JP2828840B2 - Component recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognizing device for recognizing the position of an electronic component having a lead to be sucked by a suction nozzle by illuminating an electronic part with light and reflecting the position of the component by a reflected image of the lead.

[0002]

2. Description of the Related Art In a component recognition apparatus for recognizing a reflection image of this type, conventionally, as shown in FIG.
5) Chip components called PLCC adsorbed on (5)
A light source (87) arranged in a ring shape around the axis of the suction nozzle (85) from below 6) emits light.
The light beam strikes the lead (88) and is reflected therefrom.
The component (86) is taken into the recognition camera (90) via 9) and the position of the component (86) is recognized.

Since the light source shines light on the leads (88) of the component (86) at a fixed angle, the leads (88) emerge from the side surfaces of the chip component (86) as shown in FIG. In the case of a so-called J-bend lead (88) that is bent, only the light that hits a part of the surface above the lowermost surface is reflected just below.

[0004]

However, in the prior art, only the light hitting the part of the lead (88) is reflected immediately below, and the reflected image formed by the reflected light is recognized by the recognition camera (90). However, there is a disadvantage that a clear image of a lead large enough to be recognized cannot be obtained.

Accordingly, an object of the present invention is to transmit a good reflected image of a lead to a camera regardless of the shape of the lead.

[0006]

SUMMARY OF THE INVENTION The present invention is directed to a component recognition apparatus for recognizing the position of an electronic component having a lead to which a suction nozzle is attached, by illuminating the electronic component with light and reflecting the position of the component by a reflected image of the lead. The illumination unit includes a light source that emits light, and a reflecting surface that reflects light from the light source so as to impinge on the component at various angles.

[0007]

The reflecting surface reflects the light from the light source at various angles and irradiates the leads of the electronic component, and the position of the component is recognized based on the reflected image.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 2 and 3, (1) is an X table which moves in the X direction by rotation of an X-axis motor (2), and (3) is an X table which is rotated by a Y-axis motor (4). This is an XY table that moves in the XY direction by moving in the Y direction on the X table (1), and is a printed circuit board on which the chip-shaped electronic component (5) (hereinafter, referred to as a chip component or component) is mounted. (6) is fixed and mounted on fixing means (not shown).

[0010] (7) is a supply board, chip parts (5)
A large number of component supply devices (8) for supplying the components are provided. (9) is a supply stand drive motor, which is a ball screw (1).
By rotating (0), the supply table (7) is guided by the linear guide (12) via the nut (11) fitted with the ball screw (10) and fixed to the supply table (7). Move in X direction. (13) is a turntable which rotates intermittently. At the outer edge of the table (13), mounting heads (15) having six suction nozzles (14) are arranged at regular intervals according to the intermittent pitch. I have.

(A) Description of each station The stop position of the mounting head (15) where the suction nozzle (14) sucks and takes out the component (5) from the supply device (8) is the suction station. The nozzle (14) sucks the part (5).

In (16), the positional deviation of the component (5) to be sucked by the suction nozzle (14) is imaged by a camera on the lower surface of the component (5) in a predetermined visual field range, and the image screen is recognized and recognized. The recognition station is a component recognition device, in which the turntable (13) rotates and the mounting head (15) stops on the device (16).

The next mounting head (1) of the recognition station
The stop position of 5) is the angle correction station, and the mounting head (1) is based on the recognition result by the recognition device (16).
The component (5) to be sucked by the suction nozzle (14) when the head (5) is rotated in the θ direction by the head rotation device (17).
Is corrected.

The next stop position after the angle correction station is a mounting station, on which the component (5) to be suctioned by the suction nozzle (14) of the station is mounted on the substrate (6).

The position at which the mounting head (15) stops next to the mounting station is the nozzle selection station, and the head (15) is rotated by the nozzle selection device (19) and any of the plurality of nozzles (14) is rotated. The nozzle (14) is selected.

Next, the position where the mounting head (15) stops is the nozzle access station, in which the nozzle (14) is housed and protruded by the nozzle access means (not shown).

(B) Description of the mounting head (15) Each mounting head (15) is attached to the lower part of a head elevating shaft (24) that penetrates the turntable (13) up and down at two locations inside and outside. The upper part of the shaft (24) is fixed to an L-shaped roller mounting body (25). An upper cam follower (26) and a lower cam follower (27) projecting inward from the upper portion of the roller mounting body (25) are pivotally supported.

(28) shown in FIG. 3 is a turntable (1).
3) is a support base that supports the lower part so as to be rotatable in the horizontal direction, and the support base (28) is arranged around the rotation axis of the turntable (13) with respect to the support base (28). A cylindrical cam (29) protrudes from the upper cam follower (2).
6) is in contact with the upper surface of the cam (29),
5) Mounting head (15) by suspending and supporting
I support. The lower cam follower (27) presses the lower surface of the cam (29) by pressing a spring (not shown).

Therefore, the cam followers (26) and (27) sandwich the cam (29), and the cylindrical cam (29) moves up and down as shown in FIG. Cam follower (26)
(27) moves while rolling on the upper and lower surfaces of the cam (29), and accordingly, the mounting head (15) also rotates while moving up and down so as to be at the optimum height position at each station.

FIGS. 4 and 5 show the mounting head (15).
It will be described based on.

Reference numeral (39) denotes a mounting plate fixed to a lower portion of the shaft (24), and a rotating body (40) is mounted so as to be rotatable in the θ direction. Six suction nozzles (1
4) are provided at equal rotation angles in the θ direction through the rotators (40) so that they can move up and down. The six suction nozzles (14) are of various types so as to be able to suction various components (5), such as having different diameters. An engagement body (38) is attached to the upper part of each nozzle (14),
An engagement piece (42) with which a pressing spring (41) is engaged is formed in the engagement body (38), and the nozzle (14) is constantly urged downward. The pressing spring (41) is a guide rod (104).
The engaging piece (42) is provided with a through hole through which the guide rod (104) penetrates. A lever (4) is provided on the upper part of the rotating body (40) so as to be swingable around a spindle (43).
4) is provided corresponding to each nozzle (14), and a locking claw (45) is formed below the lever (44). (46) is a spring for urging the lever (44) so that the claw (45) rotates inward.

The engaging claw (4) is provided at the upper end of the engaging body (38).
5) is formed with an upper engaging claw (47) that can be engaged with the lower engaging claw (48) formed at the lower end of the engaging body (38) on the regulating surface (40B) of the rotating body (40). The lower limit of the “projecting position” of the suction nozzle (14) is regulated by
The suction nozzle (14) is engaged with the locking claw (45) to regulate the suction nozzle (14) to the upper limit position which is the "storage position".

The suction nozzle (14) on the left side of FIG. 4 is in the storage position, and the suction nozzle (14) on the right side is in the protruding position.

Reference numeral (50) denotes a diffusion plate, and the rotating body (40)
When the component recognition device (16) recognizes the component, the light from the optical fiber (79), which will be described later, is reflected and diffused to irradiate the chip component (5) to be sucked by the suction nozzle (14). . A reflection surface (51) for reflecting light from below is formed on the upper part of the diffusion plate (50). The reflection surface (51) may be made to be a rough surface to more irregularly reflect.

At the upper end of the rotating body (40), a fitting groove (52) into which a bit (not shown) can be fitted for rotating the rotating body (40) is provided with a suction nozzle (14). Each rotating body (4
0) are formed in three directions substantially on the rotation axis. That is, the suction nozzles (14) are arranged at intervals of 60 degrees along the extension of the arrangement direction of the grooves (52).

(C) Description of the lifting mechanism of the mounting head (15) in the suction station In FIG. 3, (53) is a lifting block having a U-shaped cross section, and a cylindrical cam (29) in the suction station.
Is disposed at the cutout portion, and the lifting plate (5) which moves up and down while the turntable (13) is stopped in synchronization with the intermittent rotation of the turntable (13) by a lifting device (not shown).
The upper end is attached to 4).

Projection piece (57) at the lower part of lifting block (53)
Is the cylindrical cam (2) at the ascending position of the lifting block (53).
The cam followers (26) and (27) can move over the upper and lower portions of the projecting piece (57) by rotating the turntable (13) in the extended position of (9).

Accordingly, the mounting head (15) stopped at the suction station moves up and down.

A similar structure is also provided at the mounting station, and the lifting block (53) is raised and lowered, and the nozzle (53) is lowered by lowering the block (53) while the mounting head (15) is stopped at the station. 14), the component (5) that has been lowered and adsorbed is mounted on the substrate (6),
And rise.

(D) Description of the component supply device (8) (see FIG. 3) In the suction station, the component (5) supplied by the component supply device (8) is sucked and taken out by the suction nozzle (14) descending. . The parts (5) housed at regular intervals on a tape (not shown) wound on a tape reel (55) are moved clockwise in FIG. 3 by a swing lever (56) via a tape feed mechanism (not shown). When the tape is fed at a predetermined pitch, the tape is sent to the take-out position of the suction nozzle (14).

Reference numeral (57) denotes a lifting rod which penetrates a lifting guide block (144) attached to the support base (28) so as to be able to move up and down in order to swing the swing lever (56). The supply device (8) arrives at a position where it is sucked by the suction nozzle (14) of the suction station due to the movement of the suction station, stops and descends, depresses the swing lever (56), and performs the above-described tape feed, which is the component supply operation. And rise. The vertical movement of the lifting rod (57) is caused by the rotation of a cam (not shown).

(E) Description of the component recognition device (16) (see FIGS. 1, 2, 6 to 8) In FIG. 1, (58) is provided with a recognition camera (59) (see FIG. 6). Box, lens (60)
Is mounted inside, and the recognition camera (59) is mounted on the left side of the lens (60). The box (58) is mounted on a mounting (82) which is fixed to the support (28).

(61) is an illumination part made of aluminum, which is attached to the upper part of the box (58), and is attached so as to be located below the suction nozzle (14) stopped at the recognition station. . The lighting unit (6
1) has a cylindrical outer wall as shown in FIG. 1, FIG. 7 and FIG. The inner wall (62) of the lighting section (61) has a stepped cross section so that the inner diameter increases toward the top, and a circular opening (63) is formed on the lower surface of the lighting section (61). ) Is provided. The lowermost surface of the inner wall (62) is the first wall surface (64), the upper wall surface is the second wall surface (65), and the upper wall surface is the third wall surface (6).
6) Above it is the fourth wall surface (67) and the fifth wall surface (68).
It is. A first top surface (69) is formed between the first wall surface (64) and the second wall surface (65) and is inclined downward toward the outer wall side of the lighting unit (61). ) And third
Similarly, a second top surface (70) is formed between the third wall surface (66) and the fourth wall surface (67). Are formed. There is no such a top surface between the fourth wall surface (67) and the fifth wall surface (68), and a boundary line is formed by different inclination angles. The opening (63), the respective wall surfaces and the top surface are arranged substantially concentrically around the axis of the suction nozzle (14) stopped at the recognition station as shown in FIG. If the cross section is a plane including the axis of the suction nozzle (14), the shape of the inner wall (62) is as shown in FIG.
The shape is as shown in FIG. Inner wall (62)
Is a suction nozzle (1) cut in a horizontal plane of various heights.
4) It is formed so as to be a circle centered on the axis.

FIGS. 1, 7 and 8 show the third wall (66).
As shown in (1), a plurality of optical fibers (72) are arranged at equal intervals, and each optical fiber (72) is arranged so as to be substantially horizontal and to emit light substantially toward the axis of the suction nozzle (14). The projected light beam is irradiated to the opposing inner wall (62) with a certain spread. The first wall surface (64), the second wall surface (65), the third wall surface (66), the fourth wall surface (67), and the fifth wall surface (68) of the inner wall (62) are irradiation light from the fiber (72). It is a reflective surface that reflects light, but it is finished in a rough surface,
The reflected light reaches the suction nozzle (1) that has reached the recognition station.
The light is irregularly reflected toward the component (5) sucked at 4). As shown in FIG. 1, the first wall surface (64) of the chip component (5A) having a predetermined thickness in which light rays from the fiber (72) hitting the substantially central portion thereof are sucked at the center portion by the suction nozzle (14). The angle is set so as to irradiate a substantially central portion of the lower surface, and the inclination with respect to the horizontal plane of each of the wall surfaces is made gentlest. Therefore, when the light from the fiber (72) hits a position shifted in any direction above or below the wall surface (64), a position slightly shifted from the center of the lower surface of the chip component (5A) is irradiated, The surface is rough and diffused, so that the entire lower surface of the chip component (5A) and the leads (2
0) is applied at an angle close to the angle applied to the substantially central portion of the lower surface of the chip component (5A), so that the leads (20) are uniformly irradiated.

Also on the second wall surface (65), the light reflected on the substantially central portion thereof is formed to be inclined at an angle corresponding to the substantially central portion of the lower surface of the chip component (5A). The angle of inclination is slightly steeper than that of (64). Third wall (6
In 6), similarly, the reflected light is collected at the center of the lower surface of the component (5A), and the inclination angle is steeper than that of the second wall surface (65). The fourth wall surface (67) and the fifth wall surface (6
Similarly, the fibers (7) hit the respective substantially central portions.
The light from 2) is inclined so as to hit the center of the lower surface of the component (5A), and as a result, the upper wall surface is closer to vertical. Therefore, the first wall surface (64) irradiates light from below relatively, the fifth wall surface (68) irradiates light from a direction relatively horizontal, and the other wall irradiates light at almost all angles between them. Is done.

The first top surface (69), the second top surface (70), and the third top surface (71) are painted black so as not to reflect light. For example, the third top surface (71) is provided, and each top surface is provided so that the wall surface (67) is farther from the axis of the suction nozzle (14) than the wall surface (66). One reason is that the distance from the axis of the suction nozzle (14) is farther than the lower wall because light from the fiber (72) spreads only in a relatively narrow range. Third between (67) and wall (66)
If the top surface (71) is not provided and the wall surface (67) is brought close to the axis, the inclination does not hit the lower surface of the chip component (5A) but passes straight below and must be positioned above. Also, for example, if the wall surface (64) closest to the axis is farther from the axis, light at the same angle as in FIG. 1 cannot be applied to the lower surface of the component unless it is located below the axis. In order to provide a wall surface that reflects light within this angle range in a direction close to the horizontal direction to a wall surface that reflects the light in the direction close to the vertical direction, it is effective to form the step shape in this way.

In addition, by using a light source that spreads in a wider direction without using the fiber (72), continuous surfaces (not limited to a step-shaped surface but a spherical surface) may be provided as respective reflecting surfaces. Alternatively, a certain distance may be provided between the chip component (5) sucked by the suction nozzle (14) and the illumination unit (61), and the thickness of the chip component (5) may be different for each component type or the same. Variations even with parts types,
Alternatively, even if the light is sucked in a so-called standing state in which the side face in the longitudinal direction of the chip component (5) is sucked, it does not hit the illuminating section (61). Suction nozzle (1
The reflecting surface must be provided farther than the axis 4). Further, in order to cope with the large-sized component (5), it must be provided farther than the axis of the suction nozzle (14), but light from below, such as light from the first wall surface (64), is prevented. The reflecting surface requires a longer distance than the upper end of the illumination unit (61), and the illumination unit must be thick. However, as shown in FIG. 6, the printed board (6) is moved under the recognition station by moving the XY table (3), and the suction nozzle (14) descends from this position and prints. Since the chip component (5) must be mounted on the substrate (6), the recognition stage
In this case, it is not possible to set the illumination portion too high. Therefore, it is advantageous that the thickness of the illuminating portion is small. Therefore, it is advantageous to form the illumination portion in a stepped shape as in this embodiment.

The box (58) has the opening (6)
An opening (73) is provided in accordance with 3), and a surface light emitter (74) is provided on the bottom surface of the box (58) below the opening (73). The surface light emitter (7
4) is a structure in which an optical fiber (75) is woven, a light is emitted by light leaking from the bent fiber (75), and a diffusion plate covers the woven fiber (75). The whole is designed to emit light. A beam splitter (76) is provided above the surface light emitter (74), and the light emitted from the light emitter (74) is transmitted and radiated to the lower surface of the chip component (5A). Thereby, the lower surface of the chip component (5A) and the leads (20) are irradiated from almost all directions. The reflected light image of the chip component (5A) thus illuminated is reflected by the beam splitter (76), enters the lens (60), and is imaged and recognized by the recognition camera (59).

The optical fiber (72) is connected to the illumination unit (6).
1) It is collected at one place through the inside, bundled in a fiber tube (80), and guided to a light source section (77) shown in FIG. 6 which prevents light from leaking to the outside. The light source unit (77) is provided with a light source lamp (78), and supplies light to an end of an optical fiber (72) in a fiber tube (80). The optical fiber (75) is bundled in a fiber tube (81), guided to a light source (77), and transmits light from a light source lamp (83) to a surface light emitter (74). Light source lamp (78)
(83) is a halogen lamp, which is turned ON / OF in a short time.
The shutter (84) (see FIG. 6) is moved up and down by a drive source (not shown) to shield and open between the lamps (78) and (83) to open the lamp. It is turned on / off. Between the light source lamp (78) and the lamp (83) is a separating wall (9).
2) is provided, the lamp (78) is a fiber (72)
The lamp (83) is adapted to illuminate the fiber (75), and the lamps (78) (83) are illuminated so as to balance the illumination by the surface light emitter (74) and the optical fiber (72). Have been.

An optical fiber (7) is provided on the third top surface (71).
9) are provided at equal intervals as shown in FIG. 7, the fibers (79) are bundled in a fiber tube (94), and are divided into walls (95) on the opposite side of the lighting unit (77) in FIG. Light is supplied by a halogen lamp (not shown) provided. A shutter similar to the shutter (84) is provided between the fiber (79) lamp and the fiber (79). The fiber (7
The light irradiated from 9) is irradiated to the diffusion plate (50) so as to avoid the chip component (5) and illuminates the chip component (5) from above, and the light is transmitted through the opening (63) and the opening (73). The projected image is reflected by the beam splitter (76) and is captured by the recognition camera (59).

Depending on the type of component, the fiber (79) emits light and is recognized by a projected image, or the fiber (72) (7
Whether or not 5) is emitted and recognized by a reflected image is set by data (not shown), and a shutter (84) is opened by a controller (not shown) to transmit light from the light source lamps (78) and (83) depending on the type of component. Or the light source (7
8) The shutter (84) is closed, and the fiber (79) is supplied from a lamp (not shown) which becomes a light source of the fiber (79).
It controls whether the shutter for shining is opened.

The chip component (5A) is a so-called PLCC component having a bent lead (20) called a J-bend as shown in FIG.
Although the lead (20) is seen from above, the lead (20) has a portion that cannot be seen from above, so that recognition using a reflection image is more accurate than recognition using a transmission method using a projection image. In this embodiment, recognition using a reflection image is performed. It is stored in the data as much as possible. The lead (20) can obtain an image in which a considerable part of the part seen from below by the illumination part (61) reflects light.

In the case of a small component such as a chip resistor or a chip capacitor in which the lead does not protrude from the component body and is formed on the lower surface, if the diameter of the suction nozzle (14) is not smaller than the component, Although it is not suitable for the recognition of the transmission method, if the diameter of the nozzle (14) is small, the attraction force is reduced. Therefore, it is advantageous to use the recognition based on the reflected image because the recognition can be performed even if the nozzle diameter is increased.

A component (5) having a lead (23) outside the component body such as an SOP or QFP as shown in FIG. 11 is often recognized in a normal transmission system. Even if the lead does not protrude from the component body, it is a slightly large component, and the component (5) with a simple shape such as a rectangular shape when viewed from above can be easily recognized by transmission recognition. Are suitable.

The operation of the above configuration will be described below.

First, in accordance with the intermittent rotation of the turntable (13), the ball screw (1) is rotated by the rotation of the motor (9).
By the rotation of 0), the supply table (7) is moved to the linear guide (12).
Then, the component supply device (8) for supplying the chip component (5) to be sucked next moves to the suction station and stops. The chip component (5) to be sucked next is indicated by data in which a component type to be mounted is stored for each mounting order stored in a storage device (not shown). In this case, the chip component (5A) is assumed to be the chip component (5A). .

Next, the lifting block (53) is lowered by the lowering of the lifting plate (54) by a lifting device (not shown), and the mounting head (15) is moved via the head lifting shaft (24).
Is lowered, and the chip component (5A) supplied by the component supply device (8) by the selected and protruding suction nozzle (14).
Is adsorbed.

Next, the mounting head (15) is raised and the turntable (13) is rotated, whereby the upper cam follower (2) is rotated.
6) and the lower cam follower (27)
3) It moves by rolling and moving to the cylindrical cam (29), and moves to the next station while moving up and down along the cam (29).

Next, the mounting head (15) is moved to the recognition stage.
When the chip component (5A) is stopped after reaching the position, the shutter (84) is moved upward by the control device (not shown) because the storage device (not shown) stores the chip component (5A) as a component recognized by the reflected illumination. Open. Thus, the light from the light source lamps (78) and (83) passes through the optical fibers (72) and (75), is radiated from the tip of the optical fiber (72), and is also transmitted through the fiber (75).
The surface light emitter (74) is caused to emit surface light. As a result, light from the surface light emitter (74) is transmitted through the beam splitter (76) and irradiated from below the lead (20), and the lead (2) is irradiated.
The lower surface of 0) is irradiated substantially perpendicularly. Light radiated from the fiber (75) and reflected by the first wall surface (64) is reflected on a part of the component (5) slightly bent above the lower surface of the lead (20) and on both side surfaces bent outward. And the respective reflected lights from the second wall surface (65) to the fifth wall surface (68) are sequentially irradiated on the upper surface of the lead (20), and are reflected symmetrically with respect to the perpendicular to those surfaces. And is reflected right below. The lead (2) bent in this manner
Reflected light over an entire area outside of 0) goes to the opening (63) just below. The reflected light from the lead (20) is reflected by the beam splitter (76) through the opening (63) and the opening (73), enters the lens (60), and is taken into the recognition camera (59). The position of the component (5) relative to the suction nozzle (14) is recognized by the recognition camera (59) based on the image of the reflected light from the lead (20).

Next, the mounting head (15) sucking the component (5A) reaches the angle correction station, and the positional deviation recognized in the θ direction among the positional deviations recognized by the recognition camera (59) is the head rotation. The suction nozzle (14) is rotated and corrected by the device (17).

Next, the head (15) reaches the mounting station, and corrects the positional deviation recognized by the recognition camera (59) to change the X table (1) and the XY table (3) to the motor (2). It is moved in the XY directions by the rotation of (4), and is mounted at a desired position on the printed circuit board (6).

Next, the suction nozzle (1
The mounting head (15) having 4) is a turntable (1).
When 3) intermittently rotates twice, a nozzle selection station is reached, and then a suction nozzle (14) corresponding to the component (5) to which the head (15) sucks is selected, and the head (15) is selected.
When reaches the nozzle in / out station, the selected suction nozzle (14) is protruded.

Next, the chip part (5) to be recognized by the reflected image sucked by the suction station has the lead (21) inclined at an angle of "θ1" with respect to the vertical as shown in FIG. Even if it is a chip component (5B) or a chip component (5C) having a lead (22) inclined at “θ2” with respect to the vertical as shown in FIG. 10 (“θ1” is “θ2”) When the mounting head (15) for sucking the chip parts (5B) and (5C) reaches the recognition station, the light source (78) irradiates the surface light emitter (74) in the same manner as described above. And the light resulting from the reflection of the first wall surface (64) to the fifth wall surface (68) impinges on the lead (21) or the lead (22). In the case of the chip component (5C), the light having a relatively inclination, that is, the light from the wall surface closer to the first wall surface (64) or the light from the surface light emitter (74) is mainly used as the lead (22). ) And is reflected by the opening (63) and the opening (7).
It is taken into the recognition camera (59) as a good reflection image via 3). Further, in the case of the chip component (5B), the light that is closer to the horizontal, that is, the fifth light is compared with the case of the chip component (5C).
Light reflected from the wall surface near the wall surface (68) mainly hits the lead (21), is reflected, and is taken into the recognition camera (59) as a good reflected image. Therefore, even if the lead of the chip component (5) to be recognized by the reflected light is horizontal or nearly vertical, the light in any direction can be similarly formed as a good reflected image. Will be hit. The chip component (5) recognized in this way is then corrected for the misalignment of the recognition result in the same manner as described above, and is mounted on the printed circuit board (6).

Next, as shown in FIG. 11, when the chip component (5D) sucked by the suction nozzle (14) is a component to be recognized not by the reflected light but by the transmitted light (the component). 9 and 10 are components similar to those shown in FIGS. 9 and 10 and may be reflected images, but shall be recognized by a transmission method.) When the chip component (5D) reaches the recognition station, the shutter is released. (84) is closed, a shutter (not shown) is opened, and light is emitted from the optical fiber (79) to the diffusion plate (50) by a lamp (not shown). The light is reflected and diffused by the reflection surface (51) formed on the upper portion of the diffusion plate, and is diffused from above the chip component (5D).
The part (5D) having 3) is illuminated, and the transmitted image is reflected by the beam splitter (76) through the opening (63) and the opening (73) and recognized through the lens (60). It is taken in. Then the part (5D)
Is subjected to correction of the recognition result, and is mounted on the printed circuit board (6) as described above.

In order to illuminate the chip part (5) to be recognized by the reflected image for recognition, the shutter (84) is opened as described above. The shutter (not shown) is kept closed.

In the case of recognition by reflection, if the illumination section (61) of this embodiment is used, not only light from one direction but also light from various directions hits the leads. Such a bent portion of the lead does not emit too much light, and even if the lead itself has irregularities, a uniformly lit image can be obtained without a portion that is too strong or a dark portion in the reflected image of the lead.

Further, the inner wall (62) of the illuminating section (61) may be a wall having a smaller number of steps or a wall having a larger number of steps than in the present embodiment, and each wall is a vertical wall passing through the axis of the suction nozzle (14). The cross section of the surface may be a straight line as in this embodiment, or may be a curved surface in which light is more likely to gather at the center of the lower surface of the component.

Further, in this embodiment, the optical fiber (72) arranged side by side on the wall surface (66) is a single plastic fiber, and the periphery thereof is fixed to the wall surface (66) without any gap. Alternatively, a large number of glass fibers may be arranged in the same hole without any gap. Needless to say, a large number of glass fibers or plastic fibers may be embedded in the larger holes without any gaps, and the fiber may be fixed around the fibers with an adhesive for fixing.

The fiber (72) is provided on the wall (6).
The arrangement interval in 6) may be made smaller, and furthermore, a groove may be cut in the lateral direction of the wall surface (66), and the fiber may be embedded and fixed therein without any gap. At this time, the periphery of the fiber may be fixed with an adhesive.

Furthermore, although the fiber (79) is provided on the top surface (71), it may be provided further on the outer upper surface, may be provided on the lower top surface, or may be provided on these three places. Alternatively, it may be provided on two top surfaces and switched on and turned on for each top surface according to the size of the component.

[0061]

As described above, according to the present invention, the reflection surface can reflect the light of the light source at various angles and irradiate the leads of the electronic component. Recognition can be performed, and accurate position recognition can be performed.

[Brief description of the drawings]

FIG. 1 is a partially broken side view illustrating a state in which an illumination unit of a recognition device is illuminating for recognition of a reflected image.

FIG. 2 is a plan view of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 3 is a side view of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 4 is a side view showing the mounting head.

FIG. 5 is a plan view showing a mounting head.

FIG. 6 is a side view of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 7 is a plan view of a lighting unit.

FIG. 8 is a cross-sectional view of a lighting unit.

FIG. 9 is a side view showing a chip component.

FIG. 10 is a side view showing a chip component.

FIG. 11 is a partially cutaway side view showing a state in which the illumination unit of the recognition device is illuminating for transmission type recognition.

FIG. 12 is a side view showing a conventional example.

[Explanation of symbols]

 (5) Chip-shaped electronic component (16) Component recognition device (20) Lead (21) Lead (22) Lead (61) Illumination unit (62) Inner wall (reflective surface) (64) First wall surface (reflective surface) (65) ) Second wall surface (reflective surface) (66) Third wall surface (reflective surface) (67) Fourth wall surface (reflective surface) (68) Fifth wall surface (reflective surface) (72) Optical fiber (light source)

Claims (1)

(57) [Claims] 1. A recognizing component recognition device the position of the component by the reflection image of the suction nozzle is irradiated with light illumination unit to the electronic component having a lead of adsorbing the lead, the irradiation
Bright portion component recognition apparatus characterized by comprising: a light source emitting light, and a reflecting surface for reflecting light from said light source to strike the said components at various angles.