JP2549407Y2 - Assembled wafer boat with legs - Google Patents

Assembled wafer boat with legs

Info

Publication number
JP2549407Y2
JP2549407Y2 JP8626391U JP8626391U JP2549407Y2 JP 2549407 Y2 JP2549407 Y2 JP 2549407Y2 JP 8626391 U JP8626391 U JP 8626391U JP 8626391 U JP8626391 U JP 8626391U JP 2549407 Y2 JP2549407 Y2 JP 2549407Y2
Authority
JP
Japan
Prior art keywords
legs
wafer boat
wafer
support shaft
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8626391U
Other languages
Japanese (ja)
Other versions
JPH0529133U (en
Inventor
吉岡豊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tecnisco Ltd
Original Assignee
Tecnisco Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecnisco Ltd filed Critical Tecnisco Ltd
Priority to JP8626391U priority Critical patent/JP2549407Y2/en
Publication of JPH0529133U publication Critical patent/JPH0529133U/en
Application granted granted Critical
Publication of JP2549407Y2 publication Critical patent/JP2549407Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、脚付き組立式ウェーハ
ボートに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembled wafer boat with legs.

【0002】[0002]

【従来の技術】半導体ウェーハを拡散炉内において熱処
理する時に用いられる支持具があり、これは複数枚のウ
ェーハを一定の間隔で並置して拡散炉内に収納できるよ
うにしてある。この種の支持具は、ウェーハボートとも
称されて組立式のものがあり、例えば図3に示すように
一対の側板aと、この側板に着脱自在に支持される複数
のウェーハ支持軸bと、このウェーハ支持軸の中間部を
支持する複数の中間支持部材cとから構成されている
(実開平2−73731号公報)。
2. Description of the Related Art There is a support used when a semiconductor wafer is heat-treated in a diffusion furnace, and a plurality of wafers are arranged side by side at regular intervals and can be stored in the diffusion furnace. This type of support is also referred to as a wafer boat and is of an assembling type. For example, as shown in FIG. 3, a pair of side plates a, a plurality of wafer support shafts b detachably supported by the side plates, And a plurality of intermediate support members c for supporting an intermediate portion of the wafer support shaft (Japanese Utility Model Laid-Open No. 2-73731).

【0003】[0003]

【考案が解決しようとする課題】しかしながら、前記組
立式ウェーハボートにおいては、比較的部品点数が多い
ため、組立及び分解に相当時間が掛かり、部品の交換等
メンテナンス面でも厄介であり、部品点数の削減に解決
すべき問題点を有している。
However, since the assembly type wafer boat has a relatively large number of parts, it takes a considerable time to assemble and disassemble, and is troublesome in terms of maintenance such as replacement of parts. There are problems to be solved for reduction.

【0004】本考案は、このような従来の問題点を解決
するためになされ、組立式ウェーハボートの機能を損な
わずに部品点数を減らして組立、分解を簡単に行えるよ
うにした、脚付き組立式ウェーハボートを提供すること
を課題としたものである。
SUMMARY OF THE INVENTION [0004] The present invention has been made to solve the above-mentioned conventional problems, and has a leg assembly capable of easily assembling and disassembling by reducing the number of parts without impairing the function of an assembling wafer boat. It is an object of the present invention to provide a type wafer boat.

【0005】[0005]

【課題を解決するための手段】前記課題を技術的に解決
するための手段として、本考案は、半導体ウェーハを複
数載置して所定の熱処理を施すウェーハボートであっ
て、ウェーハを支持する2以上の支持軸と、この支持軸
の両端部を保持する側板とから構成され、前記ウェーハ
を支持する支持軸には、それ自体のたわみを抑止するた
めの脚が形成されたことを要旨とするものである。
Means for Solving the Problems As a means for technically solving the above-mentioned problems, the present invention is a wafer boat for mounting a plurality of semiconductor wafers and performing a predetermined heat treatment. The gist is that the support shaft and the side plate holding both ends of the support shaft are configured, and the support shaft for supporting the wafer is formed with legs for suppressing deflection of itself. Things.

【0006】[0006]

【作 用】脚が支持軸と一体に形成されているので、従
来例のような複数の中間支持部材が不要となって部品点
数の削減が図れ、中間支持部材の機能は支持軸に持たせ
ることができる。
[Function] Since the legs are formed integrally with the support shaft, a plurality of intermediate support members as in the conventional example are unnecessary, the number of parts can be reduced, and the function of the intermediate support member is imparted to the support shaft. be able to.

【0007】[0007]

【実施例】以下、本考案の実施例を添付図面に基づいて
詳説する。図1において、1は一対の側板であり、この
側板に複数の角柱状支持軸2、3を差し渡してその両端
部を着脱自在に取り付け、最外側の両支持軸2の下部に
は一定の間隔をあけてたわみ抑止用の脚4が支持軸と一
体に形成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a pair of side plates, on which a plurality of prism-shaped support shafts 2 and 3 are inserted, and both ends thereof are detachably attached. The legs 4 for suppressing deflection are formed integrally with the support shaft.

【0008】前記支持軸2は、上面の内側縁から内面の
上側縁にかけて支持軸の長手方向に沿って一定のピッチ
でウェーハ装着溝2aが設けられ、前記内側に取り付け
る支持軸3の上面にも同様にウェーハ装着溝3aが設け
られている。
The support shaft 2 is provided with wafer mounting grooves 2a at a constant pitch along the longitudinal direction of the support shaft from the inner edge of the upper surface to the upper edge of the inner surface. Similarly, a wafer mounting groove 3a is provided.

【0009】前記側板1は、図2に示すように上部の両
肩部に切り込み溝1aが対設され、この切り込み溝1a
に前記支持軸2の端部に形成された切り込み溝(図示せ
ず)を嵌め込むことにより支持軸2を着脱自在に取り付
けられるようにしてある。又、側板1の内面側には図1
に見えるように斜めの嵌め込み用凹部1bが形成され、
この凹部に前記支持軸3の端部を嵌合することにより側
板1の下部に支持軸3を着脱自在に取り付けられるよう
にしてある。つまり、一対の側板1間に2本の支持軸
2、3が合計4本着脱自在に取り付けられ、これらの支
持軸2、3のウェーハ装着溝2a、3aはウェーハを安
定良く保持できるように円周方向に沿って整合するよう
にしてある。
As shown in FIG. 2, the side plate 1 is provided with cut grooves 1a at both upper shoulder portions thereof.
The support shaft 2 can be removably mounted by fitting a notch (not shown) formed at the end of the support shaft 2 into the support shaft 2. FIG. 1 shows the inner surface of the side plate 1.
An oblique fitting recess 1b is formed so that
The support shaft 3 is removably attached to the lower portion of the side plate 1 by fitting the end of the support shaft 3 into the recess. That is, two support shafts 2, 3 are detachably mounted between the pair of side plates 1, and the wafer mounting grooves 2a, 3a of the support shafts 2, 3 are circular so that the wafer can be stably held. They are aligned along the circumferential direction.

【0010】前記側板1の上部には、取っ手5を装着す
るための孔1cが所定の間隔をあけて対設され、この装
着用孔1cに取っ手5の下部に設けられた係合部5aを
挿入して取っ手5を側板1の外面に密接させ、係合部5
aの先端部に設けられた溝5bにストッパー6の下部に
設けられた切り欠き6aを嵌合係止することにより、取
っ手5を着脱自在に取り付けられるようにしてある。こ
の時、ストッパー6の上部に設けられた鉤状の係止部6
bは、取っ手5の下枠5cに引っ掛かるようになってい
る。
A hole 1c for mounting a handle 5 is provided at an upper portion of the side plate 1 at a predetermined interval, and an engaging portion 5a provided at a lower portion of the handle 5 is provided in the mounting hole 1c. Insert the handle 5 into close contact with the outer surface of the side plate 1
The handle 5 is removably attached by fitting and locking a notch 6a provided at the lower part of the stopper 6 into a groove 5b provided at the front end of "a". At this time, the hook-shaped locking portion 6 provided on the stopper 6
b is adapted to be hooked on the lower frame 5c of the handle 5.

【0011】このようにして形成されたウェーハボート
7は、前記支持軸2、3のウェーハ装着溝2a、3aに
複数のウェーハ(図示せず)を装着して載置し、拡散炉
内に収納してウェーハの熱処理が行われる。前記取っ手
5はこのウェーハボート7を搬送する際に有効に利用さ
れる。
The wafer boat 7 thus formed is mounted with a plurality of wafers (not shown) mounted in the wafer mounting grooves 2a, 3a of the support shafts 2, 3, and stored in a diffusion furnace. Then, the heat treatment of the wafer is performed. The handle 5 is effectively used when transporting the wafer boat 7.

【0012】前記ウェーハの熱処理において、ウェーハ
ボート7はかなりの高温に曝され、或は相当な温度変化
を受けるが損傷乃至変形することはない。特に、最外側
の支持軸2の下部には脚4が形成されているので、これ
が補強作用をなし支持軸2自体のたわみを未然に防止す
ることができると共に、ウェーハボート7の安定性を保
持することができる。これにより、従来の中間支持部材
が不要となる。
In the heat treatment of the wafer, the wafer boat 7 is exposed to a considerably high temperature or undergoes a considerable temperature change, but is not damaged or deformed. In particular, since the legs 4 are formed below the outermost support shaft 2, the legs 4 can provide a reinforcing effect to prevent deflection of the support shaft 2 itself and maintain the stability of the wafer boat 7. can do. This eliminates the need for a conventional intermediate support member.

【0013】尚、ウェーハボートの構成部材は全てシリ
コン製であることが望ましいが、取っ手とストッパーは
石英ガラス製にすることも可能である。
It is desirable that all the components of the wafer boat are made of silicon, but the handle and the stopper can be made of quartz glass.

【0014】[0014]

【考案の効果】以上説明したように、本考案によれば、
ウェーハボートの脚が支持軸と一体に形成されているの
で、従来例のような複数の中間支持部材が不要となり、
部品点数の削減が図れ、組立及び分解が容易にできると
共に、部品交換も簡単にできる等の優れた効果を奏す
る。
[Effects of the Invention] As described above, according to the present invention,
Since the legs of the wafer boat are formed integrally with the support shaft, a plurality of intermediate support members as in the conventional example become unnecessary,
The number of parts can be reduced, and excellent effects such as easy assembly and disassembly and easy replacement of parts can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本考案の実施例を示すウェーハボートの斜視
図である。
FIG. 1 is a perspective view of a wafer boat showing an embodiment of the present invention.

【図2】 その側板部分の分解斜視図である。FIG. 2 is an exploded perspective view of the side plate portion.

【図3】 従来例の説明図である。FIG. 3 is an explanatory diagram of a conventional example.

【符号の説明】[Explanation of symbols]

1…側板 1a…切り込み溝 1b…嵌め込み用凹
部 1c…装着用孔2、3…支持軸 2a、3a…
ウェーハ装着溝 4…脚 5…取っ手5a…係合部
5b…溝 5c…下枠 6…ストッパー 6
a…切り欠き 6b…係止部 7…ウェーハボート
DESCRIPTION OF SYMBOLS 1 ... Side plate 1a ... Cut groove 1b ... Fitting recessed part 1c ... Mounting hole 2, 3 ... Support shaft 2a, 3a ...
Wafer mounting groove 4 ... Leg 5 ... Handle 5a ... Engagement part 5b ... Groove 5c ... Lower frame 6 ... Stopper 6
a: Notch 6b: Locking part 7: Wafer boat

Claims (2)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 半導体ウェーハを複数載置して所定の熱
処理を施すウェーハボートであって、ウェーハを支持す
る2以上の支持軸と、この支持軸の両端部を保持する側
板とから構成され、前記ウェーハを支持する支持軸に
は、それ自体のたわみを抑止するための脚が形成された
ことを特徴とする、脚付き組立式ウェーハボート。
1. A wafer boat on which a plurality of semiconductor wafers are placed and subjected to a predetermined heat treatment, comprising: two or more support shafts for supporting wafers; and side plates for holding both ends of the support shafts. An assembling wafer boat with legs, wherein legs are formed on a support shaft for supporting the wafers to suppress deflection of the wafer.
【請求項2】 最外側の両支持軸に脚が形成されてい
る、請求項1記載の脚付き組立式ウェーハボート。
2. The assembled wafer boat with legs according to claim 1, wherein legs are formed on both outermost support shafts.
JP8626391U 1991-09-26 1991-09-26 Assembled wafer boat with legs Expired - Lifetime JP2549407Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8626391U JP2549407Y2 (en) 1991-09-26 1991-09-26 Assembled wafer boat with legs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8626391U JP2549407Y2 (en) 1991-09-26 1991-09-26 Assembled wafer boat with legs

Publications (2)

Publication Number Publication Date
JPH0529133U JPH0529133U (en) 1993-04-16
JP2549407Y2 true JP2549407Y2 (en) 1997-09-30

Family

ID=13881935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8626391U Expired - Lifetime JP2549407Y2 (en) 1991-09-26 1991-09-26 Assembled wafer boat with legs

Country Status (1)

Country Link
JP (1) JP2549407Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521876B2 (en) 2018-03-07 2022-12-06 Tokyo Electron Limited Horizontal substrate boat

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521876B2 (en) 2018-03-07 2022-12-06 Tokyo Electron Limited Horizontal substrate boat
TWI794437B (en) * 2018-03-07 2023-03-01 日商東京威力科創股份有限公司 Horizontal substrate boat

Also Published As

Publication number Publication date
JPH0529133U (en) 1993-04-16

Similar Documents

Publication Publication Date Title
KR970008357B1 (en) Vertical boat
JP2549407Y2 (en) Assembled wafer boat with legs
JPH10284429A (en) Wafer supporting device
JP6147152B2 (en) table
JP3280437B2 (en) Vertical boat
JPH0529132U (en) Assembled wafer boat with handle
JPH09266177A (en) Wafer boat
JPH113865A (en) Boat for wafer mounting and manufacture thereof
US6473931B2 (en) Painting roller assembly
JPS62164017A (en) Polygon mirror rotating device for optical scanning
JP2010272683A (en) Vertical wafer boat
JPH0642506Y2 (en) Support frame for plate
JP2002305235A (en) Semiconductor wafer supporting apparatus
JPH10144616A (en) Semiconductor wafer supporting port
JPH10273399A (en) Assemblage boat for wafer and its attaching jig
JPH06822Y2 (en) Semiconductor wafer transfer device
JP3031487U (en) Framework assembly
WO2002058097A3 (en) Detensioning mask frame assembly for a crt
JP2000150401A (en) Fabricated wafer boat
JP2001313266A (en) Heat treating boat
KR960005246Y1 (en) Engine frame of combined machine
JPH04207022A (en) Wafer support device
JP4065699B2 (en) Semiconductor wafer support device
KR20160109740A (en) Knockdown tables for outdoor
JPS63164312A (en) Silicon wafer treating jig

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term