JP2534842B2 - Substrate separation apparatus and substrate separation method - Google Patents

Substrate separation apparatus and substrate separation method

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Publication number
JP2534842B2
JP2534842B2 JP6322681A JP32268194A JP2534842B2 JP 2534842 B2 JP2534842 B2 JP 2534842B2 JP 6322681 A JP6322681 A JP 6322681A JP 32268194 A JP32268194 A JP 32268194A JP 2534842 B2 JP2534842 B2 JP 2534842B2
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JP
Japan
Prior art keywords
substrate
substrates
overlapping
sheet
control means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6322681A
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Japanese (ja)
Other versions
JPH08175701A (en
Inventor
雅仁 朝野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Toppan Circuit Solutions Toyama Inc
Original Assignee
NEC Toppan Circuit Solutions Toyama Inc
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Application filed by NEC Toppan Circuit Solutions Toyama Inc filed Critical NEC Toppan Circuit Solutions Toyama Inc
Priority to JP6322681A priority Critical patent/JP2534842B2/en
Publication of JPH08175701A publication Critical patent/JPH08175701A/en
Application granted granted Critical
Publication of JP2534842B2 publication Critical patent/JP2534842B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は基板分離装置および基板
分離方法に係わり、特に積層状態の基板を1枚づつ分離
して他の基板加工装置へ運搬、投入する装置およびその
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate separating apparatus and a substrate separating method, and more particularly, to an apparatus and a method for separating stacked substrates one by one and transporting them to another substrate processing apparatus.

【0002】[0002]

【従来の技術】従来、この種の基板分離装置は、波打ち
駆動装置で一部の吸着パットを昇降させ、基板に波打ち
動作させて分離の確実を図ることが行われている。
2. Description of the Related Art Conventionally, in this type of substrate separating apparatus, a part of the adsorption pad is moved up and down by a corrugating driving device to corrugate the substrate to ensure the separation.

【0003】例えば、特開平4−351237号公報に
は、2枚検出装置の2枚重なり状態の検出信号に応答し
てローダの下降、波打ち動作、及び2枚検出動作を繰り
返し行わせる再試行制御手段を設けた基板分離装置にお
いて、2枚検出の繰り返し回数の増加に応じて波打ち動
作回数を増加させる波打ち回数増加手段を設けることに
より、2枚吸着時の分離の効率向上を図る図4に示すよ
うな技術が開示されている。
For example, Japanese Patent Laid-Open No. 4-351237 discloses a retry control for repeatedly performing the descending, waving, and two-sheet detecting operations of a loader in response to a two-sheet overlapping state detection signal. In the substrate separating apparatus provided with the means, by providing the corrugation number increasing means for increasing the number of corrugation operations in accordance with the increase in the number of repetitions of two-plate detection, it is shown in FIG. Such a technique is disclosed.

【0004】すなわち従来技術の図4において、パンダ
グラフ式の昇降機構22に取り付けたローダー21は波
打ち駆動装置23に接続する多数の吸着パッド4を有
し、材料台車19上に積層された多数の基板Wを上から
1枚ずつ多数の吸着パッド4で吸着し持ち上げてレール
8に沿って基板加工機20上に移動して基板加工機20
に装着させる。不所望に一番上の基板に次の基板が密着
して2枚の基板が同時に持ち上げられた際にはこれを2
枚検出装置6で検出する。搬送制御装置24において、
1枚分離制御手段10はシーケンス制御プログラムの一
部であり、波打ち駆動装置23を駆動する波打ち制御手
段12、波打ち所定の繰り返し動作を行わせる再試行制
御手段13、所定の繰り返し動作を行っても分離できな
い場合に報知手段14によりアラームを発生させかつ機
械全体を停止させる2枚吸着エラー検出手段15を設け
てある。さらに、波打ち制御手段12にはトライステッ
プごとの波打ち動作回数を所定の動作回数に増加させる
波打ち回数増加手段25を有し、再試行制御手段13に
はリトライ回数(繰り返し回数)をカウントするリトラ
イ回数カウンタ26を有し、2枚吸着エラー検出手段1
5にはリトライ回数を設定するリトライ回数設定部16
を有している。
That is, in FIG. 4 of the prior art, a loader 21 mounted on a pandagraph type lifting mechanism 22 has a large number of suction pads 4 connected to a wave driving device 23, and a large number of layers stacked on a material carriage 19. The substrate W is picked up one by one from the top by a large number of suction pads 4, and is lifted and moved along the rail 8 onto the substrate processing machine 20 to move the substrate processing machine 20.
To be attached to. If the next substrate sticks undesirably to the top substrate and two substrates are lifted at the same time,
It is detected by the sheet detection device 6. In the transfer control device 24,
The single-sheet separation control means 10 is a part of the sequence control program, and the waving control means 12 that drives the waving drive device 23, the retry control means 13 that causes the waving predetermined repeating operation, and the predetermined repeating operation are performed. There is provided a two-sheet suction error detecting means 15 for generating an alarm by the notifying means 14 and stopping the entire machine when the separation is impossible. Further, the waving control means 12 has waving number increasing means 25 for increasing the number of waving operations for each try step to a predetermined number of operations, and the retry control means 13 has a number of retries for counting the number of retries (the number of repetitions). A counter 26 having a two-sheet suction error detecting means 1
A retry count setting unit 16 that sets the retry count in 5
have.

【0005】[0005]

【発明が解決しようとする課題】この従来の基板分離装
置では、繰り返し回数(リトライ回数)、及びそれぞれ
の波打ちトライにおける波打ち動作回数が増えても各繰
り返し過程における波打ち動作パターンが同じであるた
め、最初の波打ち動作で分離が不可能であった2枚重な
り状態を何度か波打ち動作を繰り返しても分離できない
という問題点がある。すなわち、2枚検出の繰り返し回
数が多い場合は、重なり状態の基板の付着性が強い場合
であるが、その場合でも同じ波打ち動作しか行わないた
め、繰り返し時の分離の成功率が低いものである。
In this conventional substrate separating apparatus, since the number of repetitions (the number of retries) and the number of corrugation operations in each corrugation try increase, the corrugation operation pattern in each repeating process is the same. There is a problem in that the overlapping state of two sheets, which cannot be separated by the first wave operation, cannot be separated even if the wave operation is repeated several times. That is, when the number of repetitions of the two-sheet detection is large, the adhesion of the substrates in the overlapping state is strong, but even in that case, only the same waving operation is performed, so that the success rate of separation at the time of repetition is low. .

【0006】したがって本発明の目的は、このような問
題を解消し、2枚吸着時の分離の効率向上を図ることの
できる基板分離装置およびその分離方法を提供すること
にある。
Therefore, an object of the present invention is to provide a substrate separating apparatus and a separating method thereof which can solve such a problem and improve the efficiency of separation when two sheets are adsorbed.

【0007】[0007]

【課題を解決するための手段】本発明の特徴は、それぞ
れ独立して上昇、下降、中間停止のできる複数のシリン
ダーを平面的に配列し、前記シリンダーの先端に吸着パ
ットを取り付け、前記吸着パットにて吸着した基板を前
記シリンダーの昇降にて波打ち動作させる機構を有する
吸着ヘッドと、前記の吸着された基板が各吸着パット上
昇位置にて2枚重なり状態であることを検出する2枚検
出装置と、この2枚検出装置の検出信号に応答して2枚
重なり状態の基板の重なり態様を自己判断する再試行制
御手段と、前記再試行制御手段にて判断された2枚重な
り状態を分離するために前記重なり態様に応じて最適な
動作パターンを選択し、各シリンダーに出力する波打ち
制御手段とを有する基板分離装置にある。
A feature of the present invention is that a plurality of cylinders that can be independently raised, lowered, and intermediately stopped are two-dimensionally arranged, and a suction pad is attached to the tip of the cylinder. A suction head having a mechanism for waving the suctioned substrates by raising and lowering the cylinder, and a two-sheet detection device for detecting that the above-mentioned suctioned substrates are overlapped at each suction pad rising position. Then, in response to the detection signal of the two-sheet detecting device, the retry control means for self-determining the overlapping state of the two-board overlapping substrates and the two-board overlapping state judged by the retry control means are separated. For this reason, the substrate separating apparatus is provided with a corrugation control means for selecting an optimum operation pattern according to the overlapping mode and outputting it to each cylinder.

【0008】本発明の他の特徴は、前記再試行制御手段
の判断により選択された前記動作パターンにより前記各
シリンダーを動作させて重なり状態の前記基板を分離す
る前記基板装置を用いた基板分離方法にある。
Another feature of the present invention is a substrate separating method using the substrate device, wherein each cylinder is operated according to the operation pattern selected by the judgment of the retry control means to separate the overlapping substrates. It is in.

【0009】[0009]

【実施例】次に、本発明の一実施例をプリント基板の分
離を例にとって図面を用いて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to the drawings by taking separation of a printed circuit board as an example.

【0010】図1は本発明の一実施例を示す構成図であ
る。
FIG. 1 is a block diagram showing an embodiment of the present invention.

【0011】図1において、サーボモーター等により高
精度にピッチ送りが可能なエレベーター1を有する昇降
テーブル2と、昇降テーブル2上に積層状態に段積みさ
れた基板Wを吸着するためそれぞれ独立して上昇・下降
・中間停止が可能な複数のシリンダーの先端に吸着パッ
ト4を有する吸着ヘッド5と、吸着パット4にて吸着し
た基板Wの厚みを測定し確実に分離されたかどうか判定
する2枚検出装置6とを有している。この2枚検出装置
6は基板Wの側面の複数個所の厚みをそれぞれ測定して
2枚の基板が密着している重なり態様を認識するため
に、それぞれの個所に対向して複数個設けられている。
In FIG. 1, an elevating table 2 having an elevator 1 capable of highly accurate pitch feeding by a servomotor and the like, and substrates W stacked in a stacked state on the elevating table 2 are attracted independently. A suction head 5 having suction pads 4 at the tips of a plurality of cylinders that can be raised, lowered, and intermediately stopped, and the thickness of the substrate W sucked by the suction pads 4 is measured to determine whether or not they have been reliably separated. And a device 6. In order to recognize the overlapping mode in which the two substrates are in close contact with each other by measuring the thickness of each of the two sides of the substrate W, the two-sheet detecting device 6 is provided in a plurality facing each other. There is.

【0012】又、2枚検出装置6自体は、渦電流変位セ
ンサ等を使用して挟み込み厚さを検知するものであり従
来から使用されているため図面による説明は省略する。
Further, the two-sheet detecting device 6 itself detects the sandwiching thickness by using an eddy current displacement sensor or the like, and since it has been conventionally used, the explanation with reference to the drawings will be omitted.

【0013】吸着ヘッド5は昇降テーブル2と、吸着さ
れた基板Wを次工程へ搬出するための搬出コンベア7と
の上部を往復するためレール8に沿って走行する。
The suction head 5 travels along a rail 8 for reciprocating above and below the lifting table 2 and a carry-out conveyor 7 for carrying the sucked substrate W to the next step.

【0014】次に制御系を説明する。Next, the control system will be described.

【0015】搬送・昇降制御装置9は吸着ヘッド5の他
に昇降テーブル2や搬出コンベア7等を含めた装置全体
の自動運転を行う手段であり、昇降テーブル2への基板
供給装置(図示省略)や搬出コンベア7後の基板加工装
置(図示省略)とのタイミング信号の送受を互いに行
う。
The transfer / elevation controller 9 is a means for automatically operating the entire apparatus including the lifting table 2 and the carry-out conveyor 7 in addition to the suction head 5, and a substrate supply device (not shown) for the lifting table 2. And a substrate processing device (not shown) after the carry-out conveyor 7 send and receive timing signals to and from each other.

【0016】1枚分離制御手段10は、搬送・昇降制御
装置9に設けたシーケンス制御プログラムの一部であ
り、パソコン等からの基板Wの大きさ・厚み・枚数等の
基板情報11を受け、吸着ヘッド5に配列されたシリン
ダー3を昇降させて昇降テーブル2上の基板Wを1枚吸
着するプログラムからなる。
The 1-sheet separation control means 10 is a part of a sequence control program provided in the transfer / elevation control device 9, and receives board information 11 such as the size, thickness and number of the boards W from a personal computer, It is a program for raising and lowering the cylinders 3 arranged on the suction head 5 to suck one substrate W on the lifting table 2.

【0017】1枚分離制御手段10には、吸着ヘッド5
に配列された各シリンダー3を昇降させて吸着した基板
Wを波打たせる波打ち制御手段12と、2枚検出装置6
の2枚重なり状態の検出信号に応答して、基板Wの吸着
状態を自己判断する再試行制御手段13と、所定の繰り
返し動作を行っても分離できない場合に報知手段14に
アラームを発生させると共に装置全体を停止させる2枚
吸着エラー検出手段15とが設けてある。
The single-sheet separation control means 10 includes a suction head 5
Corrugation control means 12 for corrugating the adsorbed substrate W by raising and lowering each of the cylinders 3 arranged in the above, and the two-sheet detection device 6
In response to the detection signal of the two-sheet overlapping state, the retry control means 13 for self-determining the suction state of the substrates W and the alarm means 14 for generating an alarm when the separation is not possible even after performing a predetermined repeated operation. A two-sheet suction error detection means 15 for stopping the entire apparatus is provided.

【0018】次に、図2、図3を参照して、本実施例の
動作について説明する。
Next, the operation of this embodiment will be described with reference to FIGS.

【0019】図2は、図1の1枚分離制御手段10の全
体動作の概略を示す。まず段積みされた基板Wの最上段
が吸着パット4の吸着位置となるよう昇降テーブル2を
上昇させ(S1)、吸着パット4を下降し、最上段の基
板Wを吸着する(S2)。吸着後、各シリンダー3を波
打ち動作プログラムに沿って上昇・停止を繰り返して基
板Wを波打ちながら上昇させる(S3)。この波打ち動
作により、基板Wの重なり状態の分離性が向上する。波
打ちの後、吸着パット4にて吸着されている基板Wの厚
みを複数の側面個所でそれぞれの2枚検出装置6で検出
する(S4)。2枚検出装置6にて適正状態、すなわち
1枚のみの吸着状態であると判断された場合は(S
5)、後述の波打ち動作パターンクリア(S6)の後の
次工程に進み(S7)吸着ヘッド5を搬出コンベア7上
に移動して、基板Wを次工程へ搬出する。
FIG. 2 shows an outline of the entire operation of the single sheet separation control means 10 of FIG. First, the elevating table 2 is raised so that the uppermost stage of the stacked substrates W is the adsorption position of the adsorption pad 4 (S1), and the adsorption pad 4 is lowered to adsorb the uppermost substrate W (S2). After the suction, the cylinders 3 are repeatedly lifted and stopped in accordance with the waving operation program to lift the substrate W while waving (S3). This corrugation operation improves the separability of the overlapping state of the substrates W. After the corrugation, the thickness of the substrate W adsorbed by the adsorption pad 4 is detected by each of the two-sided detection devices 6 at a plurality of side surface portions (S4). When the two-sheet detecting device 6 determines that the proper state, that is, the suction state of only one sheet (S
5) The process proceeds to the next step after the waving operation pattern clear (S6) described later (S7), the suction head 5 is moved onto the unloading conveyor 7, and the substrate W is unloaded to the next step.

【0020】ステップS5の2枚検出の判断過程で、吸
着パットに吸着されている基板とその後の基板とが密着
(接着)して2枚同時に打ち上げられることにより、吸
着枚数が適正でないと判断された場合は、リトライ回数
の判断ステップ(S10)に進み、リトライ回数設定部
16により設定されたリトライ回数になったか否かを判
断する。
In the determination process for detecting the two substrates in step S5, it is determined that the number of the attracted substrates is not appropriate because the substrates attracted by the suction pad and the subsequent substrate are adhered (adhered) to be simultaneously launched. If so, the process proceeds to a retry count determination step (S10), and it is determined whether the retry count set by the retry count setting unit 16 has been reached.

【0021】最初の時は、次の判断ステップS12に進
み、2枚検出装置6の検出結果が2枚重なり状態である
か、基板無しの吸着ミス状態であるかを判断する。
At the first time, the process proceeds to the next judgment step S12, and it is judged whether the detection result of the two-sheet detecting device 6 is a two-sheet overlapping state or a suction failure state without a substrate.

【0022】2枚重なり状態の場合は再試行制御手段1
3の中の吸着状態自己判断部17に進み、それぞれの2
枚検出装置6の検出結果から基板の重なり態様を自己判
断し(S8)、波打ち制御手段12の中の波打ちパター
ン選択部18において次のリトライ時のシリンダー3の
波打ち動作パターンを選択する(S9)。
Retry control means 1 when two sheets are in an overlapping state
3. Advancing to the adsorption state self-determination unit 17 in 3
The overlapping mode of the substrates is self-determined from the detection result of the sheet detection device 6 (S8), and the corrugation pattern selection unit 18 in the corrugation control means 12 selects the corrugation operation pattern of the cylinder 3 at the next retry (S9). .

【0023】この後、吸着パット4を下降し、新しく選
択された波打ちパターンで分離動作と2枚検出装置6に
よる検出を繰り返す。波打ち動作パターンの変更により
2枚検出が適正と判断されると(S5)、波打ちパター
ン選択部18で選択された動作パターンをクリアした後
(S6)、次工程に進む。
After that, the suction pad 4 is lowered, and the separating operation and the detection by the two-sheet detecting device 6 are repeated with the newly selected wavy pattern. When it is determined that the two-sheet detection is appropriate due to the change of the wavy motion pattern (S5), the motion pattern selected by the wavy pattern selection unit 18 is cleared (S6), and then the process proceeds to the next step.

【0024】この基板分離装置は、このように2枚重な
りの状態に応じて波打ち動作による基板分離の最適パタ
ーンを選択するので、2枚重なり時の基板分離の確実性
が増す。
Since the substrate separating apparatus selects the optimum pattern for separating the substrates by the corrugation operation according to the state of overlapping the two substrates, the reliability of the substrate separation when the two substrates overlap is increased.

【0025】図3は2枚重なり検出時の分離動作パター
ンを例示するものである。
FIG. 3 exemplifies a separating operation pattern when two sheets are overlapped and detected.

【0026】図3(A)は平面形状で3行3列に配列さ
れた吸着パット4(a〜i)により一番上の基板Wで吸
着されている。
In FIG. 3 (A), the uppermost substrate W is adsorbed by the adsorption pads 4 (a to i) arranged in 3 rows and 3 columns in a planar shape.

【0027】ここで図3(A)の図面の左側で基板2枚
の重なりが検出されパットa−d−gのライン下で2枚
の基板が密着重っており、一方、図面の右側では基板2
枚の重なりが検出されないでパットc−f−iのライン
下で2枚の基板を重っていない重なり態様の2枚の基板
Wの分離について、それぞれのシリンダーによる吸着パ
ットの上下動作パターンを説明する。
Here, the overlap of the two substrates is detected on the left side of the drawing of FIG. 3 (A), and the two substrates are in contact and overlap under the line of pads a-d-g, while on the right side of the drawing. Board 2
Regarding the separation of the two substrates W in the overlapping mode in which the two substrates W are not overlapped under the line of the pad c-fi without detecting the overlap of the two sheets, the vertical movement pattern of the suction pad by each cylinder is described. To do.

【0028】図3(B)の「Y方向より」の1−2−3
−4のステップで図示したように、a,b,cどうしは
たがいに同一の高さを維持して上下動し、d,e,fど
うしもたがいに同一の高さを維持して上下動し、g,
h,iどうしもたがいに同一の高さを維持して上下動を
し、これによりY方向から視た基板Wは屈曲運動をしな
いで上下動をする。
1-2-3 of "from the Y direction" in FIG.
As shown in step -4, a, b, and c move vertically while maintaining the same height, and d, e, and f move vertically while maintaining the same height. , G,
The h and i maintain the same height and move up and down, whereby the substrate W viewed from the Y direction moves up and down without bending motion.

【0029】一方、図3(B)の「X方向より」の1−
2−3−4のステップのうちのステップ2−3で図示し
たように、a,d,gは中央のdに対して両側のa,g
は上下の位置を異ならせて上下動し、b,e,hも中央
のeに対して両側のb,hは上下の位置を異ならせて上
下動し、c,f,iも中央のfに対して両側のc,iは
上下の位置を異ならせて上下動し、これによりY方向か
ら視た基板Wは波状に波打つように屈曲運動をしながら
上下動する。
On the other hand, 1-of "from the X direction" in FIG.
As illustrated in step 2-3 of steps 2-3-4, a, d, g are a, g on both sides of the center d.
Moves vertically with different vertical positions, and b, e, h also move vertically with different vertical positions for b and h on both sides with respect to central e, and c, f, i also have central f. On the other hand, c and i on both sides move up and down with different up and down positions, whereby the substrate W viewed from the Y direction moves up and down while making a wavy bending motion.

【0030】このような動作パターンにより分離の成功
率を高めることができる。
With such an operation pattern, the success rate of separation can be increased.

【0031】[0031]

【発明の効果】以上、説明したように本発明によれば、
吸着パットにて吸着した基板が2枚検出装置で2枚重な
り状態であると判断された場合、その重なり態様を自己
判断し、その都度分離に最適なシリンダー動作パターン
を選択して分離動作を行うため、繰り返し過程における
2枚分離の成功率が向上するという効果がある。
As described above, according to the present invention,
When it is determined by the two-sheet detection device that the substrates adsorbed by the adsorption pad are in the overlapping state, the self-determination of the overlapping state is performed, and the cylinder operation pattern optimal for the separation is selected each time to perform the separating operation. Therefore, there is an effect that the success rate of separating two sheets in the repeating process is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例による基板分離装置を示す構
成図である。
FIG. 1 is a configuration diagram showing a substrate separating apparatus according to an embodiment of the present invention.

【図2】図1の基板分離装置の動作を示す流れ図であ
る。
FIG. 2 is a flowchart showing the operation of the substrate separating apparatus of FIG.

【図3】2枚重なり検出時の分離動作のパターン例を示
す図である。
FIG. 3 is a diagram showing an example of a pattern of a separating operation at the time of detecting an overlap of two sheets.

【図4】従来の基板分離装置を示す構成図である。FIG. 4 is a configuration diagram showing a conventional substrate separating apparatus.

【符号の説明】[Explanation of symbols]

1 エレベーター 2 昇降テーブル 3 シリンダー 4 吸着パット 5 吸着ヘッド 6 2枚検出装置 7 搬出コンベア 8 レール 9 搬送・昇降制御装置 10 1枚分離制御手段 11 基板情報 12 波打ち制御手段 13 再試行制御手段 14 報知手段 15 2枚吸着エラー検出手段 16 リトライ回数設定部 17 重なり態様自己判断部 18 波打ちパターン選択部 W 基板 19 材料台車機 20 基板加工機 21 ローダー 22 昇降機構機装置 23 波打ち駆動装置 24 搬送制御装置 25 波打ち回数増加手段 26 リトライ回数カウンタ DESCRIPTION OF SYMBOLS 1 Elevator 2 Lifting table 3 Cylinder 4 Suction pad 5 Suction head 6 Two-sheet detection device 7 Carry-out conveyor 8 Rail 9 Transfer / elevation control device 10 One-sheet separation control means 11 Board information 12 Retry control means 13 Retry control means 14 Notification means 15 Two-sheet suction error detection means 16 Retry number setting section 17 Overlap mode self-determination section 18 Rippling pattern selection section W substrate 19 Material trolley machine 20 Substrate processing machine 21 Loader 22 Elevating mechanism device 23 Rippling drive device 24 Transfer control device 25 Rippling Number increase means 26 Retry number counter

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 それぞれ独立して上昇、下降、中間停止
のできる複数のシリンダーを平面的に配列し、前記シリ
ンダーの先端に吸着パットを取り付け、前記吸着パット
にて吸着した基板を前記シリンダーの昇降にて波打ち動
作させる機構を有する吸着ヘッドと、前記の吸着された
基板が各吸着パット上昇位置にて2枚重なり状態である
ことを検出する2枚検出装置と、この2枚検出装置の検
出信号に応答して2枚重なり状態の基板の重なり態様を
自己判断する再試行制御手段と、前記再試行制御手段に
て判断された2枚重なり状態を分離するために前記重な
り態様に応じて最適な動作パターンを選択し、各シリン
ダーに出力する波打ち制御手段とを有することを特徴と
した基板分離装置。
1. A plurality of cylinders that can be independently raised, lowered, and intermediately stopped are arranged in a plane, a suction pad is attached to the tip of the cylinder, and a substrate suctioned by the suction pad is moved up and down in the cylinder. A suction head having a mechanism for waving, a two-sheet detection device that detects that the above-mentioned suctioned substrates are in a two-sheet overlapping state at each suction pad rising position, and a detection signal of the two-sheet detection device In response to the above, the retry control means for self-determining the overlapping manner of the two substrates in the overlapping state, and the optimum for the overlapping manner for separating the two overlapping states judged by the retry controlling means. A substrate separating apparatus comprising: a waving control unit that selects an operation pattern and outputs the selected operation pattern to each cylinder.
【請求項2】 前記再試行制御手段の判断により選択さ
れた前記動作パターンにより前記各シリンダーを動作さ
せて重なりの状態の前記基板を分離することを特徴とす
る請求項1記載の基板分離装置を用いた基板分離方法。
2. The substrate separating apparatus according to claim 1, wherein each of the cylinders is operated according to the operation pattern selected by the judgment of the retry control means to separate the overlapping substrates. Substrate separation method used.
JP6322681A 1994-12-26 1994-12-26 Substrate separation apparatus and substrate separation method Expired - Fee Related JP2534842B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6322681A JP2534842B2 (en) 1994-12-26 1994-12-26 Substrate separation apparatus and substrate separation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6322681A JP2534842B2 (en) 1994-12-26 1994-12-26 Substrate separation apparatus and substrate separation method

Publications (2)

Publication Number Publication Date
JPH08175701A JPH08175701A (en) 1996-07-09
JP2534842B2 true JP2534842B2 (en) 1996-09-18

Family

ID=18146434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6322681A Expired - Fee Related JP2534842B2 (en) 1994-12-26 1994-12-26 Substrate separation apparatus and substrate separation method

Country Status (1)

Country Link
JP (1) JP2534842B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI112848B (en) * 2002-07-12 2004-01-30 Finn Power Oy Manufacturing cell and transfer and processing equipment for workpieces
JP5296741B2 (en) * 2010-05-24 2013-09-25 トヤマキカイ株式会社 Solar cell transfer device and transfer method thereof
JP7033303B2 (en) * 2018-01-31 2022-03-10 三星ダイヤモンド工業株式会社 Board transfer device
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Also Published As

Publication number Publication date
JPH08175701A (en) 1996-07-09

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