JP2553024Y2 - RF matching termination element - Google Patents

RF matching termination element

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Publication number
JP2553024Y2
JP2553024Y2 JP1987040192U JP4019287U JP2553024Y2 JP 2553024 Y2 JP2553024 Y2 JP 2553024Y2 JP 1987040192 U JP1987040192 U JP 1987040192U JP 4019287 U JP4019287 U JP 4019287U JP 2553024 Y2 JP2553024 Y2 JP 2553024Y2
Authority
JP
Japan
Prior art keywords
matching
thickness
strip line
termination element
terminating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987040192U
Other languages
Japanese (ja)
Other versions
JPS63147001U (en
Inventor
喜秋 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1987040192U priority Critical patent/JP2553024Y2/en
Publication of JPS63147001U publication Critical patent/JPS63147001U/ja
Application granted granted Critical
Publication of JP2553024Y2 publication Critical patent/JP2553024Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 この考案は,マイクロ波を伝送するトリプレート形ス
トリツプ線路(以下,ストリツプ線路とする。)のRF整
合終端に必要不可欠なRF整合終端素子の改良に関するも
のである。 〔従来の技術〕 第5図に,例えば特開昭56-154804号公報に示された
従来のストリツプ線路の一部削除した斜視図を示す。図
中,(1a)は一方の面の一部に線路幅Wなるストリツプ
線路(2)と他方の面の全面に金属から成る地板(3)
をそれぞれ密着させた比誘電率εの誘電体から成る誘
電体基板A,(1b)は一方の面にのみ全面に地板(3)を
密着させた誘電体基板Bである。 このストリツプ線路(2)は,マイクロストリツプ線
路と比較して系が閉じているため,放射損失がなく,漏
洩電力ならびに機器に及ぼす影響がない等の利点がある
ため,アンテナ給配電回路等によく用いられる。 第6図に,従来ストリツプ線路(2)に用いられるRF
整合終端素子の一部削除した斜視図を示す。また,第7
図に断面図を示す。 図中,(4)は2板の誘電体基板を押える金属板,
(5)はRF整合終端素子である。 次に動作原理について説明する。ストリツプ線路
(2)を流れるマイクロ波電力は,RF整合終端素子
(5)に流れ込み吸収されるストリツプ線路(2)にマ
イクロ波電力が流れる時,誘電体基板(1a)と(1b)の
地板(3)間に電位が生ずるRF整合終端素子(5)が十
分金属板(4)に接地している場合,RF整合終端素子
(5)とストリツプ線路(2)は同電位となり,マイク
ロ波がRF整合終端素子(5)に入力する時に生ずる反射
損失は,第8図に示すように−25dB以下となり,RF整合
終端素子(5)に十分マイクロ波電力が吸収される。 〔考案が解決しようとする問題点〕 このように構成された従来のRF整合素子(5)は,以
上のように構成されているので,ストリツプ線路(5)
を構成する誘電体基板(1a),(1b)の厚みとRF整合終
端素子(5)の厚みを等しくしなければならない。誘電
体基板(1a),(1b)の厚みが第9図のようにRF整合終
端素子(5)より厚い場合,ストリツプ線路(2)とRF
整合終端素子(5)は同電位にならないため,マイクロ
波がRF整合終端素子(5)に入力する時に生ずる反射損
失は,第10図に示すように−15dBから−20dBと不安定に
なり,RF整合終端素子にマイクロ波電力が十分吸収され
ない問題があつた。また,RF整合終端素子(5)の厚み
とストリツプ線路(2)を構成する誘電体基板(1a),
(1b)の厚みを等しくして使用するため,マイクロ波回
路の設計に拘束を受けるなどの問題点があつた。 この考案は上記のような問題点を解消するためになさ
れたもので,誘電体基板(1a),(1b)の厚みがRF整合
終端素子(5)より厚い場合でも,ストリツプ線路
(2)とRF整合終端素子(5)は同電位となり,RF整合
終端素子(5)にマイクロ波電力が入力する時に生ずる
反射損失を小さくし,RF整合端素子(5)に十分マイク
ロ波電力が吸収されることを目的とする。 〔問題点を解決するための手段〕 この考案に係るRF整合終端素子は、RF整合終端素子の
厚み方向の両端面に金属板を接続し、RF整合終端素子と
2つの金属板の厚みにより2つの誘電体基板の厚さと等
しくなるようにRF整合終端素子の厚み方向の両端面に金
属板を接続したことによりRF整合終端素子の外導体の電
位は金属板を経由して上記2つの誘電体基板を押える金
属板に電気的に接地して同電位となるようにしたもので
ある。 〔作用〕 この考案においては,RF整合終端素子(5)の上下に
取り付けた金属板により,ストリツプ線路(2)とRF整
合終端素子(5)は同電位となり,マイクロ波電力RF整
合終端素子(5)に入力する時に生ずる反射損失は改善
され,RF整合終端素子(5)に十分マイクロ波電力が吸
収される。 〔実施例〕 第1図は,この考案の一実施例を示す一部削除した斜
視図である。図中(1a)から(5)は,上記従来のRF整
合終端素子と全く同一のものである。(6)はRF整合終
端素子(5)の厚みを誘電体基板(1a),(1b)と同一
とするために付けられた金属板である。 第2図は,金属板(6)を挿入したRF整合終端素子
(5)の断面図である。 また,第3図に誘電体基板(1a),(1b)とRF整合終
端素子(5)の厚みを同一とする金属板(6)の拡大図
を示す。 上記のように構成されたRF整合終端素子(5)におい
て,2枚の金属板(6)を付けることにより,RF整合終端
素子(5)と誘電体基板(1a)と(1b)を押える金属板
(4)に生ずる電位差とマイクロ波電力がストリツプ線
路(2)に流れる時に誘電体基板(1a)と(1b)の地板
(3)間に生ずる電位差が同電位となり,マイクロ波電
力がRF整合終端素子(5)に入力する時に生ずる反射損
失は,第4図に示すように−25dB以下となり,RF整合終
端素子(5)に十分マイクロ波電力が吸収される。 なお,上記実施例では,金属板(6)を円柱形で示し
たが四角形で形成してもよい。また,ストリツプ線路
(2)は,2枚の誘電体基板の中間に形成したが,上下ど
ちらによつてもRF整合終端子(5)に厚みの異なる金属
板(6)を取り付けることで,マイクロ波電力を十分吸
収する効果を奏する。 ここでは,誘電体基板を2枚で説明したが,誘電体基
板の枚数を2枚以上で構成する多層化した誘電体基板で
使用するRF整合終端素子にも適用できる。 〔考案の効果〕 この考案は,以上説明したように,ストリツプ線路を
用いた誘電体基板を使用して構成されるマイクロストリ
ツプアンテナや給電回路等のRF整合終端素子を設計する
場合,RF整合終端素子の厚みに拘束されずに誘電体基板
の厚みを選定できるため,設計に自由度をもたせるとい
う効果がある。 また、この考案は、2つの誘電体基板の厚みとRF整合
終端素子の厚みが異なった場合でもストリップ線路とRF
整合終端素子は同電位となり、RF整合終端素子にマイク
ロ波電力が入力する時に生ずる反射損失を小さくでき、
RF整合終端素子の電気的特性の劣化を防止することがで
きるという効果を有するものである。
[Detailed description of the invention] [Industrial application field] This invention is an RF matching terminating element that is indispensable for the RF matching termination of a triple plate strip line (hereinafter, referred to as a strip line) for transmitting microwaves. It is about improvement. [Prior Art] FIG. 5 is a perspective view of a conventional strip line disclosed in Japanese Patent Application Laid-Open No. 56-154804, for example, with a part thereof removed. In the figure, (1a) shows a strip line (2) having a line width W on a part of one surface and a ground plate (3) made of metal on the entire surface of the other surface.
The dielectric substrate A, made of a dielectric material having a relative dielectric constant epsilon r, which is tightly attached (1b) is a dielectric substrate B that is brought into close contact with the base plate (3) on the entire surface only on one surface. This strip line (2) has advantages such as no radiation loss, no leakage power and no influence on equipment since the system is closed as compared with the micro strip line, so that the antenna power supply and distribution circuit etc. Often used for Fig. 6 shows the RF used for the conventional strip line (2).
FIG. 4 shows a perspective view of the matching termination element with a part thereof removed. In addition, the seventh
The figure shows a cross-sectional view. In the figure, (4) is a metal plate that holds two dielectric substrates,
(5) is an RF matching termination element. Next, the operation principle will be described. The microwave power flowing through the strip line (2) flows into the RF matching terminating element (5), and when the microwave power flows through the strip line (2), which is absorbed, the ground plane of the dielectric substrates (1a) and (1b) 3) When the RF matching terminating element (5) in which a potential is generated is sufficiently grounded to the metal plate (4), the RF matching terminating element (5) and the strip line (2) have the same potential, and the microwave is RF. The reflection loss generated when inputting to the matching terminating element (5) is -25 dB or less as shown in FIG. 8, and the microwave power is sufficiently absorbed by the RF matching terminating element (5). [Problems to be Solved by the Invention] Since the conventional RF matching element (5) configured as described above is configured as described above, the strip line (5)
The thickness of the dielectric substrates (1a) and (1b) constituting the above must be equal to the thickness of the RF matching termination element (5). When the thickness of the dielectric substrates (1a) and (1b) is thicker than the RF matching terminating element (5) as shown in FIG.
Since the matching terminating element (5) is not at the same potential, the reflection loss that occurs when microwaves enter the RF matching terminating element (5) becomes unstable from -15 dB to -20 dB as shown in Fig. 10, and There was a problem that microwave power was not sufficiently absorbed by the RF matching termination element. Further, the thickness of the RF matching terminating element (5) and the dielectric substrate (1a) constituting the strip line (2),
Since the thickness of (1b) is equal, the design of the microwave circuit is restricted. This invention has been made in order to solve the above-mentioned problems. Even when the thickness of the dielectric substrates (1a) and (1b) is larger than that of the RF matching termination element (5), the strip line (2) can be used. The RF matching terminating element (5) has the same potential, reduces the reflection loss that occurs when microwave power is input to the RF matching terminating element (5), and sufficiently absorbs the microwave power into the RF matching terminating element (5). The purpose is to: [Means for Solving the Problems] The RF matching terminating element according to the present invention has metal plates connected to both end surfaces in the thickness direction of the RF matching terminating element. The metal plates are connected to both end surfaces in the thickness direction of the RF matching terminating element so as to be equal in thickness to the two dielectric substrates. It is electrically grounded to a metal plate holding the substrate so as to have the same potential. [Operation] In the present invention, the strip line (2) and the RF matching terminating element (5) have the same potential due to the metal plates attached above and below the RF matching terminating element (5), and the microwave power RF matching terminating element ( The reflection loss that occurs when inputting to (5) is improved, and the microwave power is sufficiently absorbed by the RF matching termination element (5). [Embodiment] Fig. 1 is a perspective view, partially omitted, showing an embodiment of the present invention. (1a) to (5) in the figure are exactly the same as the above-mentioned conventional RF matching terminating element. (6) is a metal plate provided to make the thickness of the RF matching termination element (5) the same as that of the dielectric substrates (1a) and (1b). FIG. 2 is a cross-sectional view of the RF matching termination element (5) into which the metal plate (6) has been inserted. FIG. 3 is an enlarged view of a metal plate (6) having the same thickness of the dielectric substrates (1a) and (1b) and the RF matching terminating element (5). In the RF matching terminating element (5) configured as described above, by attaching two metal plates (6), the metal that holds down the RF matching terminating element (5) and the dielectric substrates (1a) and (1b) When the potential difference generated in the plate (4) and the microwave power flow through the strip line (2), the potential difference generated between the dielectric substrate (1a) and the ground plate (3) of (1b) becomes the same potential, and the microwave power is RF matched. The reflection loss that occurs when the signal is input to the termination element (5) is -25 dB or less as shown in FIG. 4, and the microwave power is sufficiently absorbed by the RF matching termination element (5). In the above embodiment, the metal plate (6) is shown as a cylinder, but may be formed as a rectangle. Although the strip line (2) is formed in the middle of the two dielectric substrates, the metal plate (6) having a different thickness is attached to the RF matching terminator (5) in both the upper and lower directions, and thus the microstrip is achieved. This has the effect of sufficiently absorbing wave power. Although two dielectric substrates have been described here, the present invention can also be applied to an RF matching terminating element used in a multilayer dielectric substrate having two or more dielectric substrates. [Effects of the Invention] As described above, this invention is applied to the design of RF matching terminating elements such as micro-strip antennas and feed circuits that use a dielectric substrate using strip lines. Since the thickness of the dielectric substrate can be selected without being restricted by the thickness of the matching terminating element, there is an effect that the degree of freedom is given to the design. In addition, even when the thickness of the two dielectric substrates and the thickness of the RF matching terminating element are different, the present invention can provide a strip line and an RF matching termination element.
The matching terminator has the same potential, and the reflection loss that occurs when microwave power is input to the RF matching terminator can be reduced.
This has the effect that deterioration of the electrical characteristics of the RF matching termination element can be prevented.

【図面の簡単な説明】 第1図はこの考案の一実施例を示す一部削除した斜視
図,第2図はこの考案の断面図,第3図はこの考案に用
いる金属板の拡大図,第4図はこの考案によるRF整合終
端素子の電気的特性図,第5図はストリツプ線路の一部
削除した斜視図,第6図は従来のRF整合終端素子の一部
削除した斜視図,第7図は従来のRF整合終端素子の断面
図,第8図は従来のRF整合終端素子の電気的特性図,第
9図は誘電体基板の厚みとRF整合終端素子の厚みが異な
る場合の断面図,第10図は誘電体基板とRF整合終端素子
の厚みが異なる場合の電気的特性図である。 図中,(1a),(1b)は誘電体基板A,B,(2)はストリ
ツプ線路,(3)は地板,(4)は誘電体基板を押える
金属板,(5)はRF整合終端素子,(6)は金属板であ
る。 なお,図中,同一符号は同一あるいは相当部分を示す。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing one embodiment of the present invention with a part removed, FIG. 2 is a sectional view of the present invention, FIG. 3 is an enlarged view of a metal plate used in the present invention, FIG. 4 is an electrical characteristic diagram of the RF matching terminating element according to the present invention, FIG. 5 is a perspective view of a strip line with a part removed, FIG. 6 is a perspective view of a conventional RF matching terminating element with a part removed, and FIG. FIG. 7 is a cross-sectional view of a conventional RF matching termination element, FIG. 8 is an electrical characteristic diagram of the conventional RF matching termination element, and FIG. 9 is a cross section when the thickness of the dielectric substrate and the thickness of the RF matching termination element are different. FIG. 10 and FIG. 10 are electrical characteristic diagrams when the thickness of the dielectric substrate and the RF matching termination element are different. In the figure, (1a) and (1b) are dielectric substrates A and B, (2) is a strip line, (3) is a ground plane, (4) is a metal plate that holds down the dielectric substrate, and (5) is an RF matching termination. The element (6) is a metal plate. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

(57)【実用新案登録請求の範囲】 1.片面にのみ導体を被着した誘電体基板、片面に導体
をまた他方の面にはストリップ線路をそれぞれ被着した
誘電体基板、これら2つの誘電体基板をそれぞれの導体
が外側になるように重ね合わせて構成したトリプレート
形ストリップ線路に接続される上記2つの誘電体基板の
厚さより薄いRF整合終端素子において、RF整合終端素子
の厚み方向の両端面に金属板を接続しRF整合終端素子と
2つの金属板の厚みにより上記2つの誘電体基板の厚さ
と等しくなるように上記RF整合終端素子の厚み方向の両
端面に金属板を接続したことでRF整合終端素子の外導体
の電位は金属板を経由して上記2つの誘電体基板を押え
る金属板に電気的に接地して同電位となることを特徴と
するRF整合終端素子。
(57) [Rules for requesting registration of utility model] A dielectric substrate having a conductor attached to only one surface, a dielectric substrate having a conductor attached to one surface and a strip line attached to the other surface, and these two dielectric substrates are stacked such that each conductor is on the outside. In the RF matching termination element thinner than the thicknesses of the two dielectric substrates connected to the triplate strip line configured together, a metal plate is connected to both end faces in the thickness direction of the RF matching termination element, and the RF matching termination element is connected to the RF matching termination element. By connecting metal plates to both end surfaces in the thickness direction of the RF matching terminating element so that the thickness of the two metal plates becomes equal to the thickness of the two dielectric substrates, the potential of the outer conductor of the RF matching terminating element becomes metal. An RF matching terminating element characterized in that it is electrically grounded to a metal plate that holds said two dielectric substrates via a plate and has the same potential.
JP1987040192U 1987-03-19 1987-03-19 RF matching termination element Expired - Lifetime JP2553024Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987040192U JP2553024Y2 (en) 1987-03-19 1987-03-19 RF matching termination element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987040192U JP2553024Y2 (en) 1987-03-19 1987-03-19 RF matching termination element

Publications (2)

Publication Number Publication Date
JPS63147001U JPS63147001U (en) 1988-09-28
JP2553024Y2 true JP2553024Y2 (en) 1997-11-05

Family

ID=30854059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987040192U Expired - Lifetime JP2553024Y2 (en) 1987-03-19 1987-03-19 RF matching termination element

Country Status (1)

Country Link
JP (1) JP2553024Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209284A (en) 1963-06-05 1965-09-28 Charles O Hast Termination for strip transmission lines
US3343107A (en) 1963-12-03 1967-09-19 Bell Telephone Labor Inc Semiconductor package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209284A (en) 1963-06-05 1965-09-28 Charles O Hast Termination for strip transmission lines
US3343107A (en) 1963-12-03 1967-09-19 Bell Telephone Labor Inc Semiconductor package

Also Published As

Publication number Publication date
JPS63147001U (en) 1988-09-28

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