JP2524057Y2 - Microstrip circuit - Google Patents

Microstrip circuit

Info

Publication number
JP2524057Y2
JP2524057Y2 JP1989102766U JP10276689U JP2524057Y2 JP 2524057 Y2 JP2524057 Y2 JP 2524057Y2 JP 1989102766 U JP1989102766 U JP 1989102766U JP 10276689 U JP10276689 U JP 10276689U JP 2524057 Y2 JP2524057 Y2 JP 2524057Y2
Authority
JP
Japan
Prior art keywords
ground conductor
circuit
short
microstrip
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989102766U
Other languages
Japanese (ja)
Other versions
JPH0344307U (en
Inventor
均 丹野
光央 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1989102766U priority Critical patent/JP2524057Y2/en
Publication of JPH0344307U publication Critical patent/JPH0344307U/ja
Application granted granted Critical
Publication of JP2524057Y2 publication Critical patent/JP2524057Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案はマイクロストリップ回路に関し、特にトリプ
レート構造を持つマイクロストリップ回路に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a microstrip circuit, and more particularly to a microstrip circuit having a triplate structure.

〔従来の技術〕 一般にトリプレート構造のマイクロストリップ回路
は、低損失、小型化が可能であることから、マイクロ波
回路によく用いられている。
[Prior Art] Generally, a microstrip circuit having a triplate structure is often used for a microwave circuit because of its low loss and miniaturization.

従来のトリプレート構造のマイクロストリップ回路の
一例の外観斜視図を第2図(a)に、またその断面図を
第2図(b)に示す。第2図(b)において、マイクロ
ストリップライン4が形成されているプリント基板3は
誘電体2a,2bで保持され、さらに地導体板11a,11bによっ
て挾持されている。また短絡板5a,5bはプリント基板3
の周囲に設けられ、地導体板11a,11bを電気的に短絡し
ており、ボルト6によって固定されている。また第3図
に示す他の従来例のように、軽量化を計るために、地導
体板11a,11bと短絡板5a,5bが導電性接着剤8c,8d,8e,8f
で固定されているものもある。
FIG. 2A shows an external perspective view of an example of a conventional microstrip circuit having a triplate structure, and FIG. 2B shows a cross-sectional view thereof. In FIG. 2 (b), the printed circuit board 3 on which the microstrip line 4 is formed is held by dielectrics 2a and 2b and further sandwiched by ground conductor plates 11a and 11b. The short-circuit boards 5a and 5b are printed circuit boards 3
The ground conductor plates 11a and 11b are electrically short-circuited and are fixed by bolts 6. As shown in FIG. 3, in order to reduce the weight, the ground conductor plates 11a, 11b and the short-circuit plates 5a, 5b are connected to the conductive adhesives 8c, 8d, 8e, 8f.
Some are fixed at.

さらに、多層構造にする場合は、第4図に示すよう
に、第2図のマイクロストリップ回路と同様に各層の地
導体板11a〜11f間に各々の短絡板5a〜5hを挿入したもの
を複数積み重ね、ボルト6a,6bとナット7a,7bで固定した
構造としている。
Further, in the case of a multi-layer structure, as shown in FIG. 4, as in the microstrip circuit of FIG. 2, a plurality of short circuit plates 5a to 5h inserted between ground conductor plates 11a to 11f of each layer are provided. They are stacked and fixed with bolts 6a, 6b and nuts 7a, 7b.

これらトリプレート構造のマイクロストリップ回路
は、地導体板同士を短絡させることにより、回路内の電
磁波の不用なモードが発生することを防止している。
In these microplate circuits having the triplate structure, the occurrence of unnecessary modes of electromagnetic waves in the circuit is prevented by short-circuiting the ground conductor plates.

〔考案が解決しようとする課題〕[Problems to be solved by the invention]

上述した従来のトリプレート構造のマイクロストリッ
プ回路は、地導体板と短絡板とをねじで固定する構造と
なっているため、多層構造のトリプレート構造になると
軽量化が極めて困難なものとなってしまうという欠点が
あった。また地導体板と短絡板とを導電性接着剤で接着
して用いる場合において、一体成形するためには回路を
構成する誘電体とプリント基板の接着に誘電体接着剤を
使用するため、2種類の接着剤を同時硬化させなければ
ならず、接着剤の選択が困難であった。さらに、同時硬
化が不十分であると地導体板が歪み、ラインのインピー
ダンス特性が劣化する等の問題があった。
Since the conventional microstrip circuit of the above-mentioned triplate structure has a structure in which the ground conductor plate and the short-circuit plate are fixed with screws, it is extremely difficult to reduce the weight in the case of a multiplate triplate structure. There was a disadvantage that it would. In addition, when the ground conductor plate and the short-circuit plate are used by bonding with a conductive adhesive, two types of dielectric adhesive are used to bond the dielectric constituting the circuit and the printed circuit board in order to integrally mold. Must be cured simultaneously, and it is difficult to select an adhesive. Further, if the simultaneous curing is insufficient, there is a problem that the ground conductor plate is distorted and the impedance characteristic of the line is deteriorated.

本考案はこれら従来の欠点を除き、一体成形の多層構
造を軽量化可能としたマイクロストリップ回路を提供す
るものである。
The present invention is to provide a microstrip circuit which can reduce the weight of an integrally formed multilayer structure without these conventional disadvantages.

〔課題を解決するための手段〕[Means for solving the problem]

本願のマイクロストリップ回路は、マイクロストリッ
プラインを形成したプリント基板を誘電体を介して挟持
する2枚の地導体板を備え、これら2枚の地導体板の端
部を前記誘電体の外縁まで延長し且つ延長された前記2
枚の地導体板の端部の少なくとも一方を折曲げ前記端部
同士を互いに短絡接触させ前記プリント基板を囲むトリ
プレート構造とし、前記トリプレート構造を複数重ね合
せて多層構造としてなる。
The microstrip circuit of the present application includes two ground conductor plates that sandwich a printed circuit board on which a microstrip line is formed via a dielectric, and extends the ends of the two ground conductor plates to the outer edge of the dielectric. Said and extended 2
At least one of the ends of the ground conductor plates is bent to bring the ends into short-circuit contact with each other to form a triplate structure surrounding the printed circuit board, and a plurality of the triplate structures are stacked to form a multilayer structure.

〔実施例〕〔Example〕

次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.

第1図は本考案の一実施例の断面図である。 FIG. 1 is a sectional view of an embodiment of the present invention.

まず第1の層においては、マイクロストリップライン
4aを形成しているプリント基板3aは、誘電体2a,2bで挾
持され、地導体板1aと地導体板1bでマイクロストリップ
回路を構成している。地導体板1aと地導体板1bは、互い
に短絡させるためにそれぞれ端部を延長し、地導体板1b
においては更に折り曲げ、最下部にあって折り曲げない
地導体板1aの端部に接触させて導電性接着剤8a,8bで固
定している。
First, in the first layer, the microstrip line
The printed circuit board 3a forming 4a is sandwiched between dielectrics 2a and 2b, and a microstrip circuit is formed by the ground conductor plate 1a and the ground conductor plate 1b. The ground conductor plate 1a and the ground conductor plate 1b have their ends extended to short-circuit each other.
Is further bent, and is contacted with the end of the ground conductor plate 1a, which is at the bottom and is not bent, and is fixed with the conductive adhesives 8a and 8b.

第2の層においても、プリント基板3bを誘電体2c,2d
で挾持し、地導体板1cの端部を折り曲げて地導体板1bの
側面と短絡するよう接触させ、その先端部分を導電性接
着剤8a,8bで固定している。
Also in the second layer, the printed circuit board 3b is connected to the dielectrics 2c and 2d.
The end of the ground conductor plate 1c is bent so as to make contact with the side surface of the ground conductor plate 1b so as to make a short circuit, and the front end portion is fixed with conductive adhesives 8a and 8b.

第3の層においても同様に、プリント基板3cを誘電体
2e,2fで挾持し、地導体板1dの端部を折り曲げて地導体
板1c上に短絡する構造となっている。
Similarly, in the third layer, the printed circuit board 3c is
It has a structure in which the end of the ground conductor plate 1d is bent and short-circuited on the ground conductor plate 1c.

このような構造の本実施例において、第1,第2,第3の
3つの各層はトリプレート構造をしており、各地導体板
同士は短絡されていることから、回路内に電磁波の不用
なモードが生じるのを防止している。この様に地導体板
を延長し、折り曲げて短絡板として併用することで、従
来の如く短絡板を入れてボルト止めするよりも軽量構造
となり、特性の劣化を生じることもない。
In this embodiment having such a structure, each of the first, second and third layers has a triplate structure, and the conductor plates at various places are short-circuited. Mode is prevented from occurring. By extending and bending the ground conductor plate and using it as a short-circuit plate in this way, the structure becomes lighter than the conventional case where a short-circuit plate is inserted and bolted, and the characteristics do not deteriorate.

なお本実施例では3回路の3層構造としているが、他
の複数の層としても構わない。
Although the present embodiment has a three-layer structure of three circuits, other layers may be used.

〔考案の効果〕[Effect of the invention]

以上説明したように本考案は、トリプレート回路の地
導体板を延長し、最下部以外の端部を折り曲げて短絡板
として併用することにより、回路内の電磁波の不用なモ
ードを防止するとともに、多層構造が容易でしかも軽量
にできる効果がある。
As described above, the present invention extends the ground conductor plate of the triplate circuit, and bends the ends other than the lowermost portion to be used together as a short-circuit plate, thereby preventing unnecessary modes of electromagnetic waves in the circuit, There is an effect that the multilayer structure is easy and the weight can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本考案の一実施例の断面図、第2図(a),
(b)及び第3図(a),(b)は従来のマイクロスト
リップ回路の二例を示すそれぞれ斜視図,断面図、第4
図は従来のマイクロストリップ回路の多層構造の断面図
である。 1a,1b,1c,1d,11a,11b,11c,11d,11e,11f……地導体板、2
a,2b,2c,2d,2e,2f……誘電体、3,3a,3b,3c……プリント
基板、4,4a,4b,4c……マイクロストリップライン、5a,5
b,5c,5d,5e,5f,5g,5h……短絡板、6,6a,6b……ボルト、
7a,7b……ナット、8a,8b,8c,8d,8e,8f……導電性接着
剤。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG.
3 (b) and FIGS. 3 (a) and 3 (b) are a perspective view, a cross-sectional view, and a
FIG. 1 is a sectional view of a multilayer structure of a conventional microstrip circuit. 1a, 1b, 1c, 1d, 11a, 11b, 11c, 11d, 11e, 11f ... ground conductor plate, 2
a, 2b, 2c, 2d, 2e, 2f ... dielectric, 3, 3a, 3b, 3c printed circuit board, 4, 4a, 4b, 4c microstrip line, 5a, 5
b, 5c, 5d, 5e, 5f, 5g, 5h …… Short circuit board, 6,6a, 6b …… Bolt,
7a, 7b: Nut, 8a, 8b, 8c, 8d, 8e, 8f: Conductive adhesive.

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】マイクロストリップラインを形成したプリ
ント基板を誘電体を介して挾持する2枚の地導体板を備
え、これら2枚の地導体板の端部を前記誘電体の外縁ま
で延長し且つ延長された前記2枚の地導体板の端部の少
なくとも一方を折曲げ前記端部同士を互いに短絡接触さ
せ前記プリント基板を囲むトリプレート構造とし、前記
トリプレート構造を複数重ね合せて多層構造としたこと
を特徴とするマイクロストリップ回路。
1. A printed circuit board on which a microstrip line is formed is provided with two ground conductor plates sandwiching a dielectric material therebetween, and the ends of the two ground conductor plates are extended to the outer edge of the dielectric material. At least one of the ends of the two extended ground conductor plates is bent to form a triplate structure surrounding the printed circuit board by short-circuiting the ends with each other. A microstrip circuit comprising:
JP1989102766U 1989-09-01 1989-09-01 Microstrip circuit Expired - Lifetime JP2524057Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989102766U JP2524057Y2 (en) 1989-09-01 1989-09-01 Microstrip circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989102766U JP2524057Y2 (en) 1989-09-01 1989-09-01 Microstrip circuit

Publications (2)

Publication Number Publication Date
JPH0344307U JPH0344307U (en) 1991-04-24
JP2524057Y2 true JP2524057Y2 (en) 1997-01-29

Family

ID=31651644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989102766U Expired - Lifetime JP2524057Y2 (en) 1989-09-01 1989-09-01 Microstrip circuit

Country Status (1)

Country Link
JP (1) JP2524057Y2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3284435B2 (en) * 1995-10-17 2002-05-20 日本電信電話株式会社 Multi-input multi-output switch circuit
JP4526713B2 (en) * 2001-01-12 2010-08-18 三菱電機株式会社 High frequency circuit
JP5115690B2 (en) * 2006-11-20 2013-01-09 富士電機株式会社 Showcase
JP6176400B2 (en) * 2014-06-02 2017-08-09 株式会社村田製作所 Transmission line member
JP6103153B2 (en) 2014-09-26 2017-03-29 株式会社村田製作所 Transmission lines and electronic equipment
WO2018025697A1 (en) 2016-08-02 2018-02-08 株式会社村田製作所 Multilayered substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55133976A (en) * 1979-04-05 1980-10-18 Mitsubishi Electric Corp Typewriter for wirecut type electrical discharge machine
JPS6250062A (en) * 1985-08-29 1987-03-04 Uea Tec:Kk Die casting machine including plunger sleeve and/or sprue consisting of double construction
JPS62225001A (en) * 1986-03-26 1987-10-03 Nec Corp Microstrip circuit

Also Published As

Publication number Publication date
JPH0344307U (en) 1991-04-24

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