JP2543963B2 - Semiconductor automatic marking equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to the structure of a semiconductor automatic marking device.

(Prior Art) For semiconductor devices, the model number and the date of manufacture are marked on the envelope to make it convenient for customers. However, the device includes manual work. It was normal. That is, the magazine containing the envelope with the semiconductor element installed is set at a position slightly higher than the place where the marking process is performed, and the operator pushes out the individual envelopes and uses the self-weight to convey the slope. I was doing the planned marking process.

A metal plate was exclusively used for this slope, and there was some gap between it and the envelope. Moreover, the envelope that had undergone the marking process was stored in another magazine located near this position using high pressure air blow (Air Blow) or the like. (Problems to be Solved by the Invention) As described above, since there is a gap between the metal plate and the magazine, it is easy for an accident to occur during transportation of the envelope in which the semiconductor element is incorporated. However, the availability will decrease due to uncertain feeding due to high-pressure air blow.

Further, since the fixed rail is used, the device itself tends to be large in size, and there is a problem that space is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor automatic marking device that is small in size and can achieve a high operating rate without accidents during transportation.

[Means for Solving the Problems] (Means for Solving the Problems) The present invention provides a mount having a flat portion, a loader section and an unloader section installed on the flat section of the mount, and an intermediate portion between the loader section and the unloader section. A fixed magazine that is installed and can store a plurality of semiconductor elements, a first row-shaped recess formed in this fixed magazine, a supply magazine that stores the semiconductor elements pulled out from the loader section, and a supply magazine formed in this supply magazine Second row-shaped recesses, means for arranging the second row-shaped recesses along the row-shaped recesses of the fixed magazine, and semiconductor chips provided on the flat portion lifted from the fixed magazine to the supply magazine. A cylinder mechanism for moving the semiconductor element to a fixed magazine, a mechanism for positioning the semiconductor element housed in the supply magazine, a mechanism for sending the marked semiconductor element to the fixed magazine, A mechanism for transferring the semiconductor element housed in the constant magazine empty the supply magazine, is characterized in that the semiconductor element is transferred to the said supply magazine into a mechanism for moving the unloader unit.

(Operation) The semiconductor element to be processed of the present invention adopts a magazine-to-magazine carrying method and a method of performing marking in the magazine. Therefore, the chute rail required for the conventional marking device is omitted and simplified. In addition to being able to measure the size, small size and high operating rate can be achieved.

(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1 a, b, c to 4. In this semiconductor automatic marking device, a flat portion 2 is provided on one surface of the gantry 1 shown in FIG. 1b as shown in FIG. 1a, and further, the flat portion 2 is provided as shown in FIG. 1c. A loader unit 3 and an unloader unit 4 are arranged, and a fixed magazine 5 is installed in the middle thereof.

As will be apparent from FIGS. 2 and 4, the fixed magazine 5 and the supply magazine 6 to be described later contain the first row-shaped concave portions 8 and the second row-shaped concave portions 8 so that the semiconductor elements 7 to be processed can be stored. Each of the row-shaped recesses 9 is formed, and the stopper pin 10 is installed at the final end thereof.

As described above, in the semiconductor automatic marking apparatus according to the present invention, the fixed magazine 5 and the supply magazine 6 are installed in parallel so as to convey the semiconductor elements 7 to be processed by the magazine-to-magazine method. This is because if the two magazines are arranged non-parallel to each other, there are problems such as an increase in size of the apparatus and a complicated mechanism. Therefore, it is best to arrange the supply magazine 6 on the extension line of the first row-shaped recess 8 in the axial direction, but install the second row-shaped recess 9 along the first row-shaped recess 8. However, it is possible because the number of parts does not increase so much.

A supply magazine 6 accommodating the semiconductor elements 7 to be processed is supplied to the loader section 3 arranged on the flat section 2 of the gantry 1, and one of the supply magazines is extracted from the supply magazine 6 shown in FIG.
First cylinder 8 of fixed magazine 5 by cylinder 11 of
Move to the position along with and pull out this state as shown in Fig. 1b.
Shown in the side view. First after being pulled out from the loader section 3
The position of the second row-shaped recess 9 formed in the supply magazine 6 which is moved by the cylinder 11 is most conveniently arranged on the same line as that of the first row-shaped recess 8 installed in the fixed magazine 5. .

Next, the process of marking the semiconductor elements 7 to be processed housed in the supply magazine 6 is started, but a positioning mechanism is required to arrange them at a predetermined position. First, the actual operation will be described.

The semiconductor elements 7 to be processed stored in the supply magazine 6 ...
Moves to a predetermined position by the transfer claw 12 shown in FIG. 3, but this predetermined position is secured by the work stopper 14 and the first positioning pin 15 in order to maintain the corresponding relationship with the marking portion 13. .

As is apparent from FIG. 1c, the marking portion 13 is mounted on a support base 16 and has a rotatable arm portion 17 installed at its upper end, which is positioned at the predetermined position at the end portion thereof. The window portion 18 is provided so as to face the processed semiconductor element 7 thus processed.
Is placed, and the required model number, manufacturing date, etc. are marked. A laser device, for example, can be applied to the marking unit 13.

In this marking process, a structure is adopted in which the individual semiconductor elements 7 to be processed are moved by the transfer claws 12 (FIG. 3) which are interlocked with the first stepping motor 19 shown in FIG. 1A.

Further, the stepping motor 22 shown in FIG. 1 moves each column and moves to a delivery section (not shown) of the unloader section.

After completion of this step, the semiconductor element 7 to be processed is forcibly moved to the second row-shaped concave portion 9 of the fixed magazine 5 by the air ejected from the blow nozzle 20 shown in FIG.

As described above, in the present invention, the stepping motor 19, the transfer claw 12, the work stopper 14, and the positioning pin 15 are collectively referred to as a positioning mechanism.

Further, the marking mechanism includes a marking portion 13, an arm portion 17, a window portion 18 and a blow nozzle 2 mounted on the support base 16.
It includes 0.

Next, the semiconductor elements 7 to be processed, which have been moved to the fixed magazine 5 and have been subjected to positioning and marking processing, are again placed in the empty second concave portion 9 of the supply magazine 6 to return the work returning pawls shown in FIG.
Transported by the operation of 21. In the present invention, the work return pawl 21 is a transfer mechanism.

The supply magazine 6 containing the semiconductor elements 7 to be processed after the marking step is housed in the empty space of the unloader 4 to achieve the above-mentioned magazine-to-magazine. That is, the supply magazines 6 accommodating the marked semiconductor elements 7 to be processed are moved one by one to the position adjacent to the unloader 4 by the second cylinder 22, and one stacked higher than the unloader 4 is placed. A magazine-to-magazine that can be moved inside and accommodated is achieved.

As described above, after the semiconductor chips 7 to be processed are stacked one by one from the supply magazine 6 to the position adjacent to the unloader 4 by the second cylinder 22, one semiconductor device 7 is housed in the unloader 4. In the present invention, the supply magazine 6 and the unloader 4 are mechanisms for moving the semiconductor elements transferred to the supply magazine to the unloader section.

[Advantages of the Invention] In such a semiconductor automatic marking device, High availability, that is, a magazine to be used as a transport path for semiconductor elements to be processed In the to-magazine, there is only one joint, so forced transport is possible.

B. Miniaturization of the device By implementing the marking in the magazine, the mechanism of the device was simplified, and the size and cost were reduced.

C. Improved workability Since the magazine that stores the semiconductor elements to be processed could be stored in the loader and unloader that are placed on the side of the smallest area in this semiconductor marking automatic device, the work area of the operator was reduced, and thus the workability was improved. I was able to improve.

[Brief description of drawings]

1 a, b, c are a top view, a side view and a cross-sectional view of an embodiment of the present invention, and FIG. 2 is a perspective view of one component of this device,
FIG. 4 is a sectional view of the main part of this apparatus, and FIG. 4 is a perspective view of the other main part. 1 ... Stand, 2 ... Flat part, 3 ... Loader part, 4 ... Unloader part, 5 ... Fixed magazine, 6 ... Supply magazine, 7 ... Semiconductor element to be processed 8, 9 ... First and second Recess, 14 …… Work stopper 15 …… Positioning pin, 11,21 …… Cylinder 12 …… Conveying pawl, 13 …… Marking part 19 …… Stepping pin motor 21 …… Work return pawl 22 …… Individual feed stepping motor

Claims (1)

(57) [Claims] 1. A mount having a flat part, a loader part and an unloader part installed on the flat part of the mount, and a fixed magazine installed in the middle of the loader part and the unloader part and capable of storing a plurality of semiconductor elements. A first row-shaped recess formed in the fixed magazine; a supply magazine for storing the semiconductor elements pulled out from the loader section; a supply magazine for storing the semiconductor elements pulled out from the fixed magazine; A second row of recesses formed in the magazine,
Means for arranging the second row-shaped recess along the row-shaped recess of the fixed magazine; a cylinder mechanism provided on the flat portion for lifting a semiconductor element from the fixed magazine and moving it to the supply magazine; A mechanism for positioning the semiconductor elements housed in the magazine, a mechanism for sending the marked semiconductor elements to the fixed magazine, a mechanism for transferring the semiconductor elements housed in the fixed magazine to the empty supply magazine, and a mechanism for supplying the supply magazine. A semiconductor automatic marking device comprising: a mechanism for moving the transferred semiconductor element to the unloader unit.