JP2526355B2 - Radiation fin manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a radiation fin used by attaching it to various electronic devices such as an LSI package.

[0002]

2. Description of the Related Art For example, there is a technique described in Japanese Patent Laid-Open No. 4-199736.

In this technique, the constituent units of the radiation fin are
A single pin is erected on a flat plate-like joint, and the joints of the constituent units are joined together to obtain a heat radiation fin.

[0004]

In the above-mentioned conventional example, since the constituent unit body is composed of the joint portion and the single pin, the work of joining the constituent unit bodies to obtain the radiation fins is complicated, and in particular,
In order to obtain a small radiating fin, the structural unit is correspondingly small, and the handling becomes even more complicated, and depending on the size of the radiating fin, it may not be possible to manufacture by the method of the conventional example. Further, in the conventional example, since an electronic device is attached and used for each radiating fin, a radiating fin must be prepared for each electronic device, and the overall size of the device becomes large.

[0005]

Means for solving the problems: a step of stamping a metal plate to form a structural unit body composed of a connecting piece and a plurality of rods;
Simultaneously or at the same time as the step of forming the protrusion and the engaging portion for the protrusion that engage each other with the one provided in the connecting piece of the other structural unit body in the connecting piece, the fine rod portion is compressed and connected. The thickness is made thinner than the plate thickness of the piece, and thereafter, the protrusion and the engaging portion for the protrusion provided on the connecting piece are respectively formed on the engaging portion for the protrusion and the protruding portion formed on the connecting piece of the other adjacent constituent unit body. An appropriate number of constituent unit bodies are engaged with each other and connected to each other, and the connected constituent unit bodies are fixed to each other by appropriate means.

[0006]

EXAMPLES The present invention is, in general, formed by pressing a material plate made of aluminum by a press to form a structural unit body, subjecting the structural unit body to secondary processing, and connecting a suitable number of them to each other to form a radiation fin. I will get it.

[0007]

[First Embodiment] A first embodiment is shown in FIGS. 1 to 4, and as shown in FIG. 1, a plurality of structural units 1 ... And As shown in FIG. 2, the structural unit body 1 obtained in this primary step is constituted by connecting a connecting piece 2 and an appropriate number of fine rods 3, 3 ... At one end along the longitudinal direction of the connecting piece 2. The connecting piece 2 is provided with a protrusion 4 and a protruding portion engaging portion 5 that engage with each other provided in the connecting piece of another unit that is adjacently connected to the connecting piece 2. The protrusion engaging portion 5 and the protrusion engaging portion 5 are performed at the same time as the above-described die-cutting operation, but this may be performed at a different time.

Then, as shown in FIG. 3, the thin rod 3 part is compressed by a press to make the plate thickness of the thin rod 3 part thinner than the plate thickness of the connecting piece 2, and then the protrusion 4 and the protrusion. Are engaged with each other to connect the plurality of structural unit bodies 1, 1 to each other, and the connection state is fixed by an appropriate means to obtain the pin-shaped heat radiation fin A. The base of the heat radiation fin A The electronic device B is attached to one surface of 7 with an LSI package or the like, and is used as a heat radiator for heat generated from the electronic device B.

In the above process, the structural unit 1
In the die-cutting step for obtaining, for example, a band-shaped body as shown in FIG. 9 is formed, cut into an appropriate length, and then
You may make it pass through the process of forming the protrusion 4 and the engaging part 5 for protrusions.

In order to fix the connected state of the structural unit body, there is a welding means or a means for appropriately forming a through hole in the connecting piece and allowing a connecting rod as a separate body to pass through the through hole.

A means for obtaining a radiation fin A by interposing a spacer piece (which is a constituent material of the base 7 together with the connecting piece 2) having substantially the same shape as the connecting piece 2 of the structural unit body 1 between the structural unit bodies 1, 1. There is also.

Interposing a spacer piece or forming a so-called stepped portion between the connecting piece 2 and the narrow rod 3 improves the flow of air between the structural units 1 and 1 to improve the heat radiation effect. In order to increase the height, in this sense, a means of forming a step on the material plate 10 in advance and punching it out is also conceivable.

Needless to say, the material of the structural unit body 1 is not necessarily limited to aluminum.

[0014]

Second Embodiment FIGS. 5 to 8 show a third embodiment. The second embodiment is the same as the first embodiment except that the connecting piece 2 is used.
, Which constitute a structural unit body 1 by arranging fine rods 3, 3 ... at one end along the longitudinal direction of the structure, a pair of connecting pieces 2, 2 is provided, and between the connecting pieces 2, 2. The fine rods 3, 3 ... Are arranged and the rest is formed in the same manner as in the first embodiment.

As shown in FIG. 6, the heat radiation fin A obtained by the second embodiment is intended to have a heat radiation effect by selectively attaching an electronic device B to the pair of substrates 7, 7 or respectively. .

As shown by the phantom line in FIG. 8, if a pair of electronic devices B and B are attached to the radiation fin A for use, the entire apparatus including the electronic devices B and B can be downsized and the pair of electronic devices B and B can be used. Can function as a connecting material for electronic devices.

[0017]

According to the present invention, generally, a metal plate is stamped out to form a structural unit body composed of a connecting piece and a large number of rods, and the structural unit body is polymerized and connected at the connecting piece portion. Therefore, as in the prior art example, a small pin-shaped heat radiation fin can be easily obtained by avoiding the complexity of handling each constituent unit, and the thin rod of the constituent unit is integrated with the connecting piece. Therefore, it is possible to easily obtain a product in which heat conduction between the rods of the structural unit body is efficiently performed.

In particular, since the step includes a step of making the fine rod portion thinner than the plate thickness of the connecting piece, a gap is inevitably formed between the fine rod portions when the structural unit bodies are connected to form a product. Since air is satisfactorily circulated through this gap, a product having an excellent heat dissipation effect can be obtained.

In the process, each constituent unit is
Since it is so-called temporary connection due to the engagement relationship of the protrusion engaging portions, it is possible to provide a manufacturing method suitable for mechanical mass production.

[Brief description of drawings]

FIG. 1 is a front view showing the relationship between a material plate and a structural unit.

FIG. 2 is a perspective view of a structural unit body.

FIG. 3 is a perspective view of a structural unit body after secondary processing.

FIG. 4 is a sectional view of the product.

FIG. 5 is a front view showing the relationship between the material plate and the structural unit body according to the second embodiment.

FIG. 6 is a perspective view of the constituent unit of the same.

FIG. 7 is a structural unit body also after secondary processing.

FIG. 8 is a perspective view of the same product.

FIG. 9 is a front view of the strip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Structural unit 2 Coupling piece 3 Fine rod 4 Projector 5 Engaging part for projector 7 Base A Heat dissipation fin B Electronic device

Claims (1)

(57) [Claims] 1. A step of stamping a metal plate to form a structural unit body composed of a connecting piece and a plurality of rods, and the step of engaging the connecting piece with another connecting unit of another structural unit body. Simultaneously or at the same time as the step of forming the protrusion and the engaging portion for the protrusion, the fine rod is compressed to make it thinner than the plate thickness of the connecting piece, and then the protrusion and the protrusion provided on the connecting piece. Each of the constituent units connected by connecting the appropriate number of constituent unit bodies to each other by engaging the projecting engaging section formed on the connecting piece of the adjacent constituent unit body with the child engaging section A method for manufacturing a heat radiation fin, which comprises fixing the heat radiation fins to the body by appropriate means.