JP2533881Y2 - Pin board structure in circuit board inspection equipment - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention relates to a pin board structure in a circuit board inspection device. More specifically, a mounted circuit board having electronic components mounted on an upper surface is mounted on a lower bottom side. The present invention relates to a pin board structure in a circuit board inspection apparatus capable of correctly performing two types of inspections, a function test and an in-circuit test, at the time of inspection.

[Prior art] Electronic components such as resistors and capacitors are mechanically and mechanically used in a soldering process when mounted on a printed wiring board.
Receives a lot of thermal stress.

For this reason, after completing the mounting process of the electronic component on the printed wiring board, it is necessary to check whether the electronic component has a damaged portion or a defective soldering portion, and the like.
As a device for this, a circuit board inspection device such as an in-circuit tester or a function tester has been developed and is being used.

In recent years, the density of electronic components mounted on a printed wiring board has been increasing, and many circuit boards having electronic components mounted on a top surface of the printed wiring board at a high density have been provided.

FIG. 3 shows an example of a conventional structure of a pin board unit in a circuit board inspection device for a circuit board having an electronic component mounted on an upper surface.

According to the figure, a pin board 1 constituting a pin board unit is formed by implanting a substrate support rod 2, a long rod contact probe 3, and a short rod contact probe 4 on the upper surface thereof. The substrate P to be measured placed on the substrate supporting rod 2 is pressed down by pressing down a pressing rod 5 which is provided vertically on a pressing member which can be moved up and down in the apparatus main body. Down, first of all, the long rod contact probe 3
To contacting the electronic component R _1, thereby making it possible to perform the functional test.

Further, by further lowering the pressing rod 5, while making the electronic component R ₁ contact the long rod contact probe 3,
By bringing the short rod contact probe 4 into contact with the electronic component R ₂ , an in-circuit test can be performed on all the mounted electronic components R ₁ and R ₂ .

[Problem to be Solved by the Invention] By the way, according to the above-described conventional example, the entire structure of the pin board unit can be relatively simplified.
This is preferable in that the overall cost can be kept low.

However, as the density of electronic components mounted on the substrate P to be measured increases, the contact probe used in correspondence with the electronic component has to cope with it by reducing the diameter thereof. In fact, such a tendency to reduce the diameter has been further accelerated.

Such a tendency to reduce the diameter makes the side of the long rod contact probe 3 particularly easy to bend. As a result, the deflection of the distal end portion, which is the contact portion, becomes large, and there is a problem that a contact failure occurs at the time of inspection.

Also, the long rod contact probe 3 is brought into contact with the electronic component R _1, also a possible distance between the measured substrate P and Tan杆contact probe 4 which is secured in performing the function test is small, in some cases In addition, the short rod contact probe 4 also comes into contact with the substrate P to be measured, which adversely affects the measured value during the function test and adversely affects the inspection equipment.

[Means for Solving the Problems] The present invention has been made in view of the above-mentioned problems in the prior art, and its structural feature is that the base material provided on the upper side of the apparatus main body has a feature. A pin board including a bar unit in which a long rod member and a short rod member are implanted, and an elevating plate and a pin board disposed on the lower side of the apparatus body facing the bar unit The rod member unit is configured to allow relative pressure contact with each other, and the long rod member contacts the elevating plate, and the short rod member contacts the substrate to be measured. The lift board side of the pin board unit is formed so as to be capable of being placed, a substrate support rod for horizontally mounting the substrate to be measured so as to be able to settle down, a stopper for controlling the lowering of the substrate to be measured, and a stopper for the stopper. A front contact probe having a protrusion length longer than the protrusion length The pin board side is raised and lowered by a guide rod provided with a spring material capable of holding a total compressive force larger than a total supporting force of the side supporting the substrate to be measured. When it is supported at a fixed position as possible, it is formed by providing a post-stage contact probe having a protruding length shorter than the stopper and allowing the tip end to be exposed from the elevating plate and standing upright, The rod unit and the pin board unit are arranged so that when the substrate to be measured supported by the short rod bar contacts the stopper, the long rod bar also contacts the lifting plate at the same time. is there.

[Operation] Therefore, when inspecting the substrate to be measured, first, the substrate to be measured is placed horizontally on the substrate support rod of the elevating plate in the pin board unit, and then the bar member unit is lowered. Each material is brought into contact with the substrate to be measured and pressed. As a result, the substrate to be measured is pushed down to the side of the elevating plate, comes into contact with the pre-stage contact probe, continues to descend, comes into contact with the stopper, and its descending position is controlled.

Thus, it is possible to execute a predetermined function test on the substrate to be measured in a state where it is in contact with only the first-stage contact probe.

After completing such a function test, or when there is no need for a function test, the bar unit is continuously lowered and the elevating plate is pressed by the long rod bar. The descent starts toward the pin board against the total compressive force of the material, and the substrate to be measured can be brought into contact with the subsequent contact probe provided on the pin board.

As described above, the bar unit is continuously lowered while the latter contact probe is brought into contact with the substrate to be measured and pressurized, so that the lifting plate comes into surface contact with the pin board and stops its lowering.

Therefore, all of the former contact probe and the latter contact probe can be brought into contact with the substrate to be measured, so that the in-circuit test can be performed in a stable state.

Embodiment An embodiment of the present invention will be described below in detail with reference to the drawings.

The present invention relates to a rod unit 11 in which a long rod 12 and a short rod 14 are planted on a base material (not shown) provided on the upper side of an apparatus body (not shown); A lifting board 22 and a pin board, which are arranged on the lower side of the apparatus body facing the unit 11
The pin board unit 21 and the bar unit 11 are arranged so as to enable mutual relative press contact.

FIG. 1 is a front view showing an example of the basic configuration of the present invention, in which relative pressure contact between the bar unit 11 and the pin board unit 21 forcibly lowers the bar unit 11 side. This is realized by pressurizing the pinboard unit 21 side to enable pressing.

According to the drawing, the rod unit 11 is configured such that the long rod 12 is in contact with the elevating plate 22 via the distal end surface 13 and the short rod 14 is tapered at the distal end. It is formed by arranging it so that it can be brought into contact with the substrate to be measured P via the front end face 15, and any one formed using an insulating material such as a resin material can be suitably used. It is preferable that a total of four long rod members 12 are provided so that the four corners of the elevating plate 22 of the pin board unit 21 can be pressed with equal pressing force. It is desirable to arrange at least two or more of the substrates so that the pressing force is not unevenly distributed with respect to the substrate P to be measured.

On the other hand, the lifting plate 22 in the pin board unit 21
Is a substrate support rod 25 formed so that the substrate to be measured P can be lowered horizontally on the upper surface 23 side thereof, a stopper 27 for controlling the lowering of the substrate to be measured P, and the stopper 27 It is formed by firmly fixing and standing each of the first-stage contact probes 28, which have a protruding length longer than the protruding length and are settled down.

In this case, it is preferable that a total of four support rods 23 are provided at predetermined positions of the elevating plate 22 so that the substrate to be measured P can be supported at four corners thereof. It is led out from the lower surface 24.

It is desirable that at least one or more, preferably two or more, stoppers 27 are provided at appropriate positions in order to reliably and stably control the lowered position of the substrate P to be measured. .

Moreover, front contact probe 29 has a length which can perform the function test in contact only on the side of the electronic component R ₁ of the resistor such as shown in the example FIG. 2 (b) distribution It is positioned accurately according to a predetermined specification, and has a lower end 29 protruding downward from the lower surface 24 of the elevating plate 22, and one or more required numbers are planted.

The pin board in the pin board unit 21
On the side 31, a compressive force such as a compression coil spring capable of holding a total compressive force larger than the total supporting force supporting the substrate to be measured P by the substrate support rod 25 and the front contact probe 29 is applied. Each of the guide rods 41 in which a spring material 46 is interposed in the spring material interposition section 43 is formed by supporting the elevating plate 22 so as to be able to move up and down.

Moreover, when the elevating plate 22 is supported at its fixed position on the pin board 31, it has a shorter protruding length than the stopper 27, so that the tip 35 protrudes from the elevating plate 22 and appears. One or more required rear contact probes 34 erected as possible are positioned and arranged accurately according to predetermined specifications. The pin board 31 has a lift plate 22
When the lower part comes closer, the insertion holes 39, 40 for introducing the lower end part 26 of the substrate support rod 25 and the lower end part 29 of the preceding contact probe 28 so as to avoid contact therewith are located at the corresponding positions. Has been drilled.

Further, the bar unit 11 and the pin board unit 21 are configured such that the substrate to be measured P supported on the short rod
When abutting on the 27, the long rod member 12 is also arranged in a positional relationship of abutting on the side of the elevating plate 22 at the same time. This will be described in more detail with reference to FIG. 1. The substrate to be measured P is placed on the substrate support rod 25, and the distal end surface 15 of the short rod member 14 starts contacting the upper surface of the substrate to be measured P. In the state, the substrate to be measured P
The distance from the lower surface of the to the tip surface of the stopper 27 is a,
Assuming that the distance from the tip surface 13 of the long rod member 12 to the highest surface of the elevating plate 22, that is, the upper surface of the bolt head 42 of the guide rod 41 in the illustrated example is b, a positional relationship of a = b can be obtained. The bar unit 11 and the pin board unit 21 are arranged so as to be able to be used.

The relative pressure contact structure between the bar unit 11 and the pin board unit 21 in FIG. 1 showing an embodiment of the present invention is such that the pin board unit 21 side is fixed, Although the case where this is realized by lowering the side is described as an example, it may be realized by fixing the side of the bar unit 11 and raising the side of the pin board unit 21.

Further, it is preferable to mount a required bush material 38 in advance on the inner peripheral surface of the through hole 37 on the side of the pin board 31 in order to smoothly slide the guide rod 41.

Regarding the support structure of the lift plate 22 and the pin board 31 by the guide rod 41 with the spring material 46 interposed, the guide rod 41 is formed using a bolt material, and the bolt head 42 is attached to the upper surface 23 of the lift plate 22. Hook and let the through hole 30 of the elevating plate 22
44 is projected to the lower surface 33 side through the through hole 37 of the pin board 31, and it is preferable to perform this by screwing a nut material 45 to the projected lower end portion 44, but the other functions are equivalent. If it is a thing, the thing of a structure can be employ | adopted suitably. Also, if the through hole 37 of the pin board 31 is formed on the bottom surface side of the concave portion 36 formed by opening the upper surface 32 side, the spring material 46 is stably arranged via the concave portion 36. be able to.

Since this device is configured as described above,
When inspecting the substrate to be measured P, first, the substrate to be measured P is accurately and horizontally placed on the substrate support rod 25 of the elevating plate 22 in the pin board unit 21 by taking a predetermined positional relationship. Then, the side of the bar unit 11 is lowered. As the bar unit 11 descends, first, each of the short bar members 14 in the bar unit 11 is placed via the board supporting rod 25 disposed on the elevating plate 22 on the pinboard unit 21 side. The substrate comes into contact with the substrate to be measured P, which is pressed.

As a result, the substrate to be measured P is pushed down to the side of the elevating plate 22, comes into contact with the front contact probe 28 on the elevating plate 22, continues to descend, and finally, as shown in FIG. As a result of contacting the stopper 27 and temporarily stopping, the descending position is controlled.

Thus, the substrate to be measured P is the former contact probe.
It is possible to maintain the state of contact with only 28, whereby a predetermined function test can be performed.

After the completion of such a function test, or when there is no need for a function test, the bar unit 11 is continuously lowered, and in particular, by pressing the elevating plate 22 with the long rod bar 12, the pin The elevating plate 22 on the board unit 21 side moves the spring material toward the pin board 31 side.
The descent is started against the compressive force of 46, and the substrate to be measured P comes into contact with the subsequent contact probe 34 provided on the pin board 31.

As described above, the post-stage contact probe 34 is
The bar member unit 11 is continuously lowered and pressurized in the state where the contact is made, so that the elevating plate 22 comes into surface contact with the upper surface 32 of the pin board 31 as shown in FIG. The descent is stopped at that time.

In such a state, all of the former contact probe 28 and the latter contact probe 34 can be brought into contact with the substrate P to be measured, and therefore, the in-circuit test can be stably performed.

[Effects of the Invention] As described above, according to the invention, it is possible to share a substrate having a different measurement content on a substrate to be measured or a substrate to be measured separately. Since the condition is also accurate and reliable, it is possible to use short contact probes, and it is possible to secure a highly accurate and stable contact state even if the diameter of the probe is small. it can. Also, by changing the height of the spring material interposed on the guide rod, the distance between the lifting plate and the pin board can be set arbitrarily, so that the specifications of the electronic components mounted on the board to be measured can be adjusted. Accordingly, the former contact probe and the latter contact probe can be separated from each other, so that the measurement value at the time of measurement using only the former contact probe can be prevented from being adversely affected, and the adverse effect on the inspection equipment can be eliminated. High-precision inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing an embodiment of the present invention, and FIG.
FIGS. 2A and 2B show the inspection state performed on the substrate to be measured according to the present invention.
FIG. 3A is an explanatory diagram showing a function test, and FIG. 3B is an explanatory diagram showing an in-circuit test.
It is an explanatory view showing a conventional example. 11 ... Bar material unit, 12 ... Long bar material, 13 ...
14 ... Short rod material, 15 ... End face, 21 ... Pin board unit, 22 ... Elevating plate, 23 ... Top surface, 24 ... Bottom surface, 25 ...
Board support, 26 …… Basic end, 27 …… Stopper, 28 ……
Front contact probe, 29: Base end, 30: Insertion hole, 31: Pin board, 32: Upper surface, 33: Lower surface, 34:
… Rear contact probe, 35… tip, 36… recess, 37… through hole, 38… bush, 39, 40… insertion hole, 4
1… Guide rod, 42… Bolt head, 43… Spring material interposition part, 4
4 Projection, 45 Nut, 46 Spring, 47
Hole, P ...... measured substrate, R _1, R ₂ ...... electronic components.

Claims (1)

(57) [Scope of request for utility model registration] A bar unit in which a long bar and a short bar are planted on a base material provided on an upper side of an apparatus main body, and a bar body of the apparatus main body facing the bar unit. An elevating plate disposed on a lower side and a pin board unit having a pin board are configured to enable mutual relative pressure contact with each other, and the bar unit is configured such that a long rod member is formed by the elevating plate. The short rod material is formed so as to be capable of contacting with the substrate to be measured, respectively, and the side of the elevating plate in the pin board unit is for a substrate on which the substrate to be measured is horizontally mounted so as to be able to settle down. A support rod, a stopper for controlling the lowering of the substrate to be measured, and a front contact probe having a protruding length longer than the protruding length of the stopper are formed by being erected respectively, and the pin pod side supports the substrate to be measured. The total compression force greater than the total bearing capacity of the When the lift plate is supported at a fixed position so as to be able to move up and down by a guide rod having a spring material interposed therebetween, it has a protruding length shorter than that of the stopper and exposes the tip of the lift plate from the lift plate. The rod unit and the pin board unit are formed by providing a post-stage contact probe that is set up as possible, and when the substrate to be measured supported by the short rod is in contact with the stopper, the long rod is also A pin board structure in a circuit board inspection device, wherein the pin board structure is arranged under a positional relationship at the same time in contact with a lifting plate.