JP2536868Y2 - Substrate structure of cutting wheel - Google Patents

Description

[Detailed description of the invention]

[0001]

[Industrial applications] The present invention is applied to stone, concrete,
The present invention relates to a substrate structure of a cutting grindstone for cutting refractories and the like, and more particularly, to a substrate structure of a cutting grindstone having a laminated structure of a substrate and reducing noise during cutting.

[0002]

2. Description of the Related Art Conventionally, as a substrate structure of a cutting whetstone having a sound deadening effect, for example, as described in JP-A-52-17277 and JP-A-58-70869, three steel plates are stacked. Spot welding, and JP-A-59-107860 and JP-A-59-1283.
As described in JP-A-58-58, there is one in which a copper plate is disposed between both steel plates and spot-welded.

[0003] These laminated substrate structures have an effect of suppressing the whole vibration and reducing the noise at the time of cutting by arranging intermediate layers having different natural frequencies in a sandwich shape between the steel plates on both sides.

[0004]

However, a laminated substrate using a steel sheet for the intermediate layer has an appropriate substrate strength,
The steel plate requires quenching and tempering treatment, which increases the number of manufacturing steps. Further, there is a problem that it takes time to form the slits because the material is hard.

In the case of using a copper plate for the intermediate layer, since the copper plate is soft, it is easy to remove the slit portion when forming the slit, but there is a problem that the substrate strength is low.

The problem to be solved by the present invention is to obtain a substrate structure of a cutting whetstone which has a sufficient noise reduction effect, is easy to manufacture, and has excellent substrate strength.

[0007]

In order to achieve the above-mentioned object, the substrate structure of the cutting wheel according to the present invention has a structure in which an intermediate plate is disposed between outer plates and a slit is formed on the periphery of the laminated substrate. In the structure, the intermediate plate is characterized in that at least an outer peripheral portion forming the slit is made of a copper-based material, and an inner peripheral portion thereof is formed of an iron-based material.

[0008]

FIG. 1 is a partial side view of a substrate structure of a cutting grindstone according to the present invention, and FIG. 2 is an enlarged sectional view taken along line AA of FIG.

1 and 2, reference numeral 1 denotes a substrate;
It is composed of steel outer plates 2 and 2 and an intermediate plate 3 interposed therebetween. Slits 4 are formed at predetermined intervals on the periphery of the substrate 1. Further, a diamond segment 5 is attached to the outer periphery of the substrate 1 by means such as brazing.

The intermediate plate 3 has an outer peripheral portion 3a (outer peripheral portion shown by the broken line in FIG. 1) forming the slit 4 formed of a ring-shaped copper-based material, and an inner peripheral portion 3b formed of an iron-based material. ing. As a copper-based material for the substrate outer peripheral portion 3a, a condition that removal at the time of slit formation is easy is required, and C1020, C1100, or the like can be used. Further, the thickness is suitably 0.1 to 0.3 mm for the purpose of removing high frequency component noise.

On the other hand, as the iron-based material forming the inner peripheral portion 3b, SK3, SK
4, SUS304 etc. can be used,
The thickness is set at 0. 0 for the purpose of removing high frequency noise.
About 1 to 0.3 mm is appropriate.

An outer peripheral portion 3a made of a copper-based material,
The joining surface with the inner peripheral portion 3b formed of an iron-based material can be joined without a gap, or a slight gap can be provided. By doing so, it is possible to obtain a substrate structure that has a sufficient noise reduction effect, is easy to manufacture, and has high substrate strength.

Further, the intermediate plate 3 and the outer plates 2 and 2 on both sides are not joined over the front surface, but are joined by spot welding 6 to partially form a gap and obtain a high noise level reduction effect. In addition, it is also possible to partially bond with an organic adhesive.

Example 1 As Example 1, the product outer diameter: φ560 mm, the substrate outer diameter:
φ544mm, substrate thickness: 2.8, center hole diameter: φ26m
m, slit dimensions: width 2 mm x depth 17 mm x keyhole diameter 6 mm, number of slits: 40, segment length:
40 mm, number of segments: 40, segment thickness: 3.
5 mm, segment height: 8.0 mm, and the outer plates 2, 2 on both sides of the substrate are heat-treated (quenched,
Tempering) was used was tempering the H _RC 43 ± 2. As for the intermediate plate 3, the slit forming portion has a thickness of 0.1 mm.
An 18 mm ring-shaped Cu-based material (material C1020: outer diameter φ544 mm, inner diameter φ510 mm) is arranged, and an iron-based material (material SK3: thickness 0.18 mm, (Diameter φ510 mm, inner diameter: φ26 mm) and SK on both sides of the intermediate plate 3
The outer plates 2 and 2 made of a hardened steel plate were arranged and spot-welded to obtain a laminated substrate structure.

As Comparative Example 1, the same structure as that of the above-mentioned Example 1 was used, and only the intermediate plate was made of Cu material C1020.
Similarly, as Comparative Example 2, a substrate using the Fe material SK3 for the intermediate layer was manufactured, and a substrate strength test, a noise level test, and a comparison of manufacturing time were performed. The results are shown below.

Substrate Strength Test A diamond cutting wheel was attached to a cutting machine, a 7 kg load was applied to a position 500 mm from the center, and the displacement at that time was measured with a dial gauge.

As a result of the test, the average value of the displacement amount was 1.69 mm in Example 1, 1.81 mm in Comparative Example 1, and
In the case of Comparative Example 2, it was 1.69 mm.

Noise Level Measurement Test Cut Tokuyama granite at a peripheral speed of 2637 m / min, a cutting depth of 5 mm, and a feed speed of 5200 mm / min. The level was measured.

The results are 89 dB for Example 1, 89 to 90 dB for Comparative Example 1, and 89 to 90 dB for Comparative Example 2.
Decibels.

Comparison of Production Times The time required for processing the intermediate layer of the slit after spot welding and disposing the outer plates on both sides of the intermediate plate was measured.

The results required 10 minutes in Example 1 and Comparative Example 1 in which the slit portion could be easily removed by hand, and 60 minutes in Comparative Example 2 requiring machining.

As is clear from the above results, the substrate structure of Example 1 is superior to Comparative Examples 1 and 2 in all aspects of substrate strength, noise reduction effect, and manufacturing time. In particular, since the intermediate plate uses two types of materials, each having a different natural frequency, such as a copper-based material and an iron-based material, a substrate structure using only one type of material for the intermediate layer as in the comparative example. It is presumed that they have better noise attenuation characteristics.

[0023]

As described above, the substrate structure of the cutting wheel of the present invention has excellent noise attenuation characteristics because the outer peripheral portion of the intermediate plate is made of a copper-based material and the inner peripheral portion is made of an iron-based material. , While being easy to manufacture and excellent in substrate strength.

[Brief description of the drawings]

FIG. 1 is a partial side view of a substrate structure of a cutting wheel according to the present invention.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Outer plate 3 Intermediate plate 3a Outer peripheral part 3b Inner peripheral part 4 Slit 5 Diamond segment 6 Spot welding

Claims (1)

(57) [Scope of request for utility model registration] 1. A cutting whetstone substrate structure in which an intermediate plate (3) is arranged between outer plates (2) and (2) and a slit (4) is formed on the periphery of a laminated substrate (1). In the intermediate plate (3), at least the outer peripheral portion (3a) forming the slit (4) is made of a copper-based material, and the inner peripheral portion (3
b) is a substrate structure of a cutting whetstone formed of an iron-based material.