JP2565640Y2 - Insulation structure of rotating electric machine coil - Google Patents
Insulation structure of rotating electric machine coilInfo
- Publication number
- JP2565640Y2 JP2565640Y2 JP1989137967U JP13796789U JP2565640Y2 JP 2565640 Y2 JP2565640 Y2 JP 2565640Y2 JP 1989137967 U JP1989137967 U JP 1989137967U JP 13796789 U JP13796789 U JP 13796789U JP 2565640 Y2 JP2565640 Y2 JP 2565640Y2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- electric machine
- rotating electric
- machine coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Organic Insulating Materials (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Inorganic Insulating Materials (AREA)
Description
【考案の詳細な説明】 A.産業上の利用分野 本考案は、絶縁用マイカテープ及びエポキシ樹脂を用
いた回転電機コイルの絶縁構造に関する。DETAILED DESCRIPTION OF THE INVENTION A. Industrial Field of the Invention The present invention relates to an insulating structure of a rotating electric machine coil using an insulating mica tape and an epoxy resin.
B.考案の概要 本考案は、絶縁用マイカテープを用いて絶縁を施した
後、エポキシ樹脂組成物を含浸・硬化させてなる回転電
機コイルの絶縁構造において、エポキシ樹脂とその２〜
20重量％のブチラール樹脂とを含浸する接着剤を上記絶
縁用マイカテープの裏打材の接着に用いることにより、
該絶縁用マイカテープへの硬化促進剤の塗布によるtan
δの悪化を防止するものである。B. Overview of the Invention The present invention provides insulation using a mica tape for insulation, followed by impregnation and curing of an epoxy resin composition, in an insulating structure of a rotating electric machine coil, wherein an epoxy resin and its 2-
By using an adhesive impregnating with 20% by weight of butyral resin for bonding the backing material of the insulating mica tape,
Tan by applying a curing accelerator to the insulating mica tape
This prevents the deterioration of δ.
C.従来の技術 近年、高圧回転電機の小形化、高信頼性に対する要求
は日に日に大きくなり、この要求に応えるため、電気的
・機械的・熱的特性に優れたエポキシ樹脂が含浸用樹脂
として多く利用されている。C. Conventional technology In recent years, the demand for miniaturization and high reliability of high-voltage rotating electrical machines has been increasing day by day, and in order to meet this demand, epoxy resin with excellent electrical, mechanical, and thermal properties has been used for impregnation. It is widely used as a resin.
ところで、高圧回転電機の含浸用樹脂としてエポキシ
樹脂を使用する場合、樹脂硬化時の温度上昇により樹脂
粘度が一旦低下して、これにより絶縁層から樹脂が流出
してしまい、絶縁層中にボイドを含む未含浸部分が発声
してしまう。このように未含浸部分が存在すると、絶縁
層に加えられる電圧によって当該部分に部分放電が発生
し、放電劣化ひいては絶縁破壊につながる虞れがある。
したがって、通常、主絶縁用のマイカテープに潜在性の
硬化促進剤を塗布して絶縁層中の含浸樹脂の硬化速度を
速めることにより樹脂流出を防ぐような工夫がなされて
いる。By the way, when an epoxy resin is used as an impregnating resin for a high-voltage rotating electric machine, the resin viscosity temporarily decreases due to a rise in temperature at the time of curing the resin, whereby the resin flows out of the insulating layer, and voids are formed in the insulating layer. The unimpregnated part containing the vocal utters. When the non-impregnated portion exists as described above, a partial discharge is generated in the portion due to the voltage applied to the insulating layer, which may lead to discharge deterioration and ultimately dielectric breakdown.
Therefore, a measure is usually taken to prevent the resin from flowing out by applying a latent curing accelerator to the mica tape for main insulation to increase the curing speed of the impregnated resin in the insulating layer.
D.考案が解決しようとする課題 しかしながら、前述したように硬化速度を速めるため
に硬化促進剤を塗布したマイカテープで絶縁を施した
後、エポキシ樹脂を含浸・硬化させたコイルは、高温で
の誘電正接tanδが硬化促進剤を塗布していないものよ
り悪くなるという問題がある。D. Problems to be Solved by the Invention However, as described above, after applying insulation with a mica tape coated with a curing accelerator to increase the curing speed, the coil impregnated with epoxy resin and cured, There is a problem that the dielectric loss tangent tan δ is worse than that without a curing accelerator applied.
tanδは誘電体で失われる電力損失に直接関わってい
るのでできる限り小さい方が好ましく、これが大きすぎ
ると場合によって熱暴走を起す場合がある。このtanδ
は一般に温度特性を有し、温度上昇により増加するもの
が多いが、上述したようにマイカテープに硬化促進剤を
塗布した場合にはその特性が助長されることになる。し
たがって硬化促進剤を塗布しても高温でのtanδが悪化
しない絶縁構造の出現が望まれている。The value of tan δ is preferably as small as possible because it directly relates to the power loss lost by the dielectric. If it is too large, thermal runaway may occur in some cases. This tanδ
Generally has a temperature characteristic, and often increases as the temperature rises. However, when a curing accelerator is applied to a mica tape as described above, the characteristic is promoted. Therefore, the appearance of an insulating structure in which tan δ at high temperatures does not deteriorate even when a curing accelerator is applied is desired.
E.課題を解決するための手段 前記課題を解決する本考案に係る回転電機コイルの絶
縁構造は、マイカフィルムと裏打材とで構成される絶縁
用マイカテープの表面にエポキシ樹脂の硬化促進剤を塗
布した絶縁テープにより絶縁を施した回転電機コイル
に、エポキシ樹脂組成物を含浸・硬化させてなる回転電
機コイルの絶縁構造において、脂環式エポキシ樹脂に10
0重量部を上限としてノボラック系エポキシ樹脂を配合
したエポキシ樹脂混合物と、エポキシ樹脂混合物の２〜
20重量％のブチラール樹脂とからなる接着剤を、上記マ
イカフィルムと上記裏打材との接着に用いたことを特徴
とする。E. Means for Solving the Problems The insulating structure of the rotating electrical machine coil according to the present invention for solving the above-mentioned problems includes a curing accelerator of an epoxy resin on the surface of an insulating mica tape composed of a mica film and a backing material. The rotating electric machine coil insulated with the applied insulating tape is impregnated and cured with an epoxy resin composition.
An epoxy resin mixture containing novolak epoxy resin with 0 parts by weight as the upper limit, and 2 to 2 parts of the epoxy resin mixture
An adhesive comprising 20% by weight of butyral resin is used for bonding the mica film to the backing material.
本考案では、マイカフィルムと裏打材との接着に特定
の接着剤を用いることにより、高温のtanδの悪化を防
止するものである。In the present invention, by using a specific adhesive for bonding the mica film and the backing material, deterioration of high-temperature tan δ is prevented.
かかる接着剤は脂環式エポキシ樹脂に100重量部を上
限としてのノボラック系エポキシ樹脂を配合したエポキ
シ樹脂混合物と、該エポキシ樹脂混合物の２〜20重量％
のブチラール樹脂とを含有するものである。Such an adhesive is composed of an epoxy resin mixture containing an alicyclic epoxy resin and a novolak-type epoxy resin having an upper limit of 100 parts by weight, and 2 to 20% by weight of the epoxy resin mixture.
And butyral resin.
本考案では、脂環式エポキシ樹脂を主成分とする接着
剤を用いることによりtanδの温度特性の向上を図るも
のであり、脂環式エポキシ樹脂には、後述するように、
同重量までのノボラック系エポキシ樹脂を混合すること
が必須である。ここで、脂環式エポキシ樹脂及びノボラ
ック系エポキシ樹脂の例を次に挙げる。In the present invention, the temperature characteristics of tan δ are improved by using an adhesive containing an alicyclic epoxy resin as a main component.
It is essential to mix novolak epoxy resins up to the same weight. Here, examples of the alicyclic epoxy resin and the novolak epoxy resin will be described below.
脂環式エポキシ樹脂の例 ノボラック系エポキシ樹脂の例 また、ブチラール樹脂は、マイカテープのタック（ベ
トツキ）をなくし且つテープが硬くならないような作用
をするものであり、脂環式エポキシ樹脂を主成分とする
エポキシ樹脂にこのブチラール樹脂を用いることにより
tanδの温度特性がさらに向上されるようになる。この
ブチラール樹脂は、２重量％未満ではその効果が顕著に
現われなくなり、一方、20重量％を超えると特性に悪影
響を与えるようになる。なお、ブチラール樹脂と同様に
上述したような作用をするものがあれば、ブチラール樹
脂の代りに用いることもできる。Examples of alicyclic epoxy resins Examples of novolak epoxy resins The butyral resin has a function of eliminating the tackiness (stickiness) of the mica tape and preventing the tape from becoming hard. By using this butyral resin as an epoxy resin containing an alicyclic epoxy resin as a main component,
The temperature characteristic of tan δ is further improved. If the butyral resin is less than 2% by weight, its effect will not be remarkably exhibited, while if it exceeds 20% by weight, the properties will be adversely affected. In addition, as long as there is a substance which has the above-described function similarly to butyral resin, it can be used instead of butyral resin.
また、マイカフィルムとしては、アラミドフィブリッ
ド混抄集成マイカ若しくは通常の集成マイカを挙げるこ
とができる。一方、裏打材としてはガラスクロス若しく
はポリエステル不織布などを挙げることができる。Examples of the mica film include aramid fibrid mixed mica and ordinary mica. On the other hand, examples of the backing material include glass cloth and polyester nonwoven fabric.
このような特定の接着剤を用いたマイカテープを用い
る以外は特に限定されず、一般にはこのマイカテープの
表面に硬化促進剤を塗布して絶縁を施し、その後にエポ
キシ樹脂を含浸・硬化させる。There is no particular limitation except that a mica tape using such a specific adhesive is used. In general, a curing accelerator is applied to the surface of the mica tape to provide insulation, and then impregnated and cured with an epoxy resin.
ここで、硬化促進剤としては芳香族系アミンなどが用
いられ、一般に、テープ表面に0.1g/m2〜5g/m2程度塗布
される。0.1g/m2未満では硬化促進効果が顕著ではな
く、逆に5g/m2を超えると、特性に悪影響を与えるよう
になる。Here, and aromatic amines is used as the curing accelerator, generally, it is applied about 0.1g / m 2 ~5g / m 2 on the tape surface. If it is less than 0.1 g / m 2 , the effect of accelerating the curing is not remarkable, and if it exceeds 5 g / m 2 , the properties are adversely affected.
また、含浸用エポキシ樹脂としては、一般に、ビスフ
ェノール系エポキシ樹脂若しくはこれらの混合物、又は
これらに反応稀釈剤を加えたものに、当エポキシ当量と
なるような酸無水物系硬化剤を添加したものなどを用い
る。In addition, the epoxy resin for impregnation is generally a bisphenol-based epoxy resin or a mixture thereof, or a mixture obtained by adding a reaction diluent thereto, and an acid anhydride-based curing agent having an equivalent epoxy equivalent. Is used.
なお、かかるエポキシ樹脂の含浸方法も特に限定され
ないが、一般には真空加圧含浸が使用される。The method of impregnating the epoxy resin is not particularly limited, but generally, vacuum pressure impregnation is used.
F.実施例 以下、本考案を実施例に基づいて説明する。F. Embodiment Hereinafter, the present invention will be described based on an embodiment.
（実施例１） 接着剤として、脂環式エポキシ樹脂（CY−175）とノ
ボラック系エポキシ樹脂（エピコート152;油化シェルエ
ポキシ社製）とを7:3の重量比で混合したものを主成分
とし、これにその５重量％のブチラール樹脂を混合した
ものを用いた。この接着剤により、アラミドフィブリッ
ド入りの集成マイカとガラスクロスとを張り合せ、マイ
カテープとした。(Example 1) As an adhesive, a mixture of an alicyclic epoxy resin (CY-175) and a novolak-based epoxy resin (Epicoat 152; manufactured by Yuka Shell Epoxy) in a weight ratio of 7: 3 is a main component. A mixture obtained by mixing 5% by weight of the butyral resin was used. With this adhesive, the laminated mica containing aramid fibrid and the glass cloth were bonded to each other to form a mica tape.
このマイカテープに硬化促進剤として2,4,6−トリス
（ジメチルアミノメチル）フェノールを4g/m2塗布し、
これをバー状のコイルに卷回した。This mica tape is coated with 2,4,6-tris (dimethylaminomethyl) phenol as a curing accelerator at 4 g / m 2 ,
This was wound around a bar-shaped coil.
その後、グリシジルエステルタイプエポキシで分子量
190〜380のもの（HR−720;日立化成社製）70重量％，脂
環エポキシで分子量170〜330のもの（CX−221;三菱油化
社製）20重量％、及び低粘度の反応性稀釈剤であるブチ
ルグリシジルエーテル（エピオール；日本油脂社製）10
重量％からなるエポキシに、等エポキシ当量の酸無水物
系硬化剤（HN2200）を混合したエポキシ樹脂を上述した
マイカテープで絶縁を施したバー状コイルに真空加圧含
浸し、十分に硬化させた。After that, the molecular weight with glycidyl ester type epoxy
70% by weight of 190-380 (HR-720; manufactured by Hitachi Chemical), 20% by weight of alicyclic epoxy having a molecular weight of 170-330 (CX-221; manufactured by Mitsubishi Yuka), and low viscosity reactivity Butyl glycidyl ether as a diluent (Epiol; manufactured by NOF Corporation) 10
A bar-shaped coil insulated with the above mica tape was vacuum impregnated with an epoxy resin obtained by mixing an acid anhydride-based curing agent (HN2200) with an equivalent epoxy equivalent to an epoxy composed of wt% and sufficiently cured. .
（比較例１） 実施例１のマイカテープに硬化促進剤を塗布しないで
絶縁を施した以外は実施例１と同様に絶縁を形成した。Comparative Example 1 An insulation was formed in the same manner as in Example 1 except that the mica tape of Example 1 was insulated without applying a curing accelerator.
（比較例２） 実施例１の接着剤において、ブチラール樹脂を混合し
ない以外は実施例１と同様に絶縁を形成した。Comparative Example 2 Insulation was formed in the same manner as in Example 1 except that the butyral resin was not mixed in the adhesive of Example 1.
以上の実施例１、比較例２の絶縁構造について、1KV
のtanδの温度特性を測定した。この結果を第１図に示
す。また、実施例１、比較例１及び比較例２について
は、硬化時の静電容量変化率の時間変化を測定した。こ
の結果は第２図に示す。1 KV for the insulating structures of the above-described Example 1 and Comparative Example 2.
The temperature characteristics of tan δ were measured. The result is shown in FIG. Further, for Example 1, Comparative Example 1 and Comparative Example 2, the time change of the capacitance change rate during curing was measured. The result is shown in FIG.
第１図に示すように、実施例１のように脂環式エポキ
シと脂環式エポキシノボラック系エポキシとを添加した
接着剤に硬化促進剤を併用した場合には、硬化促進剤を
併用しない場合に比べて、tanδの温度特性が極めて良
好であった。As shown in FIG. 1, when the curing accelerator is used in combination with the adhesive obtained by adding the alicyclic epoxy and the alicyclic epoxy novolak epoxy as in Example 1, the case where the curing accelerator is not used together The temperature characteristics of tan δ were extremely good as compared with
また、第２図に示すコイル硬化時の静電容量の変化
は、樹脂の硬化速度とほぼ対応するものである。すなわ
ち、静電容量変化率の低下が早いほど樹脂の硬化速度が
速いことを示しており、実施例１は比較例１及び２より
硬化速度が速い。In addition, the change in capacitance during coil curing shown in FIG. 2 substantially corresponds to the curing speed of the resin. That is, it shows that the faster the decrease in the capacitance change rate, the faster the curing speed of the resin. The curing speed of Example 1 is higher than that of Comparative Examples 1 and 2.
このように実施例１では硬化促進剤を用いると通常と
同様な硬化促進効果があって、実機に使用した場合には
樹脂流出のない絶縁が可能であり、しかも、上述したよ
うにtanδ温度特性は良好なものである。As described above, in Example 1, the use of the curing accelerator has the same curing promoting effect as usual, and when used in an actual machine, enables insulation without resin spillage. Is good.
G.考案の効果 以上説明したように、本考案に係る絶縁構造は、特定
の接着剤を用いて裏打材を貼付したマイカテープに硬化
促進剤を塗布した絶縁テープでコイル絶縁を施し、これ
にエポキシ樹脂を含浸・硬化させたものであるので、樹
脂流出によるボイドのない信頼性の向上した絶縁構造で
あると共に、高温でのtanδも小さく、機器の電力ロス
が軽減されるという効果を奏するものである。G. Effects of the Invention As described above, the insulating structure according to the present invention provides coil insulation with an insulating tape in which a curing accelerator is applied to a mica tape on which a backing material is attached using a specific adhesive, and Epoxy resin impregnated and cured, so it has an insulation structure with improved reliability without voids due to resin spillage, and has a small tan δ at high temperatures, which has the effect of reducing equipment power loss. It is.
第１図はバー状コイルのtanδ−温度特性図、第２図は
静電容量変化率の時間変化図である。FIG. 1 is a graph showing a tan δ-temperature characteristic of a bar-shaped coil, and FIG. 2 is a graph showing a time change of a capacitance change rate.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−193970（ＪＰ，Ａ) 特開 昭60−250027（ＪＰ，Ａ) 特開 昭62−147934（ＪＰ，Ａ) 特公 昭53−14160（ＪＰ，Ｂ２) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-193970 (JP, A) JP-A-60-250027 (JP, A) JP-A-62-147934 (JP, A) 14160 (JP, B2)
Claims (1)
縁用マイカテープの表面にエポキシ樹脂の硬化促進剤を
塗布した絶縁テープにより絶縁を施した回転電機コイル
に、エポキシ樹脂組成物を含浸・硬化させてなる回転電
機コイルの絶縁構造において、 脂環式エポキシ樹脂に100重量部を上限としてノボラッ
ク系エポキシ樹脂を配合したエポキシ樹脂混合物と、エ
ポキシ樹脂混合物の２〜20重量％のブチラール樹脂とか
らなる接着剤を、上記マイカフィルムと上記裏打材との
接着に用いたことを特徴とする回転電機コイルの絶縁構
造。1. An epoxy resin composition is impregnated in a rotating electric machine coil in which insulation is performed by an insulating tape obtained by applying a curing accelerator of an epoxy resin to a surface of an insulating mica tape composed of a mica film and a backing material. In the insulation structure of the rotating electric machine coil that is cured, the epoxy resin mixture in which a novolak epoxy resin is blended up to 100 parts by weight with an alicyclic epoxy resin and a butyral resin of 2 to 20% by weight of the epoxy resin mixture An insulating structure for a rotating electrical machine coil, wherein the adhesive is used for bonding the mica film and the backing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137967U JP2565640Y2 (en) | 1989-11-30 | 1989-11-30 | Insulation structure of rotating electric machine coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989137967U JP2565640Y2 (en) | 1989-11-30 | 1989-11-30 | Insulation structure of rotating electric machine coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0380645U JPH0380645U (en) | 1991-08-19 |
| JP2565640Y2 true JP2565640Y2 (en) | 1998-03-18 |
Family
ID=31685097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989137967U Expired - Lifetime JP2565640Y2 (en) | 1989-11-30 | 1989-11-30 | Insulation structure of rotating electric machine coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2565640Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5166495B2 (en) * | 2010-08-11 | 2013-03-21 | 株式会社日立製作所 | Dry mica tape and electrically insulated wire ring using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314160A (en) * | 1976-07-26 | 1978-02-08 | Nec Corp | Decomposing method of hydrogen peroxide in industrial exhaust water |
-
1989
- 1989-11-30 JP JP1989137967U patent/JP2565640Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0380645U (en) | 1991-08-19 |
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