JP2567775B2 - Solder plating equipment for semiconductor device lead frame - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder plating apparatus for a semiconductor element lead frame for solder plating a semiconductor element lead frame on which a semiconductor element is mounted.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a solder plating apparatus for a lead frame of a semiconductor device of this type has an unload part 5 as shown in FIG.
The lead frame before solder plating treatment is taken out one by one from the cassette (not shown) in which the lead frame before solder plating treatment is stored in 1, and the treatment bath row 5 for solder plating treatment
The lead frame after each treatment in 2 and the solder plating treatment is housed in the empty cassette in the load portion 53.

[0003]

In the above-described lead frame solder plating apparatus having the conventional structure, the unloading section 51, the processing bath row 52, and the loading section 53 are linearly arranged in a line, so that a large arrangement is required. Need space,
In order for the operator to perform the solder plating on the lead frame using this solder plating processing device, it is necessary to move the processing devices arranged in a row from one end to the other when mounting or removing the cassette. Not only is there a problem in operability, but there is also the problem that multiple operators are required.

The present invention has been made in view of the above points, and an object of the present invention is to provide a solder plating apparatus for a lead frame of a semiconductor element, which has a small arrangement space and is excellent in operability.

[0005]

In order to solve the above problems, the present invention provides a tank and an apparatus for each processing step in which the lead frames are taken out one by one from a cassette containing a semiconductor element lead frame and subjected to a solder plating process. After each treatment,
In a solder plating device for a semiconductor element lead frame, which is configured to store the lead frame after the solder plating in an empty cassette, the baths and devices for each processing step for performing the solder plating process are sequentially arranged, and the solder plating process is performed. A device that moves the cassette that contains the lead frame before and the lead frame that contains the lead frame after the solder plating process is placed in front of the tank and the device row, and these are arranged in a substantially U shape, and the solder plating process is performed from the cassette. The lead frames are taken out one by one, each lead frame is subjected to each treatment in each treatment step, and the lead frame subjected to the solder plating treatment is lead in a substantially U-shaped arrangement until it is housed in an empty cassette. It is characterized in that a device for transferring the frame is provided.

[0006]

[Operation] As described above, the cassette containing the lead frame before the solder plating treatment and the empty cassette containing the lead frame after the solder plating treatment are arranged in front of the processing bath line,
Each lead frame before solder plating treatment is taken out one by one, and the solder plating treatment is carried out while transferring the lead frames along the substantially U-shaped path, so the installation space of the device is small and it can be operated by one operator. Operating performance and productivity are greatly improved.

[0007]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a solder plating apparatus for a semiconductor element lead frame according to the present invention. As shown
Alkali degreasing 3-1, water washing 3-2, 3-3, etching 3-4, shower 3-5, water washing 3-6, acid neutralization 3-7,
A processing line 3 is arranged in which baths and devices used in the processing steps of solder plating 3-8, pure water washing 3-9, pure hot water washing 3-10, blow 3-11 and drying 3-12 are arranged. There is.

Arranged in front of the processing line 3 is a processing line 5 in which tanks and devices used for the processing of solder stripping 5-1, washing with water 5-2, washing with water 5-3, and blow 5-4 are arranged. Has been done.

Before the processing line 5, a cassette 31-1 accommodating the lead frame 32 before the solder plating process as shown in FIG. 3 and all the lead frames are loaded, and an empty cassette 31-2 is inserted. A cassette transfer device 1 for mounting and transferring, and a cassette transfer device 6, 7 for mounting and transferring an empty cassette storing a lead frame after solder plating and a cassette storing a processed lead frame are arranged. ing.

At both ends between the processing line 5 and the cassette moving device, as will be described later, a cassette containing a lead frame before the solder plating process is installed from the cassette transfer device 1 to a predetermined position of the processing line 5 and the processing line 5. Cassette positioning mechanism 8 for moving an empty cassette from a predetermined position to the cassette transfer device 1, and an empty cassette for housing the lead frame after the solder plating process from the cassette transfer 6 to a predetermined position of the processing line 5 and the processing line 5 A cassette positioning mechanism 9 for moving the cassette housing the lead frame after the solder plating treatment to the cassette transfer device 6 from the predetermined position of is arranged. A traverse 14 and a traverse 15 that connect the processing lines 3 and 5 are arranged at both ends between the processing lines 3 and 5. Further, 2 is a frame loader for taking out the lead frame before the solder plating treatment from the cassette, and 4 is a frame unloader for storing the lead frame before the solder plating treatment in the cassette.

In the solder plating apparatus arranged as described above, the cassette that contains the lead frame before the solder plating processing on the cassette transfer apparatus 1 is moved to a predetermined position on the processing line 5 by the cassette positioning mechanism 8.
Here, the frame loader 2 takes out the sheets one by one.
The upper end of the lead frame is held by a lead frame gripping jig, which will be described later, to degrease the alkali in the processing line 3 3-1.
Washing with water 3-2, 3-3, etching 3-4, shower 3-
5, washing with water 3-6, acid neutralization 3-7, solder plating 3-8, washing with pure water 3-9, washing with pure water 3-10, blow 3-11 and drying 3-12 are sequentially transferred in each processing step. After the treatment, the lead frame subjected to the solder plating treatment is stored in the empty cassette which is on standby by the cassette positioning mechanism 9. Also,
The lead frames are taken out one by one by the frame loader 2 and the empty cassette is replaced with the cassette positioning mechanism 8
Is transferred to the cassette transfer device 1.

FIG. 2 is a diagram showing an example of a schematic configuration of the cassette transfer device 1, the cassette positioning mechanism 8, the frame loader 2, and the like. As shown in the figure, a cassette transfer device 1, a cassette positioning mechanism 8, a frame loader 2, a frame rotating mechanism 10, and a frame gripping jig 11 are arranged.
The cassette transfer device 1 can move in the direction of arrow A and is stopped at a predetermined position. A cassette 31 containing the lead frame 13 before the solder plating process on the cassette transfer device 1
-1 is grasped by the arm portion 8-1 of the positioning mechanism 8 and moved to a predetermined position (arrow B direction). Here, the pair of claw members 2-1 and 2-1 of the frame loader 2 grasp both sides in the width direction of the lead frame 13 and take out one by one. The lead frames 13 taken out one by one are moved in the direction of arrow D and placed on the bed 10-1 of the frame rotating mechanism 10. The frame rotating mechanism 10 rotates the lead frame 13 in a vertical state as indicated by an arrow C so that the frame holding jig 11 can hold the lead frame 13, and at the same time, holds the lead frame 13 vertically at a predetermined position. Move in E direction.

Here, the claw member 11 of the frame gripping jig 11
Grab the upper part of the lead frame 13 with -1, 11-1 and move it in the direction of arrow F to remove the alkaline degreasing 3-
1, water washing 3-2, 3-3, etching 3-4, shower 3-5, water washing 3-6, acid neutralization 3-7, solder plating 3-
8, washing with pure water 3-9, washing with pure water 3-10, blow 3-11 and drying 3-12 are sequentially carried out to carry out the treatment of each step. The lead frame 13 subjected to the solder plating process is stored in an empty cassette waiting on the cassette positioning mechanism 9 by a frame unloader having substantially the same structure as the frame loader 2. The cassette filled with the solder-plated lead frame is placed on the cassette transfer device 6 by the cassette positioning mechanism 9.

The lead frame 13 housed in the cassette 31 is provided on the side of the cassette positioning mechanism 8.
A lifter 12 is provided for gradually pushing up the lead frame 13 (in the direction indicated by an arrow G) when picking up one by one. Further, the processing line 5 is the solder plating 3 of the processing line 3.
In the process step of -8, the claw member 11 of the frame gripping jig 11
-1 and 11-1 are processing lines for peeling the solder plating adhered to the surfaces of the tip portions of -1, 11-1.

The device shown in FIG. 2 is a diagram showing an example of the structure of the device in which the lead frames are taken out from the cassette one by one, vertically held, and each processing step is transferred. This device is not limited to this. Not a thing.

[0016]

As described above, according to the present invention, the following excellent effects can be obtained. (1) Arrange a device for transferring a cassette containing lead frames before solder plating treatment and an empty cassette for storing lead frames after solder plating treatment, in front of the tank and the device for each treatment step for performing the solder plating treatment Since it is arranged in a substantially U-shape, the operator can mount the cassette on the apparatus, or only one part is located for detaching or attaching the cassette, and it is almost unnecessary to move the position, thereby improving operability and productivity. Can be achieved.

(2) Further, since the U-shaped arrangement is employed, the installation space can be reduced as compared with the conventional linear arrangement.

[Brief description of drawings]

FIG. 1 is a plan view of a solder plating apparatus for a semiconductor element lead frame according to the present invention.

FIG. 2 is a diagram showing a schematic configuration of a cassette transfer device, a traverse, a frame unloader, and the like.

FIG. 3 is a perspective view showing the structure of a cassette accommodating a lead frame.

FIG. 4 is a plan view of a conventional solder plating apparatus for semiconductor element lead frame.

[Explanation of symbols]

 1 cassette transfer device 2 frame loader 3 processing line 4 frame unloader 5 processing line 6,7 cassette transfer device 8,9 cassette positioning mechanism 10 frame rotating mechanism 11 frame gripping jig 12 lifter 13 lead frame 14 traverse 15 traverse

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-59-101274 (JP, A) JP-A-2-61094 (JP, A)

Claims (1)

(57) [Claims] 1. A lead frame is taken out one by one from a cassette in which a semiconductor element lead frame is housed, and each treatment is performed in a bath and an apparatus for each treatment step in which a solder plating treatment is performed, and the lead frame after the solder plating is emptied. In a solder plating apparatus for a semiconductor element lead frame configured to be housed in a cassette of a cassette, the tank and the apparatus for each processing step for performing the solder plating process are sequentially arranged, and a cassette that contains the lead frame before the solder plating process is housed. And a device for moving an empty cassette for storing the lead frame after the solder plating treatment is arranged in front of the tank and the device row and arranged in a substantially U-shape, and one lead frame before the solder plating treatment is arranged from the cassette. Of the lead frame, and the lead frame was subjected to each treatment in each of the above-mentioned treatment steps, and the solder-plated Until receiving the lead frame in the empty cassette, the generally U-shaped semiconductor device lead frame for solder plating apparatus characterized in that a device for transferring the lead frame along the arrangement.