JP2524646B2 - Floor panel - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a floor panel and a floor panel device, and in a computer room, office automation equipment room, etc., wiring such as a power line, a telephone line, and a signal line to each equipment. The present invention relates to a floor panel and a floor panel device which are easy to handle and can flexibly cope with wiring changes of equipment, and reduce the weight of the panel.

[Prior Art] In a room in which various devices are installed, a floor panel is arranged on the floor to accommodate wiring such as power lines, telephone lines, and signal lines for these devices. .

Conventionally, pillars, blocks, and other spacing members are arranged on the floor surface, and a floor panel is arranged thereon to form a double floor, and a power line, a telephone line, a space between the floor and the floor panel, Wiring such as signal lines is stretched around, branched at a required position, and pulled out onto the floor to connect to equipment.
(See, for example, JP-A-60-112954). Therefore, since the electric wires are randomly arranged in the space under the floor panel, there is a risk of causing a failure due to an induced voltage or a risk of electric power leakage.

Further, since the conventional floor panel is molded and processed by filling a heavy material such as cement and mortar, the floor panel itself is heavy, lacks mass productivity, and has poor workability in laying. If the amount of wiring to be stretched (thickness, number of wires) is large, increase the height of the floor panel to increase the space, or arrange the floor panels at a predetermined interval and It is necessary to form a wiring groove between each other to form a wide wiring groove. In this case, since the strength of the floor panel and the cover member that covers the wiring groove is increased, the weight of the floor panel device is further increased, and the workability is increased. However, there was a drawback that it was further hindered. Further, there is a problem that if there is a variation in the level of the floor surface due to the finishing of the floor surface, a means for correcting this is required.

[Problems to be Solved by the Invention] The present invention solves the above-mentioned drawbacks of the prior art, reduces the weight of the floor panel, provides a large wiring capacity, and provides a floor panel and a floor panel device having excellent workability. The purpose is to

[Means for Solving the Problems] According to the present invention, a floor panel includes a substantially flat polygonal upper surface portion and a plurality of legs that support the upper surface portion, and a plurality of floors are laid on the floor surface. A panel, which is an outer cover member in which an upper surface portion and a leg portion are integrally molded so as to form a hollow portion by blow molding, and a cavity is formed between the leg portions below a rear surface portion. And a filling hole for filling the hollow part of the outer cover member with the curable filler, and the curable filler to be filled in the hollow part, in the hollow part of the outer cover member formed by blow molding. The curable filler is filled from the filling hole.

Further, according to the present invention, the floor panel is formed by blow molding to form a bendable connecting portion in which the side surface portions of the plurality of casing members are connected to each other, and the flexibility of the connecting portion makes the floor surface uneven. To follow.

Further, according to the present invention, the floor panel, a plurality of jacket members formed by blow molding, a wiring path formed by being laid at a predetermined interval, a cover plate that covers an upper surface opening of the wiring path, The outer surface of the outer cover member formed by blow molding has a stepped portion formed to have a thickness substantially equal to the thickness of the cover plate, and the cover plate is laid so as to cover the upper surface opening, and the wiring is wired. In addition, the height of the laid cover plate is made substantially flush with the upper surface of the outer cover member due to the step formed by blow molding.

Moreover, according to the present invention, the floor panel is formed with a through hole for introducing a cable in the connecting portion formed by blow molding.

[Operation] According to the present invention, since the floor panel is provided with the cavity, the weight can be reduced. In addition to the wiring groove in the space between the floor panels and the wiring, it is possible to extend the wiring around the cavity, so that the wiring space can be increased. Further, since the outer cover of the floor panel is formed by integral hollow molding and filled with the filler, the manufacturing is easy. Moreover, the strength of the panel can be increased by filling the hollow portion of the outer cover member formed by blow molding with the curable filler. Furthermore, by applying blow molding, it is possible to create a mold for integral molding as compared with injection molding and the like.

[Embodiment] An embodiment of the floor panel and floor panel device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the floor panel according to the present invention, and FIG. 2 shows a sectional view taken along the line aa.

The floor panel 100 includes an outer cover member 10 having an upper surface portion 12, side surface portions 20, legs 22, and a back surface portion 26, and a hollow portion 10a of the outer cover member 10.
It is composed of a filler 30 filled in. The upper surface portion 12 is formed in a square shape in this embodiment, and a step portion 12a is formed on the peripheral edge thereof. The step portion 12a is shown in FIGS.
As shown, the side surface 20 of the adjacent floor panel 100
It is provided for mounting the cover plates 40 and 42, which will be described later, in a recessed manner in the opening of the wiring groove 54 formed between them. The height of the step portion 12a is formed to be the same as the thickness of the cover plates 40 and 42.

The leg portions 22 are formed at four places by the outer cover member 10, and the leg portions 22
A cavity 24 is formed between them. The cavity portion 24 may be formed so as to be higher from the end portion toward the central portion as shown in the drawing. Due to the cavity 24, this cavity
Wiring is possible in a two-dimensional direction that penetrates through 24 and is parallel to the upper surface portion 12. In addition, the floor panel 100 adjacent by the side surface portion 20
A groove 54 for wiring is formed by the space formed between the groove and the groove.

The outer cover member 10 is formed of a synthetic resin material by integral hollow molding, and a hollow portion 10a is formed. The jacket member 10 is provided with a hole (not shown) having a diameter of about 5 to 20 mm on the bottom surface of the leg portion 22, for example, and the filler 30 is filled from this hole.

As an example of the integral hollow molding means for the jacket member 10, blow molding may be mentioned. In blow molding, a parison or two sheets, which are cylindrical bodies of synthetic resin that have been melted by heating and softened, are sandwiched between molds that have been processed into a prescribed shape, and compressed air is blown into the parison or sheet to inflate it. It is a molding means.

The material of the synthetic resin material for forming the outer cover member 10 of the floor panel 100 is vinyl chloride, polyethylene,
A synthetic resin sheet such as polypropylene, polycarbonate, or polyethylene terephthalate is used. As the material of the filler 30 filled in the hollow portion 10a of the jacket member 10, low foaming (dense density) vinyl chloride, curable synthetic resin such as polystyrene, mortar, cement, sawdust in cement, air bubbles, perlite, etc. Lightweight concrete mixed with, glass fiber, carbonized fiber reinforced cement, etc. are used.

As shown in FIGS. 3 and 4, the floor panel 100 is arranged on the floor surface 52 at a predetermined interval, and the wiring groove 54 is formed by the space formed by the side surface portions 20 of the adjacent floor panels 100. To do. As shown in these drawings, the cover plates 40 are placed on the wiring grooves 54 of the adjacent floor panels 100, and the square cover plates 42 are arranged at the intersecting positions of the floor panels 100.

The cover plates 40 and 42 are fitted into the stepped portion 12a formed on the peripheral edge of the upper surface portion 12 of the floor panel 100 in a recessed manner and supported. As a result, the upper surfaces of the cover plates 40 and 42 are flush with the upper surface portion 12. A notch 40a is formed at the edge of the cover plate 40 in the longitudinal direction. Also, cover plate 4
A notch 42a is also formed in the center of the four sides of No. 2. An insertion hole 42a from the upper surface of the floor panel 100 into the wiring groove 54 is formed by the butting arrangement of the cover plates 40 with each other and the cover plate 40 and the square cover plate 42, and the insertion hole 42a can be used as a cable lead-out hole. Also, the wiring condition in the wiring groove 54 can be visually confirmed from the upper surface of the floor panel 100 without removing the cover plates 40 and 42.

Instead of the cover plates 40 and 42, a substantially cross-shaped cover plate 48 as shown in FIG. 7 may be used. Cover plate 40 and
As the material of 42, a load-bearing plate material or a molding material such as a steel material, an aluminum plate, a hard synthetic resin plate, etc. may be used after being coated with a synthetic resin material as a cushioning material or subjected to electrostatic value hair processing, etc. Good. Alternatively, a hook-and-loop fastener may be used on the contact surface between the floor panel 100 and the cover plates 40 and 42.

As a means for positioning the floor panel 100 on the floor surface 52, a member such as a plastic plate or a steel plate provided with holes into which the legs 22 of the floor panel 100 are fitted is adhered or screwed to a predetermined position on the floor surface 52. Alternatively, the legs 22 of the floor panel 100 may be fitted in the holes of the member and arranged.

By arranging the floor panel 100 and the cover plates 40 and 42 in this manner, the floor panel 100 and the cover plates 4 and
Since the surfaces of 0 and 42 are at the same level, there is no inconvenience compared to a normal floor surface, and it is easy to lay a finishing material 56 such as a carpet tile on it as required as shown in FIG. Is.

According to the floor panel 100 as described above, since the cavity 24 is provided, the weight of the floor panel 100 can be reduced, and the arrangement work is easy. In addition to the wiring groove 54 in the space between the floor panel 100 and the floor panel 100, the cavity 24
Moreover, since the wiring can be stretched around, the wiring space can be increased. Then, by classifying the wiring in the increased wiring space according to the purpose and type, the failure due to the induced voltage and the leakage of the power are prevented.

Further, since the filling material 30 is filled in the hollow portion 10a formed by the outer covering member 10, since the periphery is covered with the outer covering member 10, the outer covering member 10 serves as a reinforcing material, and shocks. It is possible to provide the floor panel 100 that is more durable and has a higher strength by preventing the filler 30 from collapsing due to such reasons.

Furthermore, since the step portion 12a is formed on the floor panel 100, the upper surface of the floor panel 100 and the cover plates 40 and 4 are
The upper surface of 2 can be configured flat.

It should be noted that a foamed sheet for base, a rubber sheet, etc. are provided on the leg portions 22 of the floor panel 100 that come into contact with the floor of the outer cover member 10 or on the entire floor surface on which the floor panel 100 is laid, so that the floor surface becomes flat. It may be an absorber that absorbs (unevenness).

5 to 8 show another embodiment of the floor panel and floor panel device according to the present invention. In these embodiments, the same functional parts are designated by the same reference numerals as in the above-mentioned embodiments.

FIG. 5 shows another embodiment of the floor panel according to the present invention, and FIG. 6 shows a cross section taken along the line bb.

In the embodiment shown in FIGS. 5 to 8, the floor panel 100 has a triangular upper surface. Seventh
As shown in the figure, a combination of two triangular floor panels 100 is operated in the same manner as the floor panel 100 shown in FIG. 1, and the cover plate 48 shown in FIG. 7 is arranged between these floor panels. It is a thing. The floor panel 100 having such a shape is used as the floor panel 1 as shown in FIG.
When combined with 00, various polygonal floor panel devices can be constructed.

In the embodiment shown in FIGS. 5 and 6, one side of the triangular upper surface 12 is aligned with the side surface 20. Therefore, the step portion 12 is formed only on the other two sides of the upper surface portion 12. This floor panel has three legs
22 and a cavity 24 is formed between these legs 22. Such floor panel 100 is shown in FIGS.
As shown in the figure, the long side portions without the step portion 12a are butted against each other and combined as a pair, and the step portion is provided around the long side portions.
It can be used as a large area floor panel provided with 12a. The two floor panels 100 combined as shown in FIG. 7 and FIG. 8 have a step portion 12a formed on the periphery of the upper surface portion 12 thereof, and the step portion 12a fits a substantially cross-shaped cover plate 48. It is arranged together. The cover plate 48 is provided with notches 48a at the tips of its four crosses, and when the cover plates 48 are in contact with each other, the wiring groove 54 is formed as in the above embodiment.
An insertion hole is formed inside.

9 and 10 show another embodiment of the floor panel according to the present invention. As shown in these drawings, the floor panel 100 of this embodiment has four panel units 102 substantially similar to the floor panel 100 of FIG. It is configured by connecting four pieces to each other. That is, the outer cover member 10 is integrally hollow-molded so that the four panel units 102 are connected together. Fillers 30 are filled in the hollow portions of the four panel units 102, respectively. The connecting portion 28 is formed thin and bendable, and can be separated by a knife or the like. The connecting portion 28 may be provided at an appropriate place such as the upper end or the lower end of the side surface portion 20 of the outer cover member 10 to connect the panel unit 102, and the same effect can be obtained.

In this embodiment, the floor panel 100 has four square upper surface portions 12 and the four upper surface portions 12 are arranged in a square shape. The upper surface portion 12 is provided with the step portion 12a only on the outer side portion when four pieces are arranged. Further, an insertion hole 28a for leading out the cable is provided at the center of the connecting portion 28.

Each of the four panel units 102 is configured with the leg portion 22 and the back surface portion 26 so as to form four leg portions 22 and a cavity portion 24 surrounded by the leg portions 22.

In this embodiment, the cavities 24 formed in the lower portions of the four panel units 102 allow wiring in a two-dimensional direction that penetrates the cavities 24 and is parallel to the main surface of the upper surface portion 12. Further, as shown in FIG. 11, the wiring groove 54 is formed by the space formed between the side surface portion 20 on the outer side portion of the floor panel 100 and the side surface portion 20 of the adjacent floor panel 100.

As shown in FIGS. 11 and 12, this floor panel 100 is arranged on the floor surface 52 at a predetermined interval, and the wiring groove 54 is formed by the space formed by the side wall portions 26 of the adjacent floor panels 100. As shown in the figure, the cover plates 40 and 42 are placed on the wiring grooves 54 of the adjacent floor panels 100, and the cover plates 40 and 42 are disposed on the upper surface portion 12 of the floor panel 100.
It is supported by the step portion 12a formed on the. The upper surfaces of the cover plates 40 and 42 are flush with the upper surface of the upper surface portion 12.

As shown in FIGS. 11 and 12, floor panel 10
0, by arranging the cover plates 40 and 42, the surface of the floor panel 100 and the cover plates 40 and 42 are at the same level, so there is no inconvenience compared to a normal flat floor surface, and tiles can be used as needed. It is easy to lay a finishing material (not shown) such as carpet on it.

Even in the floor panel 100 as described above, the cavity 24
Since the floor panel 100 is provided, the weight of the floor panel 100 can be reduced, and the arrangement work is easy. In addition to the wiring groove 54 in the space between the floor panel 100 and the floor panel 100, the cavity 2
Wiring can be extended around 4 as well, so the wiring space can be increased.

Further, since the four panel units are connected by the connecting portion 28, the area of one floor panel 100 can be increased, and the floor panel 100 can be easily arranged.

Further, since the connecting portion 28 is formed thin as shown in the drawing, it can be easily bent, and when the floor panel 100 is placed on the floor surface, the connecting portion follows the unevenness (unevenness) of the floor surface, and the connecting portion 28
It is easy to bend it with and bend it to the floor. Also,
If the connecting portion 28 can be easily separated with a knife or the like, it is easy to adjust the dimensions such as the wall.

Further, since the filler 30 is covered with the outer cover member 10,
The outer cover member 10 serves as a reinforcing material, and prevents the filler 30 from collapsing due to impact or the like.

Even in this case, the leg portion 22 that comes into contact with the floor of the floor panel 100, or the entire floor surface 52 on which the floor panel 100 is laid is provided with a foam sheet for a base, a rubber sheet, or the like,
It may be an absorber that absorbs unevenness (unevenness) on the floor.

Since the cover plates 40 and 42 described above are fitted in a drop-in method, by removing the cover plates 40 and 42 at predetermined positions when wiring the power line, telephone / information line in the wiring groove 54,
Can be easily wired. The same applies to the cable wiring change. In addition to the wiring groove 54, the floor panel 100
Since wiring can be made in the cavity 24 of the device itself, it is possible to install a branching device.

FIG. 13 shows still another embodiment of the floor panel according to the present invention, and FIG. 14 shows a cross section taken along the line d--d of FIG.

In this embodiment, the floor panel 100 is formed by connecting two panel units 102 each having an isosceles right triangle. The floor panel 100 is formed into a right-angled isosceles triangle as a whole, and a step portion 12 is formed only on its long side. In the center part that bisects the right angle of the floor panel 100,
The connecting portion 28 is formed toward the long side.

Also in this floor panel 100, the outer covering member 10 and the connecting portion 28 are formed by integral hollow molding, and the hollow portion 10a formed by the outer covering member 10 is filled with the filler 30.

FIG. 15 shows the floor panel 100 of FIGS. 13 and 14.
FIG. 16 is a plan view in which is placed on the floor surface 52, and FIG. 16 is a side view thereof. When four floor panels 100 shown in FIG. 13 are made into a group and their long sides are abutted against each other as shown in FIG. 15, a step portion 12a is arranged on the entire outer circumference of such a pair of floor panels 100. It Between the blocks composed of such two floor panels 100, a substantially cross-shaped cover plate 40 is arranged as in the embodiment of FIG.

Also in this embodiment, the cavity 2 is provided in each panel unit 102.
Since 4 is provided, the floor panel 100 is lightened, and the efficiency of handling and workability is improved.

Further, since the connecting portion 28 of each panel unit 102 is easily bent, when placed on the floor surface, the floor panel 100 follows the unevenness (unevenness) of the floor surface, bends at the connecting portion 28, and is attached to the floor. To fit in.

Further, since the two panel units 102 are connected by the connecting portion 28 to form a triangular block, floor panel devices of various shapes can be formed.

It should be noted that the floor panel according to the present invention is not limited to the shape shown in the above embodiment, and may have any polygonal shape.

[Effects of the Invention] As described above, the floor panel itself is heavy in the conventional floor panel that uses a heavy filler such as cement and mortar, but according to the present invention, the cavity portion is provided in each floor panel. When the cavity is filled with a lightweight filling material, the weight of the floor panel itself is reduced.
Furthermore, because of its light weight, the efficiency of handling such as carrying in and out of floor panels, workability, etc. is also improved.

Further, when the present invention is compared with the production of a floor material of injection molding which is a conventional technique, a common mold is used in the production of a floor material of blow molding, and various different fillers are properly used in the common mold. Since it is possible to manufacture flooring materials with different characteristics, it is excellent in mass productivity.

Further, since the filler is covered with the outer covering member, the outer covering member serves as a reinforcing material and prevents the filler from collapsing due to an impact or the like, and provides a stronger and stronger floor panel. You can

Further, since the floor panel is formed with a stepped portion, when a plurality of floor panels are arranged on the floor surface at predetermined intervals and wiring grooves are formed between the panels, the upper openings of the wiring grooves are By covering with a cover plate having the same thickness as the height of the stepped portion, the upper surface of the floor panel and the upper surface of the cover plate can be made flat.

In addition to the above wiring groove, by using the cavity of each floor panel itself as a wiring space, the wiring capacity is further increased as compared with the conventional floor panel using only the wiring groove between them. Can be made.

Also, in the case of a floor panel in which panel units are connected, the connecting portion is easy to bend, so when placed on the floor,
The floor panel follows the unevenness (unevenness) of the floor surface, bends at its joint, and fits on the floor. Furthermore, by applying blow molding, the upper surface portion that constitutes the panel, the leg portion,
Since the cavity can be integrally molded and processed at one time, mass productivity can be improved, cost can be reduced, and the strength of the panel can be adjusted by selecting the material of the filler that fills the hollow portion of the jacket member. The effect that it can be done easily occurs.

[Brief description of drawings]

1 is a perspective view showing an embodiment of a floor panel according to the present invention, FIG. 2 is a sectional view taken along the line aa of FIG. 1, and FIG. 3 shows a floor panel device in which the floor panel of FIG. 1 is arranged. FIG. 4 is a side view showing a floor panel device in which the floor panel of FIG. 1 is arranged, FIG. 5 is a perspective view showing another embodiment of the floor panel according to the present invention, and FIG. FIG. 7 is a plan view showing a floor panel device in which the floor panel of FIG. 5 is arranged, FIG. 8 is a side view of the same, and FIG. 9 is another floor panel according to the present invention. FIG. 10 is a perspective view showing an embodiment, FIG. 10 is a sectional view taken along the line cc of FIG. 9, FIG. 11 is a plan view showing a floor panel device in which the floor panel of FIG. 9 is arranged, and FIG. 13 is a perspective view showing another embodiment of the floor panel according to the present invention, and FIG. 14 is a sectional view taken along the line d--d in FIG. FIG. 15 is a plan view showing a floor panel device in which the floor panel of FIG. 13 is arranged, and FIG. 16 is a side view of the same. Explanation of symbols of main parts 10 …… Coating member 12 …… Upper surface portion 12a …… Step portion 20 …… Side surface portion 22 …… Leg portion 24 …… Cavity portion 26 …… Back surface portion 28 …… Coupling portion 30 …… Filler 40,42,48 …… Cover plate 54 …… Wiring groove 100 …… Floor panel 102 …… Panel unit

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-47156 (JP, A) JP-A-62-194357 (JP, A) Actually open Sho-58-156930 (JP, U) Actually open 1- 98845 (JP, U) Actually open 1-119727 (JP, U) Actually open 60-44947 (JP, U) Actually open 2-11936 (JP, U) Actually open 63-201136 (JP, U) Actual public Sho 63-11246 (JP, Y2)

Claims (2)

(57) [Claims] 1. A panel unit comprising a substantially flat polygonal upper surface portion, side surface portions forming a plurality of legs for supporting the upper surface portion, and a rear surface portion formed on the rear surface of the upper surface portion. A floor panel formed by flexibly connecting the side surfaces of the panel unit with a connecting member at a predetermined minute interval, the panel unit being surrounded by the top surface, the side surface and the back surface, On the other hand, a resin-made jacket member having a hollow portion formed by forming a cavity between the leg portions and the connecting member are integrally formed by blow molding, and at least the resin-made jacket member is provided. Having a filling hole provided in the leg portion, and a curable filling material filled in the hollow portion, after the resin-made outer cover member and the connecting member are integrally formed by the blow molding, With the resin-made jacket member from the filling hole Floor panel, characterized in that the hollow section we formed by filling the curable filler. 2. A substantially flat polygonal upper surface portion, side surface portions forming a plurality of legs for supporting the upper surface portion, a back surface portion formed on the back surface of the upper surface portion, and a peripheral edge of the upper surface portion. A plurality of panel units each including a step portion provided in the section are laid at predetermined intervals so as to form a wiring path between the side surfaces of the panel unit, and the panel unit is fitted into the step portion by being dropped. A floor panel comprising a cover plate covering an upper surface opening, wherein the cover plate is laid on the stepped portion to form the upper surface part and the cover plate on substantially the same plane, wherein the panel unit includes the upper surface part, The resin-made jacket member having a hollow portion surrounded by the side surface portion and the back surface portion and below the back surface portion and having a cavity formed between the leg portions and the step portion are blown. Integrated by molding A filling hole formed in at least the leg portion of the resin jacket member, and a curable filler filled in the hollow portion, and a step with the resin jacket member by the blow molding. The floor panel, wherein the curable filler is filled into the hollow portion covered with the resin jacket member from the filling hole after being integrally formed.