JP2559593Y2 - Optical semiconductor component assembly structure of light receiving / emitting module - Google Patents

Description

[Detailed description of the invention]

[0001]

INVENTION The present invention relates to relates to an optical semiconductor component assembly structure of the light emitting and receiving module, in particular, the light emitting and receiving
The present invention relates to improvement of a stem of an optical semiconductor component for a module .

[0002]

2. Description of the Related Art FIG. 4 shows a conventional optical semiconductor component for a light receiving / emitting module. The optical semiconductor component 6 includes a light emitting / receiving element 1, a heat radiation block 2, a submount 3, a lead pin 4, a stem 5, a can 7, a compensation glass 8, and the like. FIGS. 5 and 6 show a light emitting / receiving module incorporating such an optical semiconductor component. The one shown in FIG. 5 relates to Japanese Utility Model Laid-Open No. 1-94910, and the one shown in FIG. The light emitting and receiving module is assembled together with the optical semiconductor component 6, the receptacle body 12, the lens 13 and the like by using holding parts 9, 10, and 11 dedicated to assembling. The reason why the three holding parts 9, 10, 11 are used here is to adjust the three optical axes X, Y, and Z shown in FIG.

[0003]

As described above, the conventional light emitting / receiving module requires the holding parts 9, 10, and 11 dedicated to assembling for adjusting the optical axis as described above, so that the number of parts used for assembling is increased. In addition, there is a problem that the combination accuracy is poor, and the light coupling efficiency between the light emitting / receiving element 1 and the lens 13 is poor. In order to solve this difficulty,
If you raise the processing accuracy and increase the combination accuracy of those parts
Good, but there was the drawback that doing so would increase the cost of the parts.

[0004]

The object of the present invention is to provide an optical semiconductor component assembling structure of a light receiving / emitting module which does not require the above-mentioned can and can be assembled by using one holding component different from the optical semiconductor component for the light receiving / emitting module. To provide.

[0005]

The assembling structure of the optical semiconductor component of the light emitting / receiving module according to the present invention includes a light emitting / receiving element 1, a heat radiating block 2, a submount 3, a light emitting / receiving element, as shown in FIGS.
The shape of the stem 5 of the optical semiconductor component 6 in which the lead pins 4 and the like are attached to the stem 5 has an opening 20 formed at the end in the axial direction-
And the other end has a U-shaped cross section closed by the head 22.
The submount 3 and the heat radiation
Attach the lock 2 and the light emitting / receiving element 1 and open the stem 5.
The mouth 20 side is fitted to the holding jig 14 separate from the stem 5,
The head 22 side of the stem 5 is separated from the stem 5 by a holding component 15
Submount 3, heat dissipation block 2, light emitting / receiving element 1
And the outer surface 23 of the distal end of the holding component 15 is
To the mounting end face 17 of the receptacle body 12
It was attached together .

[0006]

The optical semiconductor component assembly of the light emitting / receiving module of the present invention.
In the structure, the shape of the stem 5 is changed in the
, The other end of which is closed by a head 22.
As shown in FIG. 3, one end (opening 20 side) of the stem 5 is fitted into the holding jig 14 , and the submount 3, the heat radiation block 2,
A holding portion so as to cover them from the outside of the light receiving / emitting element 1
The outer peripheral portion 16 (FIG. 3) for example YAG covered with a goods 15
Attachment of the receptacle main body 12 in which the lens 13 is mounted by welding with a laser to the distal end outer surface 23 of the holding component 15
And welded with, for example, a YAG laser
This makes it easy to assemble. in this case,
The distal end outer surface 23 of the holding component 15 is
Since it is in contact with the mounting end face 17, the mounting end face
17, the degree of freedom of movement of the holding component 15 on the
3 while moving against the receptacle body 12 in the Y-axis direction.
It is easy to adjust the position by moving
Optical axis adjustment (alignment) of three axes of X, Y and Z with holding component 15
Becomes easier. As a result, the optical semiconductor component 6 and the receptacle
Optical coupling between the lens body 12 and the lens 13 becomes accurate,
To the state by welding with a YAG laser etc.
Can be held.

[0007]

1 and 2 show different embodiments of an optical semiconductor component for a light emitting / receiving module according to the present invention. In FIGS. 1 and 2, 1 is a light emitting / receiving element, 2 is a heat dissipation block, 3 is a submount, and 4 is a lead pin. Is the same as the conventional one. These are the submount 3 and the heat radiation
The lock 2 and the light emitting / receiving element 1 are attached in this order. 1 and 2 is a stem, of which the stem 5 in FIG.
Is formed by drawing a plate material and is formed as a single member. The stem 5 in FIG. 1 is formed of two members: a cylindrical tubular portion 21 and a lid 22 fitted thereto. In either case
The stem 5 has an opening 20 at one axial end and a stem at the other end.
5 and a cross-sectional shape closed by a body or a separate head 22
It is formed in a U-shape, and the outer periphery of the stem 5 on the side of the opening 20 is
Into the holding jig 14 that is separate from the
The outer periphery is fitted into a holding component 15 separate from the stem 5.
Pressing the light emitting and receiving module for optical semiconductor component in the present invention
It is attached to the jig 14 and the holding part 1 5. in this case,
The opening 20 side of the stem 5 is fitted into the holding jig 14 and
The peripheral portion 16 is welded to the holding jig 14 by a YAG laser,
The outer periphery of the stem 5 on the head 22 side is fitted into the holding component 15 to
The mount 3, the heat radiation block 2, and the outside of the light emitting / receiving element 1.
Coated with a holding component 15, and a tip outer surface 2 of the holding component 15
3 against the mounting end face 17 of the receptacle body 12
Then, it is attached by welding with a YAG laser .

[0008]

Advantages of the Invention The assembly structure of the optical semiconductor component of the light emitting / receiving module of the present invention has the following effects. . The head 22 side of the stem 5 is held separately from the stem 5
15, a submount 3, a heat radiation block 2, a light emitting / receiving element
Because fitted each, conventional scanning 7 unnecessary and Do Ri, A simple configuration, cost is cheaper. . The assembly of the optical semiconductor component 6, since in addition to the holding part 15 of the optical semiconductor component need only be provided one conventional Optoelectronics
Than the assembly of the body parts used number of parts is reduced (previously three), the assembly is facilitated, assembly accuracy you improved. . The stem 5 is formed in a U-shaped cross section, and the stem 5
The opening 20 side is fitted to the holding jig 14 and the outer periphery of the head 22 side
Is inserted into the holding component 15 so that the optical axis can be adjusted (aligned)
It is not affected by the external dimensions of the can as in the past.
No. . Submount 3 on the outside of head 22 of stem 5, heat radiation
Since the block 2 and the light receiving / emitting element 1 are attached, the optical semiconductor
When the parts are assembled, the optical system of the receptacle body 12
(For example, the lens 13 of FIG. 3)
Light receiving and emitting element assembled with easy optical axis alignment
The optical coupling efficiency between the lens 1 and the lens 13 is also improved. . The tip outer surface 23 of the holding component 15 is connected to the receptacle body 1
2 butted against the mounting end face 17 of the
The degree of freedom of movement increases, butting against the mounting end face 17
It is easy to adjust the position by moving it while holding it, the receptacle body
The optical axis adjustment (alignment) between the holding member 12 and the holding component 15 becomes easy.
Optical semiconductor component 6, receptacle body 12, and lens 1
The optical axis alignment of 3 becomes accurate.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first embodiment of an optical semiconductor component for a light receiving / emitting module of the present invention.

FIG. 2 is a longitudinal sectional view showing a second embodiment of the optical semiconductor component for a light receiving / emitting module of the present invention.

FIG. 3 is a cross-sectional view of an example of an optical module incorporating the optical semiconductor component for a light receiving / emitting module of the present invention.

FIG. 4 is a partially longitudinal side view showing an example of a conventional optical semiconductor component for a light receiving / emitting module.

FIG. 5 is a sectional view of an example of a conventional optical module.

FIG. 6 is a sectional view of another example of the conventional optical module.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 light receiving / emitting element 2 heat radiation block 3 submount 4 lead pin 5 stem 6 optical semiconductor component 12 receptacle body 14 holding jig 15 holding component 17 mounting end face of receptacle body 20 opening 22 head 23 outer edge of tip of holding component

Continuation of the front page (56) References JP-A-56-43784 (JP, A) JP-A-57-186057 (JP, U) JP-A-3-10557 (JP, U)

Claims (1)

(57) [Scope of request for utility model registration] 1. A light emitting / receiving element (1), a heat radiating block (2), a submount (3), a lead pin (4), and the like .
Stem of optical semiconductor component (6) to be attached to stem (5)
The shape of (5) is changed in that an opening (20) is formed at one end in the axial direction.
And the other end is closed by a head (22).
And the submount outside the head (22)
(3) Remove the heat radiation block (2) and the light receiving / emitting element (1)
Attach the jig (1) to the opening (20) side of the stem (5).
4), and the head (22) side of the stem (5) is
(5) Sub-mounting in separate holding part (15)
(3) Fitting together with heat dissipation block (2) and light emitting / receiving element (1)
And the outer surface (23) of the tip of the holding component (15)
Mounting end face of the receptacle body (12) of Joule
(17) An optical semiconductor component assembling structure of a light emitting / receiving module , which is mounted in abutting manner .