JP2558598Y2 - Housing mounting device for electronic circuit package - Google Patents

Housing mounting device for electronic circuit package

Info

Publication number
JP2558598Y2
JP2558598Y2 JP1991077760U JP7776091U JP2558598Y2 JP 2558598 Y2 JP2558598 Y2 JP 2558598Y2 JP 1991077760 U JP1991077760 U JP 1991077760U JP 7776091 U JP7776091 U JP 7776091U JP 2558598 Y2 JP2558598 Y2 JP 2558598Y2
Authority
JP
Japan
Prior art keywords
housing
electronic circuit
circuit package
pins
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1991077760U
Other languages
Japanese (ja)
Other versions
JPH0523589U (en
Inventor
隆夫 相原
裕宣 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1991077760U priority Critical patent/JP2558598Y2/en
Publication of JPH0523589U publication Critical patent/JPH0523589U/en
Application granted granted Critical
Publication of JP2558598Y2 publication Critical patent/JP2558598Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、電子回路パッケージ用
ハウジング取付装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing mounting device for an electronic circuit package.

【0002】[0002]

【従来の技術】従来のハウジング取付構造は、図3に示
すように、バックボード10裏面に貫通したピン12を
ハウジング13中央部に設けられた穴13aに挿通し、
さらに上下側サポート14,15に設けられた切欠部1
4a,5aにハウジング13上下にある爪状突起13b
をはめ込み、ハウジング13の脱落を防止し、さらに切
欠部14a,15aに設けられた突起部14b,15b
によりハウジング13を支持する構造となっていた。
2. Description of the Related Art In a conventional housing mounting structure, as shown in FIG. 3, a pin 12 penetrating through the back board 10 is inserted into a hole 13a provided in the center of a housing 13, and
Notch 1 provided in upper and lower supports 14 and 15
Claw-like protrusions 13b on the upper and lower sides of the housing 13 on 4a and 5a
To prevent the housing 13 from falling off, and furthermore, the projections 14b, 15b provided in the notches 14a, 15a.
Accordingly, the housing 13 is supported.

【0003】[0003]

【考案が解決しようとする課題】上述した従来のハウジ
ング取付構造は、バックボード裏面側に貫通しているピ
ン12にハウジング13を挿通後上下側裏面サポート1
4,15に設けられた、切欠部にハウジング13を取
付、ハウジング13の爪状突起で脱落を防止し、さらに
裏面サポートの切欠部に設けられた突起によりハウジン
グを支持する構造になっているが、この様な構造では、
ピンと切欠の双方でハウジング13の位置決めをしてい
るため、ピン12とサポート14,15の切欠の位置が
一致していなければ、ハウジング13を取付られない。
In the conventional housing mounting structure described above, the upper and lower back supports 1 are inserted after the housing 13 is inserted into the pins 12 passing through the back of the back board.
Although the housing 13 is attached to the cutouts provided in the housings 4 and 15, the claw-like projections of the housing 13 prevent the housing 13 from falling off, and the housings are supported by the protrusions provided in the cutouts of the back support. , In such a structure,
Since the housing 13 is positioned by both the pins and the notches, the housing 13 cannot be attached unless the positions of the notches of the pins 12 and the supports 14 and 15 match.

【0004】また、サポート14,15とハウジング1
3の形状も複雑であり、製造面においても効率が悪いな
どの欠点があった。
Also, the supports 14, 15 and the housing 1
The shape of No. 3 was also complicated, and had disadvantages such as inefficiency in manufacturing.

【0005】[0005]

【考案の目的】本考案は、かかる従来例の有する不都合
を改善し、とくに、構造を単純化して取扱い易くすると
ともに工数の削減及び生産性向上を図った電子回路パッ
ケージ用ハウジング取付装置を提供することを、その目
的とする。
The object of the present invention is to provide a housing mounting apparatus for an electronic circuit package which solves the disadvantages of the prior art, in particular, simplifies the structure and facilitates handling, reduces man-hours and improves productivity. That is its purpose.

【0006】[0006]

【課題を解決するための手段】本考案では、電子回路パ
ッケージ側と信号授受を行う複数本のピンを裏面に向け
て貫通装備したバックボードと、このバックボード上
複数本のピンが装備された領域を挟んで平行に装備され
た電子回路パッケージのハウジング係合用の一方と他方
の長箱状サポートとを備え、これら各長箱状サポートと
係合されるハウジングの両端部に,当該ハウジングの取
付時に各ピンと平行となる方向に突出した係合用舌片を
突設すると共に、このハウジングの係合用舌片に対応し
て、一方と他方の長箱状サポートにハウジング係合用の
長溝を設けるという構成を採っている。これによって前
述した目的を達成しようとするものである。
In A to the object of the present invention includes a backboard a plurality of pins penetrating equipped toward the rear surface to perform the electronic circuit package side and the signal transfer, the <br/> plurality of on this backboard and a one and the other long box-like support housing engaging parallel-equipped electronic circuit package across the region the pin is equipped with a respective long box-support
At each end of the housing to be engaged,
At the time of attachment, an engaging tongue protruding in a direction parallel to each pin is protruded, and a long groove for housing engagement is provided on one and the other long box-shaped support corresponding to the engaging tongue of the housing. It has a configuration. This aims to achieve the above-mentioned object.

【0007】[0007]

【考案の実施例】以下、本考案の一実施例を図1ないし
図2に基づいて説明する。この図1ないし図2に示す実
施例は、電子回路パッケージ側と信号授受を行う複数本
のピン2を裏面に向けて貫通装備したバックボード1
と、このバックボード1上複数本のピン2が装備され
た領域を挟んで平行に装備された電子回路パッケージの
ハウジング係合用の一方と他方の長箱状サポート4,5
とを備えている。そして、これら各長箱状サポートと係
合されるハウジング3の両端部に,当該ハウジング3
取付時に各ピン2と平行となる方向に突出した係合用舌
片3Cを突設すると共に、このハウジング3の係合用舌
片3Cに対応して、一方と他方の長箱状サポート4,5
にハウジング係合用の長溝4C,5Cが設けられてい
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. The embodiment shown in FIGS. 1 and 2 is a back board 1 in which a plurality of pins 2 for transmitting and receiving signals to and from the electronic circuit package side are provided to penetrate toward the back surface.
When the pin 2 of the plurality of on the backboard 1 is equipped
And other long box-shaped supports 4 and 5 for engaging the housing of an electronic circuit package mounted in parallel with the region interposed therebetween.
And And each of these long box-shaped supports
At both ends of the housing 3 to be engaged, of the housing 3
At the time of mounting, an engaging tongue 3C protruding in a direction parallel to each pin 2 is protruded, and one and the other long box-shaped supports 4, 5 corresponding to the engaging tongue 3C of the housing 3 are provided.
Are provided with long grooves 4C and 5C for housing engagement.

【0008】そして、図2に示す如く、バックボード1
裏面に貫通されたバネ性を有する突起部2aを設けたピ
ン2により、ハウジング3の位置決めをし、次に上記ピ
ン2に設けられた突起部2aがハウジング3中央部の穴
3aを通過し、ハウジング3の脱落を防止する。さらに
上下裏面サポート4、5に設けた長溝4c、5cにハウ
ジング上下の舌片3cを挿通し、ハウジング3が支持さ
れる。
[0008] Then, as shown in FIG.
The positioning of the housing 3 is performed by the pins 2 provided with the protrusions 2a having a spring property penetrated on the back surface, and then the protrusions 2a provided on the pins 2 pass through the holes 3a in the center of the housing 3, The housing 3 is prevented from falling off. Further, the housing upper and lower tongue pieces 3c are inserted into the long grooves 4c and 5c provided in the upper and lower back supports 4 and 5, and the housing 3 is supported.

【0009】[0009]

【考案の効果】以上のように、本考案によると、ハウジ
ングの両端部に上記ピンと平行方向に突出した舌片を設
け、長箱状サポートには、舌片を挿通するための長溝を
設けたので、これにより、ハウジングの左右位置決めが
バックボード裏面に貫通されたピンのみによってなさ
れ、ハウジングは裏面サポートの何処にでも取付ること
ができる。また、舌片が、ピンと平行方向に突出してい
るため、ハウジングとピンとの係合と同時に舌片が長溝
に挿入され、取付における作業性の向上が図られると共
に、個別にハウジングの挿抜を行うことが自在であり、
当該ハウジングの交換等も容易に行い得るため、従来通
りの保守性を維持できる。さらに、裏面サポート及びハ
ウジングの形状も単純化され製造面においても工数が削
減されるという従来にない実用的な電子回路パッケージ
用ハウジング取付装置を提供することができる。
As described above, according to the invention], according to the present invention, housings
Tongue pieces are provided at both ends of the
The long box-shaped support has a long groove for inserting the tongue.
As a result, the left and right positioning of the housing
Only by pins penetrated on the back of the backboard
And the housing can be mounted anywhere on the back support
Can be. Also, make sure that the tongue protrudes parallel to the pin.
As a result, the tongue is elongated when the housing and pin are engaged.
At the same time to improve
In addition, it is possible to insert and remove the housing individually,
The housing can be easily replaced, etc.
Maintainability. Further, it is possible to provide an unprecedented practical housing mounting device for an electronic circuit package, in which the shapes of the back support and the housing are simplified and the number of steps is reduced in terms of manufacturing.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例を示す斜視図。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図2】パッケージ取付手順を示す説明図。FIG. 2 is an explanatory view showing a package mounting procedure.

【図3】従来例を示す説明図である。FIG. 3 is an explanatory diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1 バックボード 2 バックボードに貫通されたピン 3 ハウジング 3c ハウジング上下舌片 4 上側裏面サポート 5 下側裏面サポート 5c 下側裏面サポート長溝 DESCRIPTION OF SYMBOLS 1 Back board 2 Pin penetrated by back board 3 Housing 3c Upper and lower tongue piece of housing 4 Upper back support 5 Lower back support 5c Lower back support long groove

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 電子回路パッケージ側と信号授受を行う
複数本のピンを裏面に向けて貫通装備したバックボード
と、このバックボード上前記複数本のピンが装備され
た領域を挟んで平行に装備された電子回路パッケージの
ハウジング係合用の一方と他方の長箱状サポートとを備
え、これら各長箱状サポートと係合されるハウジングの
両端部に,当該ハウジングの取付時に前記各ピンと平行
となる方向に突出した係合用舌片を突設すると共に、こ
のハウジングの係合用舌片に対応して、前記一方と他方
の長箱状サポートに前記ハウジング係合用の長溝を設け
たことを特徴とする電子回路パッケージ用ハウジング取
付装置。
1. A backboard having a plurality of pins for transmitting and receiving signals to and from an electronic circuit package, which are penetrated toward the back surface, and said plurality of pins are provided on the backboard.
One and the other long box-shaped support for housing engagement of the electronic circuit package mounted in parallel with the region interposed therebetween, and of the housing engaged with each of these long box-shaped supports .
At both ends, parallel to the pins when mounting the housing
And a long groove for housing engagement is provided on the one and other long box-shaped supports corresponding to the engagement tongue pieces of the housing. A housing mounting device for an electronic circuit package.
JP1991077760U 1991-08-31 1991-08-31 Housing mounting device for electronic circuit package Expired - Fee Related JP2558598Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991077760U JP2558598Y2 (en) 1991-08-31 1991-08-31 Housing mounting device for electronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991077760U JP2558598Y2 (en) 1991-08-31 1991-08-31 Housing mounting device for electronic circuit package

Publications (2)

Publication Number Publication Date
JPH0523589U JPH0523589U (en) 1993-03-26
JP2558598Y2 true JP2558598Y2 (en) 1997-12-24

Family

ID=13642891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991077760U Expired - Fee Related JP2558598Y2 (en) 1991-08-31 1991-08-31 Housing mounting device for electronic circuit package

Country Status (1)

Country Link
JP (1) JP2558598Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179588U (en) * 1984-10-29 1986-05-27

Also Published As

Publication number Publication date
JPH0523589U (en) 1993-03-26

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970805

LAPS Cancellation because of no payment of annual fees