JP2561059B2 - Punching device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching device for punching a work such as a printed board or a thin board.

[0002]

2. Description of the Related Art Conventionally, a punching device for punching a work such as a printed circuit board or a thin board by punching moves a work to a centering position of a target mark taught by a moving part controlled in the X and Y directions. Position the target mark right above the die, irradiate the target mark with light from a spotlight set above the work table, capture the reflected image with the image capturing unit, binarize this with the image processing device, and center it. And move the moving part based on the result to match the center of the die with the center of the target mark, and then punch the target mark with a punch that moves so as to match the center of the die. Types exist.

[0003]

However, if the upper illumination means consisting of a spotlight is adopted, it is necessary to secure an installation space for the spotlight on the work table,
The device itself becomes large. The degree of ball breakage is high and the drilling work is often interrupted due to replacement. The work is distorted and deformed by the irradiation heat, and accuracy cannot be expected to detect the center of the target mark. It causes various problems. In order to prevent this, it is proposed that the illumination means is arranged below the work table to irradiate light toward the target mark by using the punching hole of the die, but the target mark larger than the punching hole is proposed. The center of cannot be detected. If the target mark is not fed quantitatively to the taught position due to the movement error of the moving unit and a part of the target mark comes off the punched hole, the center of the target mark cannot be detected. Since it is necessary to secure a space for arranging the lighting means under the work table, the size of the apparatus itself becomes large. There is a problem such as.

The present invention has been made in view of the conventional circumstances, and its technical problem is to focus downward illumination from an LED provided around a die toward a target mark without being obstructed by the die. Is.

[0005]

The technical means taken in order to achieve the above-mentioned object is, in claim 1, a moving part for moving a workpiece to be gripped along a work table in the X and Y directions. A die that can be exchanged on the work table,
An image pickup unit and an image processing device for centering a target mark provided on the work table facing the die, and the target mark of the work, which is in communication with the image processing device and the moving unit, are aligned with the centering position. As described above, a control unit that corrects and moves the moving unit, and a punch mechanism that is configured to be swingable so as to position the punch coaxially with the die and the lens of the imaging unit are provided. ,
The LEDs are arranged side by side diagonally upward on the inner periphery of the holes formed in the work table, and the dice are arranged in the central space surrounded by the LED groups, and the dice can be moved up and down with the position as the ascending limit. The summary is what you did. The gist of claim 2 is that a large number of the LEDs according to claim 1 are arranged side by side on the outer periphery of a ring-shaped transparent portion.

[0006]

According to the above technical means, the following actions are achieved. (Claim 1) The work is moved by the moving part by teaching so that its target mark is located on the same axis as the die and the image pickup part, and L arranged in parallel on the inner circumference of the hole of the work table.
The die is lowered so as to expose the ED group. That LE
The target mark is irradiated with cold light from the group D, the transmitted image is received by the image pickup unit on the work table, binarized by the image processing apparatus in communication, and the center of the target mark is detected by the binarized image. The work is corrected based on the detection result, the punch mechanism swings, the punch is aligned with the center of the die, and the die returns to its original position (raises).
And then pierce. (Claim 2) The luminous intensity of the cold light from the LED group is made uniform over the entire area by the ring-shaped transparent portion, and the target mark is irradiated.

[0007]

As described above, the present invention has the following advantages. (Claim 1) Since a die is provided so as to be movable up and down with the work table surface as the upper limit, and a group of LEDs is arranged on the inner circumference of a hole having a larger size for the die to move up and down, a work-friendly LED The center of the target mark can be detected and punched by downward illumination using. Therefore, the size of the device itself is increased, which is a drawback of the upward illumination. Frequent ball breakage and frequent interruption of perforation due to replacement. The work is distorted and deformed by the irradiation heat, and accuracy cannot be expected to detect the center of the target mark. However, the center of the target mark larger than the punched hole cannot be detected, which is a problem of downward illumination. If part of the target mark comes off the punched hole, the center of the target mark cannot be detected. It is possible to eliminate problems such as. (Claim 2) Since the uniform cold light is irradiated toward the target mark over the entire area of the ring-shaped transparent portion, it is possible to obtain a clear transmitted image of the target mark with higher accuracy. The center of the target mark can be detected.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 5 show a punching device of this embodiment. A is a punching device.

This punching device A is provided with a machine base 1, a work table 2, a punch mechanism 3, and a machine base 1 and a work 100.
Moving part 4, which holds the object and moves it in X and Y directions, work 10
It is composed of an image pickup section 5 for picking up an image of the target mark 101 of 0, an image processing apparatus 6 thereof, a die 7 provided on the work table 2, a downward illumination means 8, a control section 9 and the like.

The machine base 1 is provided with a supporting rod 10 having a U-shape in a front view having a space at an intermediate portion on one half side, and a moving portion 4 described later on the other half side.

The support rod 10 supports the image pickup unit 5 and the image processing device 6 at the tip of the upper half 10a thereof, and the punch mechanism 3 at the rear of the support rod 10 so as to be swingable, and the lower half 10a.
The upper surface of the b is the work table 2.

The moving unit 4 comprises an X-axis moving mechanism 14 and a Y-axis moving mechanism 24.

The X-axis moving mechanism 14 has a servo motor 14c attached to one end of a base 14b fitted across two guides 14a parallel to the Y direction mounted on the upper surface of the machine base 1. The servo motor 14c is connected to a screw 14d that is rotatably supported at the other end of the base 14b, and the workpiece 100 is attached to the screw 14d.
A movable body 34 having a work holder 34a for holding the screw is screwed into the screw, and a screw 14d driven by a servomotor 14c is used.
The moving body 34 is moved in the X direction by the rotation of, and the Y moving mechanism 24 is a servo motor provided on the machine base 1.
The screw 24b connected to the screw 24a is screwed to the base 14b, and the screw 24b is rotated by driving the servomotor 24a.
14b itself moves on the guide portion 14a in the Y direction.

As shown in the drawing, the image pickup unit 5 is constructed by coaxially incorporating a lens barrel 25 vertically mounted from the tip of the upper half portion 10a of the support rod 10 and mounted on a camera holder 15 at the tip, and a CCD 35. The lower end of the camera holder 15 is positioned so that a space 200 is secured between the lower end of the camera holder 15 and the upper surface of the work table 2, and at the lower end of the camera holder 15, a smoke-brown light shield 45 is horizontal except for the opening of the lens barrel 25. It is extended in a shape.

The image processing device 6 is a circuit section (not shown) for performing processing such as binarization on the image signal received by the image pickup section 5.
An image memory (not shown) for storing the binarized data thereof, a central processing unit (not shown) for executing a predetermined calculation necessary for detecting the center of the target mark 101, and the central processing unit. RAM, which stores necessary data for R
The target mark 10 is equipped with an OM (not shown) and the like.
Each time the work 100 is fed with the feed amount taught by the moving section 4 so that 1 is aligned with the center of the lens 25a, that is, the center of the cursor 26 on the associated monitor 16 screen, the binary image is displayed on the monitor 16 screen. Enlarged and projected, the 2
The digitized image is searched from the center of the cursor 26 on the screen of the monitor 16 to one pixel pitch and the center of the target mark 101 is detected.

The light-shielding member 45 is formed by each target mark 101.
Is the center of the lens 25a from the reference point, the punched hole 17 of the die 7.
Avoid disturbing light when teaching by moving the workpiece 100 in the X and Y directions so that it is coaxial with the center of.

The control unit 9 is linked to the image processing apparatus 6 and the moving unit 4 and inputs the taught data, and the work unit 100 is quantified by the moving unit 4 by the feed amount corresponding to each target mark 101. A predetermined program is built in for moving the work 100 in the X and Y directions via the moving unit 4 by the amount of error with respect to the detected center of the target mark 101.

The punch mechanism 3 includes an upper half portion 10 of the support rod 10.
In a, a rotating portion 23 is rotatably supported via a bearing tube 13 vertically inserted into a rear portion of the image pickup portion 5,
An arm piece 33 is extended to the height of the space 200 at the tip of the rotating portion 23, and a punch holder 43 having a replaceable punch a is provided at the tip of the arm portion 33. When the rotating portion 23 is rotated, the punch holder is rotated. The punch a in 43 is the center of the lens 25a of the imaging unit 5,
The length of the arm piece 33 is set so as to match the center of the punching hole 17 of the die 7 provided on the work table 2, and as shown in FIG.
Cylinder rod of air cylinder 53 connected to the opposite side of 23
When the 53a is contracted, the punch a in the punch holder 43 is aligned with the center of the punching hole 17 of the lens 25a and the die 7 in the space 200, and when the cylinder rod 53a is extended, the punch holder is expanded. 43 is the space
It is controlled so as to swing from the 200. Although not shown, the punch holder 43 is connected to a desired driving source for punching, such as air or a solenoid.

The lower illuminating means 8 has an LED holder 28 which is detachably attached to the hole 18 having a diameter larger than that of the die 7 so that its upper surface is flush with the upper surface of the work table 2. The LED holder 28 includes a large number of LEDs 38 radially mounted at equal intervals and a transparent portion 48 covering the surface of the LED 38 group.

As shown in FIGS. 3 and 4, the LED holder 28 has a die 7 at the center of a metal disk-shaped holder portion 28a.
The loose fitting hole 28b is opened, and mounting groove portions 28c communicating with the loose fitting hole 28b are provided in the holder portion 28a at radial intervals from the back surface direction at equal intervals, and are provided around the loose fitting hole 28b. A ring-shaped transparent portion 48 closes the inner groove opening of each mounting groove 28c.

The LED 38 is fitted and supported in the mounting groove 28c with a slight diagonal upward direction, and cools cold light into a ring-shaped transparent portion.
Irradiation is performed toward the target mark 101 of the work 100 with a uniform light intensity from 48 to the entire circumference.

As shown in FIG. 2, the die 7 has the LED
It is loosely fitted in the loose fitting hole 28b surrounded by the group 38, that is, in the central space so as to be flush with the upper surface of the work table 2, and is supported so as to be movable up and down with its position as the upper limit.

The die 7 is removably fitted into the tip of the die pad 27, and the lower half portion 10b of the support rod 10 is inserted.
The die pad is attached to the bearing guide 37 which is fixed to the inner fixing plate 10c and which detachably screws the holder portion 28a.
A piston 57 is connected to the lower end of the die pad 27 so that the die 27 can be moved up and down, and a cylinder 67 accommodating the piston 57 is provided with ascending and descending air passages 77 and 87, respectively. When the raising air is supplied from the air passage 77, the piston 57 and the die pad 27 are raised to raise the die 7 in the central space until the die 7 is flush with the upper surface of the work table 2, and conversely from the lowering air passage 87. When the descending air is supplied, the die 7 is allowed to escape downward around the transparent portion 48. In this embodiment, the compression spring 107 is interposed between the bearing 97 and the lower end portion of the die pad 27 so that the lowering can be performed more reliably.

Further, a recovery hole 117 communicating with a vacuum device (not shown) for recovering punched chips after punching is communicated with the punching hole 17 of the die 7 and opened in the die pad 27, piston 57 and cylinder 67. There is.

Reference numeral 101a is a work clamp.

The operation of the punching device of this embodiment having the above-described structure will be described. When each target mark 101 is fed by the moving portion 4 with the feed amount as taught, the air for descending is fed to the cylinder 67. Air is supplied from the passage 87 to push down the piston 57, and the die 7 at the tip of the die pad 27 descends so as to escape from the transparent portion 48 around the group of LEDs 38. Then, cold light is emitted from the group of LEDs 38 through the transparent portion 48 to the target mark 101, and the transmitted image is received by the image pickup unit 5, which is binarized by the image processing device 6 and enlarged on the monitor 16 screen. And then project the cursor 26
Search from the center to detect the center of the target mark 101,
Based on the detection result, the control unit 9 corrects the moving unit 4 to move the target mark 10 to the center of the punching hole 17 of the die 7.
1 Match the centers. Next, the punch mechanism 3 swings and stops so that the punch a coincides with the center of the punching hole 17, and the work pressing member 101a operates to press the work 100 and to the cylinder 67 from the ascending air passage 77. Air is supplied to push up the piston 57 and raise the die 7 to a predetermined height position, that is, flush with the upper surface of the work table 2. Then, punching is performed by the punch a, and the punched chips are collected outside by a vacuum device (not shown).

[Brief description of drawings]

FIG. 1 is a front view of a punching device according to an embodiment.

FIG. 2 is an enlarged cross-sectional view of a vertical moving means portion of the die.

FIG. 3 is an enlarged plan view of a lower illumination means portion.

FIG. 4 is a sectional view taken along line (4)-(4) of FIG.

5 is a sectional view taken along line (5)-(5) of FIG.

[Explanation of symbols]

48: Transparent part A: Punching device 100: Work 2: Work table 7: Dice 5: Imaging part 6: Image processing device a: Punch 101: Target mark 9: Control part 25a: Lens 3: Punch mechanism 38: LED 4: Moving part 18: Hole 28b: Central space (free fitting hole)

Claims (2)

(57) [Claims] 1. A moving part for moving a workpiece to be gripped in an X direction and a Y direction along a work table, a die replaceably provided on the work table, and a die provided opposite to the die on the work table. An image pickup unit and an image processing device for centering the target mark, and a control unit that is in communication with the image processing device and the moving unit and corrects and moves the moving unit so that the target mark of the workpiece matches the centering position. ,
The inner circumference of the hole opened in the working table, which comprises a die and a punch mechanism configured to be swingable so as to position the punch coaxially with the lens of the imaging unit. The LEDs are arranged diagonally upward and the dice are arranged in the central space surrounded by the LED group,
A punching device characterized in that the die can be moved up and down with its position being the upper limit. 2. The punching device according to claim 1, wherein a large number of the LEDs are arranged side by side on the outer periphery of a ring-shaped transparent portion.