JP2539431Y2 - Thermocouple temperature measurement device - Google Patents

Thermocouple temperature measurement device

Info

Publication number
JP2539431Y2
JP2539431Y2 JP3966292U JP3966292U JP2539431Y2 JP 2539431 Y2 JP2539431 Y2 JP 2539431Y2 JP 3966292 U JP3966292 U JP 3966292U JP 3966292 U JP3966292 U JP 3966292U JP 2539431 Y2 JP2539431 Y2 JP 2539431Y2
Authority
JP
Japan
Prior art keywords
terminal plate
thermocouple
heat
temperature
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3966292U
Other languages
Japanese (ja)
Other versions
JPH062183U (en
Inventor
重信 宮本
芳洋 岡野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP3966292U priority Critical patent/JP2539431Y2/en
Publication of JPH062183U publication Critical patent/JPH062183U/en
Application granted granted Critical
Publication of JP2539431Y2 publication Critical patent/JP2539431Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は熱電対温度測定装置に関
するものであり、詳しくは、端子板における端子間の温
度差の改善に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocouple temperature measuring device, and more particularly to improvement of a temperature difference between terminals on a terminal plate.

【0002】[0002]

【従来の技術】温度測定装置の一種に、熱電対を用いた
熱電対温度測定装置がある。ところで、熱電対を用いて
温度を測定するのにあたっては、一般に、基準接点の温
度を別途測定してその測定値により熱電対の熱起電力を
補償することが行われている。
2. Description of the Related Art One type of temperature measuring device is a thermocouple temperature measuring device using a thermocouple. Meanwhile, when measuring the temperature using a thermocouple, generally, the temperature of the reference junction is separately measured, and the thermoelectromotive force of the thermocouple is compensated by the measured value.

【0003】図3はこのような従来の熱電対温度測定装
置の一例を示す構成説明図である。図3において、1は
測定記録部などの発熱源を持った温度測定装置の本体、
2は熱電対が接続される端子板であり、端子板2は本体
1と熱的に絶縁されるようにスタッド3,4を介して本
体1に取り付けられている。端子板2の一方の面には熱
電対を接続するための端子5が植設され、本体1と対向
する他方の面には端子5相互間の温度を均一にするため
の等温板6が設けられている。この等温板6としては、
本体1と端子板2との間の空気の対流による熱の移動の
影響を軽減するために、例えば銅のような熱伝導性の優
れたある程度の板厚(例えば1mm)を有するものを用
いる。7は端子板2の温度を測定するトランジスタやサ
ーミスタなどの温度センサであり、端子板2の一部に取
り付けられている。
FIG. 3 is a structural explanatory view showing an example of such a conventional thermocouple temperature measuring device. In FIG. 3, 1 is a main body of a temperature measuring device having a heat source such as a measurement recording unit,
Reference numeral 2 denotes a terminal plate to which a thermocouple is connected. The terminal plate 2 is attached to the main body 1 via studs 3 and 4 so as to be thermally insulated from the main body 1. A terminal 5 for connecting a thermocouple is implanted on one surface of the terminal plate 2, and an isothermal plate 6 for equalizing the temperature between the terminals 5 is provided on the other surface facing the main body 1. Have been. As this isothermal plate 6,
In order to reduce the influence of heat transfer due to convection of air between the main body 1 and the terminal plate 2, a material having a certain thickness (for example, 1 mm), such as copper, having excellent thermal conductivity is used. Reference numeral 7 denotes a temperature sensor such as a transistor or thermistor for measuring the temperature of the terminal plate 2, which is attached to a part of the terminal plate 2.

【0004】このような構成において、端子5と図示し
ない熱電対との間では、ゼーベック効果による熱起電力
が発生する。従って、端子相互間に温度差があると、そ
の温度差の熱起電力分が測定誤差になる。そこで、等温
板6により端子相互間の温度差を極力小さくし、温度セ
ンサ7の測定値を基準接点温度として熱電対の熱起電力
を補償しながら熱電対による温度測定を行う。
In such a configuration, a thermoelectromotive force is generated between the terminal 5 and a thermocouple (not shown) due to the Seebeck effect. Accordingly, if there is a temperature difference between the terminals, the thermoelectromotive force component of the temperature difference becomes a measurement error. Therefore, the temperature difference between the terminals is minimized by the isothermal plate 6, and the temperature measurement by the thermocouple is performed while the thermoelectromotive force of the thermocouple is compensated using the measured value of the temperature sensor 7 as the reference contact temperature.

【0005】[0005]

【考案が解決しようとする課題】しかしながら、このよ
うな構成によれば、等温板4として熱伝導性の優れたあ
る程度の板厚を有する比較的高価な材料を用いているの
で、コストが高くなるとともに重さが重くなるという問
題がある。また、等温板の板厚を厚くすると等温効果は
大きくなるものの、反面、吸収熱容量が大きくなって等
温板を介して端子板の内部に伝達される熱も多くなって
しまう。
However, according to such a configuration, since the isothermal plate 4 is made of a relatively expensive material having an excellent thermal conductivity and a certain plate thickness, the cost increases. In addition, there is a problem that the weight increases. In addition, if the thickness of the isothermal plate is increased, the isothermal effect increases, but on the other hand, the heat absorption capacity increases and the heat transferred to the inside of the terminal plate via the isothermal plate also increases.

【0006】本考案は、このような問題点に着目したも
のであり、その目的は、外付けの等温板を用いることな
く端子間の温度差を小さくできる熱電対温度測定装置を
提供することにある。
The present invention is directed to such a problem, and an object of the present invention is to provide a thermocouple temperature measuring device capable of reducing a temperature difference between terminals without using an external isothermal plate. is there.

【0007】[0007]

【課題を解決するための手段】このような目的を達成す
る本考案は、発熱源を内包する装置本体の一部に熱電対
を接続する端子板がスタッドを介して取り付けられた温
度測定装置において、前記端子板の内部には金属コアの
プリント基板が埋設され、端子板の装置本体との対向面
には熱反射体が設けられたことを特徴とする。
SUMMARY OF THE INVENTION The present invention, which achieves the above object, is directed to a temperature measuring apparatus in which a terminal plate for connecting a thermocouple to a part of an apparatus main body including a heat source is attached via a stud. A printed circuit board of a metal core is embedded in the terminal plate, and a heat reflector is provided on a surface of the terminal plate facing the device body.

【0008】[0008]

【作用】装置本体の発熱源から端子板に向かって放射さ
れる熱は熱反射体で反射され、放射熱による端子板内部
の温度上昇は抑制される。そして、主にスタッドを介し
て端子板の内部に伝導される熱は、金属コアのプリント
基板により拡散されて等温化が図られる。
The heat radiated from the heat source of the apparatus body toward the terminal plate is reflected by the heat reflector, and the temperature rise inside the terminal plate due to the radiated heat is suppressed. Then, the heat mainly conducted into the terminal board through the studs is diffused by the printed circuit board of the metal core to achieve isothermal.

【0009】[0009]

【実施例】以下、図面を用いて本考案の実施例を詳細に
説明する。図1は本考案の一実施例の構成説明図であ
り、図3と共通する部分には同一符号を付けている。図
において、11は端子板を構成する金属コアのプリント
基板であり、端子5の端部がハンダ付けされている。1
2は端子5およびプリント基板11で構成される端子板
の周囲を囲むように絶縁性樹脂で角筒状に形成された端
子板のカバー、13はカバー12の裏側を塞ぐように絶
縁性樹脂で平板状に形成されたカバーであり、これらカ
バー12,13により有底角筒状の端子板カバーを構成
している。このように構成される有底角筒状の端子板カ
バーは、スタッド3,4を介して装置本体1に取り付け
られている。14は熱反射体であり、カバー13の装置
本体1との対向面に被着されている。熱反射体14とし
ては、アルミ箔を張り付けてもよいし、例えばアルミや
金や銀などの熱吸収率が小さい物質を蒸着してもよい。
なお、端子板の端子5と装置本体1の内部回路は、プリ
ント基板11に取り付けられているコネクタおよび装置
本体1に取り付けられているコネクタを介して電気的に
接続されるが、これらコネクタは図示しない。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of the configuration of an embodiment of the present invention, and portions common to FIG. 3 are denoted by the same reference numerals. In the figure, reference numeral 11 denotes a printed circuit board of a metal core constituting a terminal board, and an end of the terminal 5 is soldered. 1
Reference numeral 2 denotes a terminal plate cover formed of an insulating resin into a rectangular tube shape so as to surround a terminal plate constituted by the terminals 5 and the printed circuit board 11, and 13 denotes an insulating resin so as to cover the back side of the cover 12. It is a cover formed in the shape of a flat plate, and these covers 12 and 13 form a terminal plate cover in the shape of a bottomed rectangular tube. The bottomed rectangular tubular terminal plate cover thus configured is attached to the apparatus main body 1 via studs 3 and 4. Reference numeral 14 denotes a heat reflector, which is attached to a surface of the cover 13 facing the apparatus main body 1. As the heat reflector 14, an aluminum foil may be attached, or a material having a low heat absorption such as aluminum, gold, or silver may be deposited.
The terminals 5 of the terminal board and the internal circuit of the apparatus main body 1 are electrically connected via a connector attached to the printed circuit board 11 and a connector attached to the apparatus main body 1. do not do.

【0010】このような構成において、装置本体1の熱
源から端子板に向けて放射される熱は熱反射体14によ
って反射され、スタッド3,4により形成される空間に
拡散放熱される。また、アルミ箔14は吸収熱容量が小
さいので熱伝導による温度変化は小さくなる。アルミ箔
14を張り付けた場合と張り付けない場合の温度上昇の
実測例によれば、約1.5℃の改善効果が確認できた。
In such a configuration, heat radiated from the heat source of the apparatus main body 1 toward the terminal plate is reflected by the heat reflector 14 and diffused and radiated to the space formed by the studs 3 and 4. Further, since the aluminum foil 14 has a small absorption heat capacity, a temperature change due to heat conduction is small. According to an actual measurement example of the temperature rise when the aluminum foil 14 is attached and when it is not attached, an improvement effect of about 1.5 ° C. was confirmed.

【0011】一方、端子5相互間の温度差は、プリント
基板11として用いる金属コアの熱伝導特性により改善
される。同様の大きさの端子板をエポキシプリント基板
で構成したものの温度差が約1℃であったのに比べて、
金属コアのプリント基板では0.5℃程度に改善され
た。図2は本考案の他の実施例の構成説明図である。図
2の実施例では、カバー13の装置本体1との対向面
に、熱反射体15として透明樹脂で形成され内部に5m
m〜20mmのアルミ箔の小片が満たされたブラケット
を取り付けている。
On the other hand, the temperature difference between the terminals 5 is improved by the heat conduction characteristics of the metal core used as the printed board 11. Compared to a similar size terminal board made of epoxy printed circuit board, the temperature difference was about 1 ° C,
For a printed circuit board with a metal core, the temperature was improved to about 0.5 ° C. FIG. 2 is an explanatory view of the configuration of another embodiment of the present invention. In the embodiment shown in FIG. 2, the cover 13 is formed of a transparent resin as the heat reflector 15 on the surface facing the apparatus body 1 and has a length of 5 m.
A bracket filled with small pieces of aluminum foil of m to 20 mm is attached.

【0012】このような構成によれば、ブラケット15
の内部にはアルミ箔の小片が満たされているので吸収熱
容量は図1よりも小さくなり、アルミ箔小片の乱反射に
より端子板への熱移動も小さくなる。図1と同様の大き
さで比較したところ、図1の構成よりもさらに1℃程度
の温度抑制改善効果が確認できた。
According to such a configuration, the bracket 15
Is filled with small pieces of aluminum foil, so that the heat absorption capacity is smaller than in FIG. 1, and the heat transfer to the terminal plate is also reduced due to the irregular reflection of the small pieces of aluminum foil. When compared with the same size as in FIG. 1, a temperature suppression improvement effect of about 1 ° C. was further confirmed as compared with the configuration in FIG.

【0013】[0013]

【考案の効果】以上説明したように、本考案によれば、
外付けの等温板を用いることなく端子間の温度差を小さ
くできる熱電対温度測定装置が実現できる。
[Effects of the Invention] As described above, according to the present invention,
A thermocouple temperature measuring device that can reduce the temperature difference between terminals without using an external isothermal plate can be realized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例の構成説明図である。FIG. 1 is an explanatory diagram of a configuration of an embodiment of the present invention.

【図2】本考案の他の実施例の構成説明図である。FIG. 2 is a diagram illustrating the configuration of another embodiment of the present invention.

【図3】従来の熱電対温度測定装置の一例を示す構成説
明図である。
FIG. 3 is a configuration explanatory view showing an example of a conventional thermocouple temperature measuring device.

【符号の説明】[Explanation of symbols]

1 装置本体 3,4 スタッド 5 端子 11 金属コアプリント基板 12,13 カバー 14 熱反射体(アルミ箔) 15 熱反射体(アルミ箔小片入り透明ブラケット) DESCRIPTION OF SYMBOLS 1 Apparatus main body 3, 4 Stud 5 Terminal 11 Metal core printed circuit board 12, 13 Cover 14 Heat reflector (aluminum foil) 15 Heat reflector (a transparent bracket containing a small piece of aluminum foil)

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】発熱源を内包する装置本体の一部に熱電対
を接続する端子板がスタッドを介して取り付けられた温
度測定装置において、 前記端子板の内部には金属コアのプリント基板が埋設さ
れ、端子板の装置本体との対向面には熱反射体が設けら
れたことを特徴とする熱電対温度測定装置。
1. A temperature measuring device in which a terminal plate for connecting a thermocouple is mounted via a stud to a part of a device body including a heat source, wherein a printed board of a metal core is embedded in the terminal plate. A thermocouple temperature measuring device, wherein a heat reflector is provided on a surface of the terminal plate facing the device main body.
JP3966292U 1992-06-10 1992-06-10 Thermocouple temperature measurement device Expired - Lifetime JP2539431Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3966292U JP2539431Y2 (en) 1992-06-10 1992-06-10 Thermocouple temperature measurement device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3966292U JP2539431Y2 (en) 1992-06-10 1992-06-10 Thermocouple temperature measurement device

Publications (2)

Publication Number Publication Date
JPH062183U JPH062183U (en) 1994-01-14
JP2539431Y2 true JP2539431Y2 (en) 1997-06-25

Family

ID=12559302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3966292U Expired - Lifetime JP2539431Y2 (en) 1992-06-10 1992-06-10 Thermocouple temperature measurement device

Country Status (1)

Country Link
JP (1) JP2539431Y2 (en)

Also Published As

Publication number Publication date
JPH062183U (en) 1994-01-14

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Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970204