JP2549211B2 - Vapor soldering equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor phase type soldering device, and more particularly, it is possible to reduce the contamination of the inner wall of a steam tank, a heating device and the like with flux.
The present invention relates to a vapor soldering device having a steam tank structure capable of arbitrarily controlling a cooling rate of an object to be processed and reducing steam loss.

[0002]

2. Description of the Related Art As a conventional soldering method, for example, a method of soldering a substrate and a component, a method of using a flux during the soldering is generally used. Even in the vapor phase soldering device, flux is applied to the object to be processed and soldering is performed by passing the object to be processed through the steam tank. Dissolves in the processing liquid and adheres to the steam tank and heating device, resulting in pollution and reduced steam capacity (insufficient steam volume)
Cause soldering failure.

Further, in the vapor phase soldering apparatus, it is necessary to cool the object to be processed in a short time after passing the object to be processed in the steam tank. However, in order to reduce the cooling speed, the object to be processed must be cooled. A method to increase the speed of the conveyor for transporting processed materials,
Alternatively, a method of using a shielding plate at the entrance / exit of the steam tank tunnel is used.

As a conventional technique of this kind, for example,
JP-A-58-213945, JP-A-62-220
Techniques described in Japanese Patent Publication No. 274, etc. are known.

[0005]

In the vapor phase type soldering apparatus according to the above-mentioned conventional technique, as the soldering work is continued, the flux from the object to be processed is dissolved in the processing steam or liquid, Attached to the tank and heating device to contaminate them and reduce steam capacity (insufficient steam)
However, there is a problem in that it causes soldering failure due to In addition, the above-mentioned conventional technique, in particular, performs repeated soldering work, and when the apparatus is stopped after the end of the treatment, the amount of flux attached increases as the liquid temperature approaches room temperature,
Therefore, there is a problem that the cleaning and removing work of the flux adhered to the steam tank and the heating device must be frequently performed.

Further, the conventional technique of increasing the speed of the conveyor in order to increase the cooling speed of the object to be processed has a problem that the length of the preheating section and the cooling section becomes long and vibration is likely to occur. In order to solve these problems,
The conventional technique using a shield that moves in synchronization with the conveyor has a problem that the device becomes complicated and large-scale.

The object of the present invention is to solve the above-mentioned problems of the prior art, to reduce the contamination of the steam tank and the heating device due to the adhesion of flux, and to increase the speed of the conveyor without increasing the object to be treated. It is an object of the present invention to provide a vapor soldering device capable of increasing the cooling rate.

[0008]

According to the present invention, the above object is to provide a vapor soldering apparatus which comprises a steam generating mechanism for heating, and which performs soldering by heating an object to be processed by applying steam to the steam. In the processing liquid provided at a position lower than the steam tank for collecting the processing liquid in a high temperature state from inside the tank
Recovery tank with a mechanism for removing
The steam is supplied with the treatment liquid after removing the flux in the tank.
With a liquid supply tank provided at a position higher than the air tank,
The processing liquid can be re-supplied from the liquid supply tank to the steam tank.
Achieved by and. That is, in order to eliminate the adhesion of the flux to the steam tank and the heating device, it is essential to remove the flux promptly after soldering, but according to the present invention, the treatment liquid has the above-mentioned configuration. The flux can be reliably removed in the recovery tank while the temperature is high.

According to the present invention , the above-mentioned object is the above-mentioned steaming.
In order to liquefy and collect the vapor in the air tank, the outlet side is treated.
Temperature fluctuations due to turbulence of steam in the steam tank
In order to suppress it, it is necessary to spray the coolant outside the steam tank.
Reach <br/> made by providing a air outlet of coolant Ritsuto structure.

[0010]

[Operation] After the soldering is completed, the treatment liquid is provided at a position lower than the steam tank from the steam tank while the temperature is still high.
The processing liquid is moved to the collection tank by its own weight . The processing liquid that has moved to the recovery tank is cleaned by passing through a filter that removes flux and returning it to the recovery tank. Cleaned processing liquid is collected
Tank located higher than the tank from the tank
After being supplied to the steam tank, the processing liquid is returned from the liquid supply tank to the steam tank again due to its own weight and used again. According to the present invention, by constantly cleaning the processing liquid in this manner, it is possible to eliminate contamination due to the adhesion of flux to the inside of the steam tank and the heating device, and perform stable soldering.

The object to be processed is cooled by spraying a gas such as air or a cooling liquid onto the object to be processed which has passed through the inside of the steam tank from the outlet of the coolant provided in the upper part of the condenser. In this way, the present invention makes it possible to easily control the cooling rate regardless of the speed of the conveyor that conveys the object to be processed, and because the length of the condenser is long, leakage of steam for processing is prevented. It can be lost.

[0012]

Embodiments of the vapor soldering apparatus according to the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a sectional view showing the structure of an embodiment of the present invention. In FIG. 1, 1 is a steam tank, 2 is a recovery tank, 3 is a liquid supply tank, 4 is a filter, 5 to 8 are valves, 9 is a pump, 10 is a processing liquid, and 11 is a heating device. This example is an example relating to the removal of the flux in the treatment liquid.

As shown in FIG. 1, a vapor soldering apparatus according to an embodiment of the present invention accommodates a treatment liquid 10 such as fluorinated oil heated by a heating device 11 and treats it with high temperature steam. It is composed of a steam tank 1 for soldering an object, a recovery tank 2, a liquid supply tank 3, a filter 4, and valves 5 to 8 and a pump 9 which constitute a mechanism for removing the flux in the treatment liquid 10. ing. The recovery tank 2 is provided at a position lower than the treatment liquid 10 in the steam tank 1, and the liquid supply tank 3 is provided at a position higher than the treatment liquid 10 in the steam tank 1. Also, the processing liquid 1
As 0, one whose boiling point is several tens of degrees higher than the melting point of the solder is selected and used.

Next, the operation of removing the flux from the processing liquid 10 will be described.

First, after the soldering work is completed, the heating device 1
1 is stopped and the steam in the steam tank 1 is liquefied. Next, the valve 5 is opened and the high temperature processing liquid 10 is moved to the recovery tank 2. In this case, since the recovery tank 2 is provided at a position lower than the liquid recovery port of the steam tank 1, the processing liquid 10 can be moved by its own weight. Next, valve 6
Open, the valve 7 is closed, the liquid transferred to the recovery tank 2 is passed through the filter 4 by the pump 9, and the valve 6 is opened.
The process of returning to the recovery tank 2 through the same is repeatedly executed. As a result, the treatment liquid 10 transferred to the recovery tank 2 has its flux removed by the filter 4. After circulating the treatment liquid 10 for the time required to remove the flux, the valve 6 is closed and the valve 7 is opened, and the treatment liquid 10 is moved from the recovery tank 2 to the liquid supply tank 3 by the pump 9. . Since the liquid supply tank 3 is provided at a position higher than the steam tank 1, the processing liquid 10 can be sent to the steam tank 1 by its own weight simply by opening the valve 8.

In the above-described embodiment of the present invention, a clean treatment liquid after flux removal is always stored in the liquid supply tank 3 and immediately after the treatment liquid in the steam tank 1 is transferred to the recovery tank 2. When the liquid is supplied from the liquid supply tank 3 to the steam tank 1, the soldering work can be continuously performed. While the soldering work is continued by the steam tank 1, the treatment liquid transferred to the recovery tank 2 is subjected to flux removal as described above and stored in the liquid supply tank 3 for the next use. To be

The above-described embodiment of the present invention is based on the treatment liquid 10.
When removing the flux from the steam,
It is assumed that the treatment liquid 1 is discharged from the steam tank 1 and is discharged outside the steam tank 1.
It is also possible to execute the process of removing the flux from 0.

That is, in this case, as shown by the dotted line in FIG. 1, a filter device 12 in which a pump and a filter are integrated is provided at the bottom of the steam tank 1, and the filter device 12 is always operated. You can leave it.

FIG. 2 is a sectional view showing the structure of another embodiment of the present invention. In FIG. 2, 21 is a condenser, 22 is an outlet, 23 is a conveyor, and 24 is an object to be treated, and other reference numerals are the same as those in FIG. This example is an example of controlling the cooling rate of the object to be processed.

In another embodiment of the present invention, as shown in FIG. 2, a condenser 21 is provided on the inlet side and the outlet side of the steam tank 1, and an outlet 22 is installed on the upper portion thereof. . Each of the outlet ports 22 on the outlet side has a mechanism (not shown) capable of independently controlling the pressure and the flow rate, and blows a cooling agent such as cooling air or gas to cool the object to be processed 24. Further, the outlet 22 has a slit structure that blows out the coolant to the outside of the steam tank 1 in order to suppress the temperature fluctuation due to the turbulence of the steam in the steam tank 1.

The object to be treated 24 is conveyed by the conveyor 23 through a heating section (not shown) provided on the inlet side of the steam tank 1, and steam generated by the heating device 11 in the steam tank 1 is generated. After being heated to a predetermined temperature and soldered, it is blown from the outlet 22 when passing through the condenser 21 on the outlet side, and the pressure and flow rate are controlled in advance. It is cooled at any cooling rate by the agent.
In this case, it has been found that with a certain kind of solder material, a stable solder composition during solidification can be obtained by controlling the cooling rate of the object to be processed 24 at 2.5 ° C./sec or more.

During the above-mentioned soldering process, the processing liquid 10 liquefied in the inlet-side and outlet-side condensers 21 is recovered in the steam tank 1.

In the above-mentioned other embodiment of the present invention, the coolant sprayed from the outlet 22 may be air, an inert gas (for example, N2 gas) or the like, and when an inert gas is used, An atmosphere with little oxidation can be obtained. In addition, various cooling rates can be realized by discharging the coolant intermittently or continuously to the object to be processed 24 and by combining the spraying from a plurality of outlets. You can

Furthermore, in the other embodiment of the present invention described above, by increasing the length L of the condenser 21 on the outlet side, the speed of the spray flow of the coolant is increased, so that the object to be treated at the time of spraying is increased. Leakage of steam flowing out of the tank along the upper surface of 24 can be prevented. In this case, the condenser 21 on the outlet side
It was found that there is no vapor leakage by making the length L of the above 2 times or more the length of the object to be treated 24.

In the above-mentioned other embodiment of the present invention, the gas is used as the coolant, but in the present invention, a liquid having the same composition as the treatment liquid can be used as the coolant. In this case, it goes without saying that this cooling liquid needs to be recovered by another means.

The above-described other embodiment of the present invention is particularly suitable for soldering an article which is susceptible to heat, and the mechanism is simple and practical.

Although the embodiment relating to the removal of the flux in the treatment liquid and the embodiment relating to the control of the cooling rate of the object to be treated have been separately described above, the present invention can be used in combination. Is also possible.

Although the two embodiments of the present invention have been described above, the following effects can be obtained according to these embodiments.

1. Since the treatment liquid can be withdrawn from the steam tank to the recovery tank at a high temperature (flux dissolved state), the adhesion of the flux to the inner wall of the steam tank and the heating device can be minimized.

2. The flux in the treatment liquid can be promptly removed by passing the treatment liquid through the filter at a high temperature.

3. It is possible to greatly reduce the frequency of cleaning and removing work of the flux adhering to the steam tank and the heating device.

4. By providing the liquid supply tank, continuous and efficient soldering work can be performed.

5. Since the treatment liquid can be moved by utilizing the weight of the liquid, the equipment such as a pump can be minimized and labor saving can be achieved.

6. Since the cooling rate of the object to be processed can be shortened regardless of the conveyor speed, the composition can be stabilized when the solder material is solidified. It is also effective for soldering hot and weak articles.

7. By making the length of the condenser at least twice the length of the object to be treated, it is possible to eliminate steam leakage from the steam tank outlet.

[0037]

As described above, according to the present invention, in the vapor soldering apparatus, it is possible to reduce the contamination of the steam tank and the heating apparatus due to the adhesion of the flux, and to increase the speed of the conveyor without increasing The cooling rate of the processed material can be increased.

[Brief description of drawings]

FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention.

FIG. 2 is a sectional view showing the configuration of another embodiment of the present invention.

[Explanation of symbols]

 1 Steam Tank 2 Recovery Tank 3 Supply Tank 4 Filter 5-8 Valve 9 Pump 10 Treatment Liquid 11 Heating Device 21 Condenser 22 Outlet 23 Conveyor 24 Workpiece

Claims (2)

(57) [Claims] 1. A vapor soldering apparatus, comprising a steam generating mechanism for heating, wherein an object to be processed is applied to steam for heating to perform soldering, wherein the processing solution in a high temperature state is recovered from a steam tank. It ’s located lower than the steam tank
Recovery tank with a mechanism for removing the flux in the treated liquid
And the processing liquid after flux removal in the recovery tank is supplied.
Liquid supply tank installed at a position higher than the steam tank
A vapor soldering apparatus comprising: a liquid supply tank for resupplying the processing liquid to the steam tank . 2. In order to liquefy and recover the vapor in the vapor tank, a condenser for the treatment liquid is provided on the outlet side of the vapor, and a condenser for the vapor in the vapor tank is provided.
To prevent temperature fluctuations due to turbulence, remove the coolant outside the steam tank.
2. The vapor soldering apparatus according to claim 1, further comprising a coolant outlet having a slit structure that blows to the side .