the following table in comparison with the conventional example.
発明の効果 本発明により、両面凸形状のマイクロレンズの付いた
パッケージの場合には、最小0.6A/W、最大0.76A/W、平
均0.68A/Wの受光感度Ｓが得られた。結果として、従来
のARコート付フラットレンズパッケージと同等の受光感
度ＳをARコートなしで達成することができた。また、感
度のばらつきも光ファイバーの位置を調節することによ
って、相対的に小さくなり、組立てロットによる変動も
少なくなった。 Effects of the Invention According to the present invention, in the case of a package having a microlens having a biconvex shape, a light receiving sensitivity S of 0.6 A / W at the minimum, 0.76 A / W at the maximum, and 0.68 A / W on average was obtained. As a result, the light receiving sensitivity S equivalent to that of the conventional AR-coated flat lens package could be achieved without the AR coating. Also, by adjusting the position of the optical fiber, the variation in sensitivity was relatively reduced, and the variation among assembly lots was reduced.
さらに、光ファイバーを受光素子に最接近する必要も
なく、ファイバー端面の損傷の心配が全くなくなり、信
頼性の高いデバイスを実現することができた。Further, there is no need to bring the optical fiber closest to the light receiving element, and there is no fear of damage to the fiber end face, and a highly reliable device can be realized.
前述したように、本発明によると、両面凸形状の各面
の曲率を、光ファイバー側で大とし、受光素子側で小と
なしたマイクロレンズを、マイクロレンズに設けた切り
欠き部でパッケージのキャップに付けて、チップが搭載
されたステムにキャッピングすることで、両凸マイクロ
レンズ付のパッケージ構造を得ることができ、それによ
り光ファイバーとの結合性が高く、受光感度の優れた光
通信用受光装置を得た。特に受光径100μｍ以下の場合
に、顕著な集光機能を呈する。As described above, according to the present invention, the curvature of each surface of the double-sided convex shape is increased on the optical fiber side, and the microlens reduced on the light receiving element side is replaced with a notch provided in the microlens to form a package cap. In addition, by capping the stem on which the chip is mounted, a package structure with a biconvex microlens can be obtained, thereby having a high coupling with an optical fiber and an excellent light receiving sensitivity. I got Particularly, when the light receiving diameter is 100 μm or less, a remarkable light collecting function is exhibited.
第１図は本発明の両面凸形状マイクロレンズ付パッケー
ジの概要側断面図、第２図は従来のフラットレンズパッ
ケージの断面図である。 １……光ファイバー、２……両面凸形状マイクロレンズ
系、３……受光素子、４……サブマウント、５……ステ
ム、６……フラットレンズ。FIG. 1 is a schematic side sectional view of a package with a double-sided convex microlens of the present invention, and FIG. 2 is a sectional view of a conventional flat lens package. DESCRIPTION OF SYMBOLS 1 ... Optical fiber, 2 ... Double-sided convex micro lens system, 3 ... Light receiving element, 4 ... Submount, 5 ... Stem, 6 ... Flat lens.
Claims (1)
r2で、かつ、r1＞r2の両面凸形状のマイクロレンズを設
け、前記マイクロレンズに前記入射光軸に対して直角面
と前記入射光軸に対して平行で前記入射光軸からの距離
が前記r1よりも小さい平行面とで構成される切り欠き部
を前記曲率半径r2曲面側に設け、前記受光素子を載置し
たステムと共に前記受光素子をキャッピングするキャッ
プに前記入射光軸に沿って前記平行面と対応する穴を設
けて前記マイクロレンズが前記穴に前記キャップの外側
から前記受光素子に対して前記曲率半径r2曲面側を向け
て挿入されており、前記切り欠き部が前記穴の周囲に当
接されとことを特徴とする半導体受光装置。1. A method according to claim 1, wherein a radius of curvature is r1 on an optical axis incident on the light receiving element.
r2, and provided a microlens with a double-sided convex shape of r1> r2, the microlens is perpendicular to the incident optical axis and parallel to the incident optical axis and the distance from the incident optical axis is A notch composed of a parallel surface smaller than r1 is provided on the curved surface with the radius of curvature r2, and the parallel with the stem on which the light receiving element is mounted is provided along the incident optical axis on a cap that caps the light receiving element. A hole corresponding to the surface is provided, and the microlens is inserted into the hole from outside the cap with the curvature radius r2 facing the light receiving element toward the light receiving element, and the notch is provided around the hole. A semiconductor light receiving device characterized by being abutted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111008A JP2568506B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor light receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111008A JP2568506B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor light receiving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62266878A JPS62266878A (en) | 1987-11-19 |
| JP2568506B2 true JP2568506B2 (en) | 1997-01-08 |
Family
ID=14550062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61111008A Expired - Lifetime JP2568506B2 (en) | 1986-05-15 | 1986-05-15 | Semiconductor light receiving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2568506B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04111761U (en) * | 1991-03-14 | 1992-09-29 | ホーヤ株式会社 | Light receiving element |
| JP3324286B2 (en) * | 1994-06-29 | 2002-09-17 | 住友電気工業株式会社 | Analog PD module and method of manufacturing the same |
| JP2012098756A (en) * | 2012-02-07 | 2012-05-24 | Kyocera Corp | Optical path converting body and packaging structure thereof, and optical module with the same |
| CN115220162A (en) * | 2022-08-10 | 2022-10-21 | 苏州天孚光通信股份有限公司 | Optical detector, packaging device and packaging method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141213U (en) * | 1984-08-17 | 1986-03-15 | 富士通株式会社 | Light receiving module for optical communication |
-
1986
- 1986-05-15 JP JP61111008A patent/JP2568506B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62266878A (en) | 1987-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |