JP2564486Y2 - Lead frame supply device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame supply device for supplying lead frames one by one.

[0002]

2. Description of the Related Art For example, in a pellet bonding apparatus in a semiconductor manufacturing apparatus, a lead frame stacked and stored in a stocker is sequentially raised in pitch, and a top lead frame is taken out by a take-out means such as a suction nozzle, and is attached to a guide rail. It has a supply device for supplying.

[0003]

In such a conventional supply apparatus, two or more lead frames are contacted at one time by vertically contacting lead frames by surface treatment or the like applied to the lead frames. Has the drawback of being taken out.

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead frame supply device capable of reliably supplying lead frames one by one.

[0005]

According to the present invention, there is provided a lead frame supply apparatus having a stocker for stacking and storing lead frames and a take-out means for sequentially taking out the uppermost lead frames one by one in the stocker. At least one surface of the stocker facing the lead frame positioned above the inside of the stocker faces upward.
While forming a slope that extends outward as you go,
It is characterized in that it has a pressing body arranged opposite to the inclined surface with the lead frame interposed therebetween, and a drive unit for moving the pressing body in the direction of the inclined surface.

[0006]

According to the present invention, the lead frame located above the stocker is shifted in the plane direction by the movement of the pressing body, and is pressed against the inclined surface of the stocker.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of a lead frame supply device according to an embodiment of the present invention, FIG. 2 is an operation state diagram of FIG.
FIG. 3 is a front view of a pellet bonding apparatus using the lead frame supply device of FIG.

First, in FIG. 3, the pellet bonding apparatus 10 includes a supply device 20, a transfer device 30, a bonding device 40, and a storage device 50 for the lead frame 1.

The supply device 20 supplies the lead frames 1 one by one. As will be described later, the supply device 20 has a stocker 21 for stacking and storing the lead frames 1, and a take-out means 22 having a suction nozzle and the like.

The transport device 30 intermittently transports the lead frames 1 sequentially supplied one by one by the take-out means 22 of the supply device 20 along the transport rail 31 by pitch feed means (not shown).

The bonding apparatus 40 includes a moving table 41 that moves in the direction in which the lead frame 1 is conveyed,
And a bonding arm 43 supported by the bonding head 42 and movable vertically and in a direction perpendicular to the transport direction of the lead frame 1. Is provided with a suction nozzle 44.

The storage device 50 includes a magazine 51 for storing the lead frame 1 in a shelf shape, and a vertically moving device 52 for the magazine 51.

Therefore, the pellet bonding apparatus 10
In, the uppermost one of the lead frames 1 stacked and stored in the stocker 21 is sucked and held by the extracting means 22 and supplied to the transport rail 31. Therefore, the lead frame 1 is intermittently conveyed along the conveying rail 31 by a pitch feeding means (not shown) and positioned at the bonding position. Here, a semiconductor pellet is bonded on the lead frame 1. This bonding operation is performed by causing the suction nozzle 44 to suck and hold the semiconductor pellet, and then appropriately moving the movable table 41 and the bonding arm 43 according to the bonding position on the lead frame 1. The bonded lead frame 1 is conveyed to the downstream side again by pitch feeding means (not shown), and stored in a magazine 51 positioned at a predetermined height by a vertical movement device 52.

Next, the supply device 20 used here will be described with reference to FIG. In the figure, stocker 2
1 has a substantially rectangular parallelepiped storage space 23 for storing the lead frame 1 in a stacked state with the longitudinal direction of the lead frame 1 perpendicular to the paper surface. An inclined surface 24 that is inclined outward at an angle θ is formed on one of the surfaces facing the side surface (the side surface in the left-right direction in FIG. 1) of the lead frame 1 positioned above the stocker 21. . The dimension of the inclined surface 24 in the height direction is equal to the thickness of the plurality of lead frames 1 in the illustrated example, but may be at least the thickness of one lead frame 1. A pressing piece 25 is provided to face the inclined surface 24 with the lead frame 1 interposed therebetween.
The surface of the pressing piece 25 facing the inclined surface 24 has a pressing surface 26 inclined in the same direction as the inclined surface 24 and having an inclination angle of substantially θ. The pressing piece 25 is moved forward and backward in the direction of the inclined surface 24 by a driving source such as an air cylinder 27. When the pressing piece 25 advances, it enters the storage space 23 through the notch 21a provided on the side surface of the stocker 21. One side surface of the lead frame 1 located above the stocker 21 is pressed against the inclined surface 24, and the tip of the lead frame 1 is retracted from the storage space 23 when retracted. Storage space 2
A support table 28 that is moved up and down by an unillustrated elevating means is disposed below 3.

In the figure, reference numeral 29 denotes a detector provided above the side surface of the stocker 21 for detecting when the uppermost lead frame 1 in the stocker 21 is located at the take-out level. The operation of the lifting / lowering means and the take-out means 22 of the support base 28 is controlled by a control device (not shown) based on the signal of the detector 29.

Next, the operation of the supply device 20 will be described.

First, when the lead frame 1 is stored in the storage space 23 of the stocker 21, the lifting means (not shown) is driven to lower the support 28 located in the storage space 23. Then, the worker stores the lead frame 1 in the storage space 23 in a stacked state. At this time, the lowermost lead frame 1 is supported by the support 28. Next, the lifting means (not shown) is driven, and the entire lead frame 1 in a stacked state is raised by the support base 28. Then, this rise stops when the detector 29 detects the uppermost lead frame 1. Next, as shown in FIG. 2, the air cylinder 27 operates to move the pressing piece 25 forward. As a result, the plurality of lead frames 1 located in the upper part of the stocker 21 are pressed by the inclined surface 24, and are formed obliquely following the inclined surface 24. Thereafter, the pressing piece 25 retreats, and the take-out means 22 moves up and down, sucks and holds the uppermost lead frame 1, and conveys it to the conveying rail 31.

When the uppermost lead frame 1 is taken out by the take-out means 22 in this manner, the support 28 rises, and the entire lead frame 1 in the storage space 23 is raised. Then, the raising of the support 28 stops when the detector 29 detects the uppermost lead frame 1, and the same operation is repeated thereafter.

According to the above-described embodiment, the lead frame 1 located above in the stocker 21 is inclined in cooperation with the inclined surface 24 by the forward movement of the pressing piece 25, whereby each lead frame 1 Offset from each other horizontally.
Therefore, even when the stacked lead frames 1 are in close contact with each other, they can be separated, and the lead frames 1 can be reliably separated and supplied one by one.

Although the pressing surface 26 of the pressing piece 25 is an inclined surface in the above embodiment, the pressing surface may be a vertical surface if it is formed of a flexible body such as a sponge material.

[0021]

According to the present invention, lead frames can be reliably separated and supplied one by one.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a lead frame supply device according to an embodiment of the present invention.

FIG. 2 is an operation state diagram of FIG. 1;

FIG. 3 is a front view of a pellet bonding apparatus using the lead frame supply device of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 10 Pellet bonding apparatus 20 Supply apparatus 21 Stocker 22 Extraction means 23 Storage space 24 Inclined surface 25 Pressing piece 26 Pressing surface 28 Support table 30 Transport device 40 Bonding device 42 Bonding head 50 Storage device

Claims (1)

(57) [Scope of request for utility model registration] 1. A lead frame supply device comprising: a stocker for stacking and storing lead frames; and a take-out means for sequentially taking out the uppermost lead frame one by one in the stocker. Extends outwardly upwards on at least one of the surfaces facing the lead frame
A lead frame , comprising: a pressing body that forms an inclined surface and is arranged to face the inclined surface with the lead frame interposed therebetween; and a drive unit that moves the pressing body in the direction of the inclined surface. Feeding device.