JP2539071B2 - Alignment device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Overview] A positioning device for positioning a multi-terminal (pin) electronic component at a predetermined position on a substrate, and accurately positioning the electronic component on the substrate irrespective of displacement of both the substrate side and the electronic component side. With the aim of realizing a positioning device that can be mounted, it has an optical system for substrate imaging that captures the pattern of the substrate,
An image from the component photographing optical system, which has a substrate position recognizing unit that detects a positional deviation amount of the substrate by an image from the substrate photographing optical system and a component photographing optical system that photographs a terminal portion of an electronic component. A component position detecting means for detecting a positional deviation amount of the terminal portion, and an inclination angle detecting means for detecting an inclination angle θ _P of the terminal portion by an image from the component photographing optical system without depending on the inclination direction. A component position recognizing unit for detecting the amount of positional displacement of the electronic component, the amount of positional displacement detected by the substrate position recognizing unit, the amount of positional displacement detected by the component position recognizing unit, the component mounting head, and The X
An offset that calculates and stores a correction value based on the drive error amount of the Y table and sends the correction value to the control unit so that the drive of the component mounting head and the XY table is corrected by the correction value. Composed of memory and.

[Industrial applications]

The present invention relates to a positioning device for electronic components, and more particularly to a positioning device for positioning a multi-terminal (pin) electronic component at a predetermined position on a printed circuit board.

As the high integration of electronic components such as ICs dramatically progresses, miniaturization of packages forming these electronic components and increase in the number of pins have become important factors for high-density mounting.

Therefore, as a new package that replaces the conventional DIP type (Dual In-line Package), the so-called PGA type (Pin Grid Arrey) shown in the perspective view of the package in FIG. 7 has been applied to mounting components. .

In such an electronic component 2, not only the pitch L of the pins 2B through which signals are input and output is narrow and the number of the pins 2B is large, but the arrangement of the pins 2B cannot be visually observed from directly above the component. It is no longer possible to mount the electronic component 2 on the board 11 by visual manual work.

Therefore, when the electronic component 2 is mounted on the substrate 11 such as a printed circuit board, it has come to be automatically mounted by the component mounting machine using the image recognition technology.

Such a component mounting machine, as shown in the perspective view of FIG. 8, includes a container 1 in which an electronic component 2 is set in a housing 20,
It is formed by arranging an XY table 7 on which a substrate 11 is loaded and a component mounting head 8 driven by a drive mechanism 8A.

Then, the electronic component 2 set in the container 1 is picked up by the component mounting head 8 and the component mounting head 8 is driven by the drive mechanism 8A, and the pin of the electronic component 2 is placed at a predetermined position of the pattern 11A provided on the substrate 11. Positioning 2B and mounting electronic components 2 are performed one after another.

Therefore, a positioning device is provided for such positioning, and when mounting the electronic component 2, a large number of pins 2B are mounted.
Is required to be accurately positioned so as to be accurately positioned.

[Conventional technology]

The conventional alignment device is configured as shown in the conventional explanatory view of FIG. 6 (a1) and 6 (b1) are block diagrams showing the configuration, FIG. 6 (a2) is a configuration diagram of an optical system for photographing a substrate, and FIG. 6 (b2) is a configuration diagram of an optical system for photographing an electronic component. Is.

As shown in FIG. 6 (a1), the component mounting head 8 is driven by controlling the head driving unit 22 by the control unit 21, and the electronic component 2 is picked up from the container 1 and mounted on the XY table 7. The electronic component 2 is positioned at a predetermined position on the substrate 11 and the electronic component 2 is mounted.

As the component mounting head 8 in this case, a suction head that sucks the electronic component 2 by the nozzle at the tip end by suction of air is usually used.

Further, the table drive unit 23 controlled by the control unit 21.
A substrate position detector 24 for comparing the image of the substrate 11 photographed by the substrate photographing optical system 3 with the previously prepared reference image data D1 is connected to the substrate photographing optical system 3, and the substrate position detector 24 detects the positional deviation amount of the substrate 11. Is detected, and the position of the XY table 7 is adjusted according to the detected positional deviation amount.

Furthermore, the optical system 3 for photographing the substrate in this case is shown in FIG. 6 (a2).
As shown in, the irradiation light from the light source 3A passes through the condenser lens 3B, the light-shielding mask 3C, and the projection lens 3D to irradiate the substrate 11 loaded on the XY table 7, and the reflected light is imaged. The CCD 3G receives light through the lens 3E and the shielding mask 3F to capture a silhouette image of the pattern 11A provided on the substrate 11. (For such an optical system for photographing a substrate, there is Japanese Patent Application No. 63-13440.) Then, the electronic component 2 is driven by driving the component mounting head 8.
The position adjustment is performed by moving the substrate 11 in the X and Y directions while being transferred from the container 1 to the substrate 11, so that the electronic component 2 is mounted at a predetermined position.

Further, such position adjustment can also be performed with the configuration shown in FIG. 6 (b1).

That is, when the electronic component 2 is picked up by the component mounting head 8, it is photographed by the component photographing optical system 4, and the photographed image and the reference image data D2 prepared in advance.
Are compared in the component position detecting unit 28, and the positional deviation amount is detected and notified to the head driving unit 27, so that the position of the component mounting head 8 is adjusted.

When the electronic component 2 is mounted on the substrate 11 loaded on the XY table 7, when the electronic component 2 is picked up by the component mounting head 8 from the container 1, the electronic component 2 is picked up by the component photographing optical system 4. The (pin) is photographed and the amount of displacement is detected. Then, the component mounting head 8 is adjusted by the amount of displacement, and after this adjustment, the electronic component 2 is mounted at a predetermined position on the substrate 11 by driving the component mounting head 8.

As shown in FIG. 6 (b2), the component photographing optical system 4 uses the laser generating element 4A for the pin 2B in the terminal portion 2A of the electronic component 2 sucked by the nozzle at the tip of the component mounting head 8. Illuminated from all sides by laser light from the camera
It is configured to shoot on the 4th floor.

Irradiation of laser light by the laser generation element 4A in this case is performed on the side surface of the pin 2B by the cylindrical lens 4B, the mirror 4C, and the cylindrical lens 4D, and the irradiated pin 2B is photographed by the camera 4F through the filter 4E. Has been formed. (For such a component photographing optical system, there is JP-A-63-275907.) Therefore, when the electronic component 2 is picked up, the positional deviation amount is checked by the photographed image of the component photographing optical system 4. If the positional deviation is detected, the component mounting head 8 is adjusted in the X and Y directions and the angle θ, and after this position adjustment, the electronic component 2 is transferred to the board 11 and mounted. .

[Problems to be Solved by the Invention]

However, the configuration shown in FIGS. 6 (a1) and (b1) is
It is for detecting the positional deviation of either the board 11 or the electronic component 2, and for example, detecting the positional deviation of the board 11,
Even if the position adjustment is performed, if the electronic component 2 is actually displaced, it cannot be mounted at a predetermined position.
On the contrary, even if the positional deviation of the electronic component 2 is adjusted, the substrate 11
Similarly, if there is a positional deviation, it cannot be mounted at a predetermined position.

Further, the substrate photographing optical system 3 and the component photographing optical system 4
If there is a drive error peculiar to the apparatus in the drive of the XY table 7 and the component mounting head 8 due to the displacement of the mounting position of the electronic component 2, even if the electronic component 2 is moved to a predetermined position on the substrate 11, the operation is performed. However, there is a problem that it may not be mounted at a predetermined location due to a drive error.

Therefore, it is an object of the present invention to realize a positioning device that allows an electronic component to be accurately mounted on a substrate regardless of the positional deviation between the substrate side and the electronic component side.

[Means for solving the problem]

FIG. 1 is a diagram for explaining the principle of the present invention for solving the above-mentioned problems, and has a substrate photographing optical system 3 for photographing the pattern of the substrate 11, and an image from the substrate photographing optical system 3 is used to The board position recognizing unit 5 for detecting the positional deviation amount (X _b , Y _b ) of the board 11 and the component photographing optical system 4 for photographing the terminal portion 2A of the electronic component 2 are provided. Component position detecting means 6a for detecting the amount of positional deviation (X _p , Y _p ) of the terminal portion 2A by the image of the above, and the inclination angle θ _p of the terminal portion 2A by the image from the component photographing optical system 4. The component position recognizing unit 6 for detecting the positional deviation amount (X _p , Y _p , θ _p ) of the electronic component 2 by the inclination angle detecting means 6b which does not depend on the direction.
And the positional displacement amount (X _b , Y _b ) detected by the board position recognizing unit 5 and the positional displacement amount (X _p , Y _p , θ _p ) detected by the component position recognizing unit 6, A correction value (X, Y, θ) is calculated and stored by the component mounting head 8 and the drive error amount (d _x , d _y , d _θ ) of the XY table 7, and the correction value (X, Y, θ) is provided with an offset memory 10 for sending the correction value (X, Y, θ) to the control unit 9 so that the drive of the component mounting head 8 and the XY table 7 is corrected. .

[Action]

In FIG. 1, the substrates stacked on the XY table 7
The board photographing optical system 3 and the board position recognizing section 5 are provided at 11, and the electronic part 2 held by the component mounting head 8 is provided with the part photographing optical system 4 and the part position recognizing section 6, respectively.
The positional displacement amounts (X _b , Y _b ) and (X _p , Y _p , θ _p ) detected by the board position recognizing unit 5 and the component position recognizing unit 6 are sent to the offset memory 10.

However, in the present invention, the inclination deviation amount θ _{P in} the component position recognizing unit 6 is detected by the inclination angle detecting means 6b which can be detected regardless of the inclination direction (plus direction or minus direction).

In the offset memory 10, the positional displacement amounts (X _b , Y _b ) and (X _b
p , Y _p , θ _p ) and XY table 7 and component mounting head 8
Amount of driving error _{(d x, d y, d} θ) and the correction value (X, Y, θ)
Is calculated, and the calculated correction values (X, Y, θ) are notified to the control unit 9, and the positional deviations of both the XY table 7 and the component mounting head 8 are adjusted.

Therefore, compared to the conventional positional deviation adjustment of either the substrate 11 or the electronic component 2, the adjustment accuracy is improved, more accurate transfer can be performed, and the quality can be improved by reliable mounting. At the same time, since the tilt deviation amount θ _P can be detected regardless of the tilt direction of the electronic component 2, one detection control program is not required for each of the plus direction and the minus direction, and only one control program is required, and its capacity is small. It is possible.

〔Example〕

Hereinafter, the alignment apparatus according to the present invention will be described in detail with reference to FIGS. 2 to 5 showing an embodiment thereof.

FIG. 2 is a block diagram of an embodiment of the present invention, FIG. 3 is a flow chart showing the operation of the present invention, and FIG. 4 is an explanatory diagram of pin position displacement recognition of the present invention. Camera layout, Figure (b) is a density graph, Figures (c) and (d)
Is an explanatory diagram of the total number of pixels, (e) and (f) are explanatory diagrams of pin arrangement, (g) and (j) are plan views of windows,
FIG. 5H is an explanatory view of counting the number of pixels in the window, FIG. 6K is a flowchart showing the pin misalignment recognition processing, and FIG. 5 is an explanatory view of the misalignment recognition of the board of the present invention.
(A1) and (a2) are plan views of the main part of the substrate, (b) is a density graph, (c) is a design drawing of the number of pixels, and (d) is the displacement recognition of the substrate. It is a flowchart figure which shows a process. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 2, the pin 2B of the electronic component 2 picked up and held by the component mounting head 8 driven by the head driving unit 13 is photographed by the component photographing optical system 4, and the photographed image is obtained. The data DP is sent to the component position recognizing unit 6 including the ROM 6B and the RAM 6C controlled by the CPU 6A.

The board 11 loaded on the XY table 7 driven by the table drive unit 12 is photographed by the board photographing optical system 3, and the photographed image data DP is stored in the CPU 5A.
The ROM 5B and the RAM 5C controlled by the CPU 5 are sent to the board position recognizing unit 5 which is built in.

Then, the displacement data (X _p , Y _p , θ _p ) calculated by the component position recognition unit 6 and the displacement data (X _b , Y _b ) calculated by the board position recognition unit 5 are recorded in the offset memory 10. It is stored in areas E2 and E3, respectively.

Further, in the recording area E4 of the offset memory 10, a mounting error of the board photographing optical system 3 and the component photographing optical system 4,
Error data D3 (d _x , d _g , d _θ ) obtained by measuring the drive error of the component mounting head 8 and the XY table 7 is stored, and the positional deviation data (X _p , Y _p , θ _p ) and (X _b , Y _b ) and drive error data (d _x , d _y , d _θ ) are added up to calculate a correction value (X, Y, θ) in the recording area E1.
(Y, θ) is sent to the control unit 9 to control the head drive unit 13 and the table drive unit 12 so that the component mounting head 8 and X-
The position of the Y table 7 is adjusted.

Further, the image data DP is input to the camera interface 6D, A / D converted, and stored in the frame memory unit 6E. In this case, in the component photographing optical system 4, the zoom controller 6F drives the zoom mechanism 4J to increase or decrease the magnification of the photographed image, and the moving table controller 6G moves the moving table 4H to obtain an enlarged image of a predetermined portion. It is designed to be used.

Then, the positional shift data (X _p , Y _p ,
θ _p ) is calculated by the hard arithmetic processor 6H, and the calculation result is sent to the offset memory 10 via the interface 6J.
To be sent.

Similarly, the image data DB is input to the camera interface 5D, A / D converted, and stored in the frame memory unit 5E. Then, the positional deviation data (X _b , Y
_b ) is calculated by the hard processor 5F, and the calculation result is offset memory via the external interface 5G.
It is supposed to be sent to 10.

When the predetermined electronic component 2 is mounted on the substrate 11, as shown in FIG. 3, first, the predetermined electronic component 2 is held by the component mounting head 8 in response to a component mounting start command, and the component photographing optical Parts are set to move to a predetermined location in the system 4 (step S1).

On the other hand, according to the mounting data stored in the floppy 9A, the XY table 7 is moved so that the position on the substrate 11 on which the electronic component 2 is mounted faces the substrate photographing optical system 3 (step S2).

Next, the position of the electronic component 2 is recognized by the component photographing optical system 4 and the component position recognition unit 6 (step S3),
The substrate is captured by the substrate photographing optical system 3 and the substrate position recognition unit 5.
The 11 positions are recognized (step S4).

As a result, the positional shift due to the recognition of the positions of the electronic component 2 and the substrate 11 is sent to the offset memory 10, and the correction values (X, Y, θ) are calculated and stored in the offset memory 10 (step S5).

Then, the component mounting head 8 and the XY table 7 are driven based on the correction values (X, Y, θ), and the position is adjusted to mount the component (step S6).

When the mounting of one electronic component 2 is completed, the next electronic component 2
Whether or not the component is mounted is checked by referring to the mounting data described above. If “present”, the component mounting is executed by repeating the above-described operation again, and if “none”, the component mounting processing is ended.

Therefore, when the electronic component 2 is mounted on the substrate 11 at a predetermined position, the positional deviation of the electronic component 2 is corrected by the correction values (X, Y, θ), and the mounting is performed by accurate positioning.

Next, the component position recognition process (the process of step S3 in FIG. 3) will be described with reference to the explanatory views of FIGS. 4 (a) to 4 (j) and the flowchart of FIG. 4 (k).

First, the initial imaging range is selected (step S1
1). That is, the zoom mechanism 6J is driven by the zoom controller 6F to reduce the magnification and widen the imaging range (field of view) so that the entire image of the electronic component 2 can be input.

It should be noted that the camera 4F of the optical system 4 for photographing a component is shown so as to be orthogonal to the half mirror 4G arranged at a position corresponding to the terminal portion 2A of the electronic component 2 to be photographed, as shown in FIG. 4 (a). For example, the camera 4F provided at the location A and the location B has a wide field of view and low magnification, and the camera 4F provided at the location B has a narrow field of view and high magnification. Alternatively, A and B may be switched and used. In this case, the zoom mechanism 4J
It is possible to freely obtain an entire image of the terminal portion 2A or an enlarged image of a portion thereof without providing the.

Image data DP taken by the optical system 4 for taking parts
The component position recognition using 6 is performed by the component position recognizing unit 6 as the component position detecting means 6a and the inclination angle detecting means 6b in the following procedure.

First, the image data DP from the optical system 4 for photographing a part is input by the camera interface 6D, A / D converted and stored in the frame memory unit 6E. Then, the number of pixels corresponding to the respective densities 0 to 255 is counted, and a density histogram as shown in FIG. 4B is created (step S12).

Next, the binarized slice level t is set (step S13). That is, since the total number of pixels of all the component pins in the electronic component 2 is known from the design value, the area closest to the design value (hatched component in the figure) is calculated from the brighter side of the density histogram, and at that time, Is the binarized slice level t.

Then, the binarized slice level t is used to binarize the image data stored in the frame memory unit 6E (step S14). That is, the one that is darker than the binarized slice level t, that is, the background image is “0”, and the one that is brighter than the binarized slice level t, that is, the component pin image “1” is 2
The image data is binarized (A / D converted), and the binarized image data is stored in the frame memory 6E.

Next, based on the data stored in the frame memory 6E, the vertical projection distribution as shown in FIG. 4 (c) is obtained (step S15). This is a '1' in frame memory 6E
Is added for each column on the X axis. At this time, the X-axis coordinates (X1, X2) at both ends of the distribution and the distribution length m (= X2-X1) are also obtained.

Similarly, a horizontal projection distribution as shown in FIG. 4 (d) is obtained based on the data stored in the frame memory 6E (step S16). This is a '1' in frame memory 6E
Of pixels are added on the Y axis for each row. At this time, the Y-axis coordinates (Y1, Y2) at both ends of the distribution are also obtained.

Then, the reference pin (first pin P1) is searched (step S17). That is, the intersection point (X1, Y2) of the coordinates X1 and Y2 obtained in steps S15 and S16 is set as the origin P, and FIG.
As shown in (f), the binary image is scanned in the X-axis direction from the origin P, and the value of b ₁ in the figure is obtained by first searching for the coordinates that become the pixel of '1'.

Next, a ₁ (a ₁ = m−b ₁ ) is calculated from the previously obtained value of m, and the inclination direction of the component is calculated by the following comparison formula.

When a ₁ <b ₁ : θ = + θ (assumed to be positive) When a ₁ > b ₁ : θ = −θ (assumed to be negative) Since the expected maximum tilt deviation is ± 10 °, In the embodiment, “a ₁ = b ₁ ”, that is, the case of θ = 45 ° is not assumed.

Pin No. ₁ depending on this calculated tilt direction and a ₁ and b ₁
Recognize the position of P1.

 Next, the tilt angle is detected (step S18).

The inclination angle θ can be calculated by + θ = tan (a ₁ / b ₁ ) −θ = tan (b ₁ / a ₁ ). In this case, two calculation programs corresponding to the inclination angle polarities are used. Must be prepared.

Therefore, in the present invention, one calculation program is sufficient regardless of the polarity of the tilt angle by the following method of calculating the rotation angle.

That is, the inclination angle is calculated by substituting the design value 1 between the pin ends shown in the figure and the previously obtained value of m into the formula for calculating θ derived by the following procedure.

When θ is positive: sin θ = a ₁ / l, cos θ = b ₁ / l, sin θ + cos θ = a ₁ / l + b ₁ + l = (a ₁ + b ₁ ) / l = m / l Also, from the addition theorem, Therefore, substituting α = 45 °, Get. Than this, Therefore, θ is as follows.

When θ is negative: cos θ = a ₁ / l, sin θ = b ₁ / l, but since the above is the same as when θ is positive, θ is as follows.

Therefore, the calculation formula of θ does not change whether it is positive or negative, but after calculating the value of θ, the polarity code may be added according to the previously obtained tilt direction, and only one calculation program is required. .

Next, the window is set (step S19). That is, in consideration of the coordinates of the No. 1 pin P1 and the inclination angle θ obtained by the above process, the pin 2B divided by the dotted line shown in FIG. 4 (g) is centered on the basis of the pitch L which is the set value. The windows W1, W2, W3, ... Are set.

Then, the enlarged image is input (step S20). That is, the field of view is narrowed by increasing the magnification of the camera 4F, and the enlarged image data DP of each window W1, W2, W3, ... Is input, A / D converted and stored in the frame memory unit 6E.

Next, the enlarged image data is binarized (step S2
1). This binarization is performed by the same method as that performed in step S14.

Next, the center of gravity of each pin is detected (step S22).
That is, as shown in FIG. 4 (h), the frame memory unit
X-axis in the window W of the enlarged image stored in 6E,
And the number of pixels in the Y-axis direction is aggregated to create a vertical projection distribution and a horizontal projection distribution, and the center of gravity positions XG and YG at which the diagonally shaded areas S1 and S2 of the vertical projection distribution and the horizontal projection distribution are divided into two. By calculating, the center of gravity WG of the window W is calculated.

Then, check whether all pins 2B are finished (step
If not completed, the above operation is repeatedly executed until all pins are completed (steps S22 and S23).

Next, the posture of the component is recognized (step S24). That is, as shown in FIG. 4 (j), the linear expressions y ₁ and y _{2 in which the} centers of gravity WG1, WG2, ...
Is calculated by the least squares method, a straight line y that bisects the intersection point of y ₁ and y ₂ is obtained, and an angle α formed by the straight line y and the X axis is calculated.

And. On the straight line y, the coordinates (X ₀ , Y ₀ ) that are 1/2 of the diagonal line in the design value of the electronic component 2 are calculated.

Finally, the component displacement amount is calculated (step S2
Five). That is, the positional deviation data X _p , Y _p , θ _p of the electronic component 2 can be obtained by the following equations (3), (4) and (5).

X _p = X ₀ −X _k (3) Y _p = Y ₀ −Y _k (4) θ _p = 45−α (5) However, X _k and Y _{k in} this case are based on the design values. Coordinates when the displacement is zero, which is a value calculated in advance.

Next, the substrate position recognition process (the process of step S4 in FIG. 3) will be described with reference to the explanatory views of FIGS. 5 (a) to 5 (c) and the flowchart of FIG. 5 (d).

First, the image data DB photographed by the substrate photographing optical system 3 is input (step S31). That is, as shown in FIG. 5 (a1), the pattern 11A corresponding to the pin 2B and the reference mark 11B are provided on the board 11 where the electronic component 2 is mounted.
And are provided, and the reference mark is used as the image data DB.
Input the image of 11B as shown in the figure (a2).

Next, a density histogram is created (step S3
2). That is, in this image data DB, the number of pixels corresponding to predetermined densities 0 to 255 is counted and a density histogram is created, as shown in FIG.

Next, the binarized stylus level t'is set (step S33). In this case, since the area of the reference mark 11B is known by the set value, the number of pixels closest to the set value is calculated from the brighter side of the histogram, and the density at that time is set as the binarized slice level t '.

Next, binarization is performed using the binarized slice level t '(step S34). That is, A / D conversion is performed by binarizing the image data DB by setting “0” for those darker than the binarized slice level t ′ and “1” for those brighter than the binarized slice level t ′. It is stored in the frame memory unit 5E.

Next, the center of gravity of the reference mark is detected (step S3
Five). This is the same as the pixel of "1" of the image data DB in the same figure (c).
As shown in FIG. 3, the vertical projection distribution and the horizontal projection distribution are created by summing up on the X axis and the Y axis, and the barycentric position X at which the diagonally shaded areas S11 and S12 of the vertical projection distribution and the horizontal projection distribution are divided into two.
By calculating G ′ and YG ′, the center of gravity W of the reference mark 11B
Calculate G '.

Next, the board position displacement amount is calculated (step S3
6). The displacement data (X _b , Y _b ) of the substrate 11 is obtained by the following equations (6) and (7) based on the coordinates (X _k ′, Y _k ′) when the displacement of the reference mark 11B is zero. be able to.

_{X b = XG'-X k '} ... (6) Y b = YG'-Y k' ... (7) will be described offset memory 10.

Normally, there is an error in the coordinate system due to the mounting accuracy between the coordinate axes of the component photographing optical system 4 and the substrate photographing optical system 3 for detecting the component position and the substrate position, and the mechanical coordinate axis at the component mounting position. Corrects each of these with respect to a reference (usually, the machine coordinate system at the component mounting position is used). However, this has the following problems.

Problem: It is difficult and time consuming to measure the difference of each coordinate axis with respect to the reference.

Problem: Two sets of coordinate axis difference data (component side and board side)
Not only does it need to have memory, it requires memory, but it also takes time to perform calculations.

Problem: The above problem becomes more noticeable when multiple similar devices are manufactured.

Offset memory 10 to solve such problems
Is provided.

This is to prepare a reference component and a board created according to the design values, and to simply calculate the component position detection result (X _P , Y _P , θ _P ) and the board position detection result (X _b , Y _b ). The component is actually mounted with the combined value obtained by addition. Here, the component position detection result is a positional displacement amount of the component when the coordinate axis of the component photographing optical system 4 is used as a reference, and this reference is an orthogonal coordinate passing through the center of the camera visual field of the component photographing optical system 4. is there. Further, the board position detection result is a positional displacement amount of the board when the coordinate axis of the board photographing optical system 3 is used as a reference, and this reference is an orthogonal coordinate passing through the center of the camera visual field of the board photographing optical system 4. is there.

Then, by actually measuring the positional deviation amount between the pattern 11A of the substrate 11 and the electronic component 2, it is possible to obtain the opposite signs of X, Y, and θ in the following equations (8), (9), (10). The value is written in the offset memory 10 in advance.

X = X _P + X _b + d _X = 0 (8) Y = Y _P + Y _b + d _Y = 0 (9) θ = θ _P + d _θ = 0 (10) where (X, Y, θ) Is the correction value of the machine control system,
(X _P , Y _P , θ _P ) is the value of the position recognition result when using the reference part, and (X _b , Y _b ) is the value of the position recognition result when using the reference board. And (d _X , d _Y , d _θ ) are error values stored in the offset memory 10.

It should be noted that by recognizing the reference mark 11B provided at the corner of the substrate 11 in advance on the reference side, there is no problem in accuracy even if angle recognition is not performed for each mounting position.

〔The invention's effect〕

As described above, according to the present invention, when the electronic component is mounted at a predetermined position on the board, the positional deviation data (X _p , Y _p , θ _p ) of the electronic component and the positional deviation data (X _{p b} , Y _b ) and the error data (d _x , d _y , d _θ ) for mounting and driving are stored in the offset memory, and the adjustment values (X, Y, θ) that correct these positional deviations can be easily retrieved. It is possible to drive the component mounting head and the XY table according to the adjustment values (X, Y, θ) to eliminate misalignment and perform reliable mounting. Since the inclination deviation amount θ _P can be detected regardless of the inclination direction, only one control program is required.

Therefore, it is possible to provide a positioning device that can improve the positioning accuracy of mounting and can detect the deviation amount of any of the electronic components in the tilt direction with the same control program to reduce the capacity thereof.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of an alignment apparatus according to the present invention, FIG. 2 is a block diagram of an embodiment according to the present invention, FIG. 3 is a flow chart for explaining the overall operation of the present invention, and FIG. Is an explanatory view of the positional deviation recognition of the pin of the present invention,
(A) is a camera layout diagram, (b) is a density graph diagram,
(C) and (d) are explanatory views of the total number of pixels, (e) and (f)
Is a pin array explanatory diagram, (g) and (j) are plan views of windows, (h) is an explanatory diagram of the total number of pixels in the window,
(K) is a flow chart, and FIG. 5 is an explanatory view of the positional deviation recognition of the substrate of the present invention.
1) and (a2) are plan views of the main part of the substrate, (b) is a density graph, (c) is an explanatory diagram of the total number of pixels, (d) is a flowchart diagram, and FIG. 6 is a conventional explanatory diagram. (A1) and (b1) are block diagrams of the configuration, (a2) is a configuration diagram of the board, (b2) is a configuration diagram of the electronic components, FIG. 7 is a perspective view of the package, and FIG. 8 is a component mounting machine. A perspective view is shown. In the figure, 1 is a container, 2 is an electronic component, 3 is a board photographing optical system, 4 is a component photographing optical system, 5 is a board position recognition unit, 6 is a component position recognition unit, 6a is a component position detection means, and 6b is Is an inclination angle detecting means, 7 is an XY table, 8 is a component mounting head, 9 is a control unit, 10 is an offset memory, 11 is a substrate, 12 is a table drive unit, and 13 is a head drive unit.

Claims (1)

(57) [Claims] 1. An electronic component (2) set in a container (1), a head drive section (13) for driving a component mounting head (8) holding the electronic component (2), and the electronic component. A table drive section (12) for driving an XY table (7) on which a board (11) on which (2) is mounted is driven, and the table drive section (12) and the head drive section (13) are driven. A control unit (9) for controlling is provided, and the electronic component (2) is positioned at a predetermined position on the substrate (11) by driving the component mounting head (8) and the XY table (7). A positioning device, which has a board photographing optical system (3) for photographing the pattern of the board (11), and shifts the position of the board (11) by an image from the board photographing optical system (3). the amount (X _b, Y _b) a substrate position recognition unit for detecting a and (5), the terminal portion of the electronic component (2) (2A) Taking To a part photographic optical system (4), the terminal unit by the image from the component photographing optical system (4) positional deviation amount (2A) (X _p, Y _p) component position detecting means for detecting ( 6a) and the image from the component photographing optical system (4), the tilt angle θ _P of the terminal portion (2A)
The tilt angle detecting means (6b) for detecting the position of the electronic component (2) without depending on the tilt direction (X _p , Y _p ,
θ _p ), the component position recognizing unit (6), the amount of positional deviation (X _b , Y _b ) detected by the board position recognizing unit (5), and the component position recognizing unit (6). Correction value based on the amount of positional deviation (X _p , Y _p , θ _p ) and the drive error amount (d _x , d _y , d _θ ) of the component mounting head (8) and the XY table (7). (X, Y, θ) is calculated and stored, and the correction value (X, Y, θ) corrects the drive of the component mounting head (8) and the XY table (7). An offset memory (10) for sending a value (X, Y, θ) to the control unit (9), and a positioning device.